42nd week of 2021 patent applcation highlights part 83 |
Patent application number | Title | Published |
20210329762 | LIGHTING APPARATUS - A LED lighting apparatus includes a housing, a bulb shell, a driver plate, a light source plate, and a driver circuit. The bulb shell is connected to the housing. The bulb shell and the housing form a container space. The driver plate is set in the container space. The light source plate is set in the container space. The light source plate includes a base plate and a light emitting component on the base plate. The driver circuit includes a rectifier circuit and a constant current driver chip which are electrically connected to each other. The rectifier circuit is set on the driver plate. The constant current driver chip is set on the light source plate. | 2021-10-21 |
20210329763 | Eliminating Flicker and Open Load Protection for Driver Compatible with NAFTA Dim ECG - An electronic driver for transforming an electronic ballast input voltage into an operating voltage for an LED lighting module. The driver includes a flicker eliminating circuit, which is adapted to operate in a saturation mode when the input voltage is below a threshold voltage. It operates in a switch mode when the input voltage is above a threshold voltage. A voltage drop in the flicker eliminating circuit in the saturation mode is higher than in the switch mode. | 2021-10-21 |
20210329764 | SYSTEMS AND METHODS FOR RETARDING MYOPIA PROGRESSION - Myopia is a clinically significant and growing problem around the world. A major cause is the increasing time spent indoors by children, for example, playing video games, studying, and watching television. Exposure to sufficient overall light levels is known to be protective, and prevents the onset and also delays the progression of myopia. Embodiments include a computerized myopia progression retarding (“MPR”) system that includes a light source configured to provide illumination and an illumination sensor configured to sense ambient light. The MPR system also includes a processor configured to dynamically adjust the illumination in terms of either wavelength bands or luminance provided by the light source to solicit a target wavelength band or luminance for retarding myopia progression of a user. | 2021-10-21 |
20210329765 | TRANSMITTING SENSOR SIGNAL IN DEPENDENCE ON DEVICE ORIENTATION - An electronic device, e.g. a sensor device ( | 2021-10-21 |
20210329766 | LIGHTING APPARATUS - A lighting apparatus includes a lens module, a light source plate, a first set of LED modules ad a second set of LED modules, and a driver. The first set of LED modules are located at first positions of the light source plate. The second set of LED modules are located at second positions of the light source plate. The driver controls the first set of LED modules and the second set of LED modules for generating a first output light pattern and a second output light pattern. The first light pattern and the second light pattern are mixed to generate one of multiple projected shapes on a projected surface controlled by the driver. | 2021-10-21 |
20210329767 | ACTIVATING A LIGHT SOURCE IN DEPENDENCE ON PREVIOUS POWER CYCLE DURATION - A method of activating at least one light source comprises reading ( | 2021-10-21 |
20210329768 | LIGHTING SYSTEM AND METHOD THEREOF - A lighting system has a plurality of central-control devices and a plurality of groups of local light-control devices. The central-control devices are electrically connected in a first daisy-chain form. Each group of local light-control devices are electrically connected in a second daisy-chain form. Each group of local light-control devices are connected to one of the plurality of central-control devices. | 2021-10-21 |
20210329769 | SYSTEM FOR WIRELESS CONTROL OF ELECTRICAL LOADS - The present disclosure relates to the field of lighting and more specifically, to a Bluetooth low energy mesh enabled adaptive light emitting diode (LED) driver with wireless battery powered switches for lighting control. In an aspect, the LED driver can include a rectifier ( | 2021-10-21 |
20210329770 | Process for Producing Ozone and Apparatus for Ozone Generation - In an embodiment a process for producing ozone includes applying an input voltage to an input area of a piezoelectric transformer so that a high voltage is generated in an output area of the piezoelectric transformer, wherein the piezoelectric transformer is operated in a pulsed manner such that phases in which the input voltage is applied to the piezoelectric transformer and phases in which the input voltage is not applied to the piezoelectric transformer alternate at regular intervals and surrounding the piezoelectric transformer with an oxygenic process gas so that the ozone is formed from the process gas by the high voltage generated in the output area. | 2021-10-21 |
20210329771 | PLASMA TORCH - The invention relates to a plasma torch, in particular plasma cutting torch, in which at least one secondary medium is guided by at least one feeder through a housing of the plasma torch to a nozzle protection cap opening and/or to further openings that are provided in a nozzle protection cap. In the at least one feeder, at least one valve for opening and closing the feeder is provided directly within the housing of the plasma torch. | 2021-10-21 |
20210329772 | COMPACT MULTI-ISOTOPE SOLID TARGET SYSTEM UTILIZING LIQUID RETRIEVAL - The present disclosure provides a self-contained system that contains a plurality of target cartridges, automatically inserts a selected target cartridge into position for irradiation, advances a foil to facilitate irradiation over the target chamber, replaces the foil for additional irradiation (if desired), serves as a dissolution cell for retrieval of the irradiated material, removes the used target cartridge and inserts a new cartridge for subsequent cycles of operation. Consequently, only the dissolved target material and dissolution medium are transferred between the target system and any post processing cells/labs. Accordingly, a system is disclosed for processing a target material without disturbance to irradiated material (thereby eliminating risk of impurities) and without requiring manual access/intervention (thereby eliminating risk of exposure). | 2021-10-21 |
20210329773 | INTEGRATED PASSIVE COMPONENT - A capacitor is disposed on a substrate that is insulative. An inductor is disposed on the substrate. The inductor includes a conductor pattern having at least one end connected to the capacitor. The capacitor includes a dielectric film that mainly contains the same constituent element as a constituent element mainly contained in the substrate and at least two electrodes that face each other with the dielectric film interposed therebetween. | 2021-10-21 |
20210329774 | STRUCTURE FOR DELIVERING POWER - A structure for delivering power is described. In some embodiments, the structure can include conductors disposed on two or more layers. Specifically, the structure can include a first set of interdigitated conductors disposed on a first layer and oriented substantially along an expected direction of current flow. At least one conductor in the first set of interdigitated conductors may be maintained at a first voltage, and at least one conductor in the first set of interdigitated conductors may be maintained at a second voltage, wherein the second voltage is different from the first voltage. The structure may further include a conducting structure disposed on a second layer, wherein the second layer is different from the first layer, and wherein at least one conductor in the conducting structure is maintained at the first voltage. | 2021-10-21 |
20210329775 | BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS - A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements. | 2021-10-21 |
20210329776 | COMPACT ULTRASOUND IMAGING APPARATUS - An apparatus comprises a transceiver (Tx/Rx) printed circuit board (PCB) with a top surface and a bottom surface and a power supply PCB. The Tx/Rx PCB includes two transmitter devices, each comprising a number N of channels. A first transmitter device is arranged on the bottom surface and a second transmitter device is arranged on the top surface over the first transmitter device. One or more pins of the second transmitter device are shorted with one or more pins of the first transmitter device with the same function. An analog front end (AFE) device comprising N input channels is arranged on the top surface of the Tx/Rx PCB, and a digital signal processor is coupled to the AFE device. The power supply PCB comprises a power supply module configured to provide a plurality of supply voltages to the Tx/Rx PCB and the power supply PCB. | 2021-10-21 |
20210329777 | PRINTED CIRCUIT BOARD AND ANTENNA MODULE COMPRISING THE SAME - A printed circuit board has a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body. The first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers. The second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers, and each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers. | 2021-10-21 |
20210329778 | RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE - A radio frequency module includes: a module board; a first electronic component and a second electronic component that are disposed apart from each other on the module board; and a third electronic component that is electrically connected to both the first electronic component and the second electronic component, and is disposed extending across the first electronic component and the second electronic component. | 2021-10-21 |
20210329779 | Component Carrier and Method of Manufacturing the Same - A component carrier includes a stack having a first electrically insulating layer structure and a first electrically conductive layer structure arranged on the first electrically insulating layer structure. The first electrically insulating layer structure has at least one first covered portion, which is covered by the first electrically conductive layer structure, and at least one first non-covered portion, which is not covered by the first electrically conductive layer structure. The first electrically insulating layer structure defines a recess at the at least one first non-covered portion. | 2021-10-21 |
20210329780 | STRETCHABLE SUBSTRATE, METHOD FOR MANUFACTURING STRETCHABLE SUBSTRATE, DEVICE FOR MANUFACTURING STRETCHABLE SUBSTRATE STRUCTURE, AND METHOD FOR MANUFACTURING STRETCHABLE SUBSTRATE STRUCTURE - A stretchable substrate according to an embodiment of the present invention comprises a first modulus region which has a first modulus, a second modulus region which is located in a plane direction with respect to the first modulus region and has a second modulus higher than the first modulus, and a third modulus region which is located between the first modulus region and the second modulus region and has an interface modulus which gradually changes between the first modulus and the second modulus, wherein the interface modulus of the third modulus region may be constant in the thickness direction thereof. | 2021-10-21 |
20210329781 | Camera Module with Compression-Molded Circuit Board and Manufacturing Method Thereof - A camera module with compression-molded circuit board is manufactured by compression-molding that can obtain properties such as high flatness, ultra-thin, fine wiring width and high integration. | 2021-10-21 |
20210329782 | ELECTRONIC DEVICE - An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height. | 2021-10-21 |
20210329783 | PRINTED WIRING BOARD - A printed wiring board includes an insulating substrate having openings, a first conductor layer formed on a first surface of the insulating substrate, a second conductor layer formed on a second surface of the insulating substrate, magnetic material portions formed in the openings of the insulating substrate and having through holes extending from the first surface to second surface of the insulating substrate, and through-hole conductors formed on side walls of the through holes such that the through-hole conductors connect the first conductor layer and second conductor layer. The magnetic material portions include magnetic particles and resin such that the magnetic particles include particles forming the side walls and that gaps are formed between the particles and the resin, and each of the through-hole conductors includes a chemical copper plating film such that the chemical copper plating film is deposited in the gaps formed between the particles and the resin. | 2021-10-21 |
20210329784 | FLEXIBLE CONNECTION MEMBER AND ELECTRONIC DEVICE COMPRISING SAME - Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments. | 2021-10-21 |
20210329785 | CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE - A circuit board module includes a first circuit board, a second circuit board facing the first circuit board, a connecting device fixed between the first circuit board and the second circuit board, and an adapter board fixed to the connecting device and disposed between the first circuit board and the second circuit board. The adapter board is inserted into the first circuit board and the second circuit board. | 2021-10-21 |
20210329786 | MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF PRODUCING A MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND SUBSTRATE WITH A BUILT-IN ELECTRONIC COMPONENT - A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in one axial direction and having a main surface facing in the one axial direction; and an external electrode including a base layer including a step portion formed on the main surface, and a plated layer formed on the base layer, the external electrode being connected to the internal electrodes. | 2021-10-21 |
20210329787 | ELECTRICAL DEVICE, INTERLAYER PLY INCLUDING AN ELECTRICAL DEVICE AND METHODS FOR MAKING SAID ELECTRICAL DEVICE AND INTERLAYER PLY - A method of making an electrical device is described. The method comprises the steps: (i) providing a layer of interlayer material having a first major surface and a second opposing major surface; (ii) positioning at least a first electrically operable component on the first major surface of the first layer of interlayer material, the first electrically operable component being mounted on a first circuit board; and (iii) providing a layer of adhesive material, preferably as a liquid, to cover at least a portion of the first major surface of the layer of interlayer material and at least a portion of the first electrically operable component and/or at least a portion of the first circuit board such that following step (iii) the first electrically operable component is fixed on the layer of interlayer material by at least a portion of the layer of adhesive material. | 2021-10-21 |
20210329788 | METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE - This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface with contact terminals, the component being arranged at least partially within the opening with its contact terminals electrically coupled to the first conductive pattern layer, a second insulating-material layer provided on the first insulating-material layer, and a conductive pattern embedded between the first and second insulating material layers. This publication additionally discloses a method for manufacturing an electronic module. | 2021-10-21 |
20210329789 | METHOD FOR FORMING CONDUCTIVE THIN WIRE, METHOD FOR PRODUCING TRANSPARENT CONDUCTOR, METHOD FOR PRODUCING DEVICE, AND SET OF CONDUCTIVE INK AND BASE MATERIAL - An object of the present invention is to provide a method for forming a conductive thin wire, the method being capable of improving thin wire formability, conductivity, adhesion, and transmittance of a conductive thin wire, a method for producing a transparent conductor, a method for producing a device, and a set of a conductive ink and a base material. This object is achieved by a method for forming a conductive thin wire on a base material by an inkjet method using a conductive ink containing at least a main solvent having a boiling point equal to or lower than the boiling point of water, a solvent having a boiling point higher than that of water, and a conductive material, in which the base material has surface energy of less than 40 mN/m, and conditions of 30°≤θ1≤70°, 0°≤θ2≤40°, and θ2≤θ1 are satisfied when a forward contact angle of the conductive ink to the base material is represented by θ1, and a backward contact angle of the conductive ink to the base material is represented by θ2. | 2021-10-21 |
20210329790 | METHOD OF MANUFACTURING A STRUCTURE HAVING CONDUCTIVE LINES - A method of manufacturing a structure having conductive lines is disclosed by forming a patterned catalyst material layer on a substrate; activating the patterned catalyst material layer to form an activated patterned catalyst material layer including activated catalysts; and growing a conductive layer on the activated catalysts of the activated patterned catalyst material layer. The patterned catalyst material layer is formed from a catalyst material including 40 wt % to 90 wt % of polymer and 10 wt % to 60 wt % of catalyzer. An uppermost portion of the activated patterned catalyst material layer includes the activated catalysts, and the activated catalysts include metal reduced from the catalyzer. The pattern of the conductive layer corresponds to that of the patterned catalyst material layer. The structure of the conductive line of the disclosure has the characteristics of high conductivity. | 2021-10-21 |
20210329791 | Printed Circuit Board and Manufacturing Method Thereof, and Electronic Device - This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes. | 2021-10-21 |
20210329792 | A Method for Providing Electrical Connections and Apparatus Comprising Electrical Connections - This application relates to a method and apparatus formed using the method. The method includes using a first process to form at least one conductive trace on a flexible surface and using a second process to form at least one bead of fluid conductive material at a first location. The method also includes positioning at least one printed circuit board overlaying conductive trace such that the at least one bead of fluid conductive material is aligned with at least one hole in the printed circuit board and pushing the printed circuit board towards the flexible surface. The pushing of the printed circuit board toward the flexible surface forces the bead of fluid conductive material through the hole to form an electrical connection between the at least one conductive trace and an upper surface of the printed circuit board. | 2021-10-21 |
20210329793 | METHOD FOR PRODUCING A CIRCUIT BOARD ARRANGEMENT, AND CIRCUIT BOARD ARRANGEMENT - A method for producing a circuit board arrangement includes: providing a first circuit board substrate, providing a second circuit board substrate, arranged substantially planar-parallel to the first circuit board substrate, the first circuit board substrate having an underside and the second circuit board substrate having an upper face, the upper face and the underside being arranged opposite one another, providing first terminal contacts, applied to the underside of the first circuit board substrate, providing second terminal contacts, applied to the upper face of the second circuit board substrate, applying solder paste cylinders to the first terminal contacts, the solder paste cylinders applied to the first terminal contacts by a solder-paste application process with solder paste, the applied solder paste cylinders having in each case a solder-paste-cylinder upper face, and arranging the second terminal contacts of the second circuit board substrate on the solder-paste-cylinder upper faces of the solder paste cylinders. | 2021-10-21 |
20210329794 | METHOD FOR PLATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - A method for plating a printed circuit board, includes placing a substrate, including a through hole, in contact with a plating solution and disposing the substrate to face an electrode; and applying a pulsed current to each surface of the substrate, including applying pulsed currents of opposite polarity to both surfaces of the substrate at least once and applying pulsed forward currents to both surfaces of the substrate at least once, to plate from a middle to an end of the through hole. | 2021-10-21 |
20210329795 | PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT - A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less. | 2021-10-21 |
20210329796 | Flexible Display Device - Provided is a flexible display device, including a flexible display panel and a support structure, the flexible display panel includes a main structure region, a bending region and an extension region, the bending region is bent to locate the extension region at a back of the main structure region, an accommodation space is formed between the main structure region, the extension region and the bending region, at least part of the support structure is located in the accommodation space, and one end of the support structure extends into a bending space surrounded by the bending region. | 2021-10-21 |
20210329797 | Housing Frame for a Control Unit, which Housing Frame is Suitable for Externally Electrically Contacting a Circuit Carrier of the Control Unit - A housing frame for a control unit for controlling an electrical machine is disclosed. The housing frame has at least one connection pin for electrically contacting a circuit carrier of the control unit. The connection pin has a connection base and is injected into the housing frame such that the connection pin can be electrically connected to the circuit carrier at the connection base by way of laser beam welding. Also disclosed is a control unit having a housing frame, an electrical machine having a control unit, and to a method for electrically connecting a connection pin of the housing frame to a circuit carrier of a control unit. | 2021-10-21 |
20210329798 | BACK COVER EJECTION STRUCTURE - A back cover ejection structure is applied in an electronic device. The electronic device includes a back cover and a middle frame, the back cover ejection structure can eject the back cover from the middle frame. The back cover ejection structure includes a housing, a moving plate, and a rotating cover. The moving plate is received in the housing and can move in a first direction. The moving plate includes a plate body and a first groove defined in the plate body. The first groove includes a first section, the first section inclined with the first direction. The rotating cover is rotatably connected to the housing. The rotating cover includes a sliding rod slidably received in the first section. The sliding rod can push the rotating cover to rotate when sliding in the first section, causing the rotating cover to eject the back cover from the middle frame. | 2021-10-21 |
20210329799 | ELECTRONIC DEVICE INCLUDING METAL HOUSING - An electronic device includes a front plate, a back plate that faces away from the front plate, a display, a frame, a polymer member, and an adhesive layer. The display is disposed between the front plate and the back plate and visible through the front plate. The frame surrounds an interior space between the front plate and the back plate and formed of a metallic material. The frame includes a first metal part and a second metal part. The polymer member is coupled to the frame and contains a polymer material. The adhesive layer bonds the polymer member and the frame. The frame includes an opening formed in a first part thereof. The opening is formed through the first metal part and being formed to a specified depth through the second metal part. The polymer member forms at least part of an inner surface of the opening. | 2021-10-21 |
20210329800 | ELECTRONIC DEVICE INCLUDING THIN HOUSING, AND MANUFACTURING METHOD THEREFOR - An electronic device is provided. The electronic device includes a housing comprising a first surface opened while facing a first direction, a second surface facing a second direction that is opposite to the first direction, and one or more side parts disposed in different directions between the first surface and the second surface, a nonconductive structure disposed along at least a portion of the at least one side wall within the housing, and one or more stop recesses including at least one recess formed on one surface of the one or more side parts and a portion of the nonconductive structure surrounding a peripheral portion of the at least one recess. | 2021-10-21 |
20210329801 | ELECTRICAL ARRANGEMENT - An electrical arrangement ( | 2021-10-21 |
20210329802 | DISPLAY APPARATUS - A display apparatus according to a concept of the disclosure includes: a display panel configured to display an image in a front direction; a top chassis positioned in a front direction of the display panel; a bottom chassis positioned in a rear direction of the display panel; a rear cover covering a rear side of the bottom chassis; and a stand member being accommodatable in the rear cover and selectively coupled with a rear surface of the rear cover, wherein the rear cover includes an accommodating portion in which the stand member is accommodated and a coupling portion coupled with the stand member, and the stand member includes an inserting protrusion which is inserted into the accommodating portion and the coupling portion. | 2021-10-21 |
20210329803 | Adaptive Transceiver Power Supply - An improved power supply for the AN/PRC-117G military radio has been developed. The presently disclosed power supply includes an AC-DC power conversion module; a DC-DC power module and an onboard battery backup. The disclosed power supply is an adaptable power supply which configures to provide AC-DC power; DC only power and battery backup power. The AC and DC power modules are independent and separable, and may be configured by the radio user to remove the AC module and operate in a DC only mode. The adaptability of the power supply includes universal power supply for the Harris Corporation Falcon III series of radios which includes the AN/PRC-117G; RF-7800H-MP; RF-7800M-MP; RF-7800-RC; AN/PRC-160 and the RF-7800-RT intelligence, surveillance and reconnaissance terminal. | 2021-10-21 |
20210329804 | ELECTRONIC DEVICE AND ELECTRONIC DEVICE TERMINAL COVER - An electronic device includes: a casing having an opening that houses a connection terminal inside; and a terminal cover that seals the opening such that the connection terminal is not exposed. The terminal cover includes a lid that seals the opening and a fixing part that fixes the terminal cover to the casing. The lid includes a protrusion and a cushion member, the cushion member being mounted around the protrusion and having a surface lower than a surface of the protrusion. The cushion member seals the opening by being in close contact with a member provided around the opening. | 2021-10-21 |
20210329805 | HOUSING AND ELECTRONIC DEVICE USING SAME - A housing includes a base and a mark piece. The base includes a bottom wall and at least one side wall. The at least one side wall is vertically connected to the bottom wall. A height of the side wall exists between a top end of the at least one side wall and the bottom wall. The mark piece is disposed on the bottom wall and extends from the bottom wall in a direction away from the bottom wall. The mark piece has a low scale and a high scale. A distance from the low scale to the bottom wall is less than the height of the side wall. A distance from the high scale to the bottom wall is substantially the same as the height of the side wall. | 2021-10-21 |
20210329806 | ELECTRICAL DEVICE INCLUDING A CONNECTION PART AND A COVER PART CONNECTED TO THE CONNECTION PART - An electrical device includes a connection part and a cover part connected to the connection part. A mounting part is accommodated and situated in the connection part, and a first circuit board is connected to the mounting part in a coded manner. A second circuit board is situated in the cover part, which is connected to a frame part in a coded manner. The first circuit board is connected to a plug connector part, and the second circuit board is connected to a mating plug connector part. A leading guide for a plug connection is provided on the mounting part, which becomes active when the cover part is connected to the connection part. The frame part being able to be connected to the mounting part in a coded manner. | 2021-10-21 |
20210329807 | SLIDING RAIL STRUCTURE AND SERVER CABINET USING THE SAME - A server cabinet which can be assembled and disassembled by means of a buckle instead of screws includes a fixing plate and a sliding rail structure. The fixing plate defines restriction holes. The sliding rail structure comprises a rail assembly and a buckle. The rail assembly includes first and second limiting portions. The second limiting portion passes through the restriction hole and is disposed on a first side of the fixing plate. The first limiting portion, with a first limiting hole, is disposed on a second side of the fixing plate opposite to the first side. The second limiting portion, with a second limiting hole, communicates with the first limiting hole. The buckle is hooked and passes through the first limiting hole to abut the first side, and can be disengaged from the first side by rotation. | 2021-10-21 |
20210329808 | METHOD OF ADAPTING ELECTRONIC EQUIPMENT STRUCTURE FOR CABLE MANAGEMENT - A method of adapting an electronic equipment structure for cable management, the method comprising: providing a cable manager having one or more cable finger units extending from a frame, the frame including at least one spine member having an extruded construction and one or more ledges that extend along a length thereof; providing an accessory rod assembly having a base member and an accessory rod, wherein the base member includes a front-facing socket, a rear-facing hook, and a rotatable knob having a threaded end received within a threaded portion at a side of the base member, and wherein the accessory rod has an extruded construction and a generally uniform, at least partially cylindrical, cross-sectional shape; positioning the rear-facing hook of the base member against one side of the one or more ledges of the at least one spine member; rotating the rotatable knob such that the threaded end is wound within the threaded portion of the base member and bears on an opposite side of the one or more ledges of the at least one spine member, thereby clamping the at least one spine member between the rear-facing hook and the rotatable knob; and positioning a proximal end of the accessory rod within the front-facing socket of the base member such that the accessory rod extends therefrom into a cable management space. | 2021-10-21 |
20210329809 | POWER MODULE HAVING METALLIC HEAT-DISSIPATION SUBSTRATE - A power module includes a power source module and a metallic heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a first surface and a second surface. At least a heat-generating component is disposed on the second surface. The metallic heat-dissipation substrate has a first surface and a second surface opposite to each other. The first surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the second surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The second surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced. | 2021-10-21 |
20210329810 | HEAT DISSIPATION SYSTEM WITH MICROELECTROMECHANICAL SYSTEM (MEMS) FOR COOLING ELECTRONIC OR PHOTONIC COMPONENTS - In one or more embodiments, an apparatus includes a substrate and die package, a thermal transfer plate positioned adjacent to the substrate and die package for cooling the substrate and die package, wherein at least one electrical path extends through the thermal transfer plate for transmitting power from a power module to the substrate and die package, and a microelectromechanical system (MEMS) module comprising a plurality of air movement cells for dissipating heat from the thermal transfer plate. | 2021-10-21 |
20210329811 | SUB-AMBIENT COOLING SYSTEM WITH CONDENSATION CONTROL FOR USE WITH ELECTRONIC DEVICES AND RELATED METHODS - Sub-ambient cooling systems with condensation mitigation for use with electronic devices are disclosed. An example sub-ambient cooling assembly disclosed herein includes a heat spreader to remove heat from an electronic component. A thermal electric cooler that is to remove heat from the heat spreader. A heat exchanger to remove heat from the thermal electric cooler, where the thermal electric cooler is positioned between the heat spreader and the heat exchanger. A shroud is to at least partially surround the heat spreader and the thermal electric cooler, where the heat exchanger is to transfer heat to the shroud to increase a surface temperature of the shroud. | 2021-10-21 |
20210329812 | METHODS AND SYSTEMS FOR MANAGING FACILITY POWER AND COOLING - Systems, methods and non-transitory computer-readable mediums are provided for determining data center resource requirements, such as cooling and power requirements, and for monitoring performance of data center resource systems, such as cooling and power systems, in data centers. At least one aspect provides a system and method that enables a data center operator to determine available data center resources, such as power and cooling, at specific areas and enclosures in a data center to assist in locating new equipment in the data center. | 2021-10-21 |
20210329813 | SYSTEMS AND METHODS FOR ACOUSTIC LIMITS OF THERMAL CONTROL SYSTEM IN AN INFORMATION HANDLING SYSTEM - A system may include a cooling subsystem comprising at least one air mover configured to generate a cooling airflow in the system and a thermal manager communicatively coupled to the cooling subsystem for control of the cooling subsystem and configured to determine an acoustic limit associated with the cooling subsystem, correlate the acoustic limit to an acoustic-based air mover speed limit for the at least one air mover, and control the cooling subsystem to maintain an air mover speed of the at least one air mover below the acoustic-based air mover speed limit. | 2021-10-21 |
20210329814 | THERMAL TRANSFER SYSTEM AND CONTROL IN MULTIPLE OPERATING CONDITIONS - Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. A temperature control plate adapted to be thermally coupled to one or more heat-generating electronic components. The temperature control plate has a fluid inlet fluidly coupled to an inlet control, and a fluid outlet fluidly coupled to an outlet control. Both the cooling loop and the heating loop are fluidly coupled to the temperature control plate. Temperature sensors and a controller are coupled to the system. Based on initial temperature measurements, the controller determines whether the electronic components require a cooling-only temperature control strategy or require a hybrid temperature control strategy that includes heating, cooling, and a transition between heating and cooling. The controller then implements the selected strategy. | 2021-10-21 |
20210329815 | ELECTRIC POWER MODULE AND INVERTER APPARATUS HAVING THE SAME - The present disclosure relates to an electric power module and an inverter apparatus having the same. The electric power module of the present disclosure may include a power device that converts the frequency of input power for output; a housing in which a passage of cooling fluid is disposed to accommodate the power device therein, and a cooling member, one side of which is in direct heat exchange with the power device, and the other side of which is in direct heat exchange with the cooling fluid, wherein the cooling member is made of a metal foam having a multi-porous structure. As a result, it may be possible to increase a heat transfer area of the heat conductor, and suppress the occurrence of pressure loss in the cooling fluid. | 2021-10-21 |
20210329816 | HEAT PIPE WITH LIQUID RESERVOIR - Particular embodiments described herein provide for an electronic device that can be configured to include a heat pipe with a liquid reservoir. The heat pipe with a liquid reservoir can include a main heat transfer portion that includes wick material and a vapor channel and a reservoir portion that includes the wick material where the wick material in the reservoir portion occupies at least about fifteen percent more of a volume of the reservoir portion than a percentage of a volume that the wick material occupies in the main heat transfer portion. In an example, the reservoir portion holds surplus liquid that is used when the main heat transfer portion starts to experience dryout. | 2021-10-21 |
20210329817 | HEAT EXCHANGE SYSTEM - A heat exchange system includes a heat-absorbing substance such as Liquid Natural Gas (LNG), a heat dissipation apparatus, a water storage tank, a heat exchanger, and a heat exchanger. The heat exchanger is coupled between the LNG and the water storage tank. The heat exchanger is coupled between the heat dissipation apparatus and the water storage tank. The heat exchanger transfers heat of the heat dissipation apparatus to water of the water storage tank to lose heat to the heat exchanger, and the heat exchanger transfers heat of the water to the LNG | 2021-10-21 |
20210329818 | STORAGE-TYPE MODULAR DATA CENTER - Disclosed is a storage-type modular data center. The storage-type modular data center includes a box, a dust removing module, an evaporative cooling module, and an air supply module. The box is provided with an air inlet and an air outlet. A server is disposed between the air inlet and the air outlet. The dust removing module is disposed between the server and the air inlet. The evaporative cooling module is disposed between the server and the air inlet, and includes an evaporative media and a water sprinkling tray module. One end of the evaporative media is immersed in liquid contained in the water sprinkling tray module. The air supply module is operative to drive air to flow between the air inlet and the air outlet. | 2021-10-21 |
20210329819 | POWER CONVERSION SYSTEM AND POWER STORAGE SYSTEM - A power conversion system includes a housing (outer housing) and a power converter. The power converter is arranged in an internal space of the housing. An outer peripheral surface of the housing is provided with an air inlet and an air outlet. The air outlet communicates with the air inlet via the internal space of the housing and is located below the air inlet. | 2021-10-21 |
20210329820 | TILT AND ROTATE DISPENSER HAVING STRAIN WAVE GEAR SYSTEM - A dispensing system includes a dispensing unit assembly configured to dispense viscous material and a gantry coupled to the frame. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly in x-axis and y-axis directions. The dispensing unit assembly includes a support bracket secured to the gantry and a movable bracket rotatably coupled to the support bracket by a first strain wave gear system configured to enable the rotation of the movable bracket with respect to the support bracket about a first axis. The dispensing unit assembly further includes a dispensing unit rotatably coupled to the movable bracket by a second strain wave gear system configured to enable the rotation of the dispensing unit with respect to the movable bracket about a second axis generally perpendicular to the first axis. | 2021-10-21 |
20210329821 | COMPONENT REPLENISHMENT MANAGEMENT SYSTEM AND COMPONENT MOUNTING SYSTEM - In a component replenishment management system, a setting unit sets work allowable time of an operator in a work area, a replenishment target identification unit identifies component replenishment target devices which are targets of component replenishment work by the operator, and a work progress determination unit determines a progress state of the component replenishment work. Then, an extraction unit extracts the component replenishment target devices for which the component replenishment work is to be performed before work time in the work area by the operator reaches the work allowable time among the component replenishment target devices whose progress state of the component replenishment work is work not performed. | 2021-10-21 |
20210329822 | Grevillea plant named 'GR85' - A new and distinct variety of | 2021-10-21 |
20210329823 | Hop plant named 'HBC 695' - A new hop plant named ‘HBC 695’ is disclosed. ‘HBC 695’ is used for its exceptional and unique aromatic qualities, and is suitable for beer flavoring. | 2021-10-21 |