43rd week of 2019 patent applcation highlights part 56 |
Patent application number | Title | Published |
20190326090 | MODULAR HIGH-FREQUENCY SOURCE WITH INTEGRATED GAS DISTRIBUTION | 2019-10-24 |
20190326091 | ELECTROMAGNET CONTROL DEVICE AND ELECTROMAGNET SYSTEM | 2019-10-24 |
20190326092 | PLASMA ETCHING METHOD AND PLASMA PROCESSING APPARATUS | 2019-10-24 |
20190326093 | SYSTEM AND METHOD FOR CONTROL OF HIGH EFFICIENCY GENERATOR SOURCE IMPEDANCE | 2019-10-24 |
20190326094 | IMPEDANCE MATCHING USING ELECTRONICALLY VARIABLE CAPACITANCE AND FREQUENCY CONSIDERATIONS | 2019-10-24 |
20190326095 | MODULAR HIGH-FREQUENCY SOURCE | 2019-10-24 |
20190326096 | PHASED ARRAY MODULAR HIGH-FREQUENCY SOURCE | 2019-10-24 |
20190326097 | MICROWAVE PLASMA CHEMICAL VAPOR DEPOSITION DEVICE AND APPLICATION THEREOF | 2019-10-24 |
20190326098 | REMOTE MODULAR HIGH-FREQUENCY SOURCE | 2019-10-24 |
20190326099 | GENERALIZED CYLINDRICAL CAVITY SYSTEM FOR MICROWAVE ROTATION AND IMPEDANCE SHIFTING BY IRISES IN A POWER-SUPPLYING WAVEGUIDE | 2019-10-24 |
20190326100 | EXTENDED DETACHABLE GAS DISTRIBUTION PLATE AND SHOWERHEAD INCORPORATING SAME | 2019-10-24 |
20190326101 | PLASMA PROCESSING APPARATUS AND MEMBER OF PLASMA PROCESSING CHAMBER | 2019-10-24 |
20190326102 | TEMPERATURE CONTROL METHOD | 2019-10-24 |
20190326103 | PLASMA PROCESSING METHOD | 2019-10-24 |
20190326104 | PLASMA PROCESSING METHOD | 2019-10-24 |
20190326105 | PROCESSING SYSTEM AND PROCESSING METHOD | 2019-10-24 |
20190326106 | METHOD FOR ETCHING ORGANIC REGION | 2019-10-24 |
20190326107 | DATA INDEPENDENT ACQUISITION WITH VARIABLE MULTIPLEXING DEGREE | 2019-10-24 |
20190326108 | AXIAL ATMOSPHERIC PRESSURE PHOTO-IONIZATION IMAGING SOURCE AND INLET DEVICE | 2019-10-24 |
20190326109 | DUAL CHAMBER ELECTRON IMPACT AND CHEMICAL IONIZATION SOURCE | 2019-10-24 |
20190326110 | SIBN FILM FOR CONFORMAL HERMETIC DIELECTRIC ENCAPSULATION WITHOUT DIRECT RF EXPOSURE TO UNDERLYING STRUCTURE MATERIAL | 2019-10-24 |
20190326111 | SEMI-INSULATING CRYSTAL, N-TYPE SEMICONDUCTOR CRYSTAL AND P-TYPE SEMICONDUCTOR CRYSTAL | 2019-10-24 |
20190326112 | DEFECT FREE SILICON GERMANIUM (SiGe) EPITAXY GROWTH IN A LOW-K SPACER CAVITY AND METHOD FOR PRODUCING THE SAME | 2019-10-24 |
20190326113 | FLEXIBLE DEVICE ON WHICH PATTERN OF 2-DIMENSIONAL MATERIAL IS FORMED AND MANUFACTURING METHOD THEREOF | 2019-10-24 |
20190326114 | METHODS OF TREATING A SUBSTRATE TO FORM A LAYER THEREON FOR APPLICATION IN SELECTIVE DEPOSITION PROCESSES | 2019-10-24 |
20190326115 | PRE-CLEAN OF SILICON GERMANIUM FOR PRE-METAL CONTACT AT SOURCE AND DRAIN AND PRE-HIGH K AT CHANNEL | 2019-10-24 |
20190326116 | TECHNIQUES FOR FORMING LOW STRESS MASK USING IMPLANTATION | 2019-10-24 |
20190326117 | SEMICONDUCTOR WAFER THINNING SYSTEMS AND RELATED METHODS | 2019-10-24 |
20190326118 | SEMICONDUCTOR DEVICE | 2019-10-24 |
20190326119 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-10-24 |
20190326120 | TUNING WORK FUNCTION OF P-METAL WORK FUNCTION FILMS THROUGH VAPOR DEPOSITION | 2019-10-24 |
20190326121 | MANUFACTURING METHOD OF HIGH-DIELECTRIC-CONSTANT GATE INSULATING FILM OF SEMICONDUCTOR DEVICE | 2019-10-24 |
20190326122 | DEPOSITION APPARATUS AND DEPOSITION METHOD | 2019-10-24 |
20190326123 | THERMAL SILICON ETCH | 2019-10-24 |
20190326124 | METHOD FOR PROCESSING WORKPIECE | 2019-10-24 |
20190326125 | METHOD OF PROCESSING TARGET OBJECT | 2019-10-24 |
20190326126 | METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES | 2019-10-24 |
20190326127 | Multiple Patterning Method Using Mask Portions to Etch Semiconductor Substrate | 2019-10-24 |
20190326128 | Structure and Method for Embedded Gettering in a Silicon On Insulator Wafer | 2019-10-24 |
20190326129 | FLUOROCARBON MOLECULES FOR HIGH ASPECT RATIO OXIDE ETCH | 2019-10-24 |
20190326130 | FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE | 2019-10-24 |
20190326131 | MECHANICAL COUPLINGS DESIGNED TO RESOLVE PROCESS CONSTRAINTS | 2019-10-24 |
20190326132 | Semiconductor Structure and Method of Forming | 2019-10-24 |
20190326133 | PURGE STOCKER | 2019-10-24 |
20190326134 | EXHAUST NOZZLE UNIT, LOAD PORT, AND EFEM | 2019-10-24 |
20190326135 | CONVEYING MECHANISM | 2019-10-24 |
20190326136 | CUTTING APPARATUS | 2019-10-24 |
20190326137 | DEVICE FOR ALIGNMENT OF TWO SUBSTRATES | 2019-10-24 |
20190326138 | CERAMIC WAFER HEATER WITH INTEGRATED PRESSURIZED HELIUM COOLING | 2019-10-24 |
20190326139 | CERAMIC WAFER HEATER HAVING COOLING CHANNELS WITH MINIMUM FLUID DRAG | 2019-10-24 |
20190326140 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD | 2019-10-24 |
20190326141 | METHODS AND APPARATUS FOR MICROWAVE LEAKAGE REDUCTION FOR SEMICONDUCTOR PROCESS CHAMBERS | 2019-10-24 |
20190326142 | COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERATIONS, AND ASSOCIATED SYSTEMS AND METHODS | 2019-10-24 |
20190326143 | TRANSFER SUBSTRATE FOR COMPONENT TRANSFERRING AND MICRO LEDS CARRYING SUBSTRATE | 2019-10-24 |
20190326144 | METHOD AND DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODES | 2019-10-24 |
20190326145 | WAFER BOAT AND METHOD OF MANUFACTURING THE SAME | 2019-10-24 |
20190326146 | SUBSTRATE TRANSFER CHAMBER | 2019-10-24 |
20190326147 | MULTI-CASSETTE CARRYING CASE | 2019-10-24 |
20190326148 | ELECTRONIC POWER DEVICES INTEGRATED WITH AN ENGINEERED SUBSTRATE | 2019-10-24 |
20190326149 | MICRO-TRANSFER-PRINTABLE FLIP-CHIP STRUCTURES AND METHODS | 2019-10-24 |
20190326150 | SUBSTRATE PLACING APPARATUS AND SUBSTRATE PLACING METHOD | 2019-10-24 |
20190326151 | SEMICONDUCTOR TOOL WITH A SHIELD | 2019-10-24 |
20190326152 | SUBSTRATE SUPPORT WITH EDGE SEAL | 2019-10-24 |
20190326153 | PLASMA PROCESSING APPARATUS | 2019-10-24 |
20190326154 | TWO PIECE SHUTTER DISK ASSEMBLY WITH SELF-CENTERING FEATURE | 2019-10-24 |
20190326155 | Method for Stabilizing a Semiconductor Arrangement | 2019-10-24 |
20190326156 | Interconnect Structure and Method of Forming the Same | 2019-10-24 |
20190326157 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2019-10-24 |
20190326158 | INTEGRATED CIRCUIT DEVICE | 2019-10-24 |
20190326159 | RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME UTILIZING LOCALIZED SOI FORMATION | 2019-10-24 |
20190326160 | METHOD FOR PREPARING SOI WAFER BY USING RAPID THERMAL PROCESSING | 2019-10-24 |
20190326161 | SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF | 2019-10-24 |
20190326162 | GALLIUM NITRIDE SEMICONDUCTOR STRUCTURE AND PROCESS FOR FABRICATING THEREOF | 2019-10-24 |
20190326163 | Forming Uniform Fin Height on Oxide Substrate | 2019-10-24 |
20190326164 | Via Patterning Using Multiple Photo Multiple Etch | 2019-10-24 |
20190326165 | VERTICAL-TRANSPORT FIELD-EFFECT TRANSISTORS HAVING GATE CONTACTS LOCATED OVER THE ACTIVE REGION | 2019-10-24 |
20190326166 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2019-10-24 |
20190326167 | Processes for Reducing Leakage and Improving Adhesion | 2019-10-24 |
20190326168 | TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION | 2019-10-24 |
20190326169 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING A STRUCTURE PATTERN HAVING A PLURALITY OF TRENCHES | 2019-10-24 |
20190326170 | SELF-ALIGNED VIA INTERCONNECT STRUCTURES | 2019-10-24 |
20190326171 | THROUGH-SUBSTRATE VIAS FORMED BY BOTTOM-UP ELECTROPLATING | 2019-10-24 |
20190326172 | METHOD FOR PRODUCING AN INTEGRATED CIRCUIT, INTEGRATED CIRCUIT, X-RAY DETECTOR AND X-RAY DEVICE | 2019-10-24 |
20190326173 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION | 2019-10-24 |
20190326174 | METHOD OF PROCESSING WAFER | 2019-10-24 |
20190326175 | VERTICALLY STACKED TRANSISTORS IN A PIN | 2019-10-24 |
20190326176 | FINFET GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME | 2019-10-24 |
20190326177 | PERFORMING CONCURRENT DIFFUSION BREAK, GATE AND SOURCE/DRAIN CONTACT CUT ETCH PROCESSES | 2019-10-24 |
20190326178 | METHOD FOR DIRECT FORMING STRESSOR, SEMICONDUCTOR DEVICE HAVING STRESSOR, AND METHOD FOR FORMING THE SAME | 2019-10-24 |
20190326179 | INTEGRATING A PLANAR FIELD EFFECT TRANSISTOR (FET) WITH A VERTICAL FET | 2019-10-24 |
20190326180 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2019-10-24 |
20190326181 | SEMICONDUCTOR DEVICE HAVING WORK-FUNCTION METAL AND METHOD OF FORMING THE SAME | 2019-10-24 |
20190326182 | SEMICONDUCTOR DEVICES | 2019-10-24 |
20190326183 | METHOD FOR FORMING A MICROELECTRONIC DEVICE | 2019-10-24 |
20190326184 | METHOD FOR MANUFACTURING RESISTIVITY STANDARD SAMPLE AND METHOD FOR MEASURING RESISTIVITY OF EPITAXIAL WAFER | 2019-10-24 |
20190326185 | SEMICONDUCTOR MANUFACTURING EQUIPMENT AND SEMICONDUCTOR MANUFACTURING METHOD | 2019-10-24 |
20190326186 | Substrate Processing Apparatus, Substrate Processing Method, and Storage Medium | 2019-10-24 |
20190326187 | SEMICONDUCTOR DEVICE INCLUDING TEST STRUCTURE | 2019-10-24 |
20190326188 | Packaged Integrated Circuit With Interposing Functionality and Method for Manufacturing Such a Packaged Integrated Circuit | 2019-10-24 |
20190326189 | SEMICONDUCTOR DEVICE WITH ENCAPSULATING RESIN | 2019-10-24 |