43rd week of 2016 patent applcation highlights part 55 |
Patent application number | Title | Published |
20160315049 | METHOD AND STRUCTURE OF FORMING FINFET ELECTRICAL FUSE STRUCTURE | 2016-10-27 |
20160315050 | CAPACITOR WITH FUSE PROTECTION | 2016-10-27 |
20160315051 | SEMICONDUCTOR PACKAGE MANUFACTURING METHOD | 2016-10-27 |
20160315052 | SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIA AND MANUFACTURING PROCESS FOR SAME | 2016-10-27 |
20160315053 | FLEXIBLE CRSS ADJUSTMENT IN A SGT MOSFET TO SMOOTH WAVEFORMS AND TO AVOID EMI IN DC-DC APPLICATION | 2016-10-27 |
20160315054 | SEMICONDUCTOR DEVICE | 2016-10-27 |
20160315055 | INTEGRATED CIRCUIT STACK INCLUDING A PATTERNED ARRAY OF ELECTRICALLY CONDUCTIVE PILLARS | 2016-10-27 |
20160315056 | PREVENTING UNAUTHORIZED USE OF INTEGRATED CIRCUITS FOR RADIATION-HARD APPLICATIONS | 2016-10-27 |
20160315057 | Reinforcement Structure and Method for Controlling Warpage of Chip Mounted on Substrate | 2016-10-27 |
20160315058 | SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE RESISTANT TO PLASMA DAMAGE AND METNOD FOR FORMING SAME | 2016-10-27 |
20160315059 | METHOD OF PRODUCING BUMPS IN ELECTRONIC COMPONENTS, CORRESPONDING COMPONENT AND COMPUTER PROGRAM PRODUCT | 2016-10-27 |
20160315060 | SEMICONDUCTOR DEVICE | 2016-10-27 |
20160315061 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | 2016-10-27 |
20160315062 | ASSEMBLY WITH A CARRIER SUBSTRATE AND AT LEAST ONE ELECTRICAL COMPONENT ARRANGED THEREON, AND ELECTRICAL COMPONENT | 2016-10-27 |
20160315063 | BONDING WIRE FOR SEMICONDUCTOR DEVICES | 2016-10-27 |
20160315064 | THERMOCOMPRESSION BONDERS, METHODS OF OPERATING THERMOCOMPRESSION BONDERS, AND HORIZONTAL SCRUB MOTIONS IN THERMOCOMPRESSION BONDING | 2016-10-27 |
20160315065 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2016-10-27 |
20160315066 | Semiconductor Device and Method | 2016-10-27 |
20160315067 | MULTI-CHIP PACKAGE STRUCTURE, WAFER LEVEL CHIP PACKAGE STRUCTURE AND MANUFACTURING PROCESS THEREOF | 2016-10-27 |
20160315068 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | 2016-10-27 |
20160315069 | REFLECTIVE SOLDER MASK LAYER FOR LED PHOSPHOR PACKAGE | 2016-10-27 |
20160315070 | LIGHT EMITTING DEVICE INCLUDING A FILTER AND A PROTECTIVE LAYER | 2016-10-27 |
20160315071 | THREE LAYER STACK STRUCTURE | 2016-10-27 |
20160315072 | PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWEEN INTEGRATED CIRCUIT DEVICE PACKAGES | 2016-10-27 |
20160315073 | Transistor Arrangement | 2016-10-27 |
20160315074 | OPTICAL COUPLING DEVICE | 2016-10-27 |
20160315075 | SEMICONDUCTOR DEVICE | 2016-10-27 |
20160315076 | ELECTROSTATIC DISCHARGE DEVICES AND METHODS OF MANUFACTURE | 2016-10-27 |
20160315077 | Electronic Device for ESD Protection | 2016-10-27 |
20160315078 | SEMICONDUCTOR DEVICE | 2016-10-27 |
20160315079 | Multi-Gate High Voltage Device | 2016-10-27 |
20160315080 | INTEGRATED CIRCUIT DEVICES HAVING A FIN-TYPE ACTIVE REGION AND METHODS OF MANUFACTURING THE SAME | 2016-10-27 |
20160315081 | SEMICONDUCTOR DEVICE HAVING FIN ACTIVE REGIONS AND METHOD OF FABRICATING THE SAME | 2016-10-27 |
20160315082 | SEMICONDUCTOR DEVICE HAVING A PLURALITY OF FINS AND METHOD FOR FABRICATING THE SAME | 2016-10-27 |
20160315083 | SELF ALIGNED STRUCTURE AND METHOD FOR HIGH-K METAL GATE WORK FUNCTION TUNING | 2016-10-27 |
20160315084 | DIFFERENT HEIGHT OF FINS IN SEMICONDUCTOR STRUCTURE | 2016-10-27 |
20160315085 | SEMICONDUCTOR DEVICE | 2016-10-27 |
20160315086 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUGS AND METHOD OF FORMING THE SAME | 2016-10-27 |
20160315087 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2016-10-27 |
20160315088 | SEMICONDUCTOR DEVICE HAVING BURIED GATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, MEMORY CELL HAVING THE SAME AND ELECTRONIC DEVICE HAVING THE SAME | 2016-10-27 |
20160315089 | SEMICONDUCTOR MEMORY DEVICE | 2016-10-27 |
20160315090 | FERROELECTRIC MECHANICAL MEMORY AND METHOD | 2016-10-27 |
20160315091 | INTEGRATED CIRCUIT WITH HYDROGEN ABSORPTION STRUCTURE | 2016-10-27 |
20160315092 | NON-VOLATILE MEMORY DEVICE | 2016-10-27 |
20160315093 | METHOD OF MANUFACTURING A NONVOLATILE MEMORY CELL AND A FIELD EFFECT TRANSISTOR | 2016-10-27 |
20160315094 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MEASURING THE SAME | 2016-10-27 |
20160315095 | BLOCKING OXIDE IN MEMORY OPENING INTEGRATION SCHEME FOR THREE-DIMENSIONAL MEMORY STRUCTURE | 2016-10-27 |
20160315096 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR WAFER | 2016-10-27 |
20160315097 | THREE-DIMENSIONAL DOUBLE DENSITY NAND FLASH MEMORY | 2016-10-27 |
20160315098 | THIN FILM TRANSISTOR ARRAY SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND DISPLAY DEVICE HAVING THE SAME | 2016-10-27 |
20160315099 | DISPLAY DRIVER INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME | 2016-10-27 |
20160315100 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | 2016-10-27 |
20160315101 | HYBRID HIGH ELECTRON MOBILITY TRANSISTOR AND ACTIVE MATRIX STRUCTURE | 2016-10-27 |
20160315102 | Thin Film Transistor, Array Substrate and Display Device | 2016-10-27 |
20160315103 | ARRAY SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND DISPLAY DEVICE | 2016-10-27 |
20160315104 | TFT ARRANGEMENT STRUCTURE | 2016-10-27 |
20160315105 | THIN-FILM TRANSISTOR ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | 2016-10-27 |
20160315106 | THIN FILM TRANSISTOR ARRAY SUBSTRATE AND MANUFACTURE METHOD THEREOF | 2016-10-27 |
20160315107 | DISPLAY DEVICE AND ELECTRONIC UNIT | 2016-10-27 |
20160315108 | RADIATION IMAGE SENSOR | 2016-10-27 |
20160315109 | SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS | 2016-10-27 |
20160315110 | Back-Illuminated Sensor Chips | 2016-10-27 |
20160315111 | UNIT PIXEL FOR IMAGE SENSOR | 2016-10-27 |
20160315112 | 4-COLOR PIXEL IMAGE SENSOR HAVING VISIBLE COLOR NOISE REDUCTION FUNCTION IN NEAR INFRARED RAY PIXEL | 2016-10-27 |
20160315113 | PHOTOSENSITIVE IMAGING APPARATUS AND METHOD OF FORMING SAME | 2016-10-27 |
20160315114 | Image Sensor, An Inspection System And A Method Of Inspecting An Article | 2016-10-27 |
20160315115 | LIGHT CONTROL DEVICE, IMAGING ELEMENT, AND IMAGING DEVICE | 2016-10-27 |
20160315116 | METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE | 2016-10-27 |
20160315117 | METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD OF PRODUCING SOLID-STATE IMAGE SENSOR | 2016-10-27 |
20160315118 | HIGH ANNEALING TEMPERATURE PERPENDICULAR MAGNETIC ANISOTROPY STRUCTURE FOR MAGNETIC RANDOM ACCESS MEMORY | 2016-10-27 |
20160315119 | SEMICONDUCTOR MEMORY DEVICE | 2016-10-27 |
20160315120 | BLOCK ARCHITECTURE FOR VERTICAL MEMORY ARRAY | 2016-10-27 |
20160315121 | SOCKET STRUCTURE FOR THREE-DIMENSIONAL MEMORY | 2016-10-27 |
20160315122 | CROSS POINT ARRAYS OF 1-R NONVOLATILE RESISTIVE CHANGE MEMORY CELLS USING CONTINUOUS NANOTUBE FABRICS | 2016-10-27 |
20160315123 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF | 2016-10-27 |
20160315124 | SUBSTRATE FOR TRANSPARENT FLEXIBLE DISPLAY AND ORGANIC LIGHT-EMITTING DIODE DISPLAY INCLUDING THE SAME | 2016-10-27 |
20160315125 | ORGANIC ELECTROLUMINESCENCE DEVICE AND ELECTRONIC APPARATUS | 2016-10-27 |
20160315126 | OLED DISPLAY | 2016-10-27 |
20160315127 | DISPLAY DEVICE HAVING SUB-PIXEL ARRAY STRUCTURE | 2016-10-27 |
20160315128 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | 2016-10-27 |
20160315129 | FLEXIBLE OLED DISPLAY HAVING INCREASED LIFETIME | 2016-10-27 |
20160315130 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-10-27 |
20160315131 | ARRAY SUBSTRATE, FABRICATION METHOD THEREOF AND DISPLAY DEVICE | 2016-10-27 |
20160315132 | ORGANIC LIGHT EMITTING DIODE DISPLAY | 2016-10-27 |
20160315133 | DISPLAY DEVICE | 2016-10-27 |
20160315134 | METHOD FOR MANUFACTURING CIRCUIT BOARD, METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE,AND LIGHT-EMITTING DEVICE | 2016-10-27 |
20160315135 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-10-27 |
20160315136 | INTEGRATED INDUCTOR | 2016-10-27 |
20160315137 | METHODS OF FORMING DIELECTRIC LAYERS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME | 2016-10-27 |
20160315138 | HIGH DENSITY CAPACITOR STRUCTURE AND METHOD | 2016-10-27 |
20160315139 | HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS | 2016-10-27 |
20160315140 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2016-10-27 |
20160315141 | High Breakdown N-Type Buried Layer | 2016-10-27 |
20160315142 | METHOD FOR MANUFACTURING VERTICAL SUPER JUNCTION DRIFT LAYER OF POWER SEMICONDUCTOR DEVICES | 2016-10-27 |
20160315143 | METHOD FOR FABRICATING AN IMPROVED FIELD EFFECT DEVICE | 2016-10-27 |
20160315144 | MINIMIZING SHORTING BETWEEN FINFET EPITAXIAL REGIONS | 2016-10-27 |
20160315145 | CIRCUIT STRUCTURE HAVING ISLANDS BETWEEN SOURCE AND DRAIN AND CIRCUIT FORMED | 2016-10-27 |
20160315146 | SEMICONDUCTOR DEVICE HAVING ASYMMETRICAL SOURCE/DRAIN | 2016-10-27 |
20160315147 | DESIGN STRUCTURE FOR FINFET FINS | 2016-10-27 |
20160315148 | ACTIVE REGIONS WITH COMPATIBLE DIELECTRIC LAYERS | 2016-10-27 |