43rd week of 2021 patent applcation highlights part 79 |
Patent application number | Title | Published |
20210337632 | SHEET-LIKE CONDUCTIVE MEMBER - A sheet-shaped conductive member includes a pseudo sheet structure having a plurality of conductive linear bodies arranged to be spaced from each other, in which the sheet-shaped conductive member has stretchability, and a minimum interval between the conductive linear bodies is 50 μm or more. | 2021-10-28 |
20210337633 | TUBULAR ELECTRIC HEATERS EQUIPMENT UNIT - The present invention provides a device that reduces thermal influence from heated elements of equipment on the findings of the tubular electric heater and lowers the temperature of the host electrical connection. Tubular unit heaters include flange (cover) with threaded holes and bushings, which are rigidly sealed tubular heaters with the conclusions and findings of the tubular electric heater made of electric portable node connections, and protective jacket, which is mounted on the flange from the insights of the tubular heater, offered on the module flange tubular electric heaters, from the insights of tubular electric heaters, set the cylindrical shell, on the upper half of which to perform a through perforation, on the inner surface of the cylindrical shell rigidly fix at least two heat shields with holes for tubular electric heaters, and the diameter of the holes in the heat shields should exceed the outer diameter of the sleeve. | 2021-10-28 |
20210337634 | HOUSEHOLD APPLIANCE WITH IMMERSIBLE HEATER - A household appliance is configured to implement an automatic cycle of operation for treating an article. The household appliance includes a treating chamber configured to receive the article for treatment according to the automatic cycle of operation. A sump is fluidly coupled to the treating chamber. A liquid circuit is fluidly coupled to at least one of the treating chamber or the sump. An immersible heater is located within the sump. | 2021-10-28 |
20210337635 | HEATING COIL DESIGN FOR WIRELESS POWER SYSTEMS - A power transmitter is provided herein. The power transmitter provides executing a dynamic heating operation with a heating object. The power transmitter senses a metallic structure in a presence of a coil of the power transmitter and transmits waves at one or more frequencies in response to sensing the metallic structure. The power transmitter determines that the metallic structure is the heating object based operation conditions respective to transmitting the waves and executes the dynamic heating operation by providing a power transfer to the heating object. | 2021-10-28 |
20210337636 | INDUCTION HEATING DEVICE AND CONTROL METHOD OF INDUCTION HEATING DEVICE - The method for controlling an induction heating device according to the present disclosure may include receiving a driving command for a second working coil when a first working coil is being driven at a first target frequency, stopping driving of the first working coil and driving the second working coil at a preset first adjustment frequency, determining a second target frequency of the second working coil corresponding to the driving command for the second working coil, determining a final driving frequency of the first working coil and a final driving frequency of the second working coil based on the first target frequency and the second target frequency, respectively, driving the first working coil and the second working coil simultaneously at a second adjustment frequency, and adjusting a driving frequency of the first working coil and a driving frequency of the second working coil to the final driving frequency, respectively. | 2021-10-28 |
20210337637 | Blower Style Magnetic Induction Cogeneration Assembly for Generating Heat And/Or Electricity and Incorporating Traditional Heating Elements Along With Heat Sink Ribs for Redirecting Fluid Flow - A fluid conditioning assembly having a body constructed of an insulating material. An inner housing is configured within the body defining a spiral passageway in communication with an inlet for redirecting a fluid flow through an outlet. A shaft extends within the body and rotatably supports a conductive and fluid redirecting plate or like component positioned within the inner housing. At least one magnet or electromagnet is positioned within the inner housing in proximity to the rotating component, causing thermal conditioning of the fluid flow resulting from creation of high frequency oscillating magnetic fields at a given frequency range, the thermally conditioned fluid flow being redirected through the outlet. Additional features include the ability to generate electricity in a cogeneration application of the assembly. Conventional elements can also be incorporated into the assembly for operating simultaneously or being deactivated/turned off after an initial startup period. | 2021-10-28 |
20210337638 | FILTER WITH AN ENCLOSURE HAVING A MICROMACHINED INTERIOR USING SEMICONDUCTOR FABRICATION - An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. Other metal traces on the other surface of the substrate also provide reference ground. Bottom and top enclosures that enclose the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the bottom and top enclosures engage reference ground metal traces on respective surfaces of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry. | 2021-10-28 |
20210337639 | METHOD FOR OPERATING A MICROWAVE DEVICE - The invention relates to a for operating a microwave device ( | 2021-10-28 |
20210337640 | LIGHTING APPARATUS - A lighting apparatus includes a first set of LED modules, a second set of LED modules, a first lens, a second lens and a driver. The first lens covers the first set of LED modules. The second lens covers the second set of LED modules. The driver supplies a first driving current and a second driving current respectively to the first set of LED module and the second set of LED modules. The driver electively turns on and turns off the first set of LED modules and the second set of LED modules in a first mode and in a second mode. The first light span in the first mode is partially overlapping the second light span in the second mode. The first light span has a smaller span angle than the second light span. | 2021-10-28 |
20210337641 | INDUCTIVE SERIES SWITCH CONTROL SYSTEM - The present disclosure discloses an inductive series switch control system. The control system includes several control modules that are connected in series, a first output inductive switch, and a second output inductive switch. Each control module is independently connected with an output interface, and each output interface is connected to a light-emitting diode (LED) lamp of a stair lamp; every two adjacent control modules are connected through three lines that are respectively an anode circuit, a negative circuit, and a signal circuit; the first output inductive switch is electrically connected to the first control module in the serially connected control modules; the second output inductive switch is electrically connected to the last control module in the serially connected control modules; and the anode circuit and the cathode circuit between any two control modules are connected to a power input end. | 2021-10-28 |
20210337642 | BACKLIGHT UNIT AND CONTROL METHOD THEREOF, AND LIQUID CRYSTAL DISPLAY DEVICE - The present invention provides a backlight unit and a control method thereof, and a liquid crystal display device. The control method includes steps as follows: obtaining backlight data corresponding to each partition, wherein the backlight data comprises a plurality of bits of data; dividing the light-emitting unit of each partition into a plurality of subfields with different durations in a light-emitting process during a frame, wherein each subfield corresponds to one bit of data, and any two subfields comprise different numbers of secondary subfields; and outputting the plurality of subfields in a preset order. | 2021-10-28 |
20210337643 | SYSTEM, AND METHOD FOR DETERMINING A HEALTH STATUS OF A DIMMABLE PULSED LED LIGHT STRING - A system and method to determine a health status of a LED light string. The system ( | 2021-10-28 |
20210337644 | LIGHT EMITTING DEVICE AND LIGHT GENERATING METHOD - The disclosure provides a light emitting device including a power conversion circuit configured to provide a power voltage, a light source module receives the power voltage, a driving circuit, and a control circuit. The driving circuit is configured to drive a plurality of light emitting units in the light source module and detect a current value flowing through each light emitting unit to generate a current signal. The control circuit is coupled to the power conversion circuit, the light source module, and the driving circuit and is configured to detect a cross-voltage of at least one of the light emitting units. The control circuit calculates a voltage offset value according to a difference between the cross-voltage and the power voltage to generate a control signal according to the voltage offset value and the current signal to accordingly control the power conversion circuit to adjust the power voltage. | 2021-10-28 |
20210337645 | METHOD AND ADJUSTMENT SYSTEM FOR ADJUSTING SUPPLY POWERS FOR SOURCES OF ARTIFICIAL LIGHT - The invention describes a method for adjusting supply powers for a first source of artificial light ( | 2021-10-28 |
20210337646 | Methods and Systems for Feature Operational Mode Control in an Electronic Device - An electronic device includes one or more sensors, one or more processors operable with the one or more sensors, and a user interface component operable with the one or more processors in at least a first mode of operation and a second mode of operation that is different from the first mode of operation. The one or more processors operate the user interface component in the first mode of operation in response to a first trigger input, and transition operation of the user interface component from the first mode of operation to the second mode of operation upon the one or more sensors detecting a second trigger input occurring while the one or more processors operate the user interface component in the first mode of operation. | 2021-10-28 |
20210337647 | SYSTEMS AND METHODS FOR A PERCEIVED LINEAR DIMMING OF LIGHTS - A light dimming system includes one or more lights and includes a local light controller that includes a dimming controller and a processing circuit, the dimming controller configured to provide an output to the one or more light drivers. One or more electronic processors are configured to receive a dimming input value indicating a desired dimming level for the one or more lights. The processors are further configured to determine a configuration of the one or more light drivers, wherein the configuration defines whether the one or more light drivers utilize a non-linear dimming curve or a linear dimming curve, and provides the dimming controller a dimming level to output a dimming control signal to the one or more light drivers equivalent to the received dimming input value based on a non-linear or linear calculation. | 2021-10-28 |
20210337648 | Multi-Protocol Luminaire System - Example embodiments relate to multi-protocol luminaire systems. One embodiment includes a luminaire system. The luminaire system includes a light module with at least one light source. The luminaire system also includes a first peripheral interface device and a second peripheral interface device. Additionally, the luminaire system includes a first interface configured to receive first signals from the first peripheral interface device using a first protocol. Further, the luminaire system includes a second interface configured to send second signals to the second peripheral interface device using a second protocol. The first protocol and the second protocol are different. In addition, the luminaire system includes a transfer module configured to transfer first data content included in a first input signal received at the first interface and/or first processed data based on the first data content, to the second interface. Still further, the luminaire system includes a control means. | 2021-10-28 |
20210337649 | DOWNHOLE NEUTRON GENERATORS AND METHODS TO AUTO TUNE DOWNHOLE NEUTRON GENERATORS - Downhole neutron generators, downhole logging tools that utilize neutron generators, and methods to auto tune downhole neutron generators are disclosed. While a neutron generator is deployed in a borehole of a wellbore, the method includes determining whether an oscillation cycle of an ion beam current generated by the neutron generator is stable. After a determination that the oscillation cycle of the ion beam current is stable, the method includes determining proportional, integral, and derivative parameters of a proportional-integral-derivative controller that is operable to adjust an amount of power supplied to generate ions. The method further includes adjusting a replenish voltage of a replenish power supply of the neutron generator based on the proportional, integral, and derivative parameters. | 2021-10-28 |
20210337650 | LIQUID COOLING SYSTEM FOR PRECISE TEMPERATURE CONTROL OF RADIATION DETECTOR FOR POSITRON EMISSION MAMMOGRAPHY - A temperature control assembly that enables precise temperature control for radiation detectors, such as positron emission tomography (“PET”) detectors and other densely packed electronics is described. The temperature control assembly includes a liquid cooling assembly that generally includes a cold plate having formed therein one or more channels through which a liquid coolant is able to flow. The channels are enclosed by the cold plate, such that the liquid coolant does not come into contact with sensitive electronic components used in the radiation detectors. When a liquid coolant is flowing through the channels, a sufficiently low humidity level is maintained external the cold plate. The liquid cooling assembly is removable and can be arranged between layers of printed circuit boards in an array of radiation detectors. Heating elements can be coupled the liquid cooling assembly and operated to increase the temperature as necessary to maintain a precisely controlled temperature environment. | 2021-10-28 |
20210337651 | WALL FOR ISOLATION ENHANCEMENT - A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element. | 2021-10-28 |
20210337652 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other. | 2021-10-28 |
20210337653 | Component Carrier With an Embedded Thermally Conductive Block and Manufacturing Method - A component carrier includes i) a first layer stack having a first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, iii) a second layer stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. Hereby, the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described. | 2021-10-28 |
20210337654 | Integrated Circuit / Printed Circuit Board Assembly and Method of Manufacture - An integrated circuit printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB. | 2021-10-28 |
20210337655 | FLEXIBLE CIRCUIT CARD ASSEMBLY WITH PREFORMED UNDULATIONS FOR SURVEILLANCE SYSTEM HINGE ASSEMBLY - A hinge assembly configured for attachment to two objects is described herein. The hinge assembly includes: a flexible circuit board having planar conductive circuitry and including at least one preformed undulation in a region of the flexible circuit board, wherein the at least one undulation is configured to allow the flexible circuit board to bend at the region; and a plurality of plated-through holes defined by the flexible circuit board, wherein the holes are configured to allow attachment of the flexible circuit board to the two objects, wherein the flexible circuit board is configured to movably and electrically connect the two objects. | 2021-10-28 |
20210337656 | MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER RESIN SUBSTRATE - A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern. | 2021-10-28 |
20210337657 | INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMUNICATIONS SIGNALS FOR A PRINTED CIRCUIT BOARD - A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range. | 2021-10-28 |
20210337658 | PRINTED CIRCUIT BOARD - A first capacitance C | 2021-10-28 |
20210337659 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE - A heat dissipation structure applied to an electronic device includes a circuit board assembly, a pipe, a refrigerant fluid, and a water pump. The circuit board assembly is provided with a receiving chamber therein, an inlet, and an outlet. Each of the inlet and the outlet communicates with the receiving chamber. The pipe and the receiving chamber together form a liquid channel. The refrigerant fluid is received in the liquid channel. The water pump communicates with the pipe and is configured to circulate the refrigerant fluid in the liquid channel to remove heat from the circuit board assembly. | 2021-10-28 |
20210337660 | ELASTIC CIRCUIT BOARD AND PATCH DEVICE IN WHICH SAME IS USED - A stretchable circuit board includes a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material. The land part is formed of a patterned metal foil, or a printed product of an electroconductive ink containing metal particles. The stretchable base material has a tensile modulus at 25° C. room temperature of 0.5 MPa to 0.5 GPa. | 2021-10-28 |
20210337661 | WIRING STRUCTURE, DISPLAY SUBTRATE AND DISPLAY DEVICE - The present disclosure provides a wiring structure, a display substrate and a display device, and belongs to the field of display technology. The wiring structure of the present disclosure comprises a body portion provided with hollow patterns; the body portion has a first side and a second side which are provided opposite to each other along an extending direction of the wiring structure, and both the first and second sides are wavy; the body portion comprises a plurality of conductive elements sequentially connected along the extending direction of the wiring structure; and in each conductive element, a length of a protruding portion on the first side in the extending direction of the wiring structure is different from that of a protruding portion on the second side in the extending direction of the wiring structure. | 2021-10-28 |
20210337662 | CIRCUIT BOARD AND OPTICAL MODULE - An optical module, including: a first laser and a first laser chip for driving the first laser; a second laser and a second laser chip for driving the second laser; and a multi-layer circuit board, including a surface layer, a reference layer, and an intermediate layer provided between the surface layer and the reference layer, where a first row of edge connector pins and a second row of edge connector pins are disposed in at least one surface layer; the first row of edge connector pins are disposed to be closer than the second row of edge connector pins to a side edge, of the multi-layer circuit board, that is provided with an edge connector; and a region, of the intermediate layer, that corresponds to a data signal line pin in the second row of edge connector pins is a hollow region. | 2021-10-28 |
20210337663 | MULTILAYER WIRING SUBSTRATE - A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor. | 2021-10-28 |
20210337664 | Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circuit Board - A surface treated copper foil | 2021-10-28 |
20210337665 | MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer printed circuit board providing large current and high power includes an inner circuit laminated structure, a first adding-layer circuit base board, and second adding-layer circuit base board. The inner circuit laminated structure includes at least one first type and second type conductive circuit layer alternately stacked. The first and second type conductive circuit layer are respectively made of first and second type metal layer, the first and second type metal layer have different etching ability. The second adding-layer circuit base board and the first adding-layer circuit base board are formed on opposite surfaces of the inner circuit laminated structure. The first and second adding-layer circuit base boards are electrically connected to the inner circuit laminated structure. The disclosure also provides a method for manufacturing such multilayer printed circuit board. | 2021-10-28 |
20210337666 | PROVIDING ONE OR MORE CARBON LAYERS TO A COPPER CONDUCTIVE MATERIAL TO REDUCE POWER LOSS IN A POWER PLANE - A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer. | 2021-10-28 |
20210337667 | DISPLAY DEVICE and ELECTRONIC DEVICE - To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region. | 2021-10-28 |
20210337668 | ELECTRIC DEVICE - An object to provide an electric device easy to manufacture, extensible and of high quality. The electric device comprises a plurality of module boards | 2021-10-28 |
20210337669 | MULTILAYER CERAMIC CAPACITOR - In a multilayer ceramic capacitor, an interposer includes, on a side of a first external electrode in a length direction, a first through hole that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The first through hole further includes a first metal film provided on an inner wall thereof. The interposer includes, on a side of a second external electrode in the length direction, a second through hole that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The second through hole further includes a second metal film provided on an inner wall thereof. A first uncovered portion is provided, which is not covered by the first metal film, on a first surface of the inner wall of the first through hole, and a second uncovered portion is provided which is not covered by a second metal film on the first surface of the inner wall of the second through hole. | 2021-10-28 |
20210337670 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes an interposer including, on a side in a length direction, a first through conductive portion that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The interposer includes, on the other side in the length direction, a second through conductive portion that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The first mounting electrode includes a first portion that covers a portion of a first interposer end surface on the one side in the length direction of the interposer. The second mounting electrode includes a second portion that covers a portion of a second interposer end surface on the other side in the length direction of the interposer. | 2021-10-28 |
20210337671 | Fabric-Mounted Components - Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers. | 2021-10-28 |
20210337672 | DISPLAY PANEL AND DISPLAY APPARATUS - A display panel and a display apparatus containing the display panel are disclosed. The display panel includes a substrate, a circuit structure, and a first bonding adhesive. The substrate has a first bonding area. The circuit structure has a second bonding area that opposingly faces the first bonding area. The first bonding adhesive is arranged between, and configured to contact the first bonding area and the second bonding area. At least one of the first bonding area or the second bonding area comprises at least one first indentation. The first bonding adhesive at least partially fills one or more of the at least one first indentation. | 2021-10-28 |
20210337673 | DISPLAY DEVICE - A display device includes the following elements: a base substrate having an active area and a non-active area; a plurality of pads disposed on the non-active area; and a printed circuit disposed on the plurality of pads. The printed circuit may include the following elements: a support layer; a first conductive layer and a second conductive layer respectively disposed on two opposite surfaces of the support layer. The second conductive layer may include the following elements: a first conductive member; a second conductive member; and a space between the first conductive member and the second conductive member. The first conductive member and the second conductive member may be electrically connected to the first conductive layer through contact holes. A side surface of the base substrate may be positioned between two edges of the space in a direction parallel to the support layer. | 2021-10-28 |
20210337674 | ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINISHED PROBE PRODUCT, MANUFACTURING METHOD THEREOF, PROBE CARD, AND MANUFACTURING METHOD THEREOF - Proposed are an anodic aluminum oxide mold made of an anodic aluminum oxide film, a manufacturing method thereof, a half-finished probe product, a manufacturing method thereof, a probe card, and a manufacturing method thereof. | 2021-10-28 |
20210337675 | MULTILAYER BOARD AND METHOD FOR MANUFACTURING SAME - Provided are a multilayer board and a method for manufacturing same, in which a different kind of metal layer is formed between an upper metal layer and an interlayer insulating layer, the different kind of metal layer being formed only in a wiring area without being formed in a via area. The multilayer board comprises: a substrate layer; a plurality of first metal layers sequentially stacked on the substrate layer; an interlayer insulating layer formed between two different first metal layers, having a first via hole, and electrically connecting the two different first metal layers through a third metal layer formed in the first via hole; and a second metal layer formed between the upper layer of the two different first metal layers and the interlayer insulating layer. | 2021-10-28 |
20210337676 | FLEXIBLE DISPLAY SCREEN ASSEMBLY AND FLEXIBLE DISPLAY DEVICE - A flexible display screen assembly is disclosed. The flexible display screen assembly includes: a frame; and a flexible display screen adapted to the frame. The flexible display screen includes at least one first fixing member, and the frame includes at least one second fixing member that cooperates with the at least one first fixing member. The flexible display screen includes a functional film, and the at least one first fixing member is disposed on the functional film. | 2021-10-28 |
20210337677 | Electronic Device with Curved Screen - An electronic device has a curved screen. An arc-shaped transition edge is disposed on both sides of a corner of the curved screen, and a black border is bent to a side surface of the electronic device, so that a full-screen effect without a black border is achieved, and the fringe of the curved screen is continuous and smooth as a whole. | 2021-10-28 |
20210337678 | MULTI-FUNCTIONAL FRONT SLICE PANEL APPARATUS AND METHOD OF MANUFACTURE - A circuit card assembly including a printed circuit board arranged to include one or more electronic circuits and a frame connected to the printed circuit board. The circuit card including at least one connector arranged to detachably engage with a backplane connector of the electronic chassis to establish an electrical connection with a backplane printed wiring board (PWB) of the electronic chassis. The circuit card also including a front panel having at least one input/output connector and an EMI/RFI gasket positioned along a perimeter of the back side of the front panel where the EMI/RFI gasket is arranged to contact a surface of the electronic chassis along a perimeter of the circuit card assembly slot when the circuit card assembly is extended into the circuit card assembly slot. | 2021-10-28 |
20210337679 | Mounting System, Devices, Methods and Uses Thereof - The present specification discloses systems, devices, and methods provide a mounting system which includes rail and a bracket which is selectively secured to the rail. The bracket is selectively and/or automatically locked to the rail when positioned on the rail, and may be removed from the rail by activating one or more buttons or actuators. The disclosed mounting systems, devices, and methods enable a device to be protected from impact and moisture exposure, enable a device to be securely mounted on a base, and/or enable a device to be quickly secured and removed from a base. | 2021-10-28 |
20210337680 | APPARATUS AND METHOD FOR DETECTING DISASSEMBLY OF APPARATUS - An apparatus has a device installed on an entrance wall bracket. The apparatus includes a fixing member configured to fix the device to the entrance wall bracket, a detection switch selectively pushed by the fixing member to detect whether the fixing member is released, and a tamper unit operating a tamper function when the release of the fixing member is detected through the detection switch. | 2021-10-28 |
20210337681 | VENTILATION DEVICE FOR HEAT ESCAPE - Described herein is a ventilation device for admitting air ventilation of a cabinet and preventing liquid passing from outside to inside of the cabinet, the ventilation device comprises a casing capable of being mounted in front of at least one cabinet opening of a cabinet, where the casing comprises at least one casing opening, a tube with a collar, where the tube is mounted on the casing and covering the at least one casing opening, and a cap covering the collar and leaving distance between the cap and the collar making it capable for air to pass between the cap and the collar. | 2021-10-28 |
20210337682 | DISPLAY DEVICE AND METHOD OF MANUFACTURING SAME - A display device and a method of manufacturing the same are provided. The display device includes a backplate, a display panel, and a supporting structure. The backplate includes a first backplate and a second backplate. The display panel includes a first non-bending area, a second non-bending area, and a bending area. The first backplate is configured to support the first non-bending area. The second backplate is configured to support the second non-bending area. The bending area is bent toward the backplate to form a bending space. The supporting structure is filled in the bending space to support the bending area of the display panel. | 2021-10-28 |
20210337683 | FLEXIBLE DISPLAY DEVICE AND TERMINAL - The present invention provides a flexible display device and a terminal, the flexible display device includes a casing, a roller assembly, a supporting layer, and a flexible display screen. An accommodating cavity is defined in the casing. An opening is defined in a side surface. The roller assembly is disposed in the accommodating cavity and comprises a first roller, a second roller, and a connecting member. Wrapping directions of the supporting layer on the first roller and the second roller are opposite. The flexible display screen is disposed on the supporting layer. The present invention reduces a risk of damage of the flexible display screen due to the stress. | 2021-10-28 |
20210337684 | DISPLAY DEVICE - According to the present embodiment, a display device includes a frame having an opening, a roller assembly having a roller and mounted on the frame, a display module wound on the roller or unrolled from the roller, and a display operating mechanism mounted on the frame and connected with the display module to be unrolled in a direction crossing a direction of opening the opening or to be wound on the roller. | 2021-10-28 |
20210337685 | PORTABLE ELECTRONIC DEVICE CASE - Systems and methods for protecting an electronic device are described. Embodiments of the systems and methods may include a zipper extending along at least a first side and a second side of the protective case, a zipper slider configured to be located along the second side when the zipper is fully closed, an inner flap that extends in a first direction parallel to the first side from the second side to a third side of the protective case opposite the second side, and an extension of the inner flap adjacent to the second side, wherein the extension extends in a second direction parallel to the second side such that a width of the inner flap adjacent to the second side is greater than a width of the inner flap adjacent to the third side. | 2021-10-28 |
20210337686 | METAL PLATE AND DISPLAY DEVICE INCLUDING THE SAME - A display device includes a display panel including a front surface that displays an image, and a rear surface, wherein the display panel is foldable with respect to a folding axis extending in a first direction; and a metal plate disposed on the rear surface of the display panel, wherein the metal plate includes a first body and a second body that are arranged in a second direction intersecting the first direction; a patterned portion disposed between the first body and the second body to overlap the folding axis in a thickness direction of the display device; and at least one protrusion protruding parallel to the folding axis from an edge of at least one of the first body, the second body, and the patterned portion. | 2021-10-28 |
20210337687 | DUAL-AXIS HINGE ASSEMBLIES - A dual-axis hinge assembly may include a casing defining a first slot and a second slot. Further, the dual-axis hinge assembly may include a first shaft and a second shaft received through the first and second slots, respectively. The first shaft and the second shaft may engage with a first housing and a second housing of an electronic device. Furthermore, dual-axis hinge assembly may include a foldable linkage disposed in the casing and connected between the first shaft and the second shaft. Furthermore, dual-axis hinge assembly may include an elastic member connected to the foldable linkage. The foldable linkage and the elastic member may enable the first shaft and the second shaft to slide along the first slot and the second slot to variably adjust a distance between a pivot axis of the first housing and a pivot axis of the second housing. | 2021-10-28 |
20210337688 | BENDABLE COVER PLATE AND FLEXIBLE DISPLAY DEVICE - A bendable cover plate and a flexible display device are provided. The bendable cover plate makes a bending region have an arch bridge structure by providing a groove in a corresponding bending region, thereby effectively enhancing bending ability. Adopting a glass material which has undergone doping treatment and laser treatment changes original structure and properties of the glass material, thereby greatly improving a surface hardness, correspondingly improving bending ability and surface hardness of the flexible display device, and improving the bending ability of the flexible display device while satisfying a customer's touch demand. | 2021-10-28 |
20210337689 | SEAMLESS TEXTILE COVERED ENCLOSURE - An electronic device includes a body panel, a cap layer affixed to the body panel, and a covering enclosing external surfaces of the body panel such that the covering has no visible or tactile seams. | 2021-10-28 |
20210337690 | DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE - A display panel, a manufacturing method thereof and a display device are provided. The display panel includes a cover plate, an adhesive layer, and a light-shielding glue. The cover plate has an edge area. The cover plate has a filling groove in the edge area, and the light-shielding glue is filled in the filling groove. | 2021-10-28 |
20210337691 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device includes: a display module including a first substantially flat portion, a first curved portion bent from one portion of the first substantially flat portion, and a second substantially flat portion facing the first substantially flat portion in a thickness direction of the first substantially flat portion; and a cover member including a support to support the display module, the support including a first part disposed under the first substantially flat portion, a second part disposed under the second substantially flat portion, and a third part disposed under the first curved portion. The third part of the support has at least one discontinuity. | 2021-10-28 |
20210337692 | SERVER SYSTEM - A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards. | 2021-10-28 |
20210337693 | ROBOT - A robot comprises: an outer body in which a pin through-hole is formed; a cover from which a pin passing through the pin through-hole protrudes and in which a protrusion is formed at one side of the pin; and a stopper disposed at an outer circumference of the pin, wherein the stopper comprises: a protrusion contact surface on which the protrusion is contacted and caught; and an outer body contact surface that is contacted and caught by a periphery of the pin through-hole in the outer body. | 2021-10-28 |
20210337694 | HORIZONTALLY OPENING FRONT BAYS - Information Handling Systems (IHSs), such as rack-mounted servers, may support various types of replaceable components that are installed in bays, such as storage drives and computing nodes. Some servers are constructed using a chassis that includes a front row of bays and an inner row of bays. In embodiments, in a closed position, the front row of bays conceals the inner row of bays until the front row of bays is rotated horizontally to an open position that provides access to the inner row of bays. The front row of bays may be divided into two banks of drive bays. The left and right banks of bays may be opened separately by rotating them horizontally about hinges connecting each bank to the chassis. By opening in this manner, the inner bays can be administered safely and limiting the forces placed on the chassis and the rack. | 2021-10-28 |
20210337695 | SLIDE RAIL ASSEMBLY - A slide rail assembly includes a rail member, a first bracket device, a second bracket device, and a bracket member. The first bracket device is arranged on the rail member. The second bracket device is detachably mounted on one of the rail member and the first bracket device and is adjustable to displace with respect to the rail member. The bracket member can be detachably mounted on the one of the rail member and the first bracket device after the second bracket device is detached from the one of the rail member and the first bracket device. | 2021-10-28 |
20210337696 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE ADOPTING THE SAME - A heat dissipation structure adapted to dissipate heat from a heat-generating structure includes a heat dissipation unit and a liquid metal layer. The heat dissipation unit includes a heat dissipation body and an anti-corrosion metal layer formed on the heat dissipation body. The liquid metal layer is disposed between the heat-generating structure and the anti-corrosion metal layer, and is opposite to the heat dissipation body. An electronic device that adopts the heat dissipation structure is also disclosed. | 2021-10-28 |
20210337697 | WELDING-TYPE POWER SUPPLIES WITH EXPANDABLE THERMAL INTERFACES - Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices. | 2021-10-28 |
20210337698 | HEAT TRANSFER ASSEMBLY AND POWER ELECTRONICS DEVICE - The invention refers to a heat transfer assembly for cooling an electronic power circuitry, said heat transfer assembly comprising a base member and at least one electronic power component in heat conductive contact for transferring heat to said base member, a heat transfer chamber adjoining said base member and being provided with fins extending from said base member into said heat transfer chamber for transferring heat to a flow of cooling medium extending through said heat transfer chamber and passing through spaces between said fins, said heat transfer assembly is designed such that said flow of cooling medium comprising an environment induced flow extending through said heat transfer chamber and entering said heat transfer chamber with respect to the direction of gravity in a lower section thereof and exiting from said heat transfer chamber with respect to said direction of gravity from an upper section thereof. | 2021-10-28 |
20210337699 | HEAT TRANSPORT DEVICE AND ELECTRONIC APPARATUS - A heat transport device includes: a sub heat sink which extends along a surface of a main board on which a chip is mounted, and which has a sheet mounting hole formed in a portion including the chip as observed in plan view; a main heat sink which extends along a back surface opposite from the mounting surface and which is in thermal contact at a position on the back surface that corresponds to the chip; a sheet member which is installed to the sub heat sink in such a manner as to close the sheet mounting hole and which has thermal conductivity; and a bracket which is fixed to the main board and which covers the sheet mounting hole. The sheet member is in thermal contact with a surface of the chip and has lower rigidity than the sub heat sink. | 2021-10-28 |
20210337700 | DISPLAY DEVICE - A display device is disclosed. The display device includes a display panel, a vapor chamber positioned behind the display panel, a board, which is positioned behind the vapor chamber and is coupled to the vapor chamber, and an adhesive member disposed between the display panel and the vapor chamber so as to be coupled thereto, wherein the vapor chamber includes a first plate, which defines a front surface thereof and faces the display panel, a second plate, which defines a rear surface thereof and is coupled to the first plate, and fluid flowing in a space defined between the first plate and the second plate, and wherein the first plate includes a coupler, which is depressed rearwards from the first plate and to which the adhesive member is coupled. | 2021-10-28 |
20210337701 | WIRELESS CHARGER - A wireless charger configured to charge a device includes: a charging base disposed at a lower portion of the vertical wireless charger; a support portion disposed over the charging base and configured to support the device being charged; a charging coil disposed in the support portion and configured to charge the device being charged; and a cross-flow fan disposed over the charging base, having a fan air outlet extending in a width direction of the support portion, and configured to dissipate heat away from the device being charged and/or the wireless charger through exhaust air. As such, a size of the vertical wireless charger in a length direction can be reduced, and the wind propagates in a straight line and covers a larger size of the wireless charger in the width direction, thereby improving heat dissipation and increasing wind propagation distance. | 2021-10-28 |
20210337702 | METHOD AND APPARATUS FOR CONTROLLING FAN SPEED - A method and apparatus for controlling fan speed are provided. The method obtains a first PWM value and a second PWM value of the fan based on the temperature of the server component respectively through a PID regulation algorithm and an open-loop control algorithm, and controls the fan speed based on the larger value of the first PWM value and the second PWM value. | 2021-10-28 |
20210337703 | POWER MODULE ASSEMBLY - The present disclosure relates to a power module assembly, and may include a plurality of cooling fins on an upper cover covering an upper portion of a module housing and a lower cover covering a lower portion of the module housing to cool the power module received inside the module housing, and the plurality of cooling fins may constitute a cooling passage to allow coolant to flows into the module housing, and expand a heat exchange area of the power module, thereby improving the cooling performance of the power module. | 2021-10-28 |
20210337704 | TESTING METHODS AND APPARATUSES USING SIMULATED SERVERS - The present application pertains to testing methods and apparatus useful in two-phase liquid immersion cooling systems. Such systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of two phase liquid immersion cooling so actual servers are not required to test various aspects of the two phase liquid immersion cooling units. | 2021-10-28 |
20210337705 | COOLING SYSTEM AND REFRIGERANT CONTROL METHOD FOR COOLING SYSTEM - The present invention provides a cooling system including a vaporizer ( | 2021-10-28 |
20210337706 | DISPLAY DEVICE - The disclosure provides a display device, including a display panel, a flexible circuit board (FCB), a printed circuit board (PCB), and a source driver chip. The PCB is connected to the display panel by the FCB, the source driver chip is bonded to a front side of the PCB, and an exposed copper area is disposed on a backside of the PCB corresponding to the source driver chip. Therefore, heat dissipation effect of a chip is improved, production costs are reduced, and working stability of products is ensured. | 2021-10-28 |
20210337707 | ELECTROMAGNETIC COMPATIBILITY GASKET AND VENT - A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device. | 2021-10-28 |
20210337708 | Self-Contained Electromagnetic Tracking Unit - An electromagnetic tracking system includes a magnetic transmitter configured to output magnetic fields, a receiver responsive to the magnetic fields, an electronics assembly having conductive elements that cause distortion to the magnetic fields, and an output mechanism configured to output a position of the receiver relative to the magnetic transmitter, wherein the magnetic transmitter has at least one winding disposed around a hollow ferromagnetic core comprised of conductive material through which current is made to flow by the electronics, wherein the electronics assembly is at least partially contained within the hollow portion of the hollow ferromagnetic core. Methods of manufacturing include shaping walls into a hollow shell to surround an electronics assembly, covering the hollow shell with ferromagnetic material, inserting the wrapped hollow shell into a plastic bobbin, and winding the plastic bobbin with coil wire to produce three orthogonal windings. | 2021-10-28 |
20210337709 | COMPONENT SUPPLY DEVICE - A component supply device includes a reel placement portion capable of supporting a plurality of reels each on which a component supply tape is wound, and a feeder configured to feed the component supply tape toward a component supply position. The reel placement portion includes a first reel placement portion and a second reel placement portion including a first support configured to support an outer peripheral portion of a reel. The second reel placement portion is configured to change a position of the first support with respect to the feeder so as to change a distance between the feeder and the first support. | 2021-10-28 |
20210337710 | Mandevilla Plant Named 'PATMANROS2' - A new and distinct | 2021-10-28 |
20210337711 | Mandevilla Plant Named 'PATMANWHI2' - A new and distinct | 2021-10-28 |
20210337712 | Mandevilla Plant Named 'PATMANROS3' - A new and distinct | 2021-10-28 |
20210337713 | Salvia plant named 'White Profusion' - A new and distinct cultivar of perennial | 2021-10-28 |