44th week of 2008 patent applcation highlights part 31 |
Patent application number | Title | Published |
20080266741 | Conditioner With Coplanar Conductors - Disclosed are novel internal structures of energy conditioners ( | 2008-10-30 |
20080266742 | Apparatus and method for increasing switching life of electromechanical contacts in a hybrid power switching device - A circuit and related methods for use in a hybrid power switching device are provided that include at least one electromechanical relay having a coil and a contact, the electromechanical relay defining a release time and a sticking time during an on-to-off transition. At least one solid state switch is electrically connected to the contact, and a timing circuit is electrically connected to the electromechanical relay and the solid state switch. The timing circuit includes a capacitor electrically connected to a control signal input and at least one resistor electrically connected to the capacitor and to the solid state switch, wherein the capacitor and the resistor are sized such that the capacitor discharges through the resistor to activate the solid state switch for a period of time that is longer than the electromechanical relay release time and sticking time. | 2008-10-30 |
20080266743 | LIGHTING CONTROL SYSTEM - A lighting control system comprises a plurality of toggle switches, a plurality of pushbuttons, a plurality of timer circuits, a plurality of relays, and a plurality of photocells to control a first plurality of lights, a second plurality of lights, a third plurality of lights and a fourth plurality of lights. The toggle switches and pushbuttons either control the lights directly or activate the timers to control the lights. The relays may be energized to switch on the lights. The photocells may be used to control the lights that are located in an outside setting. | 2008-10-30 |
20080266744 | Electricity conducting wheel structure - A multiple electricity conducting wheel is fitted to a vehicle and interposed between two wheel bodies of a wheel of the vehicle, and includes first and second holding members, and a small-diameter electricity conducting roller with an axle supported with the second holding member; the first holding member contains the second holding member, and has two opposing slots, through which the axle of the roller is passed; the second holding member is biased downwards by a spring so as to ensure that the electricity conducting roller will be constantly in contact with the floor; the spring is positioned around a rod part, which is passed through tops of the first and the second holding members, and joined to a metallic hub of the vehicle wheel; thus, static electricity carried on the vehicle can travel to the floor through the electricity conducting wheel. | 2008-10-30 |
20080266745 | ELECTROSTATIC CHUCK WITH HEATER - An electrostatic chuck with a heater including: a base which is composed of a sintered body containing alumina; an electrode disposed in an upper part of the base: and a resistance heating element embedded in a lower part of the base. The base includes a dielectric layer between the electrode and an upper surface of the base and a supporting member between the electrode and a lower surface of the base. The dielectric layer has a carbon content of not more than 100 ppm, and the supporting member has a carbon content of 0.03 to 0.25 wt %. Moreover, the resistance heating element is formed into a coil and mainly composed of niobium. | 2008-10-30 |
20080266746 | ELECTROSTATIC CHUCK - This invention relates to a suitable electrostatic chuck to hold a substrate during the manufacture of a semiconductor integrated circuit having excellent cooling performance and insulation performance, and a low level of particulate generation, which is comprised of an electrostatic chuck, comprising a metal substrate, a first insulating layer of silicone rubber formed directly or via an adhesive layer on the metal substrate and having a thermal conductivity of 0.5 W/mK or more, an electrically conducting pattern formed directly or via an adhesive layer on this first insulating layer, a second insulating layer of an insulating polyimide film formed directly or via an adhesive layer on this electrically conducting pattern, and a third insulating layer formed directly or via an adhesive layer on this second insulating layer, wherein this third insulating layer is a silicone rubber containing reinforcing silica, this layer not containing any thermally conductive filler having an average particle size of 0.5 μm or more. | 2008-10-30 |
20080266747 | ELECTROSTATIC CHUCK - In an electrostatic chuck for chucking a glass substrate, the electrostatic chuck includes a pair of electrodes embedded in a ceramic material and interlaced with each other, where a volume resistivity of the ceramic material is 1×10 | 2008-10-30 |
20080266748 | Amplification Relay Device of Electromagnetic Wave and a Radio Electric Power Conversion Apparatus Using the Above Device - The present invention provides an amplifying repeater, which is constructed in such a manner that a ferrite core is inserted into a coil with a pre-determined number of winds to increase an induced electromotive force caused by an increase in flux linkage using a time-varying magnetic field of electromagnetic waves at a position distant from various electromagnetic wave generating sources by a predetermined distance and the induction coil and a variable condenser for inducing resonance are connected to each other to increase current while reducing a resistant component existing in the induction coil to intensify and amplify the magnetic field of electromagnetic waves. Furthermore, the present invention provides a wireless power conversion charging device using the magnetic field of electromagnetic waves, which is located between an electromagnetic wave generating source transmitter and a receiving coil or attached to the transmitter and receiving coil. The wireless power conversion charging device includes a rectifying diode for rectifying an electromotive force induced in a construction in which a resonance and impedance matching variable condenser is connected to a coil in series or in parallel in order to transmit maximum induced power to a charging battery that is a load using electromagnetic waves amplified by the amplifying repeater, and a smoothing condenser for smoothing the rectified voltage. Accordingly, charging power required for various small power electronic devices can be provided and power can be supplied to various loads. | 2008-10-30 |
20080266749 | Scalable integrated circuit high density capacitors - The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to from the capacitors. The capacitors use different metallization patterns to form the metal layers, and different via patterns to couple adjacent metal layers. In embodiments, optional shields are included as the top-most and/or bottom-most layers of the capacitors, and/or as side shields, to reduce unwanted parasitic capacitance. | 2008-10-30 |
20080266750 | Capacitor Devices - A capacitor device with a capacitance is introduced. The capacitor device includes at least one capacitive element. The at least capacitive element comprises a pair of first conductive layers being opposed to each other, at least one first dielectric layer formed on a surface of at least one of the first conductive layers, and a second dielectric layer being sandwiched between the first conductive layers. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant. The capacitance of the capacitor device depends on dielectric parameters of the first dielectric layer and the second dielectric layer. The dielectric parameters comprise the first dielectric constant and thickness of the at least one first dielectric layer and the second dielectric constant and thickness of the second dielectric layer. | 2008-10-30 |
20080266751 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a plurality of ceramic dielectric layers, a plurality of inner electrode layers and and external electrodes. The ceramic dielectric layers includes barium titanate crystal grains having pores inside. The inner electrode layers are between the ceramic dielectric layers. The external electrodes are electrically connected to the inner electrode layers. The barium titanate crystal grains each have a core-shell structure which include a core and a shell around the core. The the pores are mainly formed in the cores. | 2008-10-30 |
20080266752 | THERMAL INTERCONNECTS FOR COUPLING ENERGY STORAGE DEVICES - A thermally fitted interconnect couples energy storage cells without the use of additional materials of fasteners. Variations of the interconnect can be used to facilitate fitting of multiple energy storage cell with multiple cell to cell spacings in a rapid and inexpensive manner. | 2008-10-30 |
20080266753 | DENSIFICATION OF COMPRESSIBLE LAYERS DURING ELECTRODE LAMINATION - A compressible and deformable layer is densified and laminated to a layer of a material that is relatively resistant to stretching. The densification and bonding take place in a single step. As used in fabrication of electrodes, for example, electrodes for double layer capacitors, a deformable and compressible active electrode film is manufactured from activated carbon, conductive carbon, and a polymer. The electrode film may be bonded directly to a collector. Alternatively, a collector may be coated with a wet adhesive layer. The adhesive layer is subsequently dried onto the foil. The dried adhesive and foil combination may be manufactured as a product for later sale or use, and may be stored as such on a storage roll or other storage device. The active electrode film is overlayed on the metal foil, and processed in a laminating device, such as a calender. Lamination both densifies the active electrode film and bonds the film to the metal foil. Spreading of the active electrode film in the plane parallel to the plane of the metal foil is reduced or eliminated during lamination, because of the adhesion between the film and the foil. | 2008-10-30 |
20080266754 | ELECTRODE FOR USE WITH DOUBLE ELECTRIC LAYER ELECTROCHEMICAL CAPACITORS HAVING HIGH SPECIFIC PARAMETERS - The present invention relates to the production of electrochemical capacitors with a DEL. The proposed electrodes with DEL are based on non-metal conducting materials, including porous carbon materials, and are capable of providing for high specific energy, capacity and power parameters of electrochemical capacitors. P-type conductivity and high concentration of holes in electrode materials may be provided by thermal, ionic or electrochemical doping by acceptor impurities; irradiating by high-energy fast particles or quantums; or chemical, electrochemical and/or thermal treatment. The present invention allows for an increase in specific energy, capacity and power parameters, as well as a reduction in the cost of various electrochemical capacitors with DEL. The proposed electrodes with DEL can be used as positive and/or negative electrodes of symmetric and asymmetric electrochemical capacitors with aqueous and non-aqueous electrolytes. | 2008-10-30 |
20080266755 | NbO Capacitors With Improved Performance and Higher Working Voltages - A capacitor is described with an NbO anode. The capacitor has an NbO anode and an NbO anode lead extending from the NbO anode. A dielectric is on the NbO anode and a conductor is on the dielectric. | 2008-10-30 |
20080266756 | SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Particles of a valve metal and a binder are mixed and kneaded together. The mixed-kneaded matter obtained thereby is molded, and a through-hole is formed in the molded body. An anode body is formed by sintering the molded body. A dielectric layer is formed on the surface of the anode body thus formed. Subsequently, an conducting polymer layer is formed on the dielectric layer. | 2008-10-30 |
20080266757 | ELECTRIC CIRCUIT DEVICE - An electric circuit device comprises an electric element and a conductive plate. The electric element comprises first and second anode electrodes and a cathode electrode. The first anode electrode is disposed on one end of the electric element in the longitudinal direction DR | 2008-10-30 |
20080266758 | MOBILE UTILITIES STATION - A mobile utilities station includes a plurality of batteries charged by sheets of photovoltaic cells, all mounted in a trailer. The mobile utilities station provides various utilities, for example, electricity, water purification, HVAC, communications, etc. When available sunlight is insufficient to operate all of the devices in use, electricity is supplemented from the batteries. The batteries also power the devices at night. During periods of low usage, the photovoltaic cells recharge the batteries. | 2008-10-30 |
20080266759 | HIGH DENSITY POWER DISTRIBUTION UNIT - A power distribution unit may include a power distribution unit frame, where the power distribution unit frame has a 2U form factor, and where the power distribution unit frame is coupled to mount in an embedded computer frame. A plurality of power ingress sites may be coupled to a rear portion of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin coupled to interface with an ingress in-line, hyperboloid radial socket, and where the power distribution unit has a current capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit. | 2008-10-30 |
20080266760 | Bus Bar System with Assembly Unit Consisting of a Base Plate and Fixing Items - A bus bar system with an assembly unit having a base plate with side limbs and fixing items which are connected to the assembly unit. The assembly unit forms a receiving element for a bus bar holder and bus bars which are covered with cover elements and/or adapters for peripheral devices. The covers and/or adapters are mechanically connected to the bus bars by plug-in receiving elements and/or locking receiving elements and the adapters are also electrically connected to the bus bars. An assembly unit, which can be produced and mounted at low cost without impeding functional requirements, is provided and the assembly unit forms locking receiving elements together with retaining flanges, which protrude at a distance on the outer sides of the side limbs, and fixing flanges, wherein bar-shaped fixing items can be inserted into and/or locked inside the receiving elements. The plug-in and/or locking receiving elements of the covers and/or adapters receive the retaining flanges and the connected side limbs of the bar-shaped fixing items. | 2008-10-30 |
20080266761 | LOCK RING FOR A WATTHOUR METER APPLICATION - A lock ring for use in mounting a watthour meter, meter socket enclosure cover or a watthour meter socket adapter to each other. The lock ring includes a ring member and a housing carried on the first and second ends of the ring member. The housing may be separate housings carried on the first and second ends of the ring member. A lock is insertable into mated first and second housing members in one of a plurality of variably selectable positions that vary the circumference of the ring member to accommodate varied circumferences of watthour meters, meter socket adapters and meter socket enclosure cover mounting rings. Finger grips are formed on the housing members to facilitate closure of the housing. A plurality of axially spaced grooves are formed in one of the members for receiving lock members carried by the lock. | 2008-10-30 |
20080266762 | Electronic device casing with a plug housing - An electronic device casing with a plug housing that has a housing, a plug and a recess. The plug has an electrical wire that connects the plug and the housing, and a connector that electrically connects to the electrical wire through the plug. The recess corresponds to the plug and the connector and has a magnet mounted on the recess where the connector may be stored. When the plug is stored in the recess, the magnet holds the connector. Consequently, the plug can be mounted easily and stably in the recess and removed from the recess without pulling and tugging the electrical wire. Thus the electrical wire will be less likely to have contact faults. Besides, the recess may have a simpler shape that reduces the production cost of the plug housing. | 2008-10-30 |
20080266763 | PORTABLE ELECTRONIC APPARATUS - Provided is a portable electronic apparatus. The portable electronic apparatus includes a casing, an operation portion, and a finger placement portion. The casing includes a front surface and a back surface. The operation portion is disposed at a first position on the front surface and is operated with a first finger of a user for an input. The finger placement portion is disposed at a second position on the back surface. The second position corresponds to the first position. The finger placement portion guides a second finger of the user to be capable of being placed thereon. | 2008-10-30 |
20080266764 | CASING AND MOBILE COMMUNICATION APPARATUS - A casing of a mobile communication device includes a casing body, a cover and a screwing assembly. The outside of the casing body has a battery holding recess and a screw hole. The cover can cover the battery holding recess. The screwing assembly is fixed to the cover. The screwing assembly is screwed in the screw hole to fix the cover to the casing body or partially screwed out of the screw hole to rotate and raise the cover from the casing body. A mobile communication device is also disclosed. | 2008-10-30 |
20080266765 | Portable electronic device with drainage structure - A drainage structure is provided for a portable electronic device, such as a portable computer. The drainage structure includes an inclination formed on a top surface of a body of the portable electronic device to support a keyboard device in an inclined manner so that water spilled on the keyboard device or the top surface can be expelled out of the electronic device by gravity. If desired, height adjusting units can be arranged between the keyboard device and the top surface of the body to selectively maintain the keyboard in a horizontal condition. A drain hole or groove can be selectively formed in the body of the electronic device to facilitate drainage of water. | 2008-10-30 |
20080266766 | SMUDGE REMOVAL FROM ELECTRONIC DEVICE DISPLAYS - An apparatus and method is provided for removing smudges ( | 2008-10-30 |
20080266767 | Electronic device having interchangeable display member - A portable electronic device comprises a housing configured to releasably secure thereto one of a plurality of interchangeable display members, at least two of the plurality of display members comprising different types of display members. | 2008-10-30 |
20080266768 | Adjustable display - Various embodiments are directed to a display stand having a base and a mounting arm. The mounting arm includes a hinge connected to the base and a hinge connected to the display so the display can move about three different axes of rotation. | 2008-10-30 |
20080266769 | Electronic device with backlit display - An electronic device comprises a housing having a half-mirror region molded into the housing, and a light source disposed within the electronic device and configured to transmit light through the half-mirror region to an exterior of the housing. | 2008-10-30 |
20080266770 | AUDIO APPARATUS WITH REPLACEABLE PANEL - An audio apparatus is adapted to receive a portable music device. The apparatus has a housing with a face provided on at least a portion thereof. The housing has an interchangeable panel adapted to be removably mounted on the face of the housing to conceal a portion of the face. | 2008-10-30 |
20080266771 | Display device, a front frame used therein, and a method of manufacture thereof - A display device, a front frame used therein, and a method of manufacture thereof are provided. The display device includes a display panel and the front frame. The display panel has a display surface which is partially covered by the front frame. The front frame includes a side wall corresponding to the sides of the display panel, a top plate extending from the side wall towards the center of the display panel, and cushion filler. The top plate has an inner surface featuring a groove distributed along the side wall. The cushion filler is contained within the groove while its top protrudes from the groove and contacts the display surface outside an active area. | 2008-10-30 |
20080266772 | Plasma display device - A plasma display device including a plasma display panel (PDP) having electrodes between two substrates, a chassis base attached to and configured to support the PDP, printed circuit boards (PCBs) configured to drive the electrodes, and a plurality of flexible printed circuits (FPCs) connected to the plurality of PCBs and the electrodes, wherein at least one PCB configured to drive the electrodes is attached to the PDP. | 2008-10-30 |
20080266773 | Computer case having an active panel - An active panel system for implementation in a computer such that at least one case panel of the computer comprises one or more active panels. An active panel is a device that may be disposed in, or replace, a panel of the computer case. The active panel has a variable transparency which is dynamically or programmatically controllable by a user or a controller. An embodiment of an active panel system may be implemented in a computer, for example, to artistically embellish the computer case as well as to alter the transparency of the case such that the contents of the computer case are viewable from the exterior of the computer case without opening the case. | 2008-10-30 |
20080266774 | Wireless card module - A wireless card module comprising a bezel assembly comprising at least one bezel member couplable to a wireless card, the bezel member configured to couple the wireless card to an external antenna. | 2008-10-30 |
20080266775 | PORTABLE COMPUTER - A portable computer includes a main body casing including an upper plate and an opening formed on the upper plate; a cover pad which may be coupled to the upper plate and covers the opening, the cover pad having a plate surface and a rear surface; and a touch-pad coupled to the rear surface of the cover pad through the opening, thus protecting the touch-pad and enabling the touch-pad to sense a coordinate touched on the plate surface and generate a position data of a pointer. | 2008-10-30 |
20080266776 | Modular Computer System - One embodiment of the present invention relates to a modular computer system for use in residential, recreational, and commercial regions. The system is a computer system disposed within an existing outlet receptacle housing. The receptacle includes a conventional NEMA standard OS1 and OS2 type electrical housing and electrical line designed to accommodate a residential or commercial light switch, electrical outlet, etc. The computer system is electrically coupled to the electrical line disposed within the housing of the receptacle and includes a mechanically extendable expansion bus configured to mechanically support and data inter-couple a set of modules for providing computer functionality. The expansion bus can be extended to access the modules or collapsed within the receptacle so as to be externally visually obscured by an interface module or cover. The computer system is configured to dynamically detect and data couple with other modular computer systems in a particular region. | 2008-10-30 |
20080266777 | Serial connection external interface riser cards avoidance of abutment of parallel connection external interface memory modules - A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card. | 2008-10-30 |
20080266778 | Memory module routing - In some embodiments a memory module circuit board includes a first surface adapted to couple a first plurality of memory devices, a plurality of signal lines, and a command and address bus coupled to the signal lines. The command and address bus is routed from the signal lines and adapted to couple to at least one of the first plurality of memory devices in a manner that does not require the command and address bus lines to turn more than approximately ninety degrees before coupling to the at least one of the first plurality of memory devices. Other embodiments are described and claimed. | 2008-10-30 |
20080266779 | DRIVE CARRIER FOR COMPUTER SYSTEMS - A drive carrier for computer systems. At least some of the illustrative embodiments are drive carriers comprising a first suspension member that defines a first side of the drive carrier, a second suspension member that defines a second side of the drive carrier (the second suspension member configured to be manually flexed resiliently away from the drive carrier during installation of a disk drive), a handle having a hinge point coupled to the suspension members (the hinge point defining an axis of rotation for the handle, and the axis of rotation lies substantially parallel to a plane in which both suspension members reside), a first pin configured to couple to a mounting hole of the disk drive (and the first pin coupled to the first suspension member), and a second pin configured to couple to a mounting hole of the disk drive (and the second pin coupled to the second suspension member, wherein the first and second pins suspend the disk drive within the drive carrier between the suspension members). | 2008-10-30 |
20080266780 | Hard disk drive lever with button-induced ejection, and over-travel button-induced ejection, and over-travel indicator - A hard disk drive bracket including a bezel, a lever arm attached to the bezel rotatably between a closed position against the bezel and an open position apart from the bezel, and a unitarily formed body attached to the bezel. The lever arm includes an extension on the rotating end. The unitarily formed body includes a locking member adapted to secure the lever arm in the closed position and a release button arranged to release the locking member when the release button is depressed. The unitarily formed body may be adapted to serve as a horn attached to the bezel rotatably between a natural position in which the locking member impedes the path of the lever arm, and a forced position in which the locking member is clear of the path of the lever arm. | 2008-10-30 |
20080266781 | Small form factor hard disk drive bracket latch/release mechanism - A hard disk drive bracket latch and release mechanism includes a lever arm attached to a hard disk drive bracket bezel rotatably between a closed position against the bezel and an open position apart from the bezel, and a locking mechanism including a wireform disposed in a release button. The lever arm includes a slotted end and spring. The wireform translates between a forced releasing position when the release button is depressed and a natural latching position otherwise. The wireform is shaped to bias the release button outward. The wireform fits into the slotted end of the lever arm in the latching position. | 2008-10-30 |
20080266782 | Waterproof keyboard device - A keyboard device includes a substrate having top and bottom surfaces, and through holes extending from the top surface to the bottom surface. The bottom surface is formed with an air guide groove unit in fluid communication with each through hole. A sealing layer is mounted sealingly on the bottom surface of the substrate such that the through holes and the air guide groove unit constitute an air passage. A wiring board is mounted on the substrate. When a key cap disposed above a corresponding through hole in the substrate is pressed downwardly, a resilient tubular support member disposed between the key cap and the wiring board deforms such that air in the support member is urged into the air passage. | 2008-10-30 |
20080266783 | Docking station for portable media player or storage device - A docking station is provided which includes a housing having a receptacle bay and an electrical connector disposed within the receptacle bay. The receptacle bay of the docking station may be configured to receive a plurality of types and/or sizes of portable media players or storage devices therein. The electrical connector may be configured to transmit digital signals from and/or to the portable media player or storage device. The docking station may also include a height adjustment mechanism for adjusting the height of the electrical connector relative to the receptacle bay. A user interface may be provided for controlling the digital signals. Additionally, the docking station may also include an audio output port, a video output port, a USB port, or a combination thereof. Furthermore, the docking station may also include a speaker assembly and/or a video assembly to receive digital signals from the portable media player or storage device. | 2008-10-30 |
20080266784 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus is configured to be provided with a communication line socket provided on a backside surface of a casing of the electronic apparatus, metallic terminals provided in the communication line socket, and abutment sections each of which is provided in the vicinity of the communication line socket, and is given a predetermined height from the metallic terminals in an insertion direction of the communication line socket. By virtue of the above configuration, even if it is tried to insert a wrong plug into the communication line socket by mistake, the wrong plug abuts against the abutment sections, and the insertion is stopped on the way. | 2008-10-30 |
20080266785 | HEAT DISSIPATOR FASTENER KIT - A heat dissipator fastening kit includes two retaining bars, at least one and as many as three different brackets and multiple fasteners. The retaining bars are resilient, attach to opposite sides of an appropriate heat dissipator and respectively have two ends. The bracket attaches to a motherboard around a CPU and to the retaining bars and has several embodiments to accommodate different types of CPUs, e.g. AM2, K8, LGA775 or P4, and their motherboards. The fasteners attach the retaining bars to a heat dissipator and the bracket and the bracket to a motherboard. With such an arrangement, the heat dissipator fastening kit will be convenient and easy to use. | 2008-10-30 |
20080266786 | METHOD AND APPARATUS FOR HEAT DISSIPATION - Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed. | 2008-10-30 |
20080266787 | On-Chip Interconnect-Stack Cooling Using Sacrificial Interconnect Segments - The present invention relates to an integrated-circuit device and to a method for fabricating an integrated-circuit device with an integrated fluidic-cooling channel. The method comprises forming recesses in a dielectric layer sequence at desired lateral positions of electrical interconnect segments and at desired lateral positions of fluidic-cooling channel segments. A metal filling is deposited in the recesses of the dielectric layer sequence so as to form the electrical interconnect segments and to form a sacrificial filling in the fluidic-cooling channel segments. Afterwards, the sacrificial metal filling is selectively removed from the fluidic-cooling channel segments. | 2008-10-30 |
20080266788 | Radiation device for computer or electric appliances - A radiation device for computer or electric appliances includes a heat inhalant block under a CPU of a computer, a heat transmission block positioned next to the heat inhalant block, a bridge block, a cold crystal and a cooling source block sequentially disposed on the top of the heat transmission block with a bridge block engaged therebetween, a transparent cover covering the top of the cooling source block to form a left and a right flow canals therein, a upper heat radiation module superimposed a lower heat radiation module positioned next to the heat transmission block, a fan on the top of the upper heat radiation module, a set of the heat pipes extended from the heat inhalant block to the lower heat radiation module through the heat transmission block, a pair of lateral pipe connected between the bridge block and the lower heat radiation module and a set of the cold pipes connected between the cooling source block and the upper heat radiation module. | 2008-10-30 |
20080266789 | Telecommunication cabinet with airflow ducting - A telecommunications cabinet in which active equipment can be mounted. The cabinet including an airflow ducting arrangement located in the interior region of the cabinet. The airflow ducting arrangement accommodating thermal cooling of active equipment having internal side-to-side air cooling arrangements. | 2008-10-30 |
20080266790 | SERVER WITH A FLEXIBLE COOLING SCHEME - A server with a flexible cooling scheme is disclosed. The server comprises a case having an inside and an outside. A first fan is positioned inside the case and configured to draw gas from a first area inside the case and force the gas past a first area to be cooled. A first opening in the case is configured to allow gas from outside the case to enter the first area. When the server is in a first cooling configuration the first fan is configured to force the gas past the first area to be cooled and out to the outside of the case through a second opening in the case. When the server is in a second cooling configuration, the server further comprises a heat exchanger located in the first area and configured to seal the first opening in the case thereby preventing outside gas from entering the first area. When the server is in the second cooling configuration, a sealing device is configured to seal the second opening thereby redirecting the first fan to force the gas past the first area to be cooled and back into the first area, thereby re-circulating the gas inside the case. | 2008-10-30 |
20080266791 | REDUNDANT POWER SUPPLY SYSTEM - A redundant power supply system includes a system cabinet, a first power supply apparatus, a second power supply apparatus and a power converting circuit board. The system cabinet at least includes a first receptacle and a second receptacle. The first power supply apparatus has a first connection interface. The second power supply apparatus has a second connection interface. The power converting circuit board is disposed inside the system cabinet and includes a first insertion slot, a second insertion slot and a power converting circuit. A voltage outputted from the first power supply apparatus and/or the second power supply apparatus is converted by the power converting circuit into a regulated voltage when the first connection interface of the first power supply apparatus and the second connection interface of the second power supply apparatus are inserted into the first insertion slot and the second insertion slot, respectively. | 2008-10-30 |
20080266792 | POWER SUPPLY APPARATUS - A power supply apparatus for use with a redundant power supply system includes a casing, a main circuit board and an airflow driving device. The casing includes a first airflow opening and a second airflow opening. The main circuit board is disposed within the casing and includes plural electronic components thereon. The airflow driving device is disposed in the middle region of the main circuit board. A cooling air is pumped by the airflow driving device to be introduced into the inner portion of the casing through one of the first airflow opening and the second airflow opening, then the heat generated from the electronic components is removed by the cooling air, and finally a heated air is exhausted through the other one of the first airflow opening and the second airflow opening. | 2008-10-30 |
20080266793 | Cooling structure for power supply - A cooling structure for a power supply is disclosed. The power supply has a housing. The cooling structure includes a cooling fan and a cooler. The cooling fan is located on the inner side of the top surface of the housing. The cooler is located below the cooling fan. The cooler includes a vertical board and a plurality of cooling fins. The cooling fins are disposed slantwise on the vertical board and at intervals. There is a plurality of air-guiding channels between the cooling fins. Thereby, the airflow of the cooling fan can be guided forward to a specified direction. The hot air circulating flow will not occur. The cooling fan blows onto the electronic elements on the circuit board to exhaust the heat generated by the electronic elements, and noise generated from the cooling fans is lowered. | 2008-10-30 |
20080266794 | Processor control of cooling fluid - A processor of an apparatus in one example is configured to control at least one characteristic of a cooling fluid supplied to an electronic component based on a temperature rise of the cooling fluid between an inlet and an outlet of the electronic component. | 2008-10-30 |
20080266795 | HEAT DISSIPATING DEVICE - A heat dissipation device includes a heat sink and a fan. The heat sink includes two first fins, and a plurality of second fins between the first fins. A locking portion extends outward from each first fin. The locking portions are located higher than the second fins. A sliding guideway is defined in each locking portion. Two flanges extend from two opposite sides of the fan respectively. The flanges are capable of engaging in the guideways of the heat sink to mount the fan to the heat sink. | 2008-10-30 |
20080266796 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins. | 2008-10-30 |
20080266797 | Surface airflow heatsink device and the heatsink device components - It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(ρu | 2008-10-30 |
20080266798 | SYSTEM AND METHOD FOR LIQUID COOLING OF AN ELECTRONIC SYSTEM - A liquid cooled electronic system and method includes a first component rotably connected to a second component via a coolant pathway. The coolant pathway includes at least one hinge assembly disposed and configured to convey coolant from the first component through the hinge assembly to the second component. The hinge assembly includes a first hinge portion in operable communication with the first component, a second hinge portion in operable communication with the second component; and a hinge pin disposed and configured to convey fluid therethrough and connecting the first hinge portion to the second hinge portion. | 2008-10-30 |
20080266799 | Methods and Apparatuses for Cold Plate Stability - A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module. | 2008-10-30 |
20080266800 | HEAT SINK WITH SURFACE-FORMED VAPOR CHAMBER BASE - A heat sink comprises a vapor chamber base formed in a three-dimensional arrangement that mirrors topology of underlying structures on a substrate upon which the heat sink can be mounted, and at least one fin coupled to the vapor chamber base. | 2008-10-30 |
20080266801 | Phase change cooled power electronic module - A power electronic module is cooled by a phase change heat spreader or cooling device. The module may include switched or unswitched devices, such as power transistors, diodes, and so forth, forming circuits such as rectifiers, inverters, converters, or the like, or portions of such circuits. Heat is transferred to the heat spreader in which a continuous phase change cycle takes place to cool the circuit components. The heat spreader may extend over an area sufficient to reduce the temperature of the components, and ultimately will render portions of the overall structure more isothermal. | 2008-10-30 |
20080266802 | Phase change cooled electrical connections for power electronic devices - A technique is disclosed for cooling connections points in power electronic circuits, such as points at which wire bonding connections are made. A phase change heat spreader is thermally coupled at or near the connection point and a continuous phase change takes place in the heat spreader to extract heat from the connection point during operation. The heat spreader may extend over a area larger than the connection point to enhance cooling and to dissipate heat over a larger area. Small, specifically directed applications are possible in which specific points are cooled together or individually. | 2008-10-30 |
20080266803 | Phase change cooled electrical bus structure - A technique for cooling electrical bus structures is disclosed, in which a phase change heat spreader is thermally coupled to the bus. A continuous phase change cycle occurs within the heat spreader to draw heat from the bus during operation. The heat spreader may be planar, and extend over an area greater then the surface area of the bus to enhance cooling and to render the overall assembly more isothermal. The heat spreader may be placed near bus joints and circuits to remove heat caused by increased resistance at such locations. | 2008-10-30 |
20080266804 | THERMALLY CONDUCTIVE GREASE - The invention relates to thermally conductive greases that may contain carrier oil(s), dispersant(s), and thermally conductive particles, wherein the thermally conductive particles are a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D | 2008-10-30 |
20080266805 | Carrier For Electrical Components With Soldered-On Cooling Body - The invention relates to an assembly of a carrier for electrical components that are arranged for producing more heat than can be dissipated via natural cooling at least under certain operating conditions and a cooling body mechanically and thermally connected thereto, whereby the carrier is provided with a metal part that is connected to the cooling body by means of a metallic connection. Mounting a metal part on the carrier makes it possible to form a metallic connection between the metal part and the metal cooling body. The invention also relates to a method for assembling an assembly of a carrier for heat-producing electrical components and a cooling body mechanically and thermally connected thereto, whereby the components are initially mounted on the carrier and a metal part of the carrier is then connected to the cooling body by means of a metallic connection. | 2008-10-30 |
20080266806 | ELECTRONIC ASSEMBLY THAT INCLUDES A HEAT SINK WHICH COOLS MULTIPLE ELECTRONIC COMPONENTS - The electronic assembly includes a substrate that has a first side and a second side. The electronic assembly further includes first and second electronic components that are mounted on the first side of the substrate. The first electronic component extends a different height above the first side of the substrate as the second electronic component. The electronic assembly further includes a heat sink that includes a base and fins which extend from the base. The base of the heat sink includes a formation which engages the second electronic component in order to maintain the base of the heat sink in substantially parallel relation to the substrate. In some embodiments, the formation in the base of the heat sink is a detent, while in other embodiments the formation in the base of the heat sink is a projection. | 2008-10-30 |
20080266807 | ELECTRONIC ASSEMBLY WITH EMI SHIELDING HEAT SINK - An example electronic assembly includes a substrate that has a first surface and a second surface. The first surface of the substrate includes a grounding ring. The electronic assembly further includes one or more electronic components that are mounted on the first surface of the substrate such that the grounding ring at least partially surrounds the electronic components(s). A heat sink engages the electronic component(s) and the grounding ring in order provide cooling and EMI shielding to the electronic components(s). In some embodiments, the grounding ring surrounds the entire electronic components(s) and the heat sink engages the entire grounding ring, although in other embodiments, the grounding ring may partially surround the electronic components(s) and/or the heat sink may engage just a portion of the grounding ring. | 2008-10-30 |
20080266808 | Cooling Assembly - A method and apparatus for cooling an electronic application having at least one heat-generating electronic component mounted on a circuit board. A heat transferring heat sink is attached to the circuit board in thermal contact with one heat generating electronic component by first being statically fixed to the circuit board in a stationary position at a specified height above the circuit board, and then by resiliently biasing the component against the heat sink. | 2008-10-30 |
20080266809 | ENHANCED THERMAL CONDUCTING FORMULATIONS - A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products. | 2008-10-30 |
20080266810 | Heat management system for a power switching device - A power switching device is provided that includes a housing, a printed circuit board disposed within the housing, and a plurality of electrical components mounted to the printed circuit board, including at least one relay. At least one pair of load terminals is connected to the printed circuit board on opposite sides of the relay, and a plurality of heat transfer elements are formed through and in the printed circuit board and are dispersed proximate the relay, around the load terminals, and extending to the peripheral portion. | 2008-10-30 |
20080266811 | Motor Drive Circuit And Outdoor Unit For Air Conditioner - One of the purpose is to obtain a motor drive circuit and an outdoor unit for an air conditioner using the same, which can flexibly support change of a model at a low price and in a small lot without using unnecessary materials, wherein a stress in a soldering part due to self-heating is low, a solder reliability is high, and design constraints are small, while maintaining a low-noise and low-loss power wiring due to lowering inductance. The motor drive circuit according to the present invention, for driving the motor using the converter circuit and the inverter circuit, whereon electronic components making up a converter circuit and an inverter circuit are mounted, which includes a lead frame molded board | 2008-10-30 |
20080266812 | Pressure-contact power semiconductor module and method for producing the same - A pressure-contact power semiconductor module is arranged on a heat sink. The power semiconductor module is used with at least one substrate provided with conductor tracks and power semiconductor components. The module has a mounting body, on the underside of which the at least one substrate is arranged, and which is formed with cutouts. The module also includes a load connection element which is provided with contact feet that project away from strip sections and make pressure contact with the conductor tracks. The power semiconductor module additionally has a dimensionally stable cover, which covers the mounting body on all sides and is connected to the mounting body by means of snap-action latching connections. At least one pad element is restrained between the cover and the strip sections of the load connection elements. | 2008-10-30 |
20080266813 | Blade Server Assembly - A blade server assembly is disclosed that includes a blade server chassis, a blade server, and a support assembly connected with the blade server chassis and with the blade server so as to support the blade server substantially outside the blade server chassis. A method is also disclosed for maintaining a blade server installed in a blade server chassis that includes supporting the blade server substantially outside the blade server chassis through a support assembly connected with the blade server chassis and with the blade server. | 2008-10-30 |
20080266814 | Module Rear Wall for a Switchgear Assembly Module, Switchgear Assembly Module and Electrical Switchgear Assembly - The invention relates to a modular rear wall for a switching system module, in particular an insertion module. Said modular rear wall comprises a measuring device which is integrated therein and which forms an integral component of the switching system module. The invention also relates to a switching circuit module which comprises said type of modular rear wall, in addition to a switching system comprising at least one switching system module having a modular rear wall. | 2008-10-30 |
20080266815 | System and method to conjoin blade modules - Embodiments of the present technique are directed to a blade system. The blade system may include a first blade module comprising a first conjoining channel, and a second blade module comprising a second conjoining channel aligned with the first conjoining channel, wherein the first blade module and the second blade module are symmetrical and mechanically coupled to form a conjoined blade, wherein electrical components of the first blade module and electrical components of the second blade module are electrically coupled via an electrical coupler routed through the aligned first conjoining channel and second conjoining channel. | 2008-10-30 |
20080266816 | Light-Weight Solid State Drive With Rivet Sets - A Solid State Drive (SSD) device includes a printed circuit board assembly (PCBA) defining rivet holes, and a support structure including parallel side frame rails defining rivet openings and support platforms for receiving and supporting the PCBA. Compression-mated rivet sets are used to connect the PCBA to the support structure, each rivet set including a female rivet portion and an associated male rivet portion. The PCBA is mounted onto the support structure such that the rivet holes are aligned with the rivet openings of the plurality of rivet openings, and then the rivet sets are mounted and secured using an automatic rivet tool such that each rivet set extends through an associated rivet hole/opening and fixedly engaged such that the PCBA and the support structure are held between end caps of the respective male and female rivet portions. | 2008-10-30 |
20080266817 | SWAPPABLE ELECTRONIC DEVICE HAVING LOCKING ELEMENT - An electronic device swappable to be embedded into a system cabinet includes a casing and a locking element. The casing includes a first sidewall and a second sidewall, which have a first opening and a second opening, respectively. The locking element includes a first end part, a protrusion part, a bent part and a second end part. The first end part is fixed on an inner surface of the second sidewall of the casing. The protrusion part is partially exposed from the second opening to be engaged with a receiving structure of the system cabinet. The bent part is arranged between the first end part and the protrusion part. The second end part is exposed from the first opening so as to be protruded from the first sidewall of the casing. | 2008-10-30 |
20080266818 | Scanning module for a scanner system having a MEMS device or the like - Briefly, in accordance with one or more embodiments, a scanning module for a scanner system comprises a frame having a first section and a second section. The first section of the frame is capable of receiving a laser to secure the laser in the first section, and the second section of the frame is capable of receiving a MEMS device having a mirror, to secure the MEMS device in the first section. The laser is aligned with the mirror by the frame to cause light emitted from the laser to impinge upon the mirror during operation of the laser. Such an arrangement may facilitate the physical and/or electrical assembly of the components of the scanner system. | 2008-10-30 |
20080266819 | MOUNTING SUPPORT FOR A FLEXIBLE PRINTED CIRCUIT BOARD AND RETAINING APPARATUS HAVING THE SAME - An exemplary mounting support for a flexible printed circuit board is provided. The flexible printed circuit board has a side surface and at least one electronic component mounted on the side surface. The mounting support includes a first surface for contacting with the side surface of the flexible printed circuit board and a second surface on an opposite side of the mounting support to the first surface. The mounting support has at least one first recess defined in the first surface for receiving the at least one electronic component therein and at least one through-hole defined through the first surface and the second surface. The mounting support has at least one second recess defined in the second surface. The mounting support can fix a double surface mounted flexible printed circuit board flatly, thereby enhancing laser processing precision. | 2008-10-30 |
20080266820 | SYSTEM FOR SUPPORTING AND ELECTRICALLY GROUNDING A COVER OF AN ELECTRONIC CONTROL MODULE - A system for supporting and electrically grounding metallic covers for electronic control modules includes a housing having wall portions defining a cavity with an opening, a circuit board located within the cavity, the circuit board having a ground plane formed within the circuit board, the circuit board having a top surface substantially facing the opening and supports for proving structural support for the cover, the supports being located on the top surface of the circuit board. The system shields emissions radiating from the module. | 2008-10-30 |
20080266821 | Housing for an Electronic Circuit and Method for Sealing the Housing - A housing for an electronic circuit is provided with a single-part seal for sealing a clearance space between a floor plate and a cover, through which exposed electrical conductors are led, which connect the circuit on the inside of the housing to the surroundings. The floor plate, the cover and the conductors are made of the same kind of material, e.g., a metal. The floor plate and the cover are made of aluminum and the conductors of copper. | 2008-10-30 |
20080266822 | ELECTRONIC ELEMENTS CARRIER AND MANUFACTURING METHOD THEREOF - An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element. | 2008-10-30 |
20080266823 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly ( | 2008-10-30 |
20080266824 | PAD AND CIRCUIT BOARD, ELECTRONIC DEVICE USING SAME - A pad for soldering a lead of an electronic element includes a solder portion and one or more non-contiguous extending portions. The solder portion is configured for positioning the lead of the electronic element thereon and has a size and shape substantially equal to the size and shape of the footprint of the lead. The one or more non-contiguous extending portions extending from the solder portion and configured for providing additional solder paste in the soldering process. The pad can limit the position of the leads of the electronic element in the solder portion, thus ensuring accurate positioning of the electronic element. | 2008-10-30 |
20080266825 | ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT MOUNTED APPARATUS, METHOD OF INSPECTING BONDING PORTION THEREIN, AND CIRCUIT BOARD - An electronic component package includes: an insulating carrier substrate; a connection wiring that is provided on one side of the carrier substrate; an IC chip that is connected to the connection wiring; an external connection land that is disposed on the other side of the carrier substrate and is connected to the connection wiring via a wiring in the carrier substrate; and a solder ball that is disposed on the external connection land. A region of the external connection land that can be bonded to the solder ball has an outer shape that includes at least one arc portion and at least one straight portion. With this configuration, it is possible to provide an electronic component mounted apparatus in which bonding failure of the external connection land and the circuit board-side land with the solder ball can be reduced, and the bonding state can be easily inspected, and a method of inspecting a bonding portion therein. | 2008-10-30 |
20080266826 | ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME - An exemplary assemblable substrate for an SIP includes a substrate and a group of welding pads. The substrate defines a receiving portion therein for receiving a line of pins of the SIP. The group of welding pads is formed on the substrate for electrically coupling the line of pins to the substrate; the group of welding pads being distributed around the receiving portion, two welding pads corresponding to two adjacent pins in the same line being distributed on opposing sides of the receiving portion. | 2008-10-30 |
20080266827 | Chip component mounting structure, chip component mounting method, and electronic device - A chip component mounting structure is provided that has a chip component surface mounted on a pair of electrodes formed on a substrate. The electrodes have differing areas, and the chip component and t. | 2008-10-30 |
20080266828 | LEAD FRAME WITH SOLDER FLOW CONTROL - A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding. | 2008-10-30 |
20080266829 | SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES - A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via. | 2008-10-30 |
20080266830 | RADIO FREQUENCY ABSORBER - An exemplary embodiment of the present invention comprises a radio frequency absorber that is operative for absorbing electromagnetic energy, scattering electromagnetic signals, and/or attenuating electromagnetic signals. In accordance with certain aspects of the invention, the radio frequency absorber is substantially flat and comprises an absorbing surface. The absorbing surface is operative to absorb electromagnetic energy, scatter electromagnetic signals, and/or attenuate electromagnetic signals. In exemplary embodiments of the invention, the radio frequency absorber comprises a plurality of holes disposed within the radio frequency absorber. The radio frequency absorber, according to various embodiments of the present invention, is configured to reduce cavity oscillations and/or cavity modes and resonances within an integrated circuit device, such as a device that houses a monolithic microwave integrated circuit. | 2008-10-30 |
20080266831 | Filter and plasma display device comprising the same - A filter including: a base film; a reflection preventing layer which is formed on one side of the base film; an electro magnetic interference (EMI) shielding layer which is formed on another side of the base film; an adhesive layer, which is formed between the EMI shielding layer and a front substrate of a display panel so as to directly adhere the filter to the front substrate of the display panel; and a conductive member which is formed to externally protrude and is formed inside a groove that penetrates the reflection preventing layer and the base film so as to electrically connect the EMI shielding layer and the conductive member. Accordingly, the filter includes a single base film and can ground the EMI shielding layer at the front surface of the plasma display device. The filter is included in a plasma display device. | 2008-10-30 |
20080266832 | Lighting device - A lighting device, for illuminating display designed parts on a display plate, includes at least one light source arranged at a rear side of the display plate, and a light guide body having a light guide portion for guiding the light toward its outer-circumferential portion to output the light toward the display designed parts through a front surface of the light guide portion. The outer-circumferential portion has an outer-circumferential side wall surface at is outer end. The light guide portion has at least one projecting portion projecting from the outer-circumferential side wall surface. The projecting portion is provided with a reflecting side surface formed along the outer-circumferential side wall surface so that the reflecting side surface can reflect the light traveling in the light guide portion to be outputted through the front surface of the light guide portion. | 2008-10-30 |
20080266833 | Illuminated Rigid Body Using Contiguously Illuminated Light Source - A rigid light-passing body is disclosed. Within the body, an electroluminescent strand is supported in a predetermined configuration. In some embodiments, the body may be tubular, with the electroluminescent strand configured in spaced-apart windings around a support extending through the tubular body. In other embodiments related to area lighting, windings or strands may be closely spaced, or touching so that the windings or strands are self-supporting in their predetermined configuration. In other embodiments, there may be multiple strands that produce light of differing colors, the multiple strands attached to a support. The rigid body may also be a spherical shape, with a support therein for supporting at least one electroluminescent strand. For most embodiments, a housing is provided that includes an inverter and battery carrier for providing electrical power to the electroluminescent strand. In other embodiments, electrical power may be provided from an external source. | 2008-10-30 |
20080266834 | Antenna Through the Use of Lamp Electrodes - The present invention deals with wireless control of a lamp such as a fluorescent lamp controlled by a ballast with a wireless control interface for RF communication. The receiver input and the transmitter output of the control interface module are connected to one or more electrode wires by means of (a) coupling capacitor(s) or a Lecher line transformer. During operation the lamp electrodes serve as the lamp antenna. | 2008-10-30 |
20080266835 | Folder with detachable illumination device - A folder has a detachable illumination device disposed on an upper cover of the folder so that the illumination device, such as a lamp, can be momentarily inserted into a specific power socket to provide illumination, or can be detached and placed in a predetermined slot formed on an inner surface of the folder to facilitate the carrying. Thus, the folder can break the limitation in use in various occasions where no sufficient light source is provided, and can thus enhance the utility and the convenience thereof. | 2008-10-30 |
20080266836 | Articulated aquarium light - An articulated aquarium light is combined with a display case. The light is secured to ground, includes an upright support, and a cantilevered arm mounting one or more operative units, such as lights, etc. The light may include adjustment for the length of the support, thus allowing the cantilevered arm to be moved upward or downward. The light may alternatively or additionally include adjustment of the angular position of the cantilevered arm, thus allowing the arm to swing away from the case. | 2008-10-30 |
20080266837 | Flashlight - The present invention is an improved flashlight. In particular, the present invention is directed to an LED flashlight tag inserted into a perimeter buffer that can also hold an identification tag. The flashlight has a two-sided flashlight tag that contains a power supply, two light sources and a power switch. The flashlight tag is inserted into a perimeter buffer that exposes an exterior side of the flashlight tag and has sufficient space to contain an identification tag adjacent to an interior side of the flashlight tag. | 2008-10-30 |
20080266838 | Illuminated helmet - An illuminated helmet has a body, an illuminating device and a shell. The body is plastic foam and has an outer surface. The illuminating device is mounted on the outer surface of the body and has a flexible ribbon cable, multiple LEDs, a battery cartridge, and a switch. The switch is mounted on the body and is connected with the multiple LEDs and the battery cartridge by using the flexible ribbon cable. The shell is a plastic sheet and has an inner surface. The ribbon cable is flexible and thin, allowing the ribbon cable to be mounted smoothly on the outer surface of the body without breaking so the shell caps the body well and will not break. | 2008-10-30 |
20080266839 | HEADWEAR AND HEADWEAR BILL WITH INTEGRATED LIGHT ASSEMBLY - A lighted hat as disclosed herein includes a light assembly that is integrated into the bill section of the hat. The bill section includes a rigid substrate that has features for accommodating the light assembly. The light assembly includes at least one light element, a power supply for the at least one light element, and a control element that controls activation of the at least one light element. The substrate and the entire light assembly (other than the light-emitting portion of the light element) is covered by the outer material of the bill section. The integrated nature of the light assembly results in a clean and streamlined appearance for the lighted hat. | 2008-10-30 |
20080266840 | SURGICAL ILLUMINATION DEVICE - A surgical illumination device is disclosed. The device has a light source mounted at the end of a flexible boom. The boom is attached to a housing containing a battery and an electronic controller. A switch actuator on the housing allows a user to turn the device on and off through the controller. | 2008-10-30 |