44th week of 2016 patent applcation highlights part 57 |
Patent application number | Title | Published |
20160322221 | Low Defect Relaxed SiGe/Strained Si Structures on Implant Anneal Buffer/Strain Relaxed Buffer Layers with Epitaxial Rare Earth Oxide Interlayers and Methods to Fabricate Same | 2016-11-03 |
20160322222 | PREPARATION OF LOW DEFECT DENSITY OF III-V ON SI FOR DEVICE FABRICATION | 2016-11-03 |
20160322223 | PREPARATION OF LOW DEFECT DENSITY OF III-V ON SI FOR DEVICE FABRICATION | 2016-11-03 |
20160322224 | PROCESSES FOR USING FLUX AGENTS TO FORM POLYCRYSTALLINE GROUP III-GROUP V COMPOUNDS FROM SINGLE SOURCE ORGANOMETALLIC PRECURSORS | 2016-11-03 |
20160322225 | SEED LAYER STRUCTURE FOR GROWTH OF III-V MATERIALS ON SILICON | 2016-11-03 |
20160322226 | Techniques for Fabricating Reduced-Line-Edge-Roughness Trenches for Aspect Ratio Trapping | 2016-11-03 |
20160322227 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-11-03 |
20160322228 | STRUCTURE AND METHOD TO FORM III-V, Ge AND SiGe FINS ON INSULATOR | 2016-11-03 |
20160322229 | METHODS FOR SELECTIVE DEPOSITION OF METAL SILICIDES VIA ATOMIC LAYER DEPOSITION CYCLES | 2016-11-03 |
20160322230 | ETCHING METHOD AND ETCHING APPARATUS | 2016-11-03 |
20160322231 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322232 | USE OF NON-OXIDIZING STRONG ACIDS FOR THE REMOVAL OF ION-IMPLANTED RESIST | 2016-11-03 |
20160322233 | SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME | 2016-11-03 |
20160322234 | METHODS AND APPARATUS FOR CORRECTING SUBSTRATE DEFORMITY | 2016-11-03 |
20160322235 | METHOD FOR FABRICATING SPECIFIC TERMINATION ANGLES IN TITANIUM TUNGSTEN LAYERS | 2016-11-03 |
20160322236 | SELECTIVE METAL/METAL OXIDE ETCH PROCESS | 2016-11-03 |
20160322237 | METHOD FOR FABRICATING AN ADVANCED ROUTABLE QUAD FLAT NO-LEAD PACKAGE | 2016-11-03 |
20160322238 | METHOD OF FORMING A MOLDING LAYER FOR SEMICONDUCTOR PACKAGE | 2016-11-03 |
20160322239 | Methods and Apparatus for Cleaning a Substrate | 2016-11-03 |
20160322240 | SEMICONDUCTOR APPARATUS AND WASHING METHOD | 2016-11-03 |
20160322241 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | 2016-11-03 |
20160322242 | METHOD AND APPARATUS FOR CONTROLLING PLASMA NEAR THE EDGE OF A SUBSTRATE | 2016-11-03 |
20160322243 | CHAMBER | 2016-11-03 |
20160322244 | WAFER ROTATING APPARATUS | 2016-11-03 |
20160322245 | WORKPIECE TRANSFER SYSTEM | 2016-11-03 |
20160322246 | END EFFECTOR DEVICE | 2016-11-03 |
20160322247 | END EFFECTOR AND SUBSTRATE CONVEYING ROBOT | 2016-11-03 |
20160322248 | SUBSTRATE POSITION ALIGNMENT DEVICE AND CONTROL METHOD OF SUBSTRATE POSITION ALIGNMENT DEVICE | 2016-11-03 |
20160322249 | DEVICE FOR ALIGNMENT OF TWO SUBSTRATES | 2016-11-03 |
20160322250 | Wafer Releasing | 2016-11-03 |
20160322251 | FILM FOR SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322252 | REAR SURFACE-PROTECTIVE FILM FOR PROTECTING REAR SURFACE OF SEMICONDUCTOR ELEMENT, INTEGRATED FILM, FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING CHIP | 2016-11-03 |
20160322253 | Substrate Carrier For Solar Cells | 2016-11-03 |
20160322254 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | 2016-11-03 |
20160322255 | METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCTIVE LAYER | 2016-11-03 |
20160322256 | Technique that Patterns Both Sides of a Thin Wafer to Fabricate Bi-Directional Devices | 2016-11-03 |
20160322257 | BiMOS DEVICE WITH A FULLY SELF-ALIGNED EMITTER-SILICON AND METHOD FOR MANUFACTURING THE SAME | 2016-11-03 |
20160322258 | PERFORMANCE OPTIMIZED GATE STRUCTURES | 2016-11-03 |
20160322259 | GRAPHOEPITAXY DIRECTED SELF-ASSEMBLY PROCESS FOR SEMICONDUCTOR FIN FORMATION | 2016-11-03 |
20160322260 | BLOCK LEVEL PATTERNING PROCESS | 2016-11-03 |
20160322261 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322262 | INTEGRATION OF DEVICES | 2016-11-03 |
20160322263 | LOW-COST CMOS STRUCTURE WITH DUAL GATE DIELECTRICS AND METHOD OF FORMING THE CMOS STRUCTURE | 2016-11-03 |
20160322264 | FIN FIELD EFFECT TRANSISTOR INCLUDING A STRAINED EPITAXIAL SEMICONDUCTOR SHELL | 2016-11-03 |
20160322265 | METHOD AND APPARATUS FOR DETECTION OF FAILURES IN UNDER-FILL LAYERS IN INTEGRATED CIRCUIT ASSEMBLIES | 2016-11-03 |
20160322266 | METHOD OF SURFACE PROFILE CORRECTION USING GAS CLUSTER ION BEAM | 2016-11-03 |
20160322267 | MULTI-MODEL METROLOGY | 2016-11-03 |
20160322268 | SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF | 2016-11-03 |
20160322269 | INTEGRATED CIRCUIT COMPRISING AT LEAST AN INTEGRATED ANTENNA | 2016-11-03 |
20160322270 | 3D TAP & SCAN PORT ARCHITECTURES | 2016-11-03 |
20160322271 | Electronic Component and Method for Electrically Coupling a Semiconductor Die to a Contact Pad | 2016-11-03 |
20160322272 | INTEGRATED FILM, FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING CHIP | 2016-11-03 |
20160322273 | SIX-SIDED PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) | 2016-11-03 |
20160322274 | SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322275 | COOLER-INTEGRATED SEMICONDUCTOR MODULE | 2016-11-03 |
20160322276 | INTEGRATED CIRCUIT CHIP ASSEMBLED ON AN INTERPOSER | 2016-11-03 |
20160322277 | INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT | 2016-11-03 |
20160322278 | SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322279 | PACKAGE FOR A SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322280 | PACKAGE FOR A SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322281 | POWER MODULE AND METHOD FOR MANUFACTURING THE SAME | 2016-11-03 |
20160322282 | THROUGH ELECTRODE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-11-03 |
20160322283 | ENCAPSULATED CONFORMAL ELECTRONIC SYSTEMS AND DEVICES, AND METHODS OF MAKING AND USING THE SAME | 2016-11-03 |
20160322284 | METHOD OF TRANSFERRING AND ELECTRICALLY JOINING A HIGH DENSITY MULTILEVEL THIN FILM TO A CIRCUITIZED AND FLEXIBLE ORGANIC SUBSTRATE AND ASSOCIATED DEVICES | 2016-11-03 |
20160322285 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-11-03 |
20160322286 | Semiconductor Device and Power Converter Using the Same | 2016-11-03 |
20160322287 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322288 | Fan-Out Wafer Level Package Structure | 2016-11-03 |
20160322289 | WIRING SUBSTRATE | 2016-11-03 |
20160322290 | SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES INCLUDING MULTI-LAYER GLASS CORE AND METHODS OF MAKING THE SAME | 2016-11-03 |
20160322291 | WORK PIECES AND METHODS OF LASER DRILLING THROUGH HOLES IN SUBSTRATES USING AN EXIT SACRIFICIAL COVER LAYER | 2016-11-03 |
20160322292 | SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS | 2016-11-03 |
20160322293 | PRINTED WIRING BOARD, METHOD FOR PRODUCING PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322294 | WIRING SUBSTRATE | 2016-11-03 |
20160322295 | WIRING SUBSTRATE | 2016-11-03 |
20160322296 | PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE PACKAGE SUBSTRATES, AND METHODS FOR FABRICATING THE SEMICONDUCTOR PACKAGES | 2016-11-03 |
20160322297 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-11-03 |
20160322298 | CUT FIRST ALTERNATIVE FOR 2D SELF-ALIGNED VIA | 2016-11-03 |
20160322299 | SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322300 | INTEGRATED DEVICE PACKAGE COMPRISING AN ELECTROMAGNETIC (EM) PASSIVE DEVICE IN AN ENCAPSULATION LAYER, AND AN EM SHIELD | 2016-11-03 |
20160322301 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2016-11-03 |
20160322302 | MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-11-03 |
20160322303 | SEMICONDUCTOR DEVICE | 2016-11-03 |
20160322304 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | 2016-11-03 |
20160322305 | CHIP PACKAGE AND FABRICATION METHOD THEREOF | 2016-11-03 |
20160322306 | Integrated Circuit Substrate and Method for Manufacturing the Same | 2016-11-03 |
20160322307 | METHOD OF FORMING MARK PATTERN, RECORDING MEDIUM AND METHOD OF GENERATING MARK DATA | 2016-11-03 |
20160322308 | REAR SURFACE-PROTECTIVE FILM, FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING CHIP | 2016-11-03 |
20160322309 | Method and Apparatus for Creating and Placing a Micro Message | 2016-11-03 |
20160322310 | Image Pickup Apparatus and Camera Module | 2016-11-03 |
20160322311 | THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACKAGE WARPAGE | 2016-11-03 |
20160322312 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF | 2016-11-03 |
20160322313 | LIGHT SENSITIVE SWITCH FOR SEMICONDUCTOR PACKAGE TAMPER DETECTION | 2016-11-03 |
20160322314 | LIGHT SENSITIVE SWITCH FOR SEMICONDUCTOR PACKAGE TAMPER DETECTION | 2016-11-03 |
20160322315 | MOISTURE-RESISTANT ELECTRONIC COMPONENT, NOTABLY MICROWAVE, AND METHOD FOR PACKAGING SUCH A COMPONENT | 2016-11-03 |
20160322316 | SEMICONDUCTOR STRUCTURE WITH COMPOSITE BARRIER LAYER UNDER REDISTRIBUTION LAYER AND MANUFACTURING METHOD THEREOF | 2016-11-03 |
20160322317 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-11-03 |
20160322318 | METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES | 2016-11-03 |
20160322319 | Method of Forming a Solder Bump on a Substrate | 2016-11-03 |
20160322320 | TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS | 2016-11-03 |