45th week of 2020 patent applcation highlights part 72 |
Patent application number | Title | Published |
20200352063 | Electromagnetic Wave Shield Film, Printed Wiring Board Using Same, and Rolled Copper Foil - An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m | 2020-11-05 |
20200352064 | Electromagnetic Wave Shield Film, Printed Wiring Board Using Same, and Rolled Copper Foil - An electromagnetic wave shield film in which peeling off between a metal thin film and an adhesive layer is prevented and a printed wiring board employing the electromagnetic wave shield are provided. An electromagnetic wave shield film is formed by laminating at least a metal thin film and an adhesive layer in order, and the water vapor permeability of the electromagnetic wave shield film according to JISK7129 is 0.5 g/m | 2020-11-05 |
20200352065 | APPARATUS AND METHOD FOR UTILIZING COMMERCIAL OFF THE SHELF CIRCUIT BOARDS IN A HIGHLY KINEMATIC ENVIRONMENT - A system is disclosed which utilizes a stabilization disk | 2020-11-05 |
20200352066 | WORK MACHINE AND MOUNTING METHOD - A work machine and a mounting method by which end portions of a wire member can be mounted on connecting sections which are arranged variously are provided. A work head includes a first holding section configured to hold a first end portion and a second holding section configured to hold a second end portion. A control device includes a first mounting section configured to mount the first end portion held by the first holding section on a first connecting section, a moving section configured to cause a work head moving device to move the work head in accordance with a position of the second connecting section after having mounted the first end portion on the first connecting section, and a second mounting section configured to mount the second end portion held by the second holding section on a second connecting section. | 2020-11-05 |
20200352067 | CARRIER FOR REVERSIBLY IMMOBILIZING ONE OR MORE OBJECTS - A carrier for reversibly immobilizing one or more objects is disclosed. The carrier comprises a frame having a major axis, a top surface, a bottom surface, and one or more openings through the frame along the major axis. The carrier also comprises a film comprising a thermoplastic elastomer material and having a top surface and a bottom surface. The film is attached to the frame based on thermal bonding of the top surface of the film to the bottom surface of the frame, is under tension along the major axis, and is free to flex at the openings. The top surface of the film comprises one or more exposed top surface portions that are accessible through the openings. The exposed top surface portions exhibit a holding force on stainless steel as per ASTM D1000 that is greater than that of the bottom surface of the film. | 2020-11-05 |
20200352068 | DYE AND PRY PROCESS FOR SURFACE MOUNT TECHNOLOGY DUAL IN-LINE MEMORY MODULE - Embodiments of the invention include a dye and pry process for removing a surface mount technology (SMT) dual in-line memory module (DIMM) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the SMT DIMM. The package assembly is dried, and a dummy card stock is installed in the SMT DIMM using an epoxy. The SMT DIMM is then removed by applying a force to an exposed cavity between the dummy card stock and the semiconductor package assembly. The semiconductor package assembly and the SMT DIMM can then be inspected for the dye to locate cracks. | 2020-11-05 |
20200352069 | METHOD FOR INSPECTING INSERTION STATES OF PLURALITY OF PINS INCLUDED IN CONNECTOR INSERTED INTO SUBSTRATE, AND SUBSTRATE INSPECTION APPARATUS - A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus. | 2020-11-05 |
20200352070 | MICRO-COMPONENT TRANSFER SYSTEMS, METHODS, AND DEVICES - A system includes a computing device with circuitry and memory with instructions for execution by the circuitry. The instructions include monitoring signals indicative of a non-uniform distance between a transfer head and a receiving substrate, and, in response to the monitored signals, actuating one or more actuators towards the transfer head or the receiving substrate to deform the transfer head or the receiving substrate. | 2020-11-05 |
20200352071 | RANUNCULUS PLANT NAMED 'ABUNICORNO' - A new and distinct cultivar of | 2020-11-05 |
20200352072 | Ranunculus plant named 'Aborione' - A new and distinct cultivar of | 2020-11-05 |
20200352073 | Ranunculus plant named 'ABPEGASO' - A new and distinct cultivar of | 2020-11-05 |
20200352074 | Ranunculus 'Abgunray' - A new and distinct cultivar of | 2020-11-05 |