45th week of 2014 patent applcation highlights part 15 |
Patent application number | Title | Published |
20140327128 | Cooling System for Molded Modules and Corresponding Manufacturing Methods - A cooling system for molded modules includes a plurality of individual modules each including a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and at least partly uncovered by the mold compound, and a cooling plate at least partly uncovered by the mold compound. A molded body surrounds a periphery of each individual module to form a multi-die module. The leads of each individual module and the cooling plates are at least partly uncovered by the molded body. A lid with a port is attached to a periphery of the molded body at a first side of the multi-die module. The lid seals the multi-die module at the first side to form a cavity between the lid and the molded body for permitting fluid exiting or entering the port to contact the cooling plates of each individual module. | 2014-11-06 |
20140327129 | PACKAGE ON PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is a package on package (PoP) device and a method of manufacturing the same. In the PoP device, a thermal interface material layer is interposed between a lower semiconductor chip and an upper package substrate, and a heat sink is disposed on an upper semiconductor package substrate. This maximizes heat release. Accordingly, an operation speed can be improved and malfunction limitation can be solved. | 2014-11-06 |
20140327130 | SEMICONDUCTOR DEVICE PACKAGES INCLUDING THERMALLY INSULATING MATERIALS AND METHODS OF MAKING AND USING SUCH SEMICONDUCTOR PACKAGES - Semiconductor devices may include a first semiconductor die comprising a heat-generating region located at a periphery thereof. A second semiconductor die is attached to the first semiconductor die. At least a portion of the heat-generating region is located laterally outside a footprint of the second semiconductor die. A thermally insulating material is located on a side surface of the second semiconductor die. Methods of forming semiconductor devices may involve attaching a second semiconductor die to a first semiconductor die. The first semiconductor die includes a heat-generating region at a periphery thereof. At least a portion of the heat-generating region is located laterally outside a footprint of the second semiconductor die. A thermally insulating material is located on a side surface of the second semiconductor die. | 2014-11-06 |
20140327131 | PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion and having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers. | 2014-11-06 |
20140327132 | TSV Backside Reveal Structure and Exposing Process - A TSV backside reveal structure is provided, formed by a TSV conductive column on a substrate running throughout the substrate front surface and substrate back surface and stretching out of the substrate back surface; wherein, a sloping buffer is formed within the region between the substrate back surface and the TSV, and the height of the sloping buffer changes continuously; wherein the region close to the TSV has the highest height and the height of the buffer gradually decreases to that of the substrate back surface. | 2014-11-06 |
20140327133 | METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING THE SAME - A metal bump structure for use in a driver IC includes a metal bump disposed on a matrix, an optional capping layer disposed on the metal bump to completely cover the metal bump and a protective layer disposed on the metal bump to completely cover and protect the metal bump or the optional capping layer and so that the metal bump is not exposed to an ambient atmosphere. The protective layer or the optional capping layer may have a fringe disposed on the matrix. | 2014-11-06 |
20140327134 | METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING THE SAME - A metal bump structure for use in a driver IC includes a passivation layer disposed on a metal pad and defining a recess on the metal pad, an adhesion layer in said recess, on the metal pad and on the passivation layer, a metal bump disposed in the recess and completely covering the adhesion layer, and a capping layer disposed on the metal bump and completely covering the metal bump so that the metal bump is not exposed to an ambient atmosphere. | 2014-11-06 |
20140327135 | Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces - A semiconductor device has a substrate. A conductive layer is formed over the substrate. A duplex plated bump on lead pad is formed over the substrate. An insulating layer is formed over the conductive layer and the substrate. A portion of the insulating over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer is a lamination layer. The duplex plated bump on lead pad has a wide bump on lead pad. A semiconductor die is mounted over the substrate. The semiconductor die has a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between the first bump and the second bump. A duplex plated contact pad is formed on a surface of the substrate opposite the duplex plated bump-on-lead pad. | 2014-11-06 |
20140327136 | SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME - A semiconductor device comprises a semiconductor substrate, an under-bump metallization (UBM) structure overlying the semiconductor substrate, and a solder bump overlying and electrically connected to the UBM structure. The UBM structure comprises a first metallization layer comprising a first metal, a second metallization layer comprising a second metal different from the first metal, and a first intermetallic compound (IMC) layer between the first metallization layer and the second metallization layer, the first IMC layer comprising the first metal and the second metal. | 2014-11-06 |
20140327137 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substract, a semiconductor chip by which the flip chip was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth | 2014-11-06 |
20140327138 | SEMICONDUCTOR DEVICE - The long sides of a rectangular control chip and the long sides of a rectangular memory chip are arranged parallel with first sides of the upper surface of a wiring substrate in a BGA. A lid includes a pair of first brims and a pair of second brims, the widths of the second brims are formed wider than those of the first brims, and a mounting area for mounting chip parts and a junction base area for joining the lid are secured outside the short sides of the control chip mounted on the upper surface of the wiring substrate and outside the short sides of the memory chip mounted on the upper surface of the wiring substrate, which enables the wide-width second brims of the lid to be disposed on the junction base area. Hence, the mounting area of the BGA can be reduced. | 2014-11-06 |
20140327139 | CONTACT LINER AND METHODS OF FABRICATION THEREOF - Contact structures and methods of fabricating contact structures of semiconductor devices are provided. One method includes, for instance: obtaining a substrate including a dielectric layer over the substrate; patterning the dielectric layer with at least one contact opening; providing a contact liner within the at least one contact opening in the dielectric layer; and filling the contact liner with a conductive material. In enhanced aspects, providing the contact liner within the at least one contact opening includes: depositing a first layer within the at least one contact opening in the dielectric layer; depositing a second layer over the first layer within the at least one contact opening; depositing at least one intermediate layer over the second layer within the at least one contact opening; and depositing a top layer over the at least one intermediate layer within the at least one contact opening. | 2014-11-06 |
20140327140 | INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH IMPROVED CONTACT STRUCTURES - Integrated circuits and methods for fabricating integrated circuits are provided. In an exemplary embodiment, a method for fabricating integrated circuits includes providing a semiconductor substrate disposed with a device therein and/or thereon. A contact structure including a barrier layer and a plug metal overlying the barrier layer is formed in electrical contact with the device. A hardmask is formed overlying the contact structure. The method includes performing an etch to form a via opening through the hardmask and to expose the barrier layer and the plug metal. Further, the method removes a remaining portion of the hardmask with a wet etchant, while the contact structure is configured to inhibit the wet etchant from etching the barrier layer. In the method, the via opening is filled with a conductive material to form an interconnect to the contact structure. | 2014-11-06 |
20140327141 | COPPER INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME - A copper interconnect structure in a semiconductor device comprises a dielectric layer having sidewalls and a surface defining an opening in the dielectric layer. The copper interconnect structure also comprises a barrier layer deposited on the sidewalls and the surface of the dielectric layer defining the opening. The copper interconnect structure further comprises a barrier/seed mixed layer deposited on the barrier layer. The copper interconnect structure additionally comprises an adhesive layer deposited on the barrier/seed mixed layer. The copper interconnect structure also comprises a seed layer deposited on the adhesive layer. | 2014-11-06 |
20140327142 | METAL CONTACTS TO GROUP IV SEMICONDUCTORS BY INSERTING INTERFACIAL ATOMIC MONOLAYERS - Techniques for reducing the specific contact resistance of metal-semiconductor (group IV) junctions by interposing a monolayer of group V or group III atoms at the interface between the metal and the semiconductor, or interposing a bi-layer made of one monolayer of each, or interposing multiple such bi-layers. The resulting low specific resistance metal-group IV semiconductor junctions find application as a low resistance electrode in semiconductor devices including electronic devices (e.g., transistors, diodes, etc.) and optoelectronic devices (e.g., lasers, solar cells, photodetectors, etc.) and/or as a metal source and/or drain region (or a portion thereof) in a field effect transistor (FET). The monolayers of group III and group V atoms are predominantly ordered layers of atoms formed on the surface of the group IV semiconductor and chemically bonded to the surface atoms of the group IV semiconductor. | 2014-11-06 |
20140327143 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-11-06 |
20140327144 | Complex Semiconductor Packages and Methods of Fabricating the Same - Disclosed are complex semiconductor packages, each including a large power module package which includes a small semiconductor package, and methods of manufacturing the complex semiconductor packages. An exemplary complex semiconductor package includes a first package including: a first packaging substrate; a plurality of first semiconductor chips disposed on the first packaging substrate; and a first sealing member covering the first semiconductor chips on the first packaging substrate; and at least one second package separated from the first packaging substrate, disposed in the first sealing member, and including second semiconductor chips. | 2014-11-06 |
20140327145 | Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect - A semiconductor device has a first semiconductor die mounted over a carrier. An interposer frame has an opening in the interposer frame and a plurality of conductive pillars formed over the interposer frame. The interposer is mounted over the carrier and first die with the conductive pillars disposed around the die. A cavity can be formed in the interposer frame to contain a portion of the first die. An encapsulant is deposited through the opening in the interposer frame over the carrier and first die. Alternatively, the encapsulant is deposited over the carrier and first die and the interposer frame is pressed against the encapsulant. Excess encapsulant exits through the opening in the interposer frame. The carrier is removed. An interconnect structure is formed over the encapsulant and first die. A second semiconductor die can be mounted over the first die or over the interposer frame. | 2014-11-06 |
20140327146 | METHODS FOR IMPROVING DOUBLE PATTERNING ROUTE EFFICIENCY - A design methodology for routing for an integrated circuit is disclosed. The method includes placement of cells having double diffusion breaks, which create an extended intercell region. Metal layer prohibit zones are defined to prohibit any M1 structures in the prohibit zones. Metal layer allow zones are placed adjacent to outer metal lines, and jogs are formed in the metal layer allow zones. Vias and viabars may then be applied on the jogs. | 2014-11-06 |
20140327147 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a semiconductor substrate configured to include a circuit pattern at one surface, an insulation film formed over a back surface of the semiconductor substrate, a through silicon via (TSV) configured to pass through the semiconductor substrate and the insulation film, and an oxide film formed at a sidewall of the TSV and protruded from the back surface of the semiconductor substrate in a manner that the oxide film partially contacts the insulation film. | 2014-11-06 |
20140327148 | CHIP ON FILM PACKAGE INCLUDING DISTRIBUTED VIA PLUGS - A chip on film (COF) package includes a film substrate, first leads on a first surface of the film substrate, the first leads having a first length, and second leads on the first surface of the film substrate, the second leads having a second length larger than the first length, first via plugs penetrating the film substrate and connected to first ends of the first leads, and second via plugs penetrating the film substrate and connected to first ends of the second leads, and first connection leads on a second surface of the film substrate facing the first surface, the first connection leads having first ends connected to the first via plugs, and second connection leads on the second surface of the film substrate, the second connection leads having first ends electrically connected to the second via plugs. | 2014-11-06 |
20140327149 | DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER SUBSTRATES INCLUDING EMBEDDED-DICE, AND PROCESSES OF FORMING SAME - An apparatus includes a coreless substrate with a through-silicon via (TSV) embedded die that is integral to the coreless substrate. The apparatus includes a subsequent die that is coupled to the TSV die and that is disposed above the coreless substrate. | 2014-11-06 |
20140327150 | SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING THE SAME - A semiconductor device includes a substrate including a first surface and a second surface opposite to each other, a through-via electrode extending through the substrate. The through-via electrode has an interconnection metal layer and a barrier metal layer surrounding a side surface of the interconnection metal layer. One end of the through-via electrode protrudes above the second surface. A spacer insulating layer may be provided on an outer sidewall of the through-via electrode. A through-via electrode pad is connected to the through-via electrode and extends on the spacer insulating layer substantially parallel to the second surface. A first silicon oxide layer and a silicon nitride layer are stacked on the second surface. A thickness of the first silicon oxide layer is greater than a thickness of the silicon nitride layer. | 2014-11-06 |
20140327151 | THROUGH SUBSTRATE VIA STRUCTURES AND METHODS OF FORMING THE SAME - A structure includes a substrate, and an interconnect structure over the substrate. The structure further includes a through-substrate-via (TSV) extending through the interconnect structure and into the substrate, the TSV comprising a conductive material layer. The structure further includes a dielectric layer having a first portion over the interconnect structure and a second portion within the TSV, wherein the first portion and the second portion comprise a same material. The conductive material layer includes a first section separated from substrate by the second portion of the dielectric layer. The conductive material layer further includes a second section over a top surface of the second portion of the dielectric layer. The conductive material layer further includes a third section over the second section, wherein the third section has a width greater than a width of the second section. | 2014-11-06 |
20140327152 | CHIP PACKAGE - A chip package includes: a substrate having a first surface, a second surface, and a side surface connecting the first and the second surfaces; a dielectric layer located on the first surface; conducting pads comprising a first and a second conducting pads located in the dielectric layer; openings extending from the second surface towards the first surface and correspondingly exposing the conducting pads, wherein a first opening of the openings and a second opening of the openings next to the first opening respectively expose the first and the second conducting pads and extend along a direction intersecting the side surface of the substrate to respectively extend beyond the first and the second conducting pads; and a first and a second wire layers located on the second surface and extending into the first the second openings to electrically contact with the first and the second conducting pads, respectively. | 2014-11-06 |
20140327153 | STANDARD CELL CONNECTION FOR CIRCUIT ROUTING - Embodiments described herein provide approaches for improving a standard cell connection for circuit routing. Specifically, provided is an IC device having a plurality of cells, a first metal layer (M | 2014-11-06 |
20140327154 | MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANCAL COMPONENT HAVING A THIN-LAYER CAP - A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided. | 2014-11-06 |
20140327155 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package comprises a lower package comprising a lower substrate, a lower semiconductor chip mounted on a surface of the lower substrate, connection terminals between the lower substrate and the lower semiconductor chip, and a protection film covering the lower semiconductor chip. An upper package is spaced apart from the lower package on an upper surface of the lower substrate, the upper package comprising an upper substrate and an upper semiconductor chip. Connections are present between the lower substrate and the upper substrate to horizontally surround the lower semiconductor chip. A molding film is on the upper surface of the lower substrate to fill spaces between the connection terminals and the connections. An uppermost surface of the protection film is positioned at substantially a same vertical level as an uppermost surface of the molding film and is spaced apart from the upper package. | 2014-11-06 |
20140327156 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor package and a method for manufacturing the same. The semiconductor package may include a substrate, a lower semiconductor chip disposed on an inner surface of the substrate, and an upper semiconductor chip disposed on the lower semiconductor chip. A plurality of connection terminals may be disposed between the substrate and the lower semiconductor chip to electrically connect the lower semiconductor chip to the substrate. The upper semiconductor chip may have a lower surface which faces the substrate and an upper surface which opposes the lower surface. Bonding wires may pass through the windows to connect the lower surface of the upper semiconductor chip to an outer surface of the substrate. | 2014-11-06 |
20140327157 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A lamination structure includes a first semiconductor chip and a second semiconductor chip stacked via a bonding section so that a rear surface of the first semiconductor chip faces the main surface of the second semiconductor chip. At least a part of a side surface of the first semiconductor chip are covered with a first resin, a distribution layer is formed on the plane formed of the main surface of the first semiconductor chip and a surface of the first resin. At least part of electrodes existing in the main surface of the second semiconductor chip is electrically connected to at least part of first external electrodes formed on the distribution layer via the penetration electrodes that penetrate the first semiconductor chip. | 2014-11-06 |
20140327158 | METHOD FOR IDENTIFYING MODULATORS OF UBIQUITIN LIGASES - The present invention provides a screen which exploits mechanism-based activity probes that specifically and covalently modify the active site cysteine thiol residue of E3 Ub ligases including, but not limited to the HECT and RBR family. The activity probes are used to screen for activators and inhibitors of E3 Ub ligases, and to interrogate the functional state of E3 Ub ligases in human disease. | 2014-11-06 |
20140327159 | SODA MACHINE WITH A SAFETY FITTING - A soda machine with a safety fitting, which includes a carbon dioxide steel cylinder, a soda cylinder, a gas outlet controller fitted to the carbon dioxide steel cylinder and a gas inlet fitted to the soda cylinder; said gas outlet controller includes a gas inlet body, a drive rod, a valve core and a valve core seat, the gas inlet body including a drive rod channel, a valve core seat chamber and a gas outlet hole; a limit disk being provided at a junction area of the drive rod and the valve core; and further comprising a safety valve, a gas inlet hole of the safety valve communicating to the gas outlet controller, and a gas outlet hole communicating to the gas inlet. | 2014-11-06 |
20140327160 | CARBURETOR - A carburetor incorporating an air passage, and a fuel passage, and a rotating barrel, the rotating barrel being arranged between the air passage and the fuel passage so that a first portion of its surface is exposed to the air passage, and a second portion of its surface is exposed to the fuel passage. The rotation of the barrel transfers fuel from fuel passage to the air passage via an indent feature, the proportion of that indent feature that is exposed to the air or fuel passage being varied to meter the amount of fuel transferred. | 2014-11-06 |
20140327161 | CONTACT AND SEPARATION COLUMN AND TRAY - A contact and separation column ( | 2014-11-06 |
20140327162 | MILK-FROTHING APPARATUS, AND COFFEE OR ESPRESSO MACHINE AND AUTOMATIC BEVERAGE VENDING MACHINE HAVING A MILK-FROTHING APPARATUS OF THIS KIND - The invention relates to a milk-frothing apparatus, in particular for a coffee or espresso machine, comprising a froth-generating unit ( | 2014-11-06 |
20140327163 | METHOD FOR MAKING A DENSE SIC BASED CERAMIC PRODUCT - A process for obtaining granules for manufacturing a silicon carbide based sintered product, includes a) mixing a powder of silicon carbide SiC particles, whose average diameter d | 2014-11-06 |
20140327164 | Method of Producing Polypropylene Spunbond Fibers - Disclosed is a process for producing spunbond fibers comprising melt blending a polypropylene having a melt flow rate (230/2.16) of from 10 to 30 dg/min with a peroxide visbreaker such that the resulting melt flow rate of the visbroken polypropylene is from 50 to 100 dg/min; melt extruding the visbroken polypropylene through a die block such that filaments of the visbroken polypropylene being produced are exposed to a cabin pressure of from 4500 to 7000 Pa; and forming fibers of from less than 6.0 denier. Nonwoven fabrics and multiple-layer structures can be made from the fibers described herein that are useful for filtering and absorption related articles. | 2014-11-06 |
20140327165 | Method for Preparing a Material of a Battery Cell - A continuous process for producing a material of a battery cell using a system having a mist generator, a drying chamber, one or more gas-solid separators and a reactor is provided. A mist generated from a liquid mixture of two or more metal precursor compounds in desired ratio is dried inside the drying chamber. Heated air or gas is served as the gas source for forming various gas-solid mixtures and as the energy source for reactions inside the drying chamber and the reactor. One or more gas-solid separators are used in the system to separate gas-solid mixtures from the drying chamber into solid particles mixed with the metal precursor compounds and continuously deliver the solid particles into the reactor for further reaction to obtain final solid material particles with desired crystal structure, particle size, and morphology. | 2014-11-06 |
20140327166 | TRANSLUCENT VENEERING FOR A DENTAL PROSTHESIS FORMED BY A PRESS TO METAL PROCESS - A dental prosthesis, typically formed in a press to metal process, includes application of a porcelain composition sufficient to form a veneer on a dental prosthesis supporting metal structure, the composition having an integrated tooth-like translucency providing an aesthetic appearance. The composition is formed of a dentin frit and an enamel frit, typically sintered into a desired ingot shape including an amount of composition sufficient to veneer the prosthesis. The porcelain composition is a component of a kit that includes opaquers, other porcelains and stains useful in finishing to provide an aesthetic prosthesis. | 2014-11-06 |
20140327167 | SYSTEMS FOR FORMING AGGREGATE MATERIALS FROM HEAT FUSABLE POWERED MATERIALS - In one embodiment, a system for forming aggregate materials may include a lower open-topped mold, an upper mold, an actuation assembly, a heating system, a pressure sensor, and a controller. The lower open-topped mold can receive a heat moldable material that can include a foaming agent. The lower open-topped mold can contact the heat moldable material and the upper mold can contact the heat moldable material. The controller can execute machine readable control logic to cause the actuation assembly to generate relative outward motion at an expansion rate. The foaming agent can expand the heat moldable material when heated. During outward motion, the lower open-topped mold can maintain close contact with the heat moldable material, and the upper mold can maintain close contact with the heat moldable material. The expansion rate of the relative outward motion can be based upon a pressure signal indicative of back pressure. | 2014-11-06 |
20140327168 | CARBON DIOXIDE TREATMENT OF CONCRETE UPSTREAM FROM PRODUCT MOLD - Fresh concrete is treated with carbon dioxide prior to delivery to a product mold for forming concrete products. Carbon dioxide gas is directed through a manifold, which may be coupled to a feedbox or a hopper, upstream from the product mold. Treating the fresh concrete with the carbon dioxide gas while it is in a loose state prior to placement in the product mold may generally promote uniform and enhanced carbon dioxide uptake. | 2014-11-06 |
20140327169 | APPARATUS FOR CARBON FIBER PROCESSING AND PITCH DENSIFICATION - A pitch densification apparatus may be used to form a carbon-carbon composite material. The apparatus may be used to compress a carbon fiber material, and, thereafter, pitch densify the carbon fiber material. The compression and pitch densification of the carbon fiber material may be carried out within the same mold cavity of the pitch densification apparatus. In one example, an apparatus may comprise a mold defining a mold cavity that is configured to receive a material to be densified. The mold cavity is configured to be adjusted from a first volume to a second volume less than the first volume to compress the material in the mold cavity. The example apparatus may further comprise a gas source configured to apply a gas pressure in the mold cavity to force pitch into the material in the mold cavity to densify the material, and a vacuum source configured to create a vacuum pressure in the mold cavity at least prior to the application of the gas pressure. | 2014-11-06 |
20140327170 | PROCESS FOR MANUFACTURING POLYOLEFIN FILMS - A process for manufacturing a film of ultra-high molecular weight polyolefin includes (a) feeding an ultra-high molecular weight polyethylene with a weight average molecular weight of at least 500,000 gram/mole as a powder having a bulk density below 0.5 g/cm | 2014-11-06 |
20140327171 | METHOD FOR PREPARING POLYAMIDE GRANULES - The present invention relates to a method for preparing polyamide granules. This method comprises, in particular, steps of extruding the polymer, cooling and cutting the extruded material, and a step of cooling the granules. The method of the invention is simple and quick to implement. | 2014-11-06 |
20140327172 | BLOCK COPOLYMER FILM AND METHOD OF PRODUCING THE SAME - Provided is a block copolymer film in which a microphase separation structure formed by a block copolymer is arranged perpendicularly to the film surface, and all components forming the block copolymer are uncovered to the film surface, whereby the microphase separation structure penetrates the film surface. A method of producing the block copolymer film includes the steps of extruding a melt of the block copolymer in one direction by extrusion molding or injection molding, cooling the extruded block copolymer to a temperature equal to or lower than glass transition temperatures of polymer components in the block copolymer to provide a prismatic or cylindrical extrusion molded product, and cutting the prismatic or cylindrical extrusion molded product in the direction perpendicular to the extrusion direction. | 2014-11-06 |
20140327173 | REDUCING CROWN FLASH IN INJECTION-MOLDING PROCESSES - Crown-flash-reduction systems, methods, and apparatuses for actively reducing the likelihood of formation of crown flash on injection-molded objects. The active reduction includes moving at least one of a valve member and a mold gate periphery in a manner that actively weakens or separates molding material present in a molded object from molding material present in the closed mold gate prior to or in conjunction with de-molding the molded object. | 2014-11-06 |
20140327174 | AXIALLY ORIENTED CONFINED CRYSTALLIZATION MULTILAYER FILMS - A method of forming a confined crystallization multilayer film includes coextruding a plurality of first polymer layers and a plurality of second polymer layer to form a multilayer film wherein each first polymer layer is sandwiched between second polymer layers and axially orienting the multilayer film at a temperature below the melting temperature (T | 2014-11-06 |
20140327175 | Stretch Film Using a Multi-Manifold Die - A die for forming a stretch film includes at least: a primary passage for receiving a primary stream, the primary passage having a length extending from a die inlet opening to a die outlet opening; and a flow assembly for supplying a secondary stream to the primary passage at a secondary passage opening. A method for forming a stretch film includes: introducing a primary stream to a primary passage of a die at a die inlet opening, the primary passage having a length extending from the die inlet opening to a die outlet opening; supplying a secondary stream to the primary passage at a secondary passage opening; combining the primary stream and the secondary stream to create a combined stream; passing the combined stream through said die outlet opening; and passing the combined stream from the die outlet opening to a casting unit, thereby forming a film web. | 2014-11-06 |
20140327176 | PREFORM EXTRUSION MOLDING APPARATUS, METHOD FOR EXTRUSION MOLDING, AND PREFORM - A process includes: supplying a main resin from outer and inner flow channel, to a joined flow channel at a predetermined supply velocity for a predetermined time; supplying a second resin from a middle flow channel to the joined flow channel simultaneously with the main resin at a predetermined supply velocity for a certain time within the predetermined time; and sliding a shut-off pin to bring the pin forefront to a predetermined position near an outlet of the inner flow channel, open to the joined flow channel, before the second resin is supplied, or during a time starting after a time from the start of the second resin supply and ending with the termination of the supply, so that the velocity of main resin supply from the inner flow channel to the joined flow channel is reduced to a predetermined level by adjusting the degree of aperture for the outlet. | 2014-11-06 |
20140327177 | ORAL CARE IMPLEMENT HAVING MULTI-COMPONENT HANDLE - An oral care implement having a multi-component handle, and method of manufacturing the same. The invention can be a method of forming a handle for an oral care implement comprising: a) forming a core structure of a first hard plastic; b) forming an elongated handle body of a second hard plastic that at least partially surrounds the core structure so that opposing lateral surfaces of the core structure remain exposed; and c) forming a grip cover of a resilient material over at least a portion of the elongated handle body. | 2014-11-06 |
20140327178 | METHOD AND APPARATUS FOR MANUFACTURING A WIND TURBINE BLADE COMPONENT WITH UNIFORM TEMPERATURE CURING - A molding apparatus for manufacturing a wind turbine blade component includes a main mold body ( | 2014-11-06 |
20140327179 | HEADER FOR MODULE OF HOLLOW FIBER MEMBRANES AND METHOD OF POTTING HOLLOW FIBERS - Hollow fiber membranes are potted by injecting a liquid material into a substantially closed cavity ( | 2014-11-06 |
20140327180 | FLOATING CORE FOR GLASS INSERT MOLDING METHOD AND APPARATUSES THEREFROM | 2014-11-06 |
20140327181 | FLOATING CORE FOR GLASS INSERT MOLDING METHOD AND APPARATUSES THEREFROM | 2014-11-06 |
20140327182 | Container With Microwave Interactive Web - One aspect of the present invention is a container that includes a microwave interactive web at least partially overlying and joined to a three-dimensional support, wherein the three-dimensional support may be formed prior to having the microwave interactive web mounted thereto. The three-dimensional support may be a preformed container that is sufficiently rigid and dimensionally stable for use in containing food. | 2014-11-06 |
20140327183 | IMPRINT METHOD AND IMPRINT APPARATUS - An object is to provide an imprint method or an imprint apparatus that not only reduces the time for filling with resin or reduces pattern defects, but also reduces the surface roughness of resin. An imprint method brings a resin on a substrate and a mold having a pattern into contact with each other to transfer the pattern onto the substrate. The imprint method includes a step of bringing the resin on the substrate and the mold into contact with each other while a space between the substrate and the mold is filled with a predetermined gas, a step of curing the resin while the resin and the mold are in contact with each other, and a step of separating the resin and the mold. The predetermined gas contains a first gas having a solubility of 0.36 mol/liter or more in the resin and a second gas having a solubility of less than 0.36 mol/liter in the resin, at 20° C. and a pressure of 1 atmosphere. | 2014-11-06 |
20140327184 | TRANSPORT AND ASSEMBLY SYSTEM AND METHOD FOR COMPOSITE BARREL SEGMENTS - A barrel assembly for a composite structure includes a barrel of composite material, a first end ring, and a mid support. The barrel of composite material has a first end, an interior surface and an outer surface, and the first end ring is removably attached to the first end. The first end ring has a perimeter that is substantially congruent with the first end, and is configured to maintain a shape of the barrel. The mid support is removably disposed within the barrel, and has a plurality of spokes extending outwardly from a central hub to contact the interior surface, to maintain a shape of the barrel. | 2014-11-06 |
20140327185 | APPARATUS AND METHOD FOR MULTI-BEAM DIRECT ENGRAVING OF ELASTOMERIC PRINTING PLATES AND SLEEVES - Described herein are an apparatus and a method for direct engraving an elastomeric printing plate by multiple laser beams simultaneously. In one embodiment, an elastomeric printing plate or sleeve is positioned on an imaging drum for direct engraving. The imaging drum is rotatable around its longitudinal axis. Such rotation defines a circumferential direction, also called the transverse direction. The axis of rotation defines an axial direction, also called the longitudinal direction. The printing plate has an body and a surface made of an elastomer (made of polymer or rubber). A drive mechanism provides relative motion between a plurality of laser beams and the plate in both the transverse and longitudinal directions. | 2014-11-06 |
20140327186 | RAPID DRYING OF CERAMIC GREENWARES - Systems and methods for rapid drying of ceramic greenwares having a high graphite content are disclosed. The methods include employing microwave drying to bring the dryness of the ceramic greenware to a first select dryness and then employing close-coupled hot-air drying to bring the dryness to the final target dryness. The judicious use of close-coupled hot-air drying reduces end defects due to unevenness in the microwave drying process while also substantially speeding up the drying process. Various configurations for and combinations of microwave drying and close-coupled hot-air drying are disclosed. | 2014-11-06 |
20140327187 | Process and Apparatus for Molding Composite Articles - A method and an apparatus for molding composite articles are disclosed. The method generally involves the saturation of reinforcing fibers (e.g. glass fibers, carbon fibers, etc.) with a matrix (e.g. resin, epoxy, cyanate ester, vinyl ester, polyester, etc.) in/on a mold using a conventional resin transfer molding (“RTM”) process (e.g. “RTM-light”) or a vacuum assisted resin transfer molding (“VARTM”) process (e.g. advanced VARTM or “A-VARTM”), and, once saturation is completed, the vibration of the matrix-infused fibers using controlled ultrasonic sound waves transmitted through the mold. By vibrating the matrix-infused fibers with the ultrasonic sound waves, the method and apparatus allow voids present between fibers to be closed and localized pockets of gases to be dislodged and degassed, and also allow the fibers to compact, thereby producing composite articles with reduced porosity and higher compaction. | 2014-11-06 |
20140327188 | METHOD FOR PRODUCING FINE CONVEX PATTERN STRUCTURE AND FINE CONVEX PATTERN PRODUCTION SYSTEM - A method for producing a fine convex pattern structure having a fine convex pattern projecting from a flat portion in a predetermined direction with respect to the flat portion includes: using an imprint mold that has a fine concave pattern corresponding to the fine convex pattern and forming the fine convex pattern projecting from the flat portion under a condition in which the fine convex pattern is inclined to the flat portion side from the predetermined direction; and causing the fine convex pattern to project in the predetermined direction with respect to the flat portion by inducing electric charges at least on the inclined fine convex pattern. | 2014-11-06 |
20140327189 | PLANT FOR MAKING CONTAINERS OF THERMOPLASTIC MATERIAL - A plant for making containers of thermoplastic material in continuous cycle comprises: a rotary moulding machine ( | 2014-11-06 |
20140327190 | VACUUM BAG MOLDING ASSEMBLY AND METHODS - An assembly for vacuum bag molding includes a mold for receiving a workpiece. An edge breather comprising a plurality of braided polymer threads is disposed about a periphery of the workpiece. A vacuum bag film is disposed over the workpiece and the edge breather. A seal seals the vacuum bag film to the mold and a passageway in fluidic communication with the edge breather. | 2014-11-06 |
20140327191 | TUNNEL KILN AND METHOD FOR PRODUCING FIRED BODY USING SAME - The tunnel kiln according to the present invention includes a tunnel kiln main body having an inner wall constituted by a furnace material, and having a debinding zone and a sintering zone wherein respectively debinding and sintering of a body to be fired containing an organic component are performed; a conveying unit for conveying the body to be fired from an inlet side to an outlet side of the tunnel kiln main body; and a lining provided so that at least an inner wall of the debinding zone of the inner wall of the tunnel kiln main body is covered therewith. | 2014-11-06 |
20140327192 | METHOD FOR OPERATING AN OXYGEN BLOWING LANCE IN A METALLURGICAL VESSEL AND A MEASUREMENT SYSTEM FOR DETERMINING A MEASUREMENT SIGNAL USED IN THE METHOD - A method for operating a blowing lance for blowing a gas in a metallurgical vessel, wherein the head of the blowing lance includes at least one supersonic nozzle, operating parameter measurement signals used for the purpose of process control are continuously acquired. The inlet pressure and/or the inlet temperature of the gas at the supersonic nozzle and/or the vibration amplitude and/or the vibration frequency of the blowing lance and/or the time at which ignition occurs during the oxygen blowing process and/or the location at which ignition occurs during the oxygen blowing process is detected and/or measured in the head of the lance by a detector or sensor arranged in the head of the lance near the supersonic nozzle during operation of the blowing lance. The measurement signal(s) are transmitted to a control unit connected to the detector or sensor and made available for controlling the operation of the blowing lance. | 2014-11-06 |
20140327193 | Press Quench Machine - This invention is an apparatus for cooling a metal object that has been heated above the curing point, such that as the metal object cools, it retains its original shape. | 2014-11-06 |
20140327194 | FLUID COOLED LANCES FOR TOP SUBMERGED INJECTION - A TSL lance has an outer shell of three substantially concentric lance pipes, at least one further lance pipe concentrically within the shell, and an annular end wall at an outlet end of the lance which joins ends of outermost and innermost lance pipes of the shell at an outlet end of the lance and is spaced from an outlet end of the intermediate lance pipe of the shell. Coolant fluid is able to be circulated through the shell, by flow to and away from the outlet end. The spacing between the end wall and the outlet end of the intermediate pipe provides a constriction to the flow of coolant fluid to increase coolant fluid flow velocity therebetween. The further lance pipe defines a central bore and is spaced from the innermost lance pipe of the shell to define an annular passage, whereby materials passing along the bore and the passage mix adjacent to the outlet end of the lance. The end wall and an adjacent minor part of the length of the shell comprise a replaceable lance tip assembly. | 2014-11-06 |
20140327195 | Rotating vacuum heat treatment equipment - A rotating vacuum heat treatment equipment, applicable for heat treatment of rare earth permanent magnetic devices, hydrogen pulverization of rare earth permanent magnetic alloy, and heat treatment of mechanical electronic components, mainly comprises: a vacuum unit, a gas cooling device, and a vacuum furnace, wherein an insulating layer is provided in the vacuum furnace, a heater is provided in the insulating layer, a rotating cylinder is provided in the heater, a nozzle, connected with pipelines of the gas cooling device, is provided on the insulating layer, and cooled gas is sprayed to the rotating cylinder via the nozzle. | 2014-11-06 |
20140327196 | TRANSVERSE LEAF SPRING ASSEMBLY FOR A MOTOR VEHICLE - A transverse leaf spring assembly for a motor vehicle includes a transverse leaf spring which is arranged transversely to the motor vehicle. A bearing unit connects the transverse leaf spring to a body of the motor vehicle and has a holder and elastic dampers. Accommodated in the holder is an adapter which has an interior space suited to a cross sectional geometry of the transverse leaf spring, with the transverse leaf spring being received in the adapter between the elastic dampers. | 2014-11-06 |
20140327197 | GAS SPRING WITH TRAVEL CONTROL - In one embodiment, a gas spring having a travel control includes positive and negative chambers and a valve mechanism that controls the fluid communication between the chambers. The valve mechanism includes a valve bore that while only moving a small amount, allows for large changes in gas spring travel length. | 2014-11-06 |
20140327198 | HYDRAULIC ENGINE MOUNT INERTIA TRACK WITH MULTIPLE RESTRICTIONS - A hydraulic engine mount is provided having at least one channel provided within the engine mount. The channel is provided fully enclosed within the engine mount. The channel includes at least two restrictions operable to partially restrict fluid flow through the channel thereby preventing unwanted noise heard by the user. The at least two restrictions include at least one protrusion extending away from a side wall of the channel. Two protrusions are provided to form each restriction where the protrusions are opposed and spaced apart extending into the channel. The at least one protrusion includes at least one sloped wall. The at least one sloped wall is disposed upstream of the fluid through the channel and may be positioned adjacent to an inlet or an outlet of the channel. | 2014-11-06 |
20140327199 | FLUID-FILLED VIBRATION DAMPING DEVICE - A fluid-filled vibration damping device including: first and second mounting members elastically connected by a main rubber elastic body; a partition member supported by the second mounting member; a pressure-receiving chamber and an equilibrium chamber disposed on either side of the partition member; a housing space formed within the partition member; a plate-shaped movable member arranged in the housing space with liquid pressures of the pressure-receiving chamber and the equilibrium chamber applied to the respective faces of the movable member; and a rubber buffer arranged on wall inner surfaces of the housing space to be struck by the movable member. The movable member is grasped partially in a thickness direction between the wall inner surfaces of the housing space via the rubber buffer at surfaces facing the wall inner surfaces of the housing space. | 2014-11-06 |
20140327200 | DEVICE FOR A USER TO SECURE A WORKPIECE | 2014-11-06 |
20140327201 | Self-Centering Clamp - A clamping device is configured to ensure that a workpiece fixed between the jaws of the clamp is self centered by coupling the jaws to a pair of linkages that rotate through the same angle as the application of a first causes the jaws to translate in linear fashion across the surface of the device. In particular, the clamping device utilizes coupled linkage (e.g., a 180° bell crank), in combination with slots for retaining opposing jaws and maintaining only linear movement of the jaws, thus providing a fast and accurate self-centering arrangement. The clamping device may also be located within a hollow workpiece and controlled to move the jaws outward and engage the inner surface of the hollow workpiece in a self-aligned configuration. | 2014-11-06 |
20140327202 | DEVICE AND METHOD FOR ALIGNING AND HOLDING A PLURALITY OF SINGULATED SEMICONDUCTOR COMPONENTS IN RECEIVING POCKETS OF A TERMINAL CARRIER - In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece. | 2014-11-06 |
20140327203 | PRINTER AND METHOD OF CONTROLLING PRINTER - A printer includes a printing part that performs printing on recording paper, a cutter that cuts the recording paper, a first roller provided on the side to which the recording paper is discharged from the cutter, a second roller, a third roller, a fourth roller, and a fifth roller that are in contact with the first roller and are rotated by the rotation of the first roller, and a connecting arm that connects the center of the first roller and the center of the second roller, wherein the recording paper is discharged between the first roller and the fourth roller or between the first roller and the fifth roller. | 2014-11-06 |
20140327204 | PRINTER AND METHOD OF CONTROLLING PRINTER - A printer includes a printing part that performs printing on a label adhering to a liner, a cutter that cuts the liner to which the label adheres, a first roller provided on the side to which the liner to which the label adheres is discharged from the cutter, a second roller that is in contact with the first roller and is rotated by the rotation of the first roller, a third roller that is in contact with the first roller and is rotated by the rotation of the first roller, and a connecting arm that connects the center of the first roller and the center of the second roller, wherein the liner is separated from the label by the first roller and the second roller, and the label separated from the liner is discharged by the third roller. | 2014-11-06 |
20140327205 | PRINTER AND METHOD OF CONTROLLING PRINTER - A printer includes a printing part that performs printing on recording paper, a cutter that cuts the recording paper, a first roller provided on the side to which the recording paper is discharged from the cutter, a second roller that is in contact with the first roller and is rotated by the rotation of the first roller, a third roller that is in contact with the first roller and is rotated by the rotation of the first roller, and a connecting arm that connects the center of the first roller and the center of the second roller, wherein the recording paper is discharged between the first roller and the second roller or between the first roller and the third roller. | 2014-11-06 |
20140327206 | ACCUMULATION DEVICE FOR PAPER-LIKE SHEETS - An accumulation device for paper-like sheets comprises a conveying part, a clamping part, a guiding part and an accumulating part, which are connected serially. The conveying part is used for conveying the paper-like sheet to the clamping part. The clamping part comprises a drive shaft and multiple banknote-stacking wheels fixed to the drive shaft, and every banknote-stacking wheel is provided with multiple wheel blades having the same curvature. The paper-like sheet can be clamped between any two adjacent wheel blades and rotatably conveyed to the guiding part. The guiding part receives the paper-like sheet conveyed by the clamping part and guides the paper-like sheet to the accumulating part. The accumulating part is used for accumulating the paper-like sheet conveyed by the guide part. The paper-like sheets are reliably collected among the wheel blades and prevented from scattering, and thus the paper-like sheets can be uniformly arranged in order and stacked on the accumulating part. | 2014-11-06 |
20140327207 | SHEET CONVEYING DEVICE, IMAGE FORMING APPARATUS INCORPORATING SAME, AND METHOD OF CONVEYING A SHEET IN THE IMAGE FORMING APPARATUS - A sheet conveying device, which is incorporated in an image forming apparatus, includes a fixing device to fix an image to a sheet, a holding/conveying belt device having a plurality of belts to sandwich and convey the sheet to a downstream side from the fixing device, and a first sheet detector to detect whether the sheet exists in the belt device. When the sheet is detected at a paper jam, the fixing device and the belt device are continuously driven. When not detected, driving of the fixing device and the belt device is stopped. A method of conveying the sheet includes detecting the paper jam in the image forming apparatus, detecting the sheet in the belt device or between the fixing device and the belt device, and continuing at least one of the belt device and the fixing device based on a sheet detection result. | 2014-11-06 |
20140327208 | Methods for Shuffling Cards and Rack Assemblies For Use In Automatic Card Shufflers - Card-handling devices include a card-holding area and a card output shoe. The card output shoe includes a card-way for passage of cards from the card-holding area into a dealing-ready area. A movable gate is positioned between the card-way and the dealing-ready area to prevent cards in the dealing-ready area from re-entering the card-way. Card shufflers include a gate mounted to allow movement of randomized groups of cards from card-receiving compartments to proximate a terminal end plate of a card output shoe and to block movement of cards in an opposite direction. In related methods of moving cards, card movement through the card-way to the dealing-ready position is allowed by a movable gate and card movement from the dealing-ready position into the card-way is prevented by the movable gate. | 2014-11-06 |
20140327209 | WORD FORMATION GAME - A word formation game using a grid pattern to define a plurality of grid space, a plurality of tiles having various letters and associated numerical point values imprinted thereon, and having a root word, preferably the word “EXTRACTOR,” disposed on grid spaces, with the goal of such word game being to earn and accumulate more points than the other players by the game's end. The game provides for removing letters of words already formed in the grid spaces to form new words via simple extraction or by extracting and adding a new letter in place of the extracted letter. | 2014-11-06 |
20140327210 | SPIRIT REALMS: ARMY, THRONE, BARRIER, WEAPON AND DEFENSE STACKING AND STOCKPILING TRADING CARD GAME - Disclosed herein is a novel game that utilizes virtual or physical trading cards as game components. In one aspect of the game, game components/cards are used to build an army of minion, leader, and army cards, and further forming a perimeter comprising at least one of a barrier or fort card to protect a throne card. The goal is to destroy at least one of the barrier or fort cards by reducing the points of each to zero, thus capturing the opponent's throne card. The game involves strategy and chance, during which players create a deck for use against the deck(s) of one or more opposing players. The game may be played on various media, including, but not limited to, electronic game consoles, computers, and interactive and social media networks accessed using computers, cellular devices, tablets, etc. | 2014-11-06 |
20140327211 | COOLED SEAL - Seals having incorporated heat pipes are disclosed relating to pumps and other comparable sealing equipment that may include a seal face, a cavity, a wicking material within the cavity, and a working fluid within the cavity. The seals may be used as a pump seal rings and in other applications having comparable heat transfer requirements. | 2014-11-06 |
20140327212 | FIRE RETARDANT HIGH TEMPERATURE DRYER SEALS AND RELATED METHODS - Fire retardant dryer seals and related methods are provided herein. A fire retardant dryer seal can include an elongate, flexible base substrate having a first end and a second end. The base substrate can also have a first surface and a second surface opposite the first surface. The first end and the second end of the base substrate secured together so that the base substrate forms at least a portion of an annular shape. A heat resistant coating disposed on at least the first surface of the base substrate. | 2014-11-06 |
20140327213 | RETENTION PIN AND METHOD OF FORMING - A retention pin assembly may include a stud having a head, a shaft, and a deformable end. The shaft may include a stepped surface having a greater diameter than the deformable end. The assembly may include a support member having an opening for receiving the deformable end. The support member may include a pocket. The stepped surface of the shaft may position the stud in relation to the support member. The deformable end of the stud may be operable to be melted to form a mechanical retainer within the pocket without forming a metallurgical joint between the stud and the pocket. | 2014-11-06 |
20140327214 | INSTRUMENT HOLDER FOR A PLOTTER - An instrument holder for holding an instrument having a body and a tip in a plotter. The instrument holder comprising a body portion, a tensioner portion for centering the instrument within the instrument holder and for gripping the instrument, and a cap portion for allowing a user thereof to adjust the grip provided by the tensioner portion on the instrument. | 2014-11-06 |
20140327215 | OSCILLATING MULTI-TOOL SYSTEM - A power tool having a housing, a motor, a tool holder driven about an output axis by the motor, and an output element for performing an operation on a workpiece. The tool holder has a locating feature including a tapered portion becoming narrower in a direction away from the surface of the tool holder. The output element has an aperture for receiving the locating feature and a face facing the surface of the tool holder when the locating feature is received. The power tool also includes a flange for transferring a clamping force for urging the output element towards the tool holder and a tab projecting from the flange for finger tightening the flange. A biasing member provides the clamping force toollessly. A gap is defined between the surface of the tool holder and the face when the tapered portion of the locating feature is fully received in the aperture. | 2014-11-06 |
20140327216 | SKATE - A skate having a skate boot with a non-lasted boot shell, the shell having a first non-lasted three-dimensional sub-shell and a second non-lasted three-dimensional sub-shell, the second sub-shell being interior to and adjoining the first sub-shell, the first sub-shell comprising a first material having a first density and the second sub-shell comprising a second material having a second density, the second density being less than the first density, the shell being shaped so as to have a heel portion, an ankle portion, a lateral portion, a medial portion, and a sole portion; and a ground-engaging assembly disposed on an underside of the skate. Additional sub-shells are possible. Methods of manufacturing the skate boot shell, including molding and build-up, are also disclosed. | 2014-11-06 |
20140327217 | ICE SKATE BLADE ASSEMBLY - An ice skate blade assembly for attachment to a footwear comprising a flexible sole includes; an elongated blade comprising an ice engaging edge; the elongated blade and the ice engaging edge comprising a flexible region; the elongated blade and the ice engaging edge flexible to flex in the flexible region; and the elongated blade comprising an upper portion extending opposite the ice engaging edge, the upper portion for attachment of the elongated blade to the flexible sole of the footwear. | 2014-11-06 |
20140327218 | SIT OR STAND STROLLERS AND METHODS OF MAKING THE SAME - Sit or stand strollers and methods of using and making the same are described herein. An example stroller includes a frame having a first set of mounts and a second set of mounts. The example stroller includes a first seat removably couplable to the frame via either the first set of mounts or the second set of mounts. The stroller also includes an accessory removably couplable to the frame via either the first set of mounts or the second set of mounts, the accessory including a platform to provide a standing surface for a stroller occupant. | 2014-11-06 |
20140327219 | MOTOR-VEHICLE MULTI-LINK SUSPENSION SYSTEM INCLUDING A TRANSVERSE LEAF SPRING - A motor-vehicle multi-link suspension system includes, for each wheel, two lower transverse arms and a substantially longitudinal or inclined lower arm, each having one end pivotally connected to a respective wheel support and the opposite end pivotally connected to the motor-vehicle structure. A leaf spring is arranged transversally with respect to the longitudinal direction of the motor-vehicle. The leaf spring is supported by elastic supports arranged symmetrically at intermediate positions between the center of the leaf spring and the ends thereof. Ends of the leaf spring are pivotally connected to upper parts of the two wheel supports. Two jack-type shock absorbers have opposite ends swingably connected to the respective wheel support and the motor-vehicle structure. The end portions of the leaf spring also fulfill the function of triangular upper transverse arms of the multi-link suspension. Preferably the leaf spring is made of a composite material. | 2014-11-06 |
20140327220 | Trailing Arm Yoke Suspension With Brake Actuator Clearance - An underslung trailing arm suspension assembly is disclosed for use on heavy duty low clearance trailers having a unique beam configuration to provide clearance for a transversely mounted air brake actuator connected directly to a disc brake housing. The suspension beam includes a unique plate mounted near an axle seat below an air spring mounting plate providing clearance for a disk brake actuator. | 2014-11-06 |
20140327221 | PIVOTING AXLE SYSTEM - A pivoting axle system for an aerial lift vehicle with a chassis includes a left axle supporting a left wheel and a right axle supporting a right wheel. The left and right axles are pivotable between a transport position and a working position. A first hydraulic cylinder is connected at one end to the chassis on a right side of a vehicle center line and at an opposite end to the left axle, and a second hydraulic cylinder is connected at one end to the chassis on a left side of the vehicle center line and at an opposite end to the right axle. In the working position, the first and second hydraulic cylinders are prevented from deflection beyond a yield point. | 2014-11-06 |
20140327222 | Running Board Bracket - A bracket for mounting a running board to a vehicle. The bracket comprising a main body comprising a support surface, an interlock structure and a mount element. The support surface provides a surface for supporting the running board. The interlock structure provides a mechanical engagement with a lower flange of the vehicle. The mount element cooperates with a fastener for fastening the bracket to a structural panel of the vehicle. | 2014-11-06 |
20140327223 | ACCESS STEP FOR AGRICULTURAL MACHINE - An agricultural machine includes: a base member; and a step assembly coupled with the base member. The step assembly includes: a support member coupled with the base member and configured for moving relative to the base member between a support member storage position and a support member operating position; and at least one step coupled with the support member and configured for moving relative to the support member between a step storage position and a step operating position, the step assembly being in a step assembly storage position when the support member is in the support member storage position and the at least one step is in the step storage position, the step assembly being in a step assembly operating position when the support member is in the support member operating position and the at least one step is in the step operating position. | 2014-11-06 |
20140327224 | Unicycle with inner leg supports - A pedal-powered one-wheeled vehicle with apparatus coupled to the pedals for laterally stabilizing a user's legs. The user can apply inward pressure to the leg stabilizing apparatuses to achieve greater lateral stability and more precise control of the vehicle. Means may be provided for keeping the leg stabilizing apparatuses from moving too far apart, and for varying the distance between the pedals. Some embodiments may have an elliptical wheel. | 2014-11-06 |
20140327225 | Device of Human Conveyance - A device for human conveyance includes a frame and a resilient member that has two ends. Upon exerting a flattening force on the resilient member, increase in distance between the two ends and the increase in distance is converted into movement of the platform by, for example a ratchet system interfaced to a wheel. | 2014-11-06 |
20140327226 | FOLDABLE BICYCLE - A foldable bicycle is provided in its self-propelled use position in its folded-out state, for transporting and for storage in its folded-up state and in both its folded-out and folded up states has fixing components for maintaining the reliability of these states, and in its folded-up state it has significantly lower space demand as compared to its folded-out state. | 2014-11-06 |
20140327227 | Wheel Axle Assembly - A wheel assembly quick release lever pivots against a thrust washer to apply a force along the length of an axle. The thrust washer is pressed toward a sleeve nut at the opposite end of the axle, which displaces the thrust washer relative to the axle, drawing the sleeve nut and a pair of compression rings toward one another deeper into conical cavities of dropouts. The radially outwardly facing surfaces of the compression rings firmly seat against the tapered cavities of the closed bore dropouts, and the radially inwardly facing surfaces of the compression rings firmly seat against the axle to provide resistance to rotational movement of the axle relative to the dropouts. The inboard surfaces of the dropouts seat against the load-bearing axle faces of the hub, which provides resistance to lateral movement. | 2014-11-06 |