45th week of 2019 patent applcation highlights part 74 |
Patent application number | Title | Published |
20190342959 | LIGHT EMITTING ELEMENT DRIVING DEVICE AND DRIVING METHOD THEREOF - A light emitting element driving device includes a first energy storage element, a power source, and a converter circuit. The power source is electrically connected to the first energy storage element via the light emitting element in order to provide current to the light emitting element and to charge the first energy storage element. The converter circuit is electrically connected to the power source and the first energy storage element, and includes an inductance. When the converter circuit is in the first operational status, the first energy storage element charges the inductance. When the converter circuit is in the second operational status, the inductance is fed back to the power source. | 2019-11-07 |
20190342960 | DRIVING CIRCUIT USING BUCK CONVERTER CAPABLE OF GENERATING SUFFICIENT VOLTAGE TO POWER A LED CIRCUIT AND ASSOCIATED AUXILIARY CIRCUITRY IN A NORMAL MODE OF OPERATION, AND INSUFFICIENT TO POWER THE LED CIRCUIT BUT SUFFICIENT TO POWER THE ASSOCIATED AUXILIARY CIRCUITRY IN AN OFF MODE OF OPERATION - A circuit includes a voltage converter converting a source voltage to a supply voltage at a first node as a function of a feedback voltage at a feedback node. A first output path is coupled between the first node and a second node. Feedback circuitry compares the voltage at the second node to first and second overvoltages, and selectively couples the second node to the feedback node based thereupon. Impedance circuitry is coupled between the first node and a third node. A light emitting diode (LED) chain is coupled to the third node, and is selectively turned on and off as a function of the selective coupling of the second node to the feedback node by the feedback circuitry. | 2019-11-07 |
20190342961 | VARIABLE BEAM SOURCE WITH MIXING CHAMBER - A light device and method for producing an output light beam are disclosed. A light source assembly comprising a plurality of light sources is arranged at the first end of the light device and emits light towards the second end and parallel with the longitudinal axis of the device. The device also has a chamber for mixing light emitted from the light source assembly; and a concave reflecting optic for redirecting light exiting the chamber and emitted onto the optic. The redirected light forms an output light beam. The device also has driver circuitry for controlling drive currents to the plurality of light sources individually or in groups thereof to thereby variably control a divergence of the output light beam. | 2019-11-07 |
20190342962 | Voice Controlled Artificial Intelligent Smart Illumination Device - The present disclosure relates to a method and apparatus for controlling an artificial intelligent smart illumination device, such as a light bulb, LED light, or the like. In one embodiment, a switching circuit for providing switchable power to the illumination device, and a processing circuit coupled to the switching circuit, for detecting one or more power toggles of the power received by the male base, and for controlling illumination of the illumination device based on the detection of one or more detected toggles (e.g., switches) is disclosed. The disclosure includes an artificial intelligent system, which can determine a lighting status based on the user's preference, living behaviors, time of a day, energy efficiency, energy costs, and any other light using conditions and factors. | 2019-11-07 |
20190342963 | LIGHT FIXTURE WITH DYNAMICALLY CONTROLLABLE LIGHT DISTRIBUTION - A light engine is disclosed in which the light engine contains a core comprising an opening extending completely through the core and independently addressable LED segments. The opening defines an inner surface of the core. Each segment has multiple LEDs. A PCB contains a body adjacent to one of an inner or outer surface of the core and to which the LED segments are attached and legs extending from the body and bent to be adjacent and traverse to the other of the inner or outer surface. Each leg is associated with a different LED segment. Control circuitry is connected with the legs of the flexible PCB and independently controls parameters of the LED segments to provide a preset illumination distribution and intensity based on user input. | 2019-11-07 |
20190342964 | Luminaire with Programmable Light Distribution - A method of setting luminance levels of a solid-state light sources of a luminaire with programmable light distribution is provided. The method includes obtaining a file describing a desired light beam distribution, converting the desired light beam distribution into luminance levels for the solid-state light sources, and applying the luminance levels to the solid-state light sources to cause the luminaire to output the desired light beam distribution. | 2019-11-07 |
20190342965 | Luminaire with Programmable Light Distribution - A method of setting luminance levels of a solid-state light sources of a luminaire with programmable light distribution is provided. The method includes obtaining a file describing a desired light beam distribution, converting the desired light beam distribution into luminance levels for the solid-state light sources, and applying the luminance levels to the solid-state light sources to cause the luminaire to output the desired light beam distribution. | 2019-11-07 |
20190342966 | ELECTRICAL LOAD SET CIRCUIT, LIGHT STRIP AND CONTROL APPARATUS THEREFOR - An electrical load set circuit and apparatus having at least three control signal lines arranged in parallel, a pair of polarized electrical loads connected between two of the signal lines, and another electrical load connected between a different control signal line and one of the polarized loads. Individual ones of the electrical loads can be selectively activated without requiring an additional common (ground) line. At least two of the control signal lines can be kept in a floating state. A light strip includes plural light set circuits spaced along the control signal lines. In another variation, first and second light points are spaced along the three control signal lines, each including three different color LEDs respectively. | 2019-11-07 |
20190342967 | INDIVIDUALLY ACCESSIBLE LED LIGHT SYSTEM - Disclosed is an individually accessible LED light system in which color and luminosity of the LED lights are individually controlled. Each of the LED lights can comprise an LED light bank, which can contain any number of lights. The primary colors can be used in the LED bank to create any desired color. The LED light bank can also be incorporated on a single chip with an address and control circuit. | 2019-11-07 |
20190342968 | TOUCH SCREEN LIGHTING SYSTEM CONTROLLER - A system including an electronic processor, a transceiver communicatively coupled to the electronic processor, a touch screen display communicatively coupled to the electronic processor and a non-transient memory medium communicatively coupled to the electronic processor. The electronic processor is configured to generate a graphical representation based on at least one configuration file, the graphical representation including a button, present the graphical representation on the touch screen display, receive, via the touch screen display, a user input indicative of selecting the button, and transmit, via the transceiver, a lighting system control command based selection of the button. | 2019-11-07 |
20190342969 | CONTROL METHODS, COMPUTER-READABLE MEDIA, AND CONTROLLERS - According to various embodiments, a control method may be provided. The control method may include: determining geometric information about respective geometries of respective housings of a plurality of light sources; determining a photographic representation of an environment in which the plurality of light sources are provided; determining spatial information about the plurality of light sources based on the geometric information and based on the photographic representation; determining control information for the plurality of light sources based on the spatial information; and controlling the plurality of light sources based on the control information. | 2019-11-07 |
20190342970 | COLOR-MIXING LED COMPONENT AND METHOD OF PRODUCTION THEREFOR - A color mixing light emitting diode (LED) assembly comprises a carrier and at least three LEDs that are arranged on the carrier and configured to emit light in mutually different colors and together generate an output radiation that corresponds to an additive color mix, wherein each of the LEDs has an individual emission characteristic. The LED assembly furthermore comprises a respective driver input for each of the LEDs to supply the LEDs with electrical energy, wherein the emission characteristics of the LEDs are dependent on the respective energy supply so that the color mix of the output radiation can be set by varying the respective energy supply at the driver inputs. The LED assembly has a calibration information element that includes at least one readable calibration value for each of the LEDs that represents the individual emission characteristic of the respective LED. | 2019-11-07 |
20190342971 | Lighting Load Abnormality Detecting Device and Corresponding Lighting System - The invention relates to a lighting load abnormality detecting device, the device including a power supply module, which is configured to provide power supply for the detecting device and the lighting load connected with the detecting device; a detecting circuit is configured to detect the abnormal state of the lighting load; a control module is configured to judge whether the lighting load is abnormal or not according to the detecting circuit feedback detection information; the detecting circuit includes a parallel PWM detection circuit and a static detection circuit; the static detecting circuit is configured to independently detect anomalies when the abnormality detecting device has no pulse loading or to cooperate with the pulse width modulation detecting circuit to jointly detect anomalies when there is pulse loading. | 2019-11-07 |
20190342972 | LIGHT SOURCE POWER SUPPLY - A light source power supply circuit having multiple output channels is described, the light source comprising:
| 2019-11-07 |
20190342973 | COLOR SENSING USING PULSED LIGHT - Systems and methods for detecting a color of a color changing indicator in the presence of ambient light. A system includes a light source, a photodetector, and a processor. The processor obtains a first measurement of ambient light received from the photodetector while the light source is off. The processor causes the light source to transmit light. The processor obtains a second measurement from the photodetector during the transmission, the second measurement including the ambient light and the pulsed light reflected from an object. The processor determines a color of the color changing indicator by removing an ambient light signal from the second measurement based on the first measurement and therefrom determines a volume of bodily exudate present. | 2019-11-07 |
20190342974 | COLOR TEMPERATURE SENSOR - A color temperature sensor assembly comprising a sensor body, a substantially dome shaped diffuser extending through an opening in the sensor body, a substantially flat diffuser disposed within the sensor body below the first diffuser, and a color temperature sensing module disposed below the flat diffuser and adapted to detect a color temperature of light collected by the dome shaped diffuser and the flat diffuser. The shape of the dome diffuser helps capture light from all angles to bring in more light to the sensor and provide more accurate readings. The secondary flat diffuser is adapted to further diffuse the light to reduce light concentration and prevent inaccurate readings. The color temperature readings from the color temperature sensor assembly may be used to control at least one lighting load. | 2019-11-07 |
20190342975 | LIGHT ENGINES WITH DYNAMICALLY CONTROLLABLE LIGHT DISTRIBUTION - An apparatus is disclosed comprising: a light guide having an opening formed thereon; an illumination source at least partially disposed in the opening, the illumination source including a plurality of LEDs disposed on a flexible circuit that is wrapped around a base, which may be thermally conductive, the base having a central opening, and the flexible circuit including a plurality of legs, each leg including electrical wiring for independently operating a different one of the LEDs, each leg being wrapped around a bottom edge of the base, and into the central opening, to come above the illumination source and connect to a control board that is situated above the illumination source; and a heat-dissipating element disposed over the illumination source, the heat-dissipating element being thermally coupled to the base to dissipate heat generated by the LEDs that is supplied to the heat dissipating element via the base. | 2019-11-07 |
20190342976 | Universal Sensor Interface System For Luminaires - A universal sensor interface system for a luminaire includes a sensor receiving cavity that is formed in the luminaire and defined by a sensor receiving receptacle. Further, the universal sensor interface system includes a sensor device that is configured to be removably coupled to the sensor receiving receptacle of the luminaire and disposed in the sensor receiving cavity. The sensor device receives electrical energy from the luminaire and establishes data communication with the luminaire when the sensor device is disposed in the sensor receiving cavity. The transfer of electrical energy and data communication between the luminaire and the sensor device are enabled either wirelessly or using connector systems such as a pogo connector system. The luminaire includes a translation engine that is configured to transform data received from the sensor device to a format that is compatible with the luminaire and/or a light control system of the luminaire and vice-versa. | 2019-11-07 |
20190342977 | SYSTEMS AND METHODS FOR ALLOCATING A NETWORK ADDRESS TO A LIGHTING DEVICE - A networked light control system includes a wireless detection circuit configured to receive wireless signals emitted by marker devices associated with different lighting devices. The control system includes the lighting devices connected with each other in a wired lighting control network. The control system includes a controller configured to determine network addresses of the lighting devices in the wired lighting control network based on the wireless signals received from the marker devices. The control system includes the controller is configured to control operation of one or more of the lighting devices in the wired lighting control network using one or more of the network addresses that are determined based on the wireless signals received from the marker devices. | 2019-11-07 |
20190342978 | SYSTEMS AND METHODS TO MANAGE THEMES IN LIGHTING MODULES - A lighting system includes lighting fixtures and a lighting controller that sends commands and data over an AC power line to power and control the lighting fixtures. Lighting themes are uniquely programmable color and intensity that are applied to a collection of lighting groups to achieve different lighting modes instantly, without the delay that programming each lighting fixture individually incurs. The groups of lighting modules receive theme lighting information over the power line and store the theme information in memory. The lighting controller sends a single command to the collections of the lighting groups to apply the theme. Each lighting module retrieves and applies the theme information. | 2019-11-07 |
20190342979 | CODED LIGHT MODULATION ARRANGEMENT - The invention describes a coded light modulation arrangement ( | 2019-11-07 |
20190342980 | DRIVER CIRCUIT - The driver circuit according to the invention includes a receiver module, a counter unit, isolation units and a voltage regulation unit. The receiver module receives an initiation signal and performs filtering using a low-pass filter to convert the initiation signal into a driving signal which is transmitted to the counter unit. Upon receiving the driving signal, the output terminals of the counter unit are sequentially activated to output a control signal. The isolation units may be diodes or transistors adapted to output an isolated control signal. The voltage regulation unit includes a plurality of resistors and is adapted to output a control voltage corresponding to one of the resistors according to the isolated control signal. The control voltage is useful in shifting the operation of an electrical device from one operation state to another. | 2019-11-07 |
20190342981 | BLUETOOTH.TM. RADIO MODULE WITH REAL TIME CLOCK - A system including a lighting controller and a radio adapter. The lighting controller includes a smart port and is configured to control at least one lighting fixture. The radio adapter is communicatively coupled to the lighting controller via the smart port. The radio adapter is configured to establish a wireless communication link between the lighting controller and an external device, communicatively couple the external device to the lighting controller via the smart port, and provide a master clock timing signal to the lighting controller via the smart port. | 2019-11-07 |
20190342982 | ILLUMINATION CONTROL SYSTEMS AND METHODS - Illumination control systems and methods, including those for influencing circadian rhythm, are disclosed. Embodiments include a control device capable of obtaining desired color temperature (e.g., local daylight) information, generating a color temperature value, and outputting a signal including the color temperature value. Embodiments further include a server having means for obtaining at least one of geographical location information and time of day information relative to the server, a processor to determine local daylight information, and a wireless transmitter to broadcast the signal within a site system. Embodiments further include one or more lighting control devices to control lighting devices, each lighting control having a wireless receiver to continuously listen for and receive the signal broadcasted by the server, and a lighting driver to change the lighting output of the coupled lighting device according to the detected signal. | 2019-11-07 |
20190342983 | A LIGHTING SYSTEM FOR CONTROLLING AN LED ARRAY - A lighting system ( | 2019-11-07 |
20190342984 | CONTROL DEVICE FOR CONTROLLING MULTIPLE OPERATING CHARACTERISTICS OF AN ELECTRICAL LOAD - A load control device may be configured to control multiple characteristics of one or more electrical loads such as the intensity and color of a lighting load. The load control device may include concentric rotating portions for adjusting the multiple characteristics. A control circuit of the load control device may be configured to generate control data for controlling one or more of the characteristics of the electrical loads in response to rotations of the concentric rotating portions. The control circuit may be further configured to provide feedback regarding the control being applied on one or more visual indicators. The load control device may be a wall-mounted dimmer device or a battery-powered remote control device. | 2019-11-07 |
20190342985 | SYSTEMS AND APPARATUSES FOR HIGH PERFORMANCE ATMOSPHERE THIN FILM PIEZOELECTRIC RESONANT PLASMAS TO MODULATE AIR FLOWS - Systems and apparatuses for applying a plasma actuator system for reducing aerodynamic drag of a vehicle by discharging plasma is provided. The system includes: at least one pair of thin films configured to integrate into a pair of electrodes wherein each of the thin films of the pair of thin films is composed of a thin film piezo-electric material; a dielectric configured as an insulator region to separate each electrode integrated with the thin film piezo-electric material; and a power supply to deliver alternating current to each electrode to provide a high voltage output obtained by the thin film piezo-electric material integrated with the pair of electrodes wherein the high voltage output is about 10 kV. | 2019-11-07 |
20190342986 | Method of High-Efficient Heat Dissipation for Plasma Torch Electrode by Using Integrated Heat Pipes - Plasma torch with an integrated electrode incorporating many heat pipes each heat pipe comprises an evaporating section and a condensing section set at a front end and a rear end of the electrode, respectively. The heat pipes with extremely high thermal conductivity can be used to replace the traditional water-cooled torch's electrode. The effect of reducing the elevated temperature at the torch's arc root zone through cooling by heat pipes is beneficial for prolonging the lifetime of plasma torch. Each heat pipe is filled with a small amount of working fluid. Even if one heat pipe is etched out, the cooling liquid thus ejected is limited without causing gas explosion and rock curing; the rest of heat pipes are not damage and can still function; although the heat dissipation efficiency might be reduced a little, the plasma torch still works. Thus, flexibility of the whole heat dissipation is enhanced. | 2019-11-07 |
20190342987 | ELECTRONIC STRUCTURE COMPRISING A MATRIX ARRAY OF ELECTRONIC DEVICES HAVING IMPROVED THERMAL PERFORMANCES - An electronic structure includes a plurality of electronic devices arranged in the form of a matrix array including a first number of rows, the electronic devices of each row being connected in series, the matrix array further including a plurality of switches, the rows of the matrix array being distributed in a second number of groups intended to be connected in series by the switches, the groups connected in series being supplied with an electrical supply current, at least one of the groups including at least two rows connected in parallel so as to distribute the supply current between the at least two rows. | 2019-11-07 |
20190342988 | PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT - A packaged microelectronic component includes a substrate and a semiconductor die coupled to a top surface of the substrate. A method of attaching the packaged microelectronic component to a secondary structure entails applying a metal particle-containing material to at least one of a bottom surface of the substrate and a mounting surface of the secondary structure. The packaged microelectronic component and the secondary structure are arranged in a stacked relationship with the metal particle-containing material disposed between the bottom surface and the mounting surface. A low temperature sintering process is performed at a maximum process temperature less than a melt point of the metal particles to transform the metal particle-containing material into a sintered bond layer joining the packaged microelectronic component and the secondary structure. In an embodiment, the substrate may be a heat sink for the packaged microelectronic component and the secondary structure may be a printed circuit board. | 2019-11-07 |
20190342989 | ELECTRONIC CONTROL DEVICE, VEHICLE, AND METHOD FOR MANUFACTURING ELECTRONIC CONTROL DEVICE - Provided is an electronic control unit, which includes a printed wiring board on which a semiconductor element is mounted, including a power supply pattern and a ground pattern which are formed on the printed wiring board and connected to the semiconductor element, at least one capacitance adjustment pattern which is formed on the printed wiring board, and a connection portion which is provided for each capacitance adjustment pattern and able to switch electrical connection between either the power supply pattern or the ground pattern and the capacitance adjustment pattern. | 2019-11-07 |
20190342990 | DEVICE, SYSTEM AND METHOD TO MITIGATE SIGNAL NOISE IN COMMUNICATIONS WITH A MEMORY MODULE - Techniques and mechanisms for mitigating signal deterioration in communications between two circuit boards. In an embodiment, a packaged device accommodates coupling to a first circuit board which, in turn, accommodates connection to a second circuit board. In one such embodiment, an amplifier circuit of the packaged device includes an amplifier circuit which comprises a variable resistor and an active circuit element coupled thereto. The device receives via one of the circuit boards a control signal and a voltage which configure the amplifier circuit to provide an impedance matching for communication between the circuit boards. In another embodiment, the device comprises multiple common gate amplifiers which are variously configurable each to provide a respective impedance matching for communications between a motherboard and a dual in-line memory module. | 2019-11-07 |
20190342991 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE - A printed circuit board includes an electronic component including a first base and a plurality of first lands, the first base including a first main surface, the plurality of first lands being disposed around a first portion of the first main surface and spaced from each other, a printed wiring board including a second base and a plurality of second lands, the second base including a second main surface, the plurality of second lands being disposed around a second portion of the second main surface and spaced from each other, bonding portions configured to bond the first lands and the second lands, a resin portion configured to cover the bonding portions and including cured thermosetting resin, and a member having a property to repel uncured thermosetting resin and disposed on one of the first portion and the second portion. | 2019-11-07 |
20190342992 | Coplanar LED Array and Driver Assembly - An LED array and driver design minimizes space requirements and simplifies assembly, while reducing costs. A printed circuit board with LED driver electronics has a central opening through which the LED array is mounted. In one form the LED array is a chip on board (COB) array, the array being circular and fitting closely within the central opening of the PCB. Four integral leaf springs are formed into the flat PCB, in position to push the LED array down when the PCB and LED array are attached against the heat sink. Two of the springs have electrical contacts that make contact with those of the LED array. With the LED array and driver circuit on the face of a light assembly, the space rear of the driver circuit is free to be open to air flow for cooling. | 2019-11-07 |
20190342993 | STRETCHABLE ELECTRONICS AND METHOD FOR FABRICATING THE SAME - Provided is stretchable electronics. The stretchable electronics includes stretchable substrate, first support patterns disposed on a first surface of the stretchable substrate, and output devices disposed on the first patterns, respectively. The first support patterns are arranged in a first direction and a second direction, which are parallel to an extension direction of the substrate, and each of the output devices generates an output stimulation. | 2019-11-07 |
20190342994 | SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS - A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer. | 2019-11-07 |
20190342995 | SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS - A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer. | 2019-11-07 |
20190342996 | BOARD TO BOARD INTERCONNECT - A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad. | 2019-11-07 |
20190342997 | ELECTRONIC DEVICE - An electronic device is provided and including a first substrate including a first glass substrate and a first conductive layer; a second substrate including: a second glass substrate which is disposed to be apart from the first conductive layer and includes a first surface opposed to the first conductive layer and a second surface opposite to the first surface, a second conductive layer disposed on the second surface, and a first hole penetrating the second glass substrate; and a connecting material electrically connecting the first conductive layer and the second conductive layer via the first hole, wherein the first hole is shaped as a funnel, and the connecting material includes a hollow part in which an insulative filling material is filled. | 2019-11-07 |
20190342998 | CIRCUIT BOARD MODULE FOR DISPLAY DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - Disclosed is an circuit board module for a display device having a rigid-flex circuit board structure which is capable of improving spatial efficiency of a mother board, and simplifying a structure of the mother board, a method for manufacturing the same, and a display device, wherein a rigid-flex printed circuit board, a rigid printed circuit board, and a flexible printed circuit cable are respectively manufactured on the different mother boards, separately, and then combined with one another, whereby it is possible to realize the more-improved spatial efficiency of the mother board in comparison to a case of manufacturing the rigid-flex printed circuit board, the rigid printed circuit board, and the flexible printed circuit cable on one mother board. | 2019-11-07 |
20190342999 | ELECTRIC ELEMENT - An electric element includes a conducting path connecting electrodes and an insulating layer covering the conducting path. The electric element includes bonding portions in which the electrodes are disposed and a line portion connecting between the bonding portions. The line portion has a curved region sandwiched by portions having an outer shape curved on both sides of the insulating layer disposed to sandwich the conducting path. The line portion includes bonding patterns including metal surfaces exposed from the insulating layer. Each of contours of the bonding patterns includes at least two linear sides. At least two sides of the contour of a first bonding pattern disposed in the curved region are parallel or substantially parallel to at least two sides of a contour of at least one of the bonding patterns adjacent in an extending direction of the line portion. | 2019-11-07 |
20190343000 | CRYSTAL PACKAGING WITH CONDUCTIVE PILLARS - A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals. | 2019-11-07 |
20190343001 | PRINTED CIRCUIT BOARDS WITH THICK-WALL VIAS - In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches). | 2019-11-07 |
20190343002 | INTEGRATING JOSEPHSON AMPLIFIERS OR JOSEPHSON MIXERS INTO PRINTED CIRCUIT BOARDS - An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers. | 2019-11-07 |
20190343003 | INTEGRATING JOSEPHSON AMPLIFIERS OR JOSEPHSON MIXERS INTO PRINTED CIRCUIT BOARDS - An aspect includes one or more board layers. A first chip cavity is formed within the one or more board layers, wherein a first Josephson amplifier or Josephson mixer is disposed within the first chip cavity. The first Josephson amplifier or Josephson mixer comprises at least one port, each port connected to at least one connector disposed on at least one of the one or more board layers, wherein at least one of the one or more board layers comprises a circuit trace formed on the at least one of the one or more board layers. | 2019-11-07 |
20190343004 | METHOD OF FORMING PROTECTIVE FILM ON AT LEAST ONE ELECTRONIC MODULE - A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules. | 2019-11-07 |
20190343005 | METHODS OF MANUFACTURING PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS - An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation. | 2019-11-07 |
20190343006 | COMPONENT PLACEMENT DEVICE - A component placement device for picking up a component and placing a component on a substrate device comprises a holder which is movable at least in a main direction, as well as a nozzle for picking up a component. The nozzle is movable at least in a direction opposite the main direction relative to the holder. The component placement device comprises a fluid flow channel which opens or closes upon movement of the nozzle in the direction opposite the main direction relative to the holder, detection means for detecting the opening or closing of the fluid flow channel as well as means for controlling the movement of the holder in at least the main direction on the basis of a signal delivered by the detection means concerning the opening or closing of the fluid flow channel. | 2019-11-07 |
20190343007 | ELECTRONIC DEVICE - An electronic device includes: an electronic component; and a mounting member on which the electronic component is mounted. A center of gravity of the electronic component is at a position separated from the mounting member. The electronic device further includes: a rigid member having a frame shape, which is fixed to the mounting member and surrounds the electronic component in a direction perpendicular to a direction from the center of gravity of the electronic component to the mounting member; and a connecting member which connects the electronic component to the rigid member on a side opposite to the mounting member with respect to the electronic component. | 2019-11-07 |
20190343008 | Embedding Known-Good Component Between Known-Good Component Carrier Blocks With Late Formed Electric Connection Structure - A method of manufacturing a component carrier, wherein the method comprises mounting a known-good component on or spaced with regard to a first known-good component carrier block, thereafter forming an electrically conductive connection structure on and/or in and/or spaced with regard to the first component carrier block, and embedding the component between the first component carrier block and a second known-good component carrier block. | 2019-11-07 |
20190343009 | LARGE DISPLAY DEVICE HAVING PARTIALLY CURVED PART - A large-sized display device having a partially curved part, includes: a partially curved transparent panel fixing plate comprising a curved part, formed so as to have a predetermined curved surface, and a flat part, formed so as to be continuous with the curved part; a curved display panel formed so as to have a curved surface corresponding to the curved surface of the curved part for displaying an image through the panel fixing plate; and a flat display panel installed at the flat part for displaying an image through the panel fixing plate. | 2019-11-07 |
20190343010 | DISPLAY APPARATUS AND PORTABLE TERMINAL - A display apparatus includes a window member, a display panel and a support member. The window member includes a window flat portion, and a window bent portion which extends bent from the window flat portion. The display panel includes an upper flat portion overlapping with the window flat portion, an upper bent portion extending bent from the upper flat portion to extend along the window bent portion, and a lower bent portion extending from the upper bent portion and bent toward a center of the upper flat portion. The support member disposes the display panel between the window member and the support member and extends along the lower bent portion of the display panel. Each of the upper flat portion and the upper bent portion is a display area of the display panel, and the lower bent portion is a non-display area of the display panel. | 2019-11-07 |
20190343011 | MEDICAL DEVICES - In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature. | 2019-11-07 |
20190343012 | EASILY ASSEMBLED AND DISASSEMBLED LATCHING STRUCTURE - A latching structure includes a first plate, a second plate and a sliding plate disposed on a surface of the first plate and movable in a first direction. The first plate includes first arches each having an alignment hole in the first direction. The second plate includes second arches each having a latching hole in the first direction. The sliding plate includes pins corresponding to the latching holes. When the alignment hole accommodates the second arch and the sliding plate is located at a latching position, the pin is located in a corresponding latching hole to block separation of the first plate from the second plate in a second direction. When the sliding plate is located at a retracted position, the pin separates from the corresponding latching hole to allow separation of the first plate from the second plate in the second direction. | 2019-11-07 |
20190343013 | ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE - An electronic device including a waterproof structure is provided. The electronic device includes a housing that includes a first face, a second face that faces in a direction substantially opposite to the first face, and a side surface that at least partially encloses a space between the first face and the second face, a middle plate arranged between the first face and the second face inside the housing to be substantially parallel to the first face, extending from the side surface, and including at least one opening, a printed circuit board arranged between the middle plate and the second face, a display arranged between the middle plate and the first face, and including a face directed toward the second face, and a seal member configured to hermetically seal the at least one opening of the middle plate, and arranged between the face of the display and the middle plate. | 2019-11-07 |
20190343014 | METHOD FOR CONTROLLING THE ASSEMBLY OF A PRINTED CIRCUIT BOARD BY RIVETING - A method for mounting a printed circuit board for an automotive vehicle on a carrier structure including at least one rivet. The printed circuit board includes at least one mounting aperture that is capable of accommodating the rivet and which defines an electrical conduction zone and at least one mark having a control end up to which the mark extends over the electrical conduction zone. The method includes a step of positioning the printed circuit board on the carrier structure such that the rivet extends through the mounting aperture, a step of riveting the rivet such that its head is at least partly flattened on the electrical conduction zone and a step of determining the conformity of riveting when the head of the rivet covers the control end of the mark. | 2019-11-07 |
20190343015 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE - A power semiconductor device includes: a plurality of power modules including control terminals; a heat sink, on which the plurality of power modules are mounted; and a control substrate, to which the control terminals are fixed. The plurality of power modules each include a first protruding portion close to the control terminals, and a second protruding portion far from the control terminals. The heat sink has, at a position corresponding to the first protruding portion, a first recessed portion formed to have an inner diameter larger than an outer diameter of the first protruding portion, and engaged with the first protruding portion. At a position corresponding to the second protruding portion, the heat sink has a second recessed portion formed to have the shape of an elongated hole whose minor diameter is larger than an outer diameter of the second protruding portion, and engaged with the second protruding portion. | 2019-11-07 |
20190343016 | ELECTRONIC UNIT - An electronic unit for a hand-held power tool, having a mounting frame having an accommodation space into which a circuit board carrying a plurality of electronic components is inserted and at least one heat sink for the heat dissipation of waste heat arising at the electronic components. A slot section with at least one insertion slot, oriented perpendicular to the printed circuit board, for mounting an electronic component along a direction of insertion is formed on the mounting frame. The at least one heat sink is associated with the slot section. | 2019-11-07 |
20190343017 | THERMAL MANAGEMENT SOLUTIONS FOR STACKED INTEGRATED CIRCUIT DEVICES USING UNIDIRECTIONAL HEAT TRANSFER DEVICES - An integrated circuit structure may be formed having a first integrated circuit device, a second integrated circuit device electrically coupled to the first integrated circuit device, and at least one unidirectional heat transfer device between the first integrated circuit device and the second integrated circuit device. In one embodiment, the unidirectional heat transfer device may be oriented such that it has a higher conductivity in the direction of heat transfer from the first integrated circuit device to the second integrated circuit device than it does in the opposite direction. When the temperature of the second integrated circuit device rises above the temperature of the first integrated circuit device, the unidirectional heat transfer device will act as a thermal insulator, and when the temperature of the first integrated circuit device rises above the temperature of the second integrated circuit device, the unidirectional heat transfer device will act as a thermal conductor. | 2019-11-07 |
20190343018 | WATER-COOLING HEAD - A water-cooling head includes a casing, a base, a thermal conduction structure and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The pump includes a fixing element, a shaft and an impeller. After the fixing element is fixed, the fixing element is contacted with the base or contacted with the thermal conduction structure, and the shaft is fixed on the fixing element. Consequently, the impeller is stably rotated about the shaft, and the performance and the reliability of the water-cooling head are enhanced. | 2019-11-07 |
20190343019 | COOLING DEVICE FOR AN ELECTRONICS MODULE - A device for cooling an electronic component includes a substrate having a component mounting surface and a fluid flow surface recessed relative to the component mounting surface. The device also includes an inlet orifice positioned proximate a first end of the fluid flow surface and an outlet orifice positioned proximate a second end of the fluid flow surface. A pattern of surface features is arranged on the fluid flow surface. The pattern of surface features is configured to entrain a coolant flowing across the fluid flow surface and redirect the coolant upward and away from the fluid flow surface. | 2019-11-07 |
20190343020 | COOLING DEVICE WITH INTEGRAL SHIELDING STRUCTURE FOR AN ELECTRONICS MODULE - A heat sink for cooling an electronic component includes a substrate comprising an electrically non-conductive material and an inlet port and an outlet port extending outward from the substrate. The inlet and outlet ports are fluidically coupled to a fluid flow surface of the heat sink by passages that extend through a portion of the substrate. The heat sink also includes a shield comprising an electrically conductive material. The shield is disposed atop or within the substrate and is configured to suppress electromagnetic interference generated by an electronic component coupled to the heat sink. | 2019-11-07 |
20190343021 | HEAT DISSIPATION UNIT CONNECTION REINFORCEMENT STRUCTURE - A heat dissipation unit connection reinforcement structure includes a case, at least one reinforcement structure and at least one heat pipe. The case has a case chamber and at least one opening formed through a top side of the case in communication with the case chamber. The reinforcement structure has a reinforcement main body correspondingly disposed on the opening. The reinforcement main body has a connection hole in communication with the case chamber. The heat pipe has a heat pipe chamber. One end of the heat pipe is inserted in the corresponding connection hole. The heat pipe chamber is in communication with the case chamber. The inner circumference of the reinforcement main body is tightly attached to and connected with an outer side of the corresponding heat pipe. | 2019-11-07 |
20190343022 | TEMPERATURE ACCORDANCE AIRFLOW BALANCING BAFFLE SYSTEM - An information handling system may include a processor, a memory communicatively coupled to the processor, first and second information handling resources, an air mover configured to provide airflow to the first and second information handling resources, a baffle configured to apportion the airflow between the first and second information handling resources, and a first structural element coupled to the baffle. The first structural element may be proximate to the first information handling resource and may include a shape-memory alloy (SMA). In response to an increase in temperature associated with the first information handling resource, the SMA may be operable to change a physical dimension of the first structural element such that the baffle is moved from a first orientation to a second orientation, the second orientation corresponding to a higher airflow to the first information handling resource. | 2019-11-07 |
20190343023 | ELECTRONIC EQUIPMENT ENCLOSURE - An electronic equipment enclosure includes a frame structure and a customizable side air dam kit. The frame structure includes a front frame, a rear frame, front-to-back frame members connecting corners of the front and rear frames together, reinforced bracket structures located near ends of the cross members, and extruded horizontal mounting rails parallel to, but inward from, the front-to-back frame members. The ends of the horizontal mounting rails are connected to the reinforced bracket structures. Panels are installed in longitudinal slots in the front-to-back frame members and horizontal mounting rails, each of which is extruded. The customizable side air dam kit includes a framework of horizontal and vertical frame pieces, adapted to connect to the frame structure, and a customizable air dam panel supported by the framework. A plurality of the frame pieces are provided to an installer for use in constructing the framework to fit the specific frame structure. | 2019-11-07 |
20190343024 | MINI-SPLIT HVAC DUCTED RETURN AND SUPPLY SYSTEM - Improved methods and systems for cooling a data room are presented wherein an HVAC mini-split unit is configured with a manifold and return air ducts that enhance the movement of warm air to the return air intake of the unit without mixing the return air with the cool air supplied by the unit. Other embodiments provide methods and systems for supplying cool air from a mini-split unit to the front of the equipment rack, thereby shortening the path of warm air behind the equipment rack to the mini-split unit and eliminating the mixing of intake air with supply air. | 2019-11-07 |
20190343025 | DATA CENTER LIQUID CONDUCTION COOLING APPARATUS AND METHOD - Embodiments disclosed include a heat exchange apparatus comprising an equipment-side coolant circuit configured for fluid communication with a first coolant compartment via a first coolant in-flow and out-flow valve. The embodiment further comprises a second coolant compartment operatively coupled to the first coolant compartment and comprising a second coolant in-flow and out-flow valve in fluid communication with a coolant supply source. The first coolant compartment is calibrated to receive hot coolant via the first coolant in-flow valve from a heat transfer element comprised in the equipment side coolant circuit line coupled to a heat generating source and in fluid communication with the first coolant in-flow valve, and the first coolant out-flow valve is calibrated to return the coolant to the heat transfer element comprised in the equipment side coolant circuit line. The second coolant compartment is calibrated to receive cold coolant from the coolant supply source via the second coolant in-flow valve and to return the received cold coolant to the coolant supply source via the second coolant out-flow valve in an open-loop coolant circuit line. | 2019-11-07 |
20190343026 | LIQUID COOLING SYSTEM FOR CABINET SERVER - The present application discloses a liquid cooling system for a cabinet server, which includes a primary side liquid circulation pipe, a distribution control device, and a secondary side liquid circulation pipe, and the primary side liquid circulation pipe is connected to the water filling device. The distribution control device is connected to the primary side liquid circulation pipe, and the secondary side liquid circulation pipe is connected to the distribution control device and at least one cabinet server. The liquid cooling system of the present application cools the cabinet server by liquid cooling, and the energy efficiency ratio of the liquid cooling system is below 1.3, there is almost no noise, no low filling water temperature is needed, natural cooling source is fully utilized, and the cooling tower can be used to meet the heat dissipation requirement. | 2019-11-07 |
20190343027 | FERRITE POWDER, RESIN COMPOSITION, ELECTROMAGNETIC SHIELDING MATERIAL, ELECTRONIC CIRCUIT SUBSTRATE, ELECTRONIC CIRCUIT COMPONENT, AND ELECTRONIC DEVICE HOUSING - The present invention provides a powdered ferrite having high dispersibility in a resin and high electromagnetic shielding characteristics. The powdered ferrite comprises platy ferrite particles having a spinel crystal structure. The powdered ferrite comprises at least 50 number % platy ferrite particles each having at least one protrusion on a surface of the particle, and the protrusion has a shape selected from the group consisting of a rectangular pyramid, a truncated rectangular pyramid, an elongated rectangular pyramid, and combinations thereof. | 2019-11-07 |
20190343028 | COMPONENT MOUNTING METHOD - The component mounting method is a method for mounting a component using a component mounter including a mounting head, a component camera as an imaging device configured to image a component, a first component holding section provided on the mounting head and capable of holding a first component, and a second component holding section capable of holding a second component at a position lower than the first component, the component mounting method having steps wherein the first component holding section picks up the first component, the imaging device images the first component, the second component holding section picks up the second component while the first component holding section holds the first component, and the second component is imaged while the first component holding section holds the first component and the second component holding section holds the second component. | 2019-11-07 |
20190343029 | Strawberry Plant Named 'DR. DUNCAN' - The present invention provides new and distinct strawberry plant designated as ‘Dr. Duncan’ (a.k.a. ‘108637’). | 2019-11-07 |
20190343030 | HOSTA PLANT NAMED 'WU HOO' - A new and distinct cultivar of | 2019-11-07 |
20190343031 | Zoysiagrass named 'KSUZ 0802' - The new and distinct zoysiagrass variety described herein is a | 2019-11-07 |