46th week of 2019 patent applcation highlights part 54 |
Patent application number | Title | Published |
20190348342 | PACKAGE STRUCTURE WITH MULTIPLE SUBSTRATES | 2019-11-14 |
20190348343 | SEMICONDUCTOR PACKAGE SYSTEM | 2019-11-14 |
20190348344 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2019-11-14 |
20190348345 | Module Lid with Embedded Two-Phase Cooling and Insulating Layer | 2019-11-14 |
20190348346 | PATTERNED DIE PAD FOR PACKAGED VERTICAL SEMICONDUCTOR DEVICES | 2019-11-14 |
20190348347 | Die Attach Methods and Semiconductor Devices Manufactured based on Such Methods | 2019-11-14 |
20190348348 | SEMICONDUCTOR DEVICE WITH LEAD TERMINALS HAVING PORTIONS THEREOF EXTENDING OBLIQUELY | 2019-11-14 |
20190348349 | TERMINAL STRUCTURE AND SEMICONDUCTOR MODULE | 2019-11-14 |
20190348350 | SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD | 2019-11-14 |
20190348351 | SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 2019-11-14 |
20190348352 | WIRING STRUCTURE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-11-14 |
20190348353 | SEMICONDCUTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2019-11-14 |
20190348354 | SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2019-11-14 |
20190348355 | ISOLATOR WITH SYMMETRIC MULTI-CHANNEL LAYOUT | 2019-11-14 |
20190348356 | PACKAGE CARRIER STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-11-14 |
20190348357 | DISPLAY DEVICE | 2019-11-14 |
20190348358 | PACKAGE STRUCTURE APPLIED TO DRIVING APPARATUS OF DISPLAY | 2019-11-14 |
20190348359 | PRINTED CIRCUIT BOARD AND ELECTRONIC EQUIPMENT | 2019-11-14 |
20190348360 | SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING | 2019-11-14 |
20190348361 | MANAGED INTEGRATED CIRCUIT POWER SUPPLY DISTRIBUTION | 2019-11-14 |
20190348362 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-11-14 |
20190348363 | SEMICONDUCTOR DEVICES HAVING ELECTROSTATIC DISCHARGE LAYOUTS FOR REDUCED CAPACITANCE | 2019-11-14 |
20190348364 | DEVICES INCLUDING VIAS EXTENDING THROUGH ALTERNATING DIELECTRIC MATERIALS AND CONDUCTIVE MATERIALS, AND RELATED METHODS | 2019-11-14 |
20190348365 | DUAL THICKNESS FUSE STRUCTURES | 2019-11-14 |
20190348366 | REDISTRIBUTION LAYER STRUCTURES FOR INTEGRATED CIRCUIT PACKAGE | 2019-11-14 |
20190348367 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | 2019-11-14 |
20190348368 | Methods Of Forming Self-Aligned Vias And Air Gaps | 2019-11-14 |
20190348369 | METHOD AND APPARATUS FOR PROTECTING METAL INTERCONNECT FROM HALOGEN BASED PRECURSORS | 2019-11-14 |
20190348370 | Semiconductor Device and Method of Manufacture | 2019-11-14 |
20190348371 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2019-11-14 |
20190348372 | ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME | 2019-11-14 |
20190348373 | Semiconductor Device with Stress Relieving Structure | 2019-11-14 |
20190348374 | WIRING BOARD AND SEMICONDUCTOR DEVICE | 2019-11-14 |
20190348375 | FLIP-CHIP PACKAGING SUBSTRATE AND METHOD FOR FABRICATING THE SAME | 2019-11-14 |
20190348376 | SEMICONDUCTOR DEVICE | 2019-11-14 |
20190348377 | DIELECTRIC CRACK STOP FOR ADVANCED INTERCONNECTS | 2019-11-14 |
20190348378 | IMPLEMENTING TRANSIENT ELECTRONIC CIRCUITS FOR SECURITY APPLICATIONS | 2019-11-14 |
20190348379 | IMPEDANCE COMPENSATION OF FLIP CHIP CONNECTION FOR RF COMMUNICATIONS | 2019-11-14 |
20190348380 | Antenna Package Structure And Antenna Packaging Method | 2019-11-14 |
20190348381 | Integrated Fan-Out Structure and Method of Forming | 2019-11-14 |
20190348382 | Stress Relieving Structure for Semiconductor Device | 2019-11-14 |
20190348383 | MONOLITHIC DECOUPLING CAPACITOR BETWEEN SOLDER BUMPS | 2019-11-14 |
20190348384 | DEVICE FOR INSPECTING A BUMP HEIGHT, DEVICE FOR PROCESSING A SUBSTRATE, METHOD FOR INSPECTING A BUMP HEIGHT, AND STORAGE MEDIUM | 2019-11-14 |
20190348385 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-11-14 |
20190348386 | CHIP PACKAGE STRUCTURE | 2019-11-14 |
20190348387 | SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES | 2019-11-14 |
20190348388 | Compressible Foamed Thermal Interface Materials and Methods of Making the Same | 2019-11-14 |
20190348389 | APPARATUS WITH MULTI-WAFER BASED DEVICE COMPRISING EMBEDDED ACTIVE AND/OR PASSIVE DEVICES AND METHOD FOR FORMING SUCH | 2019-11-14 |
20190348390 | SEMICONDUCTOR MODULE COMPRISING A FIRST AND SECOND CONNECTING ELEMENT FOR CONNECTING A SEMICONDUCTOR CHIP, AND ALSO PRODUCTION METHOD | 2019-11-14 |
20190348391 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-11-14 |
20190348392 | High Speed Handling of Ultra-Small Chips by Selective Laser Bonding and Debonding | 2019-11-14 |
20190348393 | BONDING APPARATUS | 2019-11-14 |
20190348394 | METHODS FOR FABRICATING 3D SEMICONDUCTOR DEVICE PACKAGES, RESULTING PACKAGES AND SYSTEMS INCORPORATING SUCH PACKAGES | 2019-11-14 |
20190348395 | THIN BONDED INTERPOSER PACKAGE | 2019-11-14 |
20190348396 | MODULAR VOLTAGE REGULATORS | 2019-11-14 |
20190348397 | Molded Semiconductor Package Having a Package-in-Package Structure and Methods of Manufacturing Thereof | 2019-11-14 |
20190348398 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | 2019-11-14 |
20190348399 | SEMICONDUCTOR PACKAGE AND RELATED METHODS | 2019-11-14 |
20190348400 | SEMICONDUCTOR MEMORY DEVICE | 2019-11-14 |
20190348401 | SEMICONDUCTOR DEVICE ASSEMBLY WITH HEAT TRANSFER STRUCTURE FORMED FROM SEMICONDUCTOR MATERIAL | 2019-11-14 |
20190348402 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD | 2019-11-14 |
20190348403 | STRUCTURE AND METHOD TO FORM NANOSHEET DEVICES WITH BOTTOM ISOLATION | 2019-11-14 |
20190348404 | METHOD OF MANUFACTURING POWER SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE | 2019-11-14 |
20190348405 | APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE | 2019-11-14 |
20190348406 | SEMICONDUCTOR DICE ASSEMBLIES, PACKAGES AND SYSTEMS, AND METHODS OF OPERATION | 2019-11-14 |
20190348407 | SEMICONDUCTOR PACKAGE | 2019-11-14 |
20190348408 | Multiphase Parallel DCDC Circuit and Chip Structure Thereof | 2019-11-14 |
20190348409 | LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS | 2019-11-14 |
20190348410 | Electronic Device Including a Transistor and a Variable Resistor | 2019-11-14 |
20190348411 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-11-14 |
20190348412 | POWER SEMICONDUCTOR DEVICES | 2019-11-14 |
20190348413 | DEVICES INCLUDING CONTROL LOGIC STRUCTURES, ELECTRONIC SYSTEMS, AND RELATED METHODS | 2019-11-14 |
20190348414 | SEMICONDUCTOR DEVICES | 2019-11-14 |
20190348415 | TRANSISTORS EMPLOYING CAP LAYER FOR GE-RICH SOURCE/DRAIN REGIONS | 2019-11-14 |
20190348416 | SEMICONDUCTOR DEVICE INCLUDING TRANSISTORS SHARING GATES | 2019-11-14 |
20190348417 | Integrated Memory and Integrated Assemblies | 2019-11-14 |
20190348418 | SEMICONDUCTOR DEVICE INCLUDING AIR GAPS AND METHOD FOR FABRICATING THE SAME | 2019-11-14 |
20190348419 | Integrated Assemblies Which Include Carbon-Doped Oxide, and Methods of Forming Integrated Assemblies | 2019-11-14 |
20190348420 | MEMORY DEVICES AND METHODS OF FABRICATING THE SAME | 2019-11-14 |
20190348421 | Including Forming First, Second, and Third Contact Openings | 2019-11-14 |
20190348422 | SEMICONDUCTOR STRUCTURE AND STATIC RANDOM ACCESS MEMORY, AND FABRICATION METHODS THEREOF | 2019-11-14 |
20190348423 | Memory Arrays, and Methods of Forming Memory Arrays | 2019-11-14 |
20190348424 | Integrated Assemblies Having Ferroelectric Transistors with Body Regions Coupled to Carrier Reservoirs; and Methods of Forming Integrated Assemblies | 2019-11-14 |
20190348425 | SEMICONDUCTOR DEVICES | 2019-11-14 |
20190348426 | METHOD FOR FORMING MEMORY DEVICE | 2019-11-14 |
20190348427 | Method of Making Embedded Memory Device With Silicon-On-Insulator Substrate | 2019-11-14 |
20190348428 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-11-14 |
20190348429 | SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF | 2019-11-14 |
20190348430 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-11-14 |
20190348431 | SEMICONDUCTOR DEVICE | 2019-11-14 |
20190348432 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND FABRICATING EQUIPMENT FOR SEMICONDUCTOR DEVICE USING THE SAME | 2019-11-14 |
20190348433 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2019-11-14 |
20190348434 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-11-14 |
20190348435 | THREE-DIMENSIONAL MEMORY DEVICE HAVING DOUBLE-WIDTH STAIRCASE REGIONS AND METHODS OF MANUFACTURING THE SAME | 2019-11-14 |
20190348436 | VERTICAL MEMORY DEVICE | 2019-11-14 |
20190348437 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME | 2019-11-14 |
20190348438 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2019-11-14 |
20190348439 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-11-14 |
20190348440 | PIXEL ARRAY SUBSTRATE AND DRIVING METHOD THEREOF | 2019-11-14 |
20190348441 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | 2019-11-14 |