47th week of 2020 patent applcation highlights part 61 |
Patent application number | Title | Published |
20200365547 | SEMICONDUCTOR APPARATUS WITH HIGH-STABILITY BONDING LAYER AND PRODUCTION METHOD THEREOF | 2020-11-19 |
20200365548 | Semiconductor Package and Method of Forming a Semiconductor Package | 2020-11-19 |
20200365549 | Clip Having Locking Recess | 2020-11-19 |
20200365550 | Bonded Semiconductor Devices and Methods of Forming The Same | 2020-11-19 |
20200365551 | ELECTRONIC DEVICE | 2020-11-19 |
20200365552 | ADHESIVE BONDING COMPOSITION AND METHOD OF USE | 2020-11-19 |
20200365553 | BATCH MANUFACTURE OF PACKAGES BY SHEET SEPARATED INTO CARRIERS AFTER MOUNTING OF ELECTRONIC COMPONENTS | 2020-11-19 |
20200365554 | MULTI-MODULE INTEGRATED INTERPOSER AND SEMICONDUCTOR DEVICE FORMED THEREFROM | 2020-11-19 |
20200365555 | SEMICONDUCTOR PACKAGE | 2020-11-19 |
20200365556 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ARRAY | 2020-11-19 |
20200365557 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE | 2020-11-19 |
20200365558 | SEMICONDUCTOR PACKAGE | 2020-11-19 |
20200365559 | SEMICONDUCTOR MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A MODULE SUBSTRATE AND A BONDING WIRE | 2020-11-19 |
20200365560 | SEMICONDUCTOR DEVICE | 2020-11-19 |
20200365561 | MULTI-CHIP MODULES INCLUDING STACKED SEMICONDUCTOR DICE | 2020-11-19 |
20200365562 | POWER AND TEMPERATURE MANAGEMENT FOR FUNCTIONAL BLOCKS IMPLEMENTED BY A 3D STACKED INTEGRATED CIRCUIT | 2020-11-19 |
20200365563 | CHIP PACKAGE STRUCTURE WITH MOLDING LAYER | 2020-11-19 |
20200365564 | SEMICONDUCTOR MODULE | 2020-11-19 |
20200365565 | CASCODE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | 2020-11-19 |
20200365566 | IN-SITU CURING OF COLOR CONVERSION LAYER IN RECESS | 2020-11-19 |
20200365567 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR | 2020-11-19 |
20200365568 | LED CHIP AND MANUFACTURING METHOD OF THE SAME | 2020-11-19 |
20200365569 | PACKAGE-ON-PACKAGE STRUCTURE | 2020-11-19 |
20200365570 | PACKAGE STRUCTURE WITH DUMMY DIE | 2020-11-19 |
20200365571 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2020-11-19 |
20200365572 | SEMICONDUCTOR PACKAGE WITH DUMMY MIM CAPACITOR DIE | 2020-11-19 |
20200365573 | Hermetic Optical Component Package Having Organic Portion and Inorganic Portion | 2020-11-19 |
20200365574 | NON-VOLATILE MEMORY | 2020-11-19 |
20200365575 | TECHNIQUES FOR PROCESSING DEVICES | 2020-11-19 |
20200365576 | TFT SUBSTRATE, ESD PROTECTION CIRCUIT AND MANUFACTURING METHOD OF TFT SUBSTRATE | 2020-11-19 |
20200365577 | SEMICONDUCTOR INTEGRATED CIRCUIT | 2020-11-19 |
20200365578 | ELECTROSTATIC DISCHARGE CIRCUIT | 2020-11-19 |
20200365579 | DEVICE INCLUDING INTEGRATED ELECTROSTATIC DISCHARGE PROTECTION COMPONENT | 2020-11-19 |
20200365580 | DEVICE INCLUDING INTEGRATED ELECTROSTATIC DISCHARGE PROTECTION COMPONENT | 2020-11-19 |
20200365581 | ELECTROSTATIC PROTECTION CIRCUIT AND ELECTRONIC DEVICE | 2020-11-19 |
20200365582 | SEMICONDUCTOR DEVICE | 2020-11-19 |
20200365583 | 3D INTEGRATED CIRCUIT | 2020-11-19 |
20200365584 | NANOSHEET P-TYPE TRANSISTOR WITH OXYGEN RESERVOIR | 2020-11-19 |
20200365585 | FORMING CRYSTALLINE SOURCE/DRAIN CONTACTS ON SEMICONDUCTOR DEVICES | 2020-11-19 |
20200365586 | INTEGRATED CIRCUIT DEVICE | 2020-11-19 |
20200365587 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2020-11-19 |
20200365588 | FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME | 2020-11-19 |
20200365589 | Integrated Circuit Device and Method of Forming the Same | 2020-11-19 |
20200365590 | Structure and Method for MOSFET Device | 2020-11-19 |
20200365591 | SEMICONDUCTOR DEVICE AND OPERATION METHOD THEREOF | 2020-11-19 |
20200365592 | SEMICONDUCTOR DEVICE | 2020-11-19 |
20200365593 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING A PLURALITY THEREOF | 2020-11-19 |
20200365594 | SUBSTRATE PROCESSING APPARATUS AND MONITORING METHOD | 2020-11-19 |
20200365595 | APPARATUSES INCLUDING CAPACITOR STRUCTURES, AND RELATED MEMORY DEVICES, ELECTRONIC SYSTEMS, AND METHODS | 2020-11-19 |
20200365596 | SEMICONDUCTOR FORMATION USING HYBRID OXIDATION | 2020-11-19 |
20200365597 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-11-19 |
20200365598 | SEMICONDUCTOR DEVICE AND METHOD OF PREPARING THE SAME | 2020-11-19 |
20200365599 | STATIC RANDOM ACCESS MEMORY (SRAM) AND FORMING METHOD THEREOF | 2020-11-19 |
20200365600 | MEMORY STRUCTURE | 2020-11-19 |
20200365601 | STRUCTURES AND SRAM BIT CELLS INTEGRATING COMPLEMENTARY FIELD-EFFECT TRANSISTORS | 2020-11-19 |
20200365602 | SEMICONDUCTOR DEVICE | 2020-11-19 |
20200365603 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2020-11-19 |
20200365604 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME | 2020-11-19 |
20200365605 | Memory Arrays, and Methods of Forming Memory Arrays | 2020-11-19 |
20200365606 | Integrated Assemblies Having Ferroelectric Transistors with Body Regions Coupled to Carrier Reservoirs; and Methods of Forming Integrated Assemblies | 2020-11-19 |
20200365607 | ONE-TIME PROGRAMMABLE DEVICE COMPATIBLE WITH VERTICAL TRANSISTOR PROCESSING | 2020-11-19 |
20200365608 | NOR Memory Cell with Vertical Floating Gate | 2020-11-19 |
20200365609 | PROCESSES FOR FORMING 3-DIMENSIONAL HORIZONTAL NOR MEMORY ARRAYS | 2020-11-19 |
20200365610 | SONOS Memory and Method for Manufacturing the Same | 2020-11-19 |
20200365611 | MEMORY DEVICE AND METHOD FOR FORMING THE SAME | 2020-11-19 |
20200365612 | THREE DIMENSIONAL MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | 2020-11-19 |
20200365613 | NON-VOLATILE MEMORY STRUCTURE | 2020-11-19 |
20200365614 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | 2020-11-19 |
20200365615 | VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME | 2020-11-19 |
20200365616 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE | 2020-11-19 |
20200365617 | INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME | 2020-11-19 |
20200365618 | MEMORY DEVICE USING A MULTILAYER FERROELECTRIC STACK AND METHOD OF FORMING THE SAME | 2020-11-19 |
20200365619 | TRANSFER PRINTING FOR RF APPLICATIONS | 2020-11-19 |
20200365620 | TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF | 2020-11-19 |
20200365621 | SYSTEMS AND METHODS FOR A SEMICONDUCTOR STRUCTURE HAVING MULTIPLE SEMICONDUCTOR-DEVICE LAYERS | 2020-11-19 |
20200365622 | TFT ARRAY SUBSTRATE AND DISPLAY PANEL | 2020-11-19 |
20200365623 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | 2020-11-19 |
20200365624 | ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE | 2020-11-19 |
20200365625 | DISPLAY PANEL AND PREPARATION METHOD THEREOF, AND DISPLAY DEVICE | 2020-11-19 |
20200365626 | DISPLAY COMPONENT AND DISPLAY DEVICE | 2020-11-19 |
20200365627 | CONNECTION STRUCTURE AND FABRICATION METHOD THEREOF, ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF | 2020-11-19 |
20200365628 | IMAGE SENSOR | 2020-11-19 |
20200365629 | IMAGING DEVICE AND SIGNAL PROCESSING DEVICE | 2020-11-19 |
20200365630 | GERMANIUM ON INSULATOR FOR CMOS IMAGERS IN THE SHORT WAVE INFRARED | 2020-11-19 |
20200365631 | IMPROVED HYBRID OPTICAL/ELECTRONIC SYSTEM | 2020-11-19 |
20200365632 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | 2020-11-19 |
20200365633 | IMAGING DEVICE INCLUDING UNIT PIXEL CELL WHICH INCLUDES PHOTOELECTRIC CONVERTER AND SIGNAL DETECTION CIRCUIT | 2020-11-19 |
20200365634 | Semiconductor Switching Device Separate by Device Isolation | 2020-11-19 |
20200365635 | IMAGE SENSOR INCLUDING PLANAR BOUNDARY BETWEEN OPTICAL BLACK AND ACTIVE PIXEL SENSOR AREAS | 2020-11-19 |
20200365636 | OPTICAL STRUCTURE AND MANUFACTURING METHOD FOR THE SAME | 2020-11-19 |
20200365637 | IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2020-11-19 |
20200365638 | COLOR FILTER ARRAY, IMAGERS AND SYSTEMS HAVING SAME, AND METHODS OF FABRICATION AND USE THEREOF | 2020-11-19 |
20200365639 | STACKED LENS STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | 2020-11-19 |
20200365640 | IMAGING DEVICE, CAMERA MODULE, AND ELECTRONIC APPARATUS | 2020-11-19 |
20200365641 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS | 2020-11-19 |
20200365642 | SEMICONDUCTOR INTEGRATED CIRCUIT, ELECTRONIC DEVICE, SOLID-STATE IMAGING APPARATUS, AND IMAGING APPARATUS | 2020-11-19 |
20200365643 | SOLID-STATE IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS | 2020-11-19 |
20200365644 | PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS | 2020-11-19 |
20200365645 | Method of Using A Surfactant-Containing Shrinkage Material to Prevent Photoresist Pattern Collapse Caused by Capillary Forces | 2020-11-19 |
20200365646 | IMAGE SENSOR AND FABRICATION METHOD THEREOF | 2020-11-19 |