47th week of 2016 patent applcation highlights part 54 |
Patent application number | Title | Published |
20160343563 | ION TRAP WITH VARIABLE PITCH ELECTRODES | 2016-11-24 |
20160343564 | EDGE TRIM PROCESSES AND RESULTANT STRUCTURES | 2016-11-24 |
20160343565 | SUBSTRATE CLEANING METHOD FOR REMOVING OXIDE FILM | 2016-11-24 |
20160343566 | SUBSTRATE WITH CRYSTALLIZED SILICON FILM AND MANUFACTURING METHOD THEREOF | 2016-11-24 |
20160343567 | METHOD OF FORMING NON-CONTINUOUS LINE PATTERN AND NON-CONTINUOUS LINE PATTERN STRUCTURE | 2016-11-24 |
20160343568 | METHOD FOR FORMING SURFACE OXIDE LAYER ON AMORPHOUS SILICON | 2016-11-24 |
20160343569 | METHOD FOR FORMING POLYSILICON | 2016-11-24 |
20160343570 | SILICON CARBIDE SUBSTRATE AND METHOD FOR PRODUCING SILICON CARBIDE SUBSTRATE | 2016-11-24 |
20160343571 | Method for removing dielectric layers from semiconductor components by using a laser beam | 2016-11-24 |
20160343572 | METALLIZED JUNCTION FINFET STRUCTURES | 2016-11-24 |
20160343573 | SEMICONDUCTOR DEVICE HAVING ELECTRODE MADE OF HIGH WORK FUNCTION MATERIAL, METHOD AND APPARATUS FOR MANUFACTURING THE SAME | 2016-11-24 |
20160343574 | Segmented Edge Protection Shield | 2016-11-24 |
20160343575 | METHOD OF FABRICATING PATTERN STRUCTURE | 2016-11-24 |
20160343576 | FORMULATIONS TO SELECTIVELY ETCH SILICON AND GERMANIUM | 2016-11-24 |
20160343577 | Methods for Manufacturing Semiconductor Devices | 2016-11-24 |
20160343578 | METHODS AND APPARATUS FOR FORMING A RESIST ARRAY USING CHEMICAL MECHANICAL PLANARIZATION | 2016-11-24 |
20160343579 | CHAMBER CLEANING AND SEMICONDUCTOR ETCHING GASES | 2016-11-24 |
20160343580 | TECHNIQUE TO DEPOSIT SIDEWALL PASSIVATION FOR HIGH ASPECT RATIO CYLINDER ETCH | 2016-11-24 |
20160343581 | UNIFORM, DAMAGE FREE NITRIDE ETCH | 2016-11-24 |
20160343582 | APPARATUS FOR ADVANCED PACKAGING APPLICATIONS | 2016-11-24 |
20160343583 | Method of laser annealing a semiconductor wafer with localized control of ambient oxygen | 2016-11-24 |
20160343584 | HEAT TREATMENT APPARATUS EMITTING FLASH OF LIGHT | 2016-11-24 |
20160343585 | CONTACT STRUCTURE AND EXTENSION FORMATION FOR III-V NFET | 2016-11-24 |
20160343586 | METHOD FOR PATTERNING OF LAMINATED MAGNETIC LAYER | 2016-11-24 |
20160343587 | WIRING BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS THEREOF | 2016-11-24 |
20160343588 | USE OF GRAPHO-EPITAXIAL DIRECTED SELF-ASSEMBLY APPLICATIONS TO PRECISELY CUT LOGIC LINES | 2016-11-24 |
20160343589 | DEPOSITION APPARATUS, APPARATUS FOR SUCCESSIVE DEPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2016-11-24 |
20160343590 | POWER MODULE AND FABRICATION METHOD FOR THE SAME | 2016-11-24 |
20160343591 | REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES | 2016-11-24 |
20160343592 | FLIP CHIP MODULE WITH ENHANCED PROPERTIES | 2016-11-24 |
20160343593 | SEMICONDUCTOR PACKAGE INCLUDING PREMOLD AND METHOD OF MANUFACTURING THE SAME | 2016-11-24 |
20160343594 | WET ETCHING MACHINE AND ETCHING METHOD USING THE SAME | 2016-11-24 |
20160343595 | CORROSION RESISTANT GAS DISTRIBUTION MANIFOLD WITH THERMALLY CONTROLLED FACEPLATE | 2016-11-24 |
20160343596 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 2016-11-24 |
20160343597 | APPARATUS FOR TREATING SUBSTRATE | 2016-11-24 |
20160343598 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND FOUP TO BE USED THEREFOR | 2016-11-24 |
20160343599 | PROCESSING APPARATUS | 2016-11-24 |
20160343600 | ELECTROSTATIC PUCK ASSEMBLY WITH METAL BONDED BACKING PLATE FOR HIGH TEMPERATURE PROCESSES | 2016-11-24 |
20160343601 | METHOD OF PREPARING LAMINATE, AND METHOD OF SEPARATING SUPPORT | 2016-11-24 |
20160343602 | WORKPIECE CLAMP | 2016-11-24 |
20160343603 | WAFER TRANSPORT DEVICE | 2016-11-24 |
20160343604 | SUBSTRATE STRUCTURE WITH EMBEDDED LAYER FOR POST-PROCESSING SILICON HANDLE ELIMINATION | 2016-11-24 |
20160343605 | Solvent-Based Oxidation on Germanium and III-V Compound Semiconductor Materials | 2016-11-24 |
20160343606 | AIR GAP FORMING TECHNIQUES BASED ON ANODIC ALUMINA FOR INTERCONNECT STRUCTURES | 2016-11-24 |
20160343607 | PRESERVING THE SEED LAYER ON STI EDGE AND IMPROVING THE EPITAXIAL GROWTH | 2016-11-24 |
20160343608 | SHALLOW TRENCH ISOLATION TRENCHES AND METHODS FOR NAND MEMORY | 2016-11-24 |
20160343609 | TECHNIQUES FOR TRENCH ISOLATION USING FLOWABLE DIELECTRIC MATERIALS | 2016-11-24 |
20160343610 | STITCHED DEVICES | 2016-11-24 |
20160343611 | INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME | 2016-11-24 |
20160343612 | FEATURE FILL WITH MULTI-STAGE NUCLEATION INHIBITION | 2016-11-24 |
20160343613 | THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON | 2016-11-24 |
20160343614 | WAFER PROCESSING METHOD | 2016-11-24 |
20160343615 | Methods of Packaging Semiconductor Devices and Structures Thereof | 2016-11-24 |
20160343616 | SEMICONDUCTOR DEVICE INCLUDING AT LEAST ONE ELEMENT | 2016-11-24 |
20160343617 | SUBSTRATE DIVIDING METHOD | 2016-11-24 |
20160343618 | SUBSTRATE DIVIDING METHOD | 2016-11-24 |
20160343619 | SUBSTRATE DIVIDING METHOD | 2016-11-24 |
20160343620 | Nano Wire Structure and Method for Fabricating the Same | 2016-11-24 |
20160343621 | DIRECTLY FORMING SiGe FINS ON OXIDE | 2016-11-24 |
20160343622 | SELECTIVE THICKENING OF PFET DIELECTRIC | 2016-11-24 |
20160343623 | IMPLANT-FREE PUNCH THROUGH DOPING LAYER FORMATION FOR BULK FINFET STRUCTURES | 2016-11-24 |
20160343624 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2016-11-24 |
20160343625 | METHOD AND SYSTEM FOR CONTROLLING PLASMA IN SEMICONDUCTOR FABRICATION | 2016-11-24 |
20160343626 | THERMOCOMPRESSION BONDERS, METHODS OF OPERATING THERMOCOMPRESSION BONDERS, AND HORIZONTAL CORRECTION MOTIONS USING LATERAL FORCE MEASUREMENT IN THERMOCOMPRESSION BONDING | 2016-11-24 |
20160343627 | SEMICONDUCTOR DEVICE | 2016-11-24 |
20160343628 | ELEMENT-ACCOMMODATING PACKAGE AND MOUNTING STRUCTURE | 2016-11-24 |
20160343629 | WAFER STACK PROTECTION SEAL | 2016-11-24 |
20160343630 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | 2016-11-24 |
20160343631 | SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKING AND USING THE SAME | 2016-11-24 |
20160343632 | CHIP PACKAGE HAVING A PATTERNED CONDUCTING PLATE AND METHOD FOR FORMING THE SAME | 2016-11-24 |
20160343633 | THIN FILM BASED FAN OUT AND MULTI DIE PACKAGE PLATFORM | 2016-11-24 |
20160343634 | PACKAGING FOR FINGERPRINT SENSORS AND METHODS OF MANUFACTURE | 2016-11-24 |
20160343635 | SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WORKPIECE | 2016-11-24 |
20160343636 | Waterproof Electronic Device and Manufacturing Method Thereof | 2016-11-24 |
20160343637 | DEVICE INTEGRATION OF ACTIVE COOLING SYSTEMS | 2016-11-24 |
20160343638 | PROCESS FOR PRODUCING A MICROFLUIDIC CIRCUIT WITHIN A THREE-DIMENSIONAL INTEGRATED STRUCTURE, AND CORRESPONDING STRUCTURE | 2016-11-24 |
20160343639 | SEMINCONDUCTOR DEVICE ASSEMBLY WITH VAPOR CHAMBER | 2016-11-24 |
20160343640 | SEMICONDUCTOR DEVICE | 2016-11-24 |
20160343641 | POWER SEMICONDUCTOR MODULE | 2016-11-24 |
20160343642 | SEMICONDUCTOR DEVICE | 2016-11-24 |
20160343643 | SEMICONDUCTOR LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD THEREOF | 2016-11-24 |
20160343644 | POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-11-24 |
20160343645 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2016-11-24 |
20160343646 | HIGH ASPECT RATIO INTERCONNECT FOR WAFER LEVEL PACKAGE (WLP) AND INTEGRATED CIRCUIT (IC) PACKAGE | 2016-11-24 |
20160343647 | SEMICONDUCTOR DEVICE, METAL MEMBER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2016-11-24 |
20160343648 | INTERPOSER AND SEMICONDUCTOR MODULE FOR USE IN AUTOMOTIVE APPLICATONS | 2016-11-24 |
20160343649 | Molding Compound Structure | 2016-11-24 |
20160343650 | GLASS CLAD MICROELECTRONIC SUBSTRATE | 2016-11-24 |
20160343651 | SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE | 2016-11-24 |
20160343652 | METHOD AND APPARATUS FOR FORMING MULTI-LAYERED VIAS IN SEQUENTIALLY FABRICATED CIRCUITS | 2016-11-24 |
20160343653 | Package Structure and Three Dimensional Package Structure | 2016-11-24 |
20160343654 | WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE | 2016-11-24 |
20160343655 | SUBSTRATE STRUCTURE WITH ARRAY OF MICROMETER SCALE COPPER PILLAR BASED STRUCTURES AND METHOD FOR MANUFACTURING SAME | 2016-11-24 |
20160343656 | Semiconductor Device and Method of Manufacturing Semiconductor Device | 2016-11-24 |
20160343657 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-11-24 |
20160343658 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-11-24 |
20160343659 | E-FUSE IN SOI CONFIGURATION | 2016-11-24 |
20160343660 | WIRING STRUCTURES AND SEMICONDUCTOR DEVICES | 2016-11-24 |
20160343661 | STRUCTURE FOR COUPLING METAL LAYER INTERCONNECTS IN A SEMICONDUCTOR DEVICE | 2016-11-24 |
20160343662 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME | 2016-11-24 |