48th week of 2014 patent applcation highlights part 17 |
Patent application number | Title | Published |
20140346629 | IMAGING ELEMENT - An imaging element includes: a plurality of photoelectric converting elements that receive irradiation of light and convert the light into electrical charges; and a color filter layer which has a red filter, a green filter, and a blue filter which are respectively provided for the photoelectric converting elements. Partition walls having a lower refractive index than those of the red filter, the green filter, and the blue filter are provided only around the peripheries of the red filters. | 2014-11-27 |
20140346630 | Semiconductor detector head and a method for manufacturing the same - A semiconductor detector head comprises a detector chip having a front side and a back side, and a substrate on the back side of said detector chip. Contact points are located on at least one of said substrate and said detector chip. A first set of contact pins protrude on an opposite side of said substrate than said detector chip. At least one of the contact pins of said first set is conductively coupled to at least one of said contact points. A base plate holds a second set of contact pins that protrude from said base plate towards the contact pins of said first set. Electric connections are made between matching pairs of contact pins of said first and second sets. | 2014-11-27 |
20140346631 | RADIATION DETECTOR SYSTEM AND METHOD OF MANUFACTURE - The present disclosure provides a high electric field radiation detector including a first electrode, a second electrode, a radiation detecting layer, and a soft polymer layer below the radiation detecting layer and in contact with at least the first electrode. The present disclosure provides a method of manufacturing a radiation detector including obtaining a first electrode, depositing a soft polymer layer on the first electrode, depositing a radiation detecting layer above the soft polymer layer, and depositing a second electrode above the amorphous material layer. The present disclosure also provides a method of manufacturing a radiation detector including obtaining a first electrode and a second electrode, depositing a soft polymer layer on the first electrode and the second electrode, and depositing a radiation detecting layer above the soft polymer layer. | 2014-11-27 |
20140346632 | PHOTODETECTOR CIRCUIT - A photodetector circuit is provided that includes: a first wiring connected to an input terminal; a second wiring connected to an output terminal; and first and second photosensors each including a first terminal connected to the first wiring and a second terminal connected to the second wiring, wherein the first wiring and the second wiring are arranged in parallel, and the sum of resistance values of a first path from the input terminal to the output terminal via the first wiring, the first photosensor, and the second wiring is identical to the sum of resistance values of a second path from the input terminal to the output terminal via the first wiring, the second photosensor, and the second wiring. | 2014-11-27 |
20140346633 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a high voltage isolation structure having a double RESURF structure. The high voltage isolation structure separates a low potential region from a high potential region. The high voltage isolation structure has an annular strip shape in a plan view and includes a straight portion and a corner portion which is connected to the straight portion. In the high voltage isolation structure, a p-type RESURF region is formed in a surface layer of a front surface of a substrate in an n-type well region along the outer circumference of the n-type well region. In the corner portion, the total amount of impurities per unit area in the RESURF region is less than that in the straight portion. | 2014-11-27 |
20140346634 | ON-CHIP INDUCTORS WITH REDUCED AREA AND RESISTANCE - An integrated circuit that includes an on-chip inductor wrapped around an interface pad. On-chip inductors are arranged around an interface pad to reduce the area occupied by the inductor. Furthermore, arranging the on-chip inductors in an upper level metal layer, such us the redistribution layer (RDL), the top metal interconnect layer (MTop), or the second-to-top metal interconnect layer (MTop-1) reduces the on-chip inductor parasitic resistance, reducing the loss of signal. | 2014-11-27 |
20140346635 | SEMICONDUCTOR MODULE AND DRIVING DEVICE FOR SWITCHING ELEMENT - A semiconductor module includes: a semiconductor element; first and second main current passages for energizing the semiconductor element, the first and second main current passages being opposed to each other in such a manner that a first energization direction of the first main current passage is opposite to a second energization direction of the second main current passage, or an angle between the first energization direction and the second energization direction is an obtuse angle; and a coil unit sandwiched between the first and second main current passages. The coil unit includes a coil, which generates an induced electromotive force when a magnetic flux interlinks with the coil, the magnetic flux being generated when current flows through the first and second main current passages. | 2014-11-27 |
20140346636 | SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor chip is mounted on a first surface of an interconnect substrate, and has a multilayer interconnect layer. A first inductor is formed over the multilayer interconnect layer, and a wiring axis direction thereof is directed in a horizontal direction to the interconnect substrate. A second inductor is formed on the multilayer interconnect layer, and a wiring axis direction thereof is directed in the horizontal direction to the interconnect substrate. The second inductor is opposite to the first inductor. A sealing resin seals at least the first surface of the interconnect substrate and the semiconductor chip. A groove is formed over the whole area of a portion that is positioned between the at least first inductor and the second inductor of a boundary surface of the multilayer interconnect layer and the sealing resin. | 2014-11-27 |
20140346637 | Hybrid Semiconductor Package - A semiconductor package includes a substrate, an RF semiconductor die attached to a first side of the substrate, a capacitor attached to the first side of the substrate, and a first terminal on the first side of the substrate. The semiconductor package further includes copper or aluminum bonding wires or ribbons connecting the first terminal to an output of the RF semiconductor die, and gold bonding wires or ribbons connecting the capacitor to the output of the RF semiconductor die. The gold bonding wires or ribbons are designed to accommodate greater RF Joule heating during operation of the RF semiconductor die than the copper or aluminum bonding wires or ribbons. Corresponding methods of manufacturing are also described. | 2014-11-27 |
20140346638 | Single-Crystalline Aluminum Nitride Substrate and a Manufacturing Method Thereof - The present invention relates to a single-crystalline aluminum nitride wherein a carbon concentration is 1×10 | 2014-11-27 |
20140346639 | PROCESS FOR MANUFACTURING A SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR SUBSTRATE OBTAINED - The invention relates to a process for manufacturing a semiconductor substrate, characterized in that it comprises providing at least one donor semiconductor substrate comprising at least one useful silicon layer; inspecting the donor substrate via an inspecting machine in order to detect whether the useful layer contains emerging cavities of a size larger than or equal to a critical size, said critical size being strictly smaller than 44 nm; and manufacturing a semiconductor substrate comprising at least part of the useful layer of the donor substrate if, considering cavities of a size larger than or equal to the critical size, the density or number of cavities in the useful layer of the donor substrate is lower than or equal to a critical defect density or number. | 2014-11-27 |
20140346640 | NON-LITHOGRAPHIC HOLE PATTERN FORMATION - A metal layer is deposited over a material layer. The metal layer includes an elemental metal that can be converted into a dielectric metal-containing compound by plasma oxidation or nitridation. A hard mask portion is formed over the metal layer. A plasma impermeable spacer is formed on at least one first sidewall of the hard mask portion, while at least one second sidewall of the hard mask portion is physically exposed. Plasma oxidation or nitridation is performed to convert physically exposed surfaces of the metal layer into the dielectric metal-containing compound. A sequence of a surface pull back of the hard mask portion, cavity etching, another surface pull back, and conversion of top surfaces into the dielectric metal-containing compound are repeated to form a hole pattern having a spacing that is not limited by lithographic minimum dimensions. | 2014-11-27 |
20140346641 | WAFER DICING WITH WIDE KERF BY LASER SCRIBING AND PLASMA ETCHING HYBRID APPROACH - Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, approaches for wafer dicing with wide kerf by using a laser scribing and plasma etching hybrid approach are described. For example, a method of dicing a semiconductor wafer including a plurality of integrated circuits separated by dicing streets involves forming a mask above the semiconductor wafer, the mask having a layer covering and protecting the integrated circuits. The method also involves patterning the mask with a laser scribing process to provide a patterned mask having a pair of parallel gaps for each dicing street, exposing regions of the semiconductor wafer between the integrated circuits. Each gap of each pair of parallel gaps is separated by a distance. The method also involves etching the semiconductor wafer through the gaps in the patterned mask to singulate the integrated circuits. | 2014-11-27 |
20140346642 | SURFACE MOUNTABLE ELECTRONIC COMPONENT - A surface mountable electronic component free of connecting wires comprises a semiconductor substrate, wherein a plurality of solderable connection areas are arranged at the underside of the component. The component comprises at least one recess is formed in the region of the edges bounding the underside; and in that the recess is covered with an insulating layer. A method for the manufacture of such a component comprises the formation of corresponding recesses. | 2014-11-27 |
20140346643 | INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES - A method of forming a wafer level packaged circuit device includes forming a device wafer, the device wafer including a first group of one or more material layers left remaining in a first region of a substrate of the device wafer; and forming a cap wafer configured to be attached to the device wafer, the cap wafer including a second group of one or more material layers left remaining in a second region of a substrate of the cap wafer; wherein a combined thickness of the first and second groups of one or more material layers defines an integrated bond gap control structure upon bonding of the device wafer and the cap wafer. | 2014-11-27 |
20140346644 | Exclusion Zone for Stress-Sensitive Circuit Design - A semiconductor structure less affected by stress and a method for forming the same are provided. The semiconductor structure includes a semiconductor chip. Stress-sensitive circuits are substantially excluded out of an exclusion zone to reduce the effects of the stress to the stress-sensitive circuits. The stress-sensitive circuits include analog circuits. The exclusion zone preferably includes corner regions of the semiconductor chip, wherein the corner regions preferably have a diagonal length of less than about one percent of the diagonal length of the semiconductor chip. The stress-sensitive analog circuits preferably include devices having channel lengths less than about five times the minimum channel length. | 2014-11-27 |
20140346645 | THROUGH SILICON VIA AND PROCESS THEREOF - A through silicon via includes a substrate and a conductive plug. The substrate has a hole in a side. The conductive plug is disposed in the hole, and the conductive plug having an upper part protruding from the side, wherein the upper part has a top part and a bottom part, and the top part is finer than the bottom part. Moreover, a through silicon via process formed said through silicon via is also provided, which includes the following step. A hole is formed in a substrate from a side. A first conductive material is formed to cover the hole and the side. A patterned photoresist is formed to cover the side but exposing the hole. A second conductive material is formed on the exposed first conductive material. The patterned photoresist is removed. The first conductive material on the side is removed to form a conductive plug in the hole. | 2014-11-27 |
20140346646 | STRUCTURES WITH THROUGH VIAS PASSING THROUGH A SUBSTRATE COMPRISING A PLANAR INSULATING LAYER BETWEEN SEMICONDUCTOR LAYERS - A through via contains a conductor ( | 2014-11-27 |
20140346647 | MONITORING STRUCTURE AND MONITORING METHOD FOR SILICON WET ETCHING DEPTH - A monitoring structure and a relevant monitoring method for the silicon wet etching depth are provided. The structure includes a wet etched groove formed on a monocrystalline silicon material with at least two top surfaces thereof being rectangular; and the top surface widths of the grooves are W | 2014-11-27 |
20140346648 | LOW-K NITRIDE FILM AND METHOD OF MAKING - A low-K nitride film and a method of making are disclosed. Embodiments include forming a nitride film on a substrate by plasma enhanced chemical vapor deposition (PECVD) and periodically fluctuating a production of radicals during the PECVD based, at least in part, on plural cycles of a radiofrequency (RF) induced plasma. | 2014-11-27 |
20140346649 | Three dimension structure memory - A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 microns in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques. | 2014-11-27 |
20140346650 | SYSTEMS AND METHODS FOR THIN-FILM DEPOSITION OF METAL OXIDES USING EXCITED NITROGEN-OXYGEN SPECIES - The present invention relates to a process and system for depositing a thin film onto a substrate. One aspect of the invention is depositing a thin film metal oxide layer using atomic layer deposition (ALD). | 2014-11-27 |
20140346651 | CHARGE DAMAGE PROTECTION ON AN INTERPOSER FOR A STACKED DIE ASSEMBLY - An apparatus relating generally to an interposer is disclosed. In such an apparatus, the interposer has a plurality of conductors and a plurality of charge attracting structures. The plurality of charge attracting structures are to protect at least one integrated circuit die to be coupled to the interposer to provide a stacked die. The plurality of conductors include a plurality of through-substrate vias. | 2014-11-27 |
20140346652 | BURIED DIGITLINE (BDL) ACCESS DEVICE AND MEMORY ARRAY - A memory array includes a plurality of digitline (DL) trenches extending along a first direction; a buried digitline between the DL trenches; a trench fill material layer sealing an air gap in each of the DL trenches; a plurality of wordline (WL) trenches extending along a second direction; an active chop (AC) trench disposed at one end of the buried digitline; a shield layer in the air gap; and a sidewall conductor around the sidewall of the AC trench. | 2014-11-27 |
20140346653 | ELECTRONIC DEVICE - An electronic device includes a first substrate including a first electrode formed on a surface of the first substrate, an electronic component mounted on another surface of the first substrate, a second substrate placed on the first substrate via the electronic component, and a shield disposed between the first substrate and the second substrate. | 2014-11-27 |
20140346654 | CHIP PACKAGE - A chip package comprising a carrier, a chip, a plurality of first conductive elements, an encapsulation, and a conductive film is provided. The carrier has a carrying surface and a back surface opposite to the carrying surface. Furthermore, the carrier has a plurality of common contacts in the periphery of the carrying surface. The chip is disposed on the carrying surface and electrically connected to the carrier. In addition, the first conductive elements are disposed on the common contacts respectively. The encapsulation is disposed on the carrying surface and encapsulating the chip. Moreover, the conductive film is disposed over the encapsulation and the first conductive elements, so as to electrically connect with the common contacts via the first conductive elements. A process for fabricating the chip package is further provided. The chip package is capable of preventing the EMI problem and thus provides superior electrical performance. | 2014-11-27 |
20140346655 | MEMORY CELL - A method of programming a memory cell includes causing a current to flow through a first silicide-containing portion and a second silicide-containing portion of the memory cell; and causing, by the current, an electron-migration effect to form an extended silicide-containing portion within the gap such that the memory cell is converted from a first state into a second state. The memory cell includes a silicon-containing line continuously extending between a first region and a second region; the first silicide-containing portion over the silicon-containing line and adjacent to the first region; and the second silicide-containing portion over the silicon-containing line and adjacent to the second region. The first silicide-containing portion and the second silicide-containing portion are separated by a gap if the memory cell is at the first state. The extended silicide-containing portion extends from the second silicide-containing portion towards the first silicide-containing portion. | 2014-11-27 |
20140346656 | Multilevel Leadframe - A multilevel leadframe for an integrated circuit package is provided that has a plurality of lead lines formed in a first level and bond pads formed in a second level. A first set of bond pads is arranged in a first row and are separated from an adjacent bond pad by a bond pad clearance distance. A second set of bond pads is arranged in second row adjacent the first row of bond pads. Each bond pad in the second row may be connected to one of the plurality of lead lines on the first level that is routed between adjacent bond pads in the first row. Since the bond pads in the first row are on a different level then the lead lines, the bond pads may be spaced close together. | 2014-11-27 |
20140346657 | THIN FILM CAPPING - A method for sealing cavities in micro-electronic/-mechanical system (MEMS) devices to provide a controlled atmosphere within the sealed cavity includes providing a semiconductor substrate on which a template is provided on a localized area of the substrate. The template defines the interior shape of the cavity. Holes are made so as to enable venting of the cavity to provide a desired atmosphere to enter into the cavity through the hole. Finally, a sealing material is provided in the hole to seal the cavity. The sealing can be made by compression and/or melting of the sealing material. | 2014-11-27 |
20140346658 | FABRICATING A MICROELECTRONICS LID USING SOL-GEL PROCESSING - A method for fabrication of a lid for a microelectronic device is described, wherein the microelectronic device comprises of a die and a laminate. A gel is formed having a coefficient of thermal expansion (CTE) within a threshold percentage value of either a CTE of the die or a CTE of the laminate of the microelectronics device. A metal piece is inserted into the gel to form a lid. | 2014-11-27 |
20140346659 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes: semiconductor modules in which a circuit board having at least one or more semiconductor chips mounted thereon is sealed with a mold resin material and an attachment hole is formed; main terminal plates that individually connect individual connection terminals of the plurality of semiconductor modules which are arranged in parallel; and a module storage case into which the plurality of the semiconductor modules connected by the main terminal plates are inserted integrally with the main terminal plates from an opening portion and which holds the plurality of semiconductor modules such that the position of the semiconductor modules can be adjusted during attachment and includes attachment insertion holes facing the attachment holes of the semiconductor modules. | 2014-11-27 |
20140346660 | POWER ELECTRONICS DEVICES HAVING THERMAL STRESS REDUCTION ELEMENTS - Power electronics devices having thermal stress reduction elements are disclosed. A power electronics device includes a heat source having a heat source perimeter, a first conduction member coupled to the heat source, and a substrate coupled to the first conduction member. The first conduction member includes a support portion that extends to at least the heat source perimeter and a plurality of finger portions extending from the support portion and separated from one another by web regions, where the plurality of finger portions have a finger thickness that is greater than a web thickness of the web regions. | 2014-11-27 |
20140346661 | CHIP PACKAGE STRUCTURE AND CHIP PACKAGING METHOD - Embodiments of the present invention provide a chip package structure and a chip packaging method, which is related to the field of electronic technologies, and can protect chips and effectively dissipate heat for chips. The chip package structure includes a substrate, chips, and a heat dissipating lid, where the chips include at least one master chip disposed on the substrate and at least one slave chip disposed on the substrate; the heat dissipating lid is bonded to the slave chip by using a heat conducting material, and the heat dissipating lid covers the at least one slave chip; and the heat dissipating lid includes a heat dissipating window at a position corresponding to the at least one master chip. The embodiments of the present invention are applicable to multi-chip packaging. | 2014-11-27 |
20140346662 | FORMING MODIFIED CELL ARCHITECTURE FOR FINFET TECHNOLOGY AND RESULTING DEVICE - Methods for accommodating a non-integer multiple of the M2 pitch for the cell height of a semiconductor cell and the resulting devices are disclosed. Embodiments may include forming a cell within an integrated circuit (IC) with a height of a first integer and a remainder times a track pitch of a metal track layer, and forming power rails within the metal track layer at boundaries of the cell accommodating for the remainder. | 2014-11-27 |
20140346663 | SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING - A packaged semiconductor device is made by forming a conductive pad on an external surface of an integrated circuit device, forming a passivation layer over the conductive pad, removing a portion of the passivation layer over a bond area on the conductive pad, forming a sacrificial anode around a majority of a periphery surrounding the bond area, forming a conductive bond in the bond area, and forming an encapsulating material around the conductive bond and an exposed portion of the sacrificial anode. | 2014-11-27 |
20140346664 | VARIABLE TEMPERATURE SOLDERS FOR MULTI-CHIP MODULE PACKAGING AND REPACKAGING - Various methods of mounting semiconductor chips on a substrate are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a first plurality of solder interconnect structures to a first semiconductor chip. The first solder interconnect structures have a first melting point. The first semiconductor chip may be tested. If the first semiconductor chip passes the testing, then a second semiconductor chip is coupled to the first semiconductor chip using a second plurality of solder interconnect structures that have a second melting point lower than the first melting point. | 2014-11-27 |
20140346665 | Integrated Circuit Structure and Method for Reducing Polymer Layer Delamination - An embodiment integrated circuit structure includes a substrate, a metal pad over the substrate, a post-passivation interconnect (PPI) structure over the substrate and electronically connected to the metal pad, a first polymer layer over the PPI structure, an under bump metallurgy (UBM) extending into an opening in the first polymer layer and electronically connected to the PPI structure, and a barrier layer on a top surface of the first polymer layer adjacent to the UBM. | 2014-11-27 |
20140346666 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device and a manufacturing method thereof are provided. The manufacturing method includes following steps. A mould is provided. The mould has a chamber and a plurality of protrusions in the chamber. A thermosetting material is injected into the chamber. The thermosetting material is cured. A parting step is performed to separate the cured thermosetting material from the mould, so as to form an interposer substrate. A plurality of blind holes corresponding to the protrusions is formed on the interposer substrate. A conductive material is filled into the blind holes to form a plurality of conductive pillars. A conductive pattern layer is formed on a surface of the interposer substrate. The conductive pattern layer is electrically connected with the conductive pillars. | 2014-11-27 |
20140346667 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package comprising: a lower semiconductor package comprising a lower semiconductor chip mounted on a lower package substrate and a lower molding layer substantially covering the lower semiconductor chip and having through holes arranged in a first direction and a second direction. The first direction is different from the second direction; and for each of the through holes, first and second upper widths of the through hole in the first and second directions are less than a third upper width of the through hole in a third direction that is a diagonal direction with respect to the first and second directions. | 2014-11-27 |
20140346668 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC COMPONENT - An electrode layer is formed on a gate insulating film. An interlayer insulating film is formed on the gate insulating firm. A lower pad is formed by a damascene method. Next, a through hole is formed, and a first interlayer insulating film, which is provided with a projected portion that is in the same pattern as a lower insulating film, is exposed within the through hole at the same time. After etching the first interlayer insulating film so that a part of the projected portion remains as an etching residue, a via insulating film is formed and the via insulating film at the bottom of the through hole is etched. After that, a through electrode is formed by plating an electrode material on the inner side of the via insulating film on the through hole. | 2014-11-27 |
20140346669 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package includes a passivation layer overlying a semiconductor substrate, a pillar bump overlying the passivation layer, and a molding compound layer overlying the passivation layer and covering a lower portion of the bump. A sidewall of the passivation layer is covered by the molding compound layer. | 2014-11-27 |
20140346670 | SEMICONDUCTOR PACKAGE WITH SINGLE SIDED SUBSTRATE DESIGN AND MANUFACTURING METHODS THEREOF - A multilayer substrate includes a first outer conductive patterned layer, a first insulating layer exposing a portion of the first outer conductive patterned layer to define a first set of pads, a second outer conductive patterned layer, and a second insulating layer exposing a portion of the second outer conductive patterned layer to define a second set of pads. The multilayer substrate further includes inner layers each with an inner conductive patterned layer, multiple inner conductive posts formed adjacent to the inner conductive patterned layer, and an inner dielectric layer, where the inner conductive patterned layer and the inner conductive posts are embedded in the inner dielectric layer, and a top surface of each of the inner conductive posts is exposed from the inner dielectric layer. | 2014-11-27 |
20140346671 | Fan-Out Package Structure and Methods for Forming the Same - A package includes a device die including a first plurality of metal pillars at a top surface of the device die. The package further includes a die stack including a plurality of dies bonded together, and a second plurality of metal pillars at a top surface of the die stack. One of the device die and the plurality of dies includes a semiconductor substrate and a through-via penetrating through the semiconductor substrate, A polymer region includes portions encircling the device die and the die stack, wherein a bottom surface of the polymer region is substantially level with a bottom surface of the device die and a bottom surface of the die stack. A top surface of the polymer region is level with top ends of the first and the second plurality of metal pillars. Redistribution lines are formed over the first and the second plurality of metal pillars. | 2014-11-27 |
20140346672 | Integrated Circuit Structure Having Dies with Connectors - An embodiment is an integrated circuit structure including a first die attached to a second die by a first connector. The first connector includes a solder joint portion between a first nickel-containing layer and a second nickel-containing layer, a first copper-containing layer between the first nickel-containing layer and the solder joint portion, and a second copper-containing layer between the second nickel-containing layer and the solder joint portion. | 2014-11-27 |
20140346673 | Methods and Apparatus for bump-on-trace Chip Packaging - Methods and apparatuses for a attaching a first substrate to a second substrate are provided. In some embodiments, a first substrate has a protective layer, such as a solder mask, around a die attach area, at which a second substrate is attached. A keep-out region (e.g., an area between the second substrate and the protective layer) is a region around the second substrate in which the protective layer is not formed or removed. The keep-out region is sized such that a sufficient gap exists between the second substrate and the protective layer to place an underfill between the first substrate and the second substrate while reducing or preventing voids and while allowing traces in the keep-out region to be covered by the underfill. | 2014-11-27 |
20140346674 | GRAPHENE-METAL E-FUSE - A structure including an M | 2014-11-27 |
20140346675 | Semiconductor Integrated Circuit and Fabricating the Same - A semiconductor integrated circuit (IC) with a dielectric matrix is disclosed. The dielectric matrix is located between two conductive features. The matrix includes a first nano-scale dielectric block, a second nano-scale dielectric block, and a first nano-air-gap formed by a space between the first nano-scale dielectric block and the second nano-scale dielectric block. The matrix also includes third nano-scale dielectric block and a second nano-air-gap formed by a space between the second nano-scale dielectric block and the third nano-scale dielectric block. The nano-scale dielectric blocks share a first common width, and the nano-air-gaps share a second common width. An interconnect structure integrates the dielectric matrix with the conductive features. | 2014-11-27 |
20140346676 | SEMICONDUCTOR DEVICE - Semiconductor chips are disposed on an insulating substrate with conductive patterns, and a printed circuit board with metal pins is disposed above the insulating substrate with conductive patterns, with the semiconductor chips therebetween. A plurality of external lead terminals is fixed to the insulating substrate with conductive patterns, with the plurality of external lead terminals disposed adjacent to each other in parallel. Furthermore, metal foil pieces, formed on front and rear surfaces of the printed circuit board with metal pins respectively so as to face each other, are disposed above the semiconductor chips. | 2014-11-27 |
20140346677 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a plurality of parallel conductive lines that are spaced apart from one another in a first direction and extend in a second direction transverse to the first direction. The parallel conductive lines includes first and second lines that are adjacent, and a third line that is adjacent to the second line, and the first and third lines each have a cut portion at different points along the second direction. | 2014-11-27 |
20140346678 | Parallel Signal Via Structure - A silicon interposer with redundant thru-silicon vias. The silicon interposer includes a first trace structure on a first side of the interposer and a second trace structure on a second side of the interposer. The silicon interposer also includes at least two redundant thru-silicon vias connecting the first trace structure to the second trace structure. | 2014-11-27 |
20140346679 | PACKAGE SUBSTRATES WITH MULTIPLE DICE - This disclosure relates generally to package substrates with multiple embedded dice wherein each of the embedded dice can be connected directly to a bus of the package substrate without being routed through another die. The package substrate may be configured as a bumpless build up layer (BBUL) substrate. | 2014-11-27 |
20140346680 | FORMING OF AN ELECTRIC CONNECTION OF THE VIA TYPE - A method and an electronic component including: a substrate including at least a hole at least partially going through a thickness of the substrate; an electrically conducting element positioned in the hole and configured to form an electric connection through the hole, wherein the electrically conducting element includes an electrically conducting and self-supporting pillar with a height oriented according to the thickness of the substrate; and a space between at least a part of the wall of the hole and a part of a peripheral wall of the pillar. | 2014-11-27 |
20140346681 | ELECTRONIC DEVICE - In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer. | 2014-11-27 |
20140346682 | SEMICONDUCTOR DEVICE - A semiconductor device includes a plurality of first conductive layers stacked on top of one another, a plurality of first slits passing through the first conductive layers, and a plurality of second slits passing through the first conductive layers and crossing end portions of the first slits to form cross-shaped edges. | 2014-11-27 |
20140346683 | STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACKED MICROELECTRONIC DEVICES - Stacked microelectronic devices and methods of manufacturing stacked microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a plurality of electrically isolated, multi-tiered metal spacers on a front side of a first microelectronic die, and attaching a back-side surface of a second microelectronic die to individual metal spacers. In another embodiment, the method of manufacturing the microelectronic device may further include forming top-tier spacer elements on front-side wire bonds of the first die. | 2014-11-27 |
20140346684 | CONNECTION METHOD, CONNECTION STRUCTURE, INSULATING ADHESIVE MEMBER, ELECTRONIC COMPONENT HAVING ADHESIVE MEMBER, AND METHOD FOR MANUFACTURING SAME - An insulating adhesive film is formed by laminating a first insulating adhesive layer which contains a filler in an insulating adhesive composition and a second insulating adhesive layer which contains no filler in an insulating adhesive composition. H/22014-11-27 | |
20140346685 | SILICON-BASED ELECTRONICS WITH DISABLING FEATURE - Silicon-based circuitry is dissolved or otherwise disabled in a controlled manner by reactive materials provided beneath the insulating layer on which the circuitry is formed. Heat and/or light induced acid generating materials are provided for corroding one or more circuitry components. Additionally and/or alternatively, gas-producing materials are deposited in compartments beneath the insulating layer. The gas-producing materials cause pressure to rise within the compartments, damaging the chip. Chemical reactions within the chip may be facilitated by heating elements and/or light generating elements embedded within the chip and actuated by triggering circuits. | 2014-11-27 |
20140346686 | METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBY - A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device. | 2014-11-27 |
20140346687 | ELECTRICAL DEVICE FOR CIRCULATING AIR - An electrical device for circulating air is provided. The electrical device includes a pole attached to a fixed support, a coupling attached to the pole and plurality of fans is attached to the coupling. The plurality of fans receives power from a power source through electrical cables. Further, the electrical device includes a battery for providing power to the fans and thus making it a portable device. The electrical device may be placed on any surface in any area. The single coupling for attaching the plurality of fans makes it easier to assemble or disassemble the parts of the electrical device. | 2014-11-27 |
20140346688 | HUMIDIFIER AND A METHOD OF MONITORING THE WATER LEVEL IN THE HUMIDIFIER - The present invention relates to a humidifier and a method of monitoring the water level in the humidifier, the method comprising the steps of: detecting the temperature at the air outlet of the humidifier and generating temperature signals indicating the temperature thereof ( | 2014-11-27 |
20140346689 | AEROSOL GENERATING DEVICE WITH A CAPILLARY INTERFACE - There is provided an aerosol generating device including a storage portion configured to store an aerosol-forming substrate. The device includes a vaporizer configured to heat the aerosol-forming substrate, a capillary material configured to convey the liquid aerosol-forming substrate from the storage portion towards the vaporizer by capillary action, and a porous material between the capillary material and the vaporizer. | 2014-11-27 |
20140346690 | APPARATUS FOR MANUFACTURING LENS ARRAY AND METHOD OF MANUFACTURING LENS ARRAY - An apparatus for manufacturing a lens array includes a first lens forming unit that has a plurality of blades forming partition walls on a polymer substrate on which a parallax image is formed and a plurality of nozzles discharging a polymer, a detecting unit that detects a position of the parallax image, and a scanning control unit that adjusts a scanning start position of the first lens forming unit based on the position of the parallax image detected by the detecting unit and controls forming of the partition walls by the blades and discharging of the polymer to a region between the partition walls through the nozzle on a surface of the polymer substrate on which the parallax image is formed. | 2014-11-27 |
20140346691 | MOLDING DIE STRUCTURE OF MOLDED ARTICLE AND MANUFACTURING METHOD OF MOLDED ARTICLE - Fixed side molding dies are removed from fixed side molding dies insertion hole portions in accordance with the disconnection in the connection/disconnection while maintaining a contact state that a second transfer portion is in contact with a portion other than a fixed side optical functional surface of each molded article at the time of mold opening of a fixed die and a movable die. Thereby a first transfer portion is released from the fixed side optical functional surface. | 2014-11-27 |
20140346692 | METHOD OF MANUFACTURING OPTICAL ELEMENT - Disclosed is a method of manufacturing an optical element capable of increasing surface accuracy of an optical surface of an optical element with a plastic lens portion. A cavity which is formed when a pair of molds are closed has a compression molding space and an annular injection molding space, and the method includes a compression molding step of casting a compression molding material into the compression molding space of the molds and an injection molding step of injecting an injection molding material into the injection molding space in a state where the molds are closed and forming an injection molded portion at the outer circumferential edge of the compression molded compression molding material. In the injection molding step, before the compression molding material reaches a temperature lower than the glass transition temperature, the injection of the injection molding material starts. | 2014-11-27 |
20140346693 | METHODS OF FORMING A TIR OPTICAL FIBER LENS - Methods of forming a total-internal-reflection (TIR) optical fiber lens are disclosed. The methods include heating an end of an optical fiber with a defocused infrared laser beam to form a bulbous tip having a curved outer surface that defines a lens surface. The bulbous tip is laser cleaved to define a TIR facet. Light traveling in the fiber diverges at an effective fiber end and is reflected by the TIR facet through the lens surface to form an image at an image plane. | 2014-11-27 |
20140346694 | POSITION DETECTION APPARATUS, IMPRINT APPARATUS, AND POSITION DETECTION METHOD - A position detection apparatus includes an illumination optical system for illuminating a first diffraction grating having periods in each of a first direction and a second direction different from the first direction, and a second diffraction grating having a period different from the period in the second direction of the first diffraction grating in the second direction, at an oblique incidence, and a detection optical system for detecting diffracted light from the first diffraction grating and the second diffraction grating, wherein a relative position of the first diffraction grating and the second diffraction grating is detected based on the detected diffracted light, and wherein the illumination optical system includes a plurality of light intensity distributions in the first direction except for on an optical axis of the detection optical system, in a pupil plane thereof. | 2014-11-27 |
20140346695 | METHOD OF MANUFACTURING AN OPHTHALMIC LENS WITH A PASSIVE EVENT-BASED COLORATION SYSTEM - The present invention discloses methods and apparatus for methods and apparatus for manufacturing an Ophthalmic Lens with passive event coloration mechanisms, which may not require a power source. In some embodiments, the passive event coloration mechanisms may be combined with Rigid Inserts or Media Inserts, wherein the inserts may provide additional functionalities. | 2014-11-27 |
20140346696 | APPARATUS AND METHOD OF PREPARING ELECTRONIC INK MICROCAPSULES - An apparatus and a method of preparing electronic ink microcapsules are disclosed. The apparatus of preparing electronic ink microcapsules includes: a first input tube, a second input tube, a UV light source, and an output tube connected to both the first input tube and the second input tube, respectively. The first input tube is a shading tube adapted to input an electrophoresis suspension comprising a mixture of a pre-polymer and a photo-initiator. The second input tube is adapted to input an aqueous solution comprising surfactant. The UV light source is adapted to radiate the mixed liquid in the output tube which is a mixture of the liquids input from the first input tube and the second input tube to prepare the electronic ink microcapsules. The electronic ink microcapsules prepared by using the apparatus and the method of preparing electronic ink microcapsules exhibit advantages including good uniformity, good thermal stability, etc. | 2014-11-27 |
20140346697 | AGGREGATED THREAD STRUCTURE, PRODUCTION METHOD THEREOF, AND ELECTRIC WIRE USING THE SAME - A method for producing an aggregated thread structure includes (a) a process of dispersing carbon nanotube to a first solvent, which is water or a mixed solvent containing organic solvent and water, with a surfactant, to create a dispersion and (b) a process of injecting the dispersion, in which carbon nanotube is dispersed, to a condensing liquid, which is a second solvent that differs from the first solvent, to thereby aggregate and spin carbon nanotube. The aggregated thread structure containing carbon nanotube has: a bulk density of 0.5 g/cm | 2014-11-27 |
20140346698 | METHOD OF SPRAY-DRYING AND APPARATUS FOR SPRAY-DRYING - Method of spray-drying a high-viscosity fluid, e.g. comprising a food product. The method comprises providing a nozzle plate wherein at least one nozzle is provided, said nozzle plate having an inner main surface and an outer main surface. The method comprises providing the high-viscosity fluid in a reservoir that is in fluidum connection with the at least one nozzle. The method comprises pressurizing the high-viscosity fluid in the reservoir, wherein the fluid flows, as a result of said pressurizing, towards the nozzle plate, thus creating a pressure difference over the at least one nozzle so that the fluid flows out of the at least one nozzle, thereby passing the outer main surface after passing the inner main surface. A cross-sectional area of the at least one nozzle in the inner main surface exceeds a cross-sectional area of the at least one nozzle in the outer main surface. | 2014-11-27 |
20140346699 | UNIFORM TEXTURE FOR CONCRETE WALLS - A method of forming a concrete wall having a substantially uniform exterior surface texture. The method includes the initial step of pouring concrete into a wall form. The concrete is poured from a first mixture and is allowed to cure. After the concrete is cured, the wall form is removed from the resultant concrete base structure. A roughened texture is then created on the base structure. A finishing mixture is then applied to the roughened texture. The finishing mixture may be created by separating the aggregate from a portion of the remaining first mixture. The finishing mixture creates a smooth texture on the exterior surfaces of the initially formed base structure. | 2014-11-27 |
20140346700 | IMPRINTING METHOD, IMPRINTING APPARATUS, AND DEVICE MANUFACTURING METHOD - An imprinting method of this disclosure includes supplying an imprint material on a substrate having a pattern including a mark on the substrate formed thereon; bringing a mold having a pattern including a mark on the mold into contact with the imprint material; curing the imprint material in a state in which the mold is in contact therewith; and forming a pattern including the mark on the imprint material, and characterized in that an optical system configured to form an image of the mark on the imprint material and an image of the mark on the substrate are used to detect the mark on the imprint material and the mark on the substrate after the space between the substrate and the mold has been increased until the mark on the mold is positioned out of a focal depth of the optical system, thereby obtaining a relative positional deviation between the pattern on the substrate and the pattern on the imprint material. | 2014-11-27 |
20140346701 | PATTERN FORMATION DEVICE, METHOD FOR PATTERN FORMATION, AND PROGRAM FOR PATTERN FORMATION - According to one embodiment, a pattern formation device that presses a template that includes a concave and convex part onto a transferring object and that forms a pattern in which a shape of the concave and convex part is transferred is provided. The device includes: a calculation part; an adjustment part; and a transfer. The calculation part calculates, using design information of the pattern, the distribution of force applied to the pattern at a time of releasing the template pressed onto the transferring object from the transferring object. The adjustment part adjusts forming conditions of the pattern in order to uniformly approach the distribution of force calculated by the calculation part. The transfer part transfers the shape of the concave and convex part to the transferring object according to the forming conditions adjusted by the adjustment part. | 2014-11-27 |
20140346702 | METHOD AND APPARATUS FOR MATERIAL DENSIFICATION - A process and apparatus for densification of material compresses the material, then heats and cools the compressed material to provide structural integrity and durability to the resultant densified product. For a lignocellulosic biomass material an inherent binder is used. The binder is activated substantially only along the periphery of the compressed material to increase throughput and reduce energy used during the densification process. To optimize throughput and densified material density and durability, the process and apparatus includes a compaction pressure measurement that provides a signal to a constrictor located at the exit, or between the exit and initial compaction location, to automatically control compaction pressure as material type, initial density, moisture and load weight vary. | 2014-11-27 |
20140346703 | BACTERIOSTATIC TEXTILE BASED ON POLYAMIDE 11 - The present invention relates to a bacteriostatic textile material of polyamide 11 where said polyamide 11 has an inherent viscosity of from 0.5 to 1.7 and contains no impurities with a diameter greater than 5 μm. The bacteriostatic textile material is useful in the fields of medicine, hygiene, baggage, clothing manufacture, clothing, household equipment and goods, upholstery, carpets, automobiles, industry, notably industrial filtration, agriculture and/or building construction. | 2014-11-27 |
20140346704 | METHOD FOR PRODUCING AN ABSORBENT PAPER PRODUCT HAVING VISUAL ELEMENTS - A method of manufacturing a strip of absorbent paper product. The method includes: providing a strip that has a strip width, which has a first dimension, disposed between a first edge and a second edge and a centerline extending in a longitudinal direction equidistant between the first edge and the second edge; imparting a pattern of first design elements in a central region wherein each first design element comprises a visual center point and the pattern has a pattern centerline in the longitudinal direction, the pattern of first design elements being disposed within a central width having a second dimension, the second dimension being less than the first dimension, and the central region extending laterally outwardly on each side of the centerline; and, imparting a plurality of second design elements on the strip, wherein at least one of second design elements is disposed in the central region. | 2014-11-27 |
20140346705 | SYSTEMS, METHODS AND APPARATUSES FOR DIRECT EMBOSSMENT OF A POLYMER MELT SHEET - A continuous single-stage embossing station comprised of two (2) temperature controlled engraved rollers which is located immediately after the extrusion die in the manufacturing process for multi-layer laminated glass panels and allows for dual simultaneous embossment of both sides of a polymer melt sheet and produces a polymer interlayer sheet with increased permanence, embossed retention values and decreased incidence of mottle and stack sticking peel force values. Also disclosed herein is an embossed polymer interlayer sheet with a first side, a second side and an embossed surface on at least one of the sides, with a surface roughness Rz of 10 to 90 microns on the embossed surface, a permanence of greater than 95% when tested at 100° C. for five (5) minutes and an embossed surface retention of greater than 70% when tested at 140° C. for five (5) minutes. | 2014-11-27 |
20140346706 | SYSTEM AND METHOD FOR PRODUCING PREFORMS - A system for producing a composite preform, especially for continuous preforming of reinforcing material for a composite component, is provided. The system includes: a feeding device for feeding one or more layers of preform material from a material supply along a process path; a heating device arranged in the process path for heating the one or more layers of the preform material fed along the process path to soften or activate a resin or binder in the one or more layers; and a forming device arranged in the process path downstream of the heating device and configured to shape or mould a cross-sectional profile of the one or more layers of preform material as the one or more layers are fed along the process path. A method for producing a composite preform is also provided. | 2014-11-27 |
20140346707 | ACRYLIC RUBBER COMPOSITION, ACRYLIC RUBBER MOLDED PRODUCT, AND METHOD FOR PRODUCING SAME - The present invention aims to provide an acrylic rubber composition capable of giving an acrylic rubber molded product good in low-friction properties and non-sticking properties. The present invention relates to an acrylic rubber composition containing an acrylic rubber (A) and a fluororesin (B), the fluororesin (B) being a perfluororesin. | 2014-11-27 |
20140346708 | CONNECTOR HOUSING - A connector housing ( | 2014-11-27 |
20140346709 | HEATING PREFORMS - An apparatus for reheating and conditioning an elongate preform for forming a blow moulded container, said apparatus comprising: a receiver including an elongate annular non-cylindrical inner surface portion, wherein the surface portion defines a cavity and is adapted to engage with an elongate outer surface of an elongate preform to transfer heat thereto by conduction from said surface portion, wherein the surface portion includes a three-dimensional relief to provide substantially non-uniform contact between the receiver and the elongate preform; and means for heating said receiver. | 2014-11-27 |
20140346710 | THERMALLY CONDUCTIVE SHEET AND PROCESS FOR PRODUCING SAME - A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction. | 2014-11-27 |
20140346711 | FOOD SERVICE ARTICLES BEARING DECORATIVE MARKINGS, IMAGES AND/OR CUSTOM CONTENT AND METHOD THEREFOR - A plastic food service article bearing a decorative mark or image and method therefor is disclosed. The method includes providing an article made from a colored plastic such as polystyrene, polypropylene, polyethylene, PET, PLA, ABS, etc., that discolors when irradiated with a laser beam; applying a laser beam to cause localized surface discoloration; and controlling the deflection and amplitude of the beam to form a surface decoration and/or image. In embodiments, the laser is a YAG or Fiber laser, the markings emulate silver or gold or pewter without applying metals, inks, or coatings to the plastic articles. The markings are clearly visible against both light and dark backgrounds, and can be placed in food-contact areas of the articles. The technique can be used for marking customized and personalized designs, images, and photographs on food service articles. Embodiments can be used to decorate plates and/or cutlery. | 2014-11-27 |
20140346712 | CABLE WITH INJECTION MOLDED COUPLING PART - A method of making cable includes injection molding a coupling part which is manufactured from a polymer mixture with a thermoplastic material as polymer component, where the cable casing contains thermoplastic polyurethane cross-linked by radiation. The cable has a water-tight and fixed connection between the casing of the cable and the section of the coupling part injection molded around the casing. | 2014-11-27 |
20140346713 | METHOD AND DEVICE FOR FORMING FINE PATTERNS - A method for forming fine patterns, including: holding, by a holding member, a sheet-like deformable thin-plate mold with fine patterns having been predeterminedly formed, above a UV-light-transparent substrate such that a UV hardening resin has been applied beforehand on a surface thereof, in such a manner that the mold is at a predetermined angle inclined with tension being applied; and letting a surface of the thin-plate mold serially get in contact with the UV hardening resin by allowing, after a first pressing roll installed above the thin-plate, mold is allowed to descend from above the thin-plate mold, the first pressing roll to relatively move concerning the substrate in a lateral direction while pressing, by the first pressing roll, the thin-plate mold against the UV hardening resin with a predetermined pressure. | 2014-11-27 |
20140346714 | Multilayer Blown Films for Shrink Applications - The present invention discloses multilayer blown films for shrink label and related applications. These multilayer blown films can comprise a core layer containing an ethylene polymer, and inner and outer layers containing conjugated diene monovinylarene block copolymers. | 2014-11-27 |
20140346715 | METHOD AND DEVICE FOR THE PRODUCTION OF TUBULAR STRUCTURAL COMPONENTS - A method for producing a tubular structural component and device for production thereof are disclosed. A tubular moulding tool has an inner mould surface shaped corresponding to an outer surface of the structural component. A support surface of an expandable support, formed corresponding to the moulding tool shape such that in an unexpanded state the support fills the moulding tool while the support surface and the mould surface run parallel leaving an expansion spacing of the support surface to the mould surface, is covered with a tubular non-crimp fibre fabric, such that fibres of a fibre layer of the non-crimp fibre fabric run diagonally around the support. After the support has been arranged in the moulding tool, the non-crimp fibre fabric is pressed against the mould surface by expanding the support with radial expansion of the non-crimp fibre fabric. The non-crimp fibre fabric is infiltrated by a curable matrix. | 2014-11-27 |
20140346716 | Handle Positioning Apparatus Outside Mould for Pre-Inserted-Handle Bottle Blow Moulding Machine, and Method of Use Thereof - A handle positioning apparatus outside mould for pre-inserted-handle bottle blow moulding machine, and a method of use thereof. The apparatus comprises a sliding block base, a handle positioning assembly, and a bottle pre-form positioning assembly. The bottle pre-form positioning assembly is provided in the middle of the sliding block base, and the handle positioning assembly is provided at one end of the sliding block base. The method of use thereof involves the handle positioning apparatus outside mould carrying a bottle pre-form being placed on a bottle pre-form conveying track; at the awaiting blow moulding position, a handle is placed into the handle positioning apparatus outside mould, and the same is transported into the mould where the bottle will be blown and once completed, is discharged via the bottle pre-form conveying track. | 2014-11-27 |
20140346717 | FLAT CONTAINER COMPRISING THERMOPLASTIC RESIN AND METHOD FOR MOLDING THE SAME - The invention realizes easy manufacturing of a flat container molded by blow molding, in which the wall thickness of a container wall is made uniform, and which provides improved mechanical strength, heat resistance, etc. and has a good appearance. The flat container obtained by the blow molding of a polyester resin is characterized in that the container has a flatness ratio of not less than 1.3, and in that its body has a wall thickness ratio of a maximum wall thickness to a minimum wall thickness of not more than 1.6, a difference in elongation between a maximally stretched portion and a minimally stretched portion of not more than 150% in a tensile test at 95° C., a crystallinity of not less than 30%, and a difference in TMA non-load change between a maximally stretched portion and a minimally stretched portion of not more than 500 μm at 75° C. and 100° C. | 2014-11-27 |
20140346718 | SYSTEMS AND METHODS FOR CUSHION SUPPORTS - The mattress assemblies have an array of springs extending from a sheet. Each spring in the array may be manufactured by choosing a position for the spring, cutting a profile of the sheet spring in the sheet, peeling back or bending the profile or tab of the sheet, and shaping the profile to form the sheet spring. The array of springs may be formed from creating a plurality of such springs along rows and columns. In certain embodiments, multiple sheets may be stacked to form the sheet spring array. | 2014-11-27 |
20140346719 | VIBRATION INSULATING MEMBER - A vibration insulating member is equipped between one component and an other component. The vibration insulating member includes a through hole forming portion and a contact portion. The through hole forming portion is formed of an elastic material to have a through hole in which a connection member is inserted to connect the one component with the other component. The contact portion is projected radially inward from an inner wall of the through hole forming portion. The contact portion has an inner wall on a radially inside. When the connection member is inserted in the through hole, an outer wall of the connection member forms a gap with the inner wall of the through hole forming portion and is in contact with the inner wall of the contact portion. | 2014-11-27 |
20140346720 | HYDRAULIC BEARING - The invention is directed to a hydraulic bearing which includes two connecting pieces, an annular rubber-elastic spring, a hydraulic chamber unit made of a working chamber and a compensating chamber and a partition unit having a connecting channel between the working chamber and the compensating chamber. The partition unit is configured as a disc and is disposed within the vertical elevation of the annular rubber-elastic spring and one of the connecting pieces. | 2014-11-27 |
20140346721 | HOLLOW SPRING UTILIZING SEAMLESS STEEL PIPE - There are provided: a seamless steel pipe formed from a cylindrical steel material billet through a hot isostatic extrusion step, wherein a depth of a contiguous flaw formed on an inner periphery surface and an outer periphery surface of the steel pipe is 50 nm or less; a hollow spring obtained by forming a hollow body in a shape of a coil or a bar or a bar with curved part from the seamless steel pipe made of spring steel and applying a surface treatment to the hollow body so that the hollow body has compressive residual stress; and a method for producing seamless steel pipe including: a billet molding step; a first heating step; a hot isostatic extrusion step; a second heating step; an extension step; a third heating step; and a pickling step. | 2014-11-27 |
20140346722 | ELECTRICALLY SWITCHABLE LOCKING TORQUE STRUT - A switchable locking torque strut assembly and associated method are provided. The strut assembly is interposed between an associated vehicle chassis and an associated vehicle powertrain to provide high elastomeric rate resistance during start-up and/or shutdown of an associated internal combustion engine (ICE) and low elastomeric rate resistance during idle and/or driving events. The strut assembly includes a housing and a shaft at least partially received in the housing and operatively mounted for selective relative movement relative to the housing. A locking assembly is interposed between the strut and the housing for selectively locking the strut relative to the housing in response to start-up and/or shutdown of the ICE. | 2014-11-27 |
20140346723 | Apparatus for Joining Pipe Sections - The present invention relates to a method and apparatus to be used when welding two abutting sections of pipe or tubing, and also to purge blocks for establishing a localized inert atmosphere inside two abutting pipe sections in the region of a desired weld joint. The present invention comprises an inflatable bladder with elongated engaging members that can be removable positioned within the ends of two abutting pipe sections in order to center the two abutting sections of pipe and create the purge block. | 2014-11-27 |
20140346724 | CAROUSEL CARRIER FOR A VACUUM TREATMENT INSTALLATION - The present invention relates to a vacuum treatment installation having carousel carriers, in which the carousel drive is arranged on the wall that is located opposite the door of the vacuum treatment installation. In this way, the coupling of the carousel of the carousel carrier to the carousel drive is ensured without any further mechanism. | 2014-11-27 |
20140346725 | PORTABLE WORK HOLDING DEVICE AND ASSEMBLY - A work holding device, such as a vice, includes first and second jaws and a spindle connected between them to change the distance between the jaws for holding a work piece. An elongated connection member extends from the first jaw and is shaped to fit into a receiver member of a receiver hitch on a vehicle. Adjustable projections are provided on the elongated connection member for reducing movement of the vice in the hitch. The adjustable projections may be set screws. An end cap is provided on the end of the elongated connection member. The work holding device may be mounted in a receiver member or bracket on a workbench or other work area. | 2014-11-27 |
20140346726 | SHEET PROCESSING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet processing device includes an exit tray and a sheet alignment mechanism. On the exit tray, ejected sheets or ejected sheet sheaves subjected to stapling are stacked. When at least a sheet is ejected, the sheet alignment mechanism aligns the sheets in a manner to be in contact with and catch opposite ends of the sheets stacked on the exit tray from a base end side of the exit tray. When a sheet sheaf is ejected, the sheet alignment mechanism comes in contact with a plurality of points on a topmost surface of the sheet sheaves stacked on the exit tray to detect a height difference between the plurality of points. | 2014-11-27 |
20140346727 | PAPER FEEDING DEVICE AND IMAGE FORMING DEVICE - Disclosed is a paper feeding device ( | 2014-11-27 |
20140346728 | SHEET FEED DEVICE AND IMAGE FORMING APPARATUS - A sheet feed device comprises: a sheet feed tray configured to be enabled to be drawn from a main body of an image forming apparatus; a bottom plate arranged in the sheet feed tray and configured to stack thereon a plurality of sheets; a driving unit configured to move the bottom plate upward; a drive transmitting unit configured to transmit a driving force from a drive source arranged on the main body to the driving unit; and a one-way rotation transmitting unit configured to unidirectionally transmit input from the drive transmitting unit to the driving unit and configured to be arranged on one side of the drive transmitting unit opposite to a side connected to the driving unit. | 2014-11-27 |