48th week of 2021 patent applcation highlights part 89 |
Patent application number | Title | Published |
20210378082 | CONSUMABLES FOR CUTTING TORCHES - Consumables for cutting torches include consumables that define a parallel plasma channel and/or a steep, elongated plasma chamber. Additionally, the consumables may define smooth, rounded edges between different geometries of the plasma channel (e.g., at transitions between straight and angles sections) and/or between the plasma channel and the plasma chamber. That is, the consumables may provide a plasma channel that does not converge, diverge, or define any corners and/or a plasma channel that transitions to the plasma chamber without defining any corners. | 2021-12-02 |
20210378083 | NEUTRON GUN AND NUCLEAR-POWERED ENERGY GENERATOR - A breech-loading neutron gun ( | 2021-12-02 |
20210378084 | HEAT SINK AND CIRCUIT DEVICE - Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection. | 2021-12-02 |
20210378085 | CIRCUIT BOARD, SEMICONDUCTOR DEVICE, POWER CONVERTER, AND MOVING OBJECT - The first and second electronic components are mounted on a printed circuit board. A temperature indicating resin comes in contact with not the second electronic component but the first electronic component. The temperature indicating resin visually changes upon increase in the temperature. Alternatively, an electronic component is mounted on the printed circuit board. The temperature indicating resin comes in contact with not the electronic component but the printed circuit board. The temperature indicating resin visually changes upon increase in the temperature. | 2021-12-02 |
20210378086 | COOLING DEVICE - A cooling device includes: an electronic component; a circuit board on which the electronic component is mounted; and a heat sink provided to dissipate heat to an outside of the cooling device. The cooling device also includes: a graphite sheet integrally provided on a surface of the heat sink on one side facing the electronic component; a heat conductive portion contacting both a part of the graphite sheet and the electronic component; and a shielding portion. The shielding portion is provided at a position between a portion of the circuit board where no electronic component is mounted and the graphite sheet to cover a shielded surface of the graphite sheet. | 2021-12-02 |
20210378087 | SYSTEMS AND METHODS FOR THERMAL CONTROL OF A GENERATOR CONTROL UNIT - A generator control unit (GCU) having thermal control includes a GCU housing having a first side and a second side. A printed wiring board (PWB) is within the GCU housing between the first side and the second side. The PWB includes a component side that faces a first side of the GCU housing. At least one through via is positioned through a thickness of the PWB. At least one boss is positioned on the component side of the PWB. The at least one boss extends from a component of the PWB to the first side of the GCU housing. | 2021-12-02 |
20210378088 | DISPLAY DEVICE - A display device includes: a display panel; an input sensor disposed on the display panel; a flexible circuit board connected to the display panel and the input sensor; a first differential signal line and a second differential signal line, which are disposed on the flexible circuit board and connected to the display panel; and a transmission line and a receiving line, which are disposed on the flexible circuit board and connected to the input sensor. In a plan view, the receiving line is disposed between the first differential signal line and the second differential signal line. | 2021-12-02 |
20210378089 | Method and Design of High-Performance Interconnects with Improved Signal Integrity - Described herein are systems and methods for a design method and new interconnect structures with incorporated interdigital trapezoidal tabs structures enabled with materials with either larger permittivity or permeability for improved signal integrity. | 2021-12-02 |
20210378090 | ELECTROMAGNETIC WAVE REDUCING STRUCTURE - The present invention addresses providing an electromagnetic wave reducing structure that can reduce leakage to outside of noise that is emitted by a circuit, from low frequency to high frequency, without using a special, difficult to obtain item. To address this problem, the electromagnetic wave reducing structure is provided with: a first conductor layer and a second conductor layer facing opposite each other; and a capacitor group comprising a plurality of capacitors connected to the first conductor layer and the second conductor layer. All the gaps are approximately equal between the capacitors in any pair of adjacent capacitors in a first direction within the plane and any pair of adjacent capacitors in a second direction which is the direction within the plane that is approximately perpendicular to the first direction, in a surface parallel to the surface of the first conductor layer that faces opposite the second conductor layer. | 2021-12-02 |
20210378091 | CALIBRATION CIRCUIT BOARD AND ANTENNA APPARATUS INCLUDING THE SAME - A calibration circuit board for an antenna. The calibration circuit board may include: a first metal layer configured to be grounded; a first substrate over the first metal layer; a second substrate over the first substrate; and a plurality of couplers. Each coupler may include: a transmission line provided with an input port and an output port at both ends thereof, respectively; and a coupling line coupled with the transmission line and including two first portions respectively located at both sides of the transmission line, and a second portion connected between the two first portions. The coupling lines may be connected in series to provide a first calibration port and a second calibration port. One of the transmission lines and the coupling lines may be between the first substrate and the second substrate, and the other of the transmission lines and the coupling lines may be over the second substrate. | 2021-12-02 |
20210378092 | CARRIER BOARD STRUCTURE WITH AN INCREASED CORE-LAYER TRACE AREA AND METHOD FOR MANUFACTURING SAME - Carrier board structure with an increased core-layer trace area and method for manufacturing the same are introduced. The carrier board structure comprises a core layer structure, a first circuit build-up structure, and a second circuit build-up structure. The core layer structure comprises a core layer, a signal transmission portion, and an embedded circuit layer, wherein the signal transmission portion and the embedded circuit layer are disposed inside the core layer and electrically connected. The first circuit build-up structure is disposed on the core layer on a same side as the embedded circuit layer and is electrically connected to the embedded circuit layer. The second circuit build-up structure is disposed on the core layer on a same side as the signal transmission portion, and is electrically connected to the first circuit build-up structure through the signal transmission portion and the embedded circuit layer. | 2021-12-02 |
20210378093 | DISPLAY SCREEN, SPLICED DISPLAY SCREEN, AND SPLICING METHOD FOR SPLICED DISPLAY SCREEN - A display screen, a spliced display screen, and a splicing method for the spliced display screen are provided. The display screen includes a substrate and at least one first flexible printed circuit FPC. The substrate is provided with at least one set of first signal lines on a side edge of the substrate, where each set of first signal lines is coupled with a first connecting portion of a corresponding first FPC, and for each first FPC, a second connecting portion of the first FPC faces the side edge of the substrate where the at least one set of first signal lines is disposed. | 2021-12-02 |
20210378094 | SURFACE MOUNT PADS FOR NEXT GENERATION SPEEDS - A high-speed transmission circuit comprises, as part of a signal path, a connector pin disposed on a pad that comprises an unused pad region. The unused pad region is not considered part of the signal path but is part of a resonant sub-circuit. In various embodiments, by properly adjusting the dimensions of the pad region and other structures in the high-speed transmission circuit, resonant frequencies of the sub-circuit are shifted to a frequency range that is outside of the frequency range of interest in the signal path, thereby, reducing insertion loss and increasing signal integrity without compromising mechanical stability. | 2021-12-02 |
20210378095 | ELECTRONIC ASSEMBLY - An electronic assembly is provided, including a wiring board, a control element, and a pair of first internal electrical connectors. The wiring board includes a mounting surface, a first patterned conductive layer, a plurality of second patterned conductive layers, a plurality of near conductive holes, a plurality of far conductive holes, and a first conductive path. The first patterned conductive layer is located between the mounting surface and the second patterned conductive layers. The control element is mounted on the mounting surface of the wiring board. The pair of first internal electrical connectors are mounted on the mounting surface of the wiring board, and are adapted for mounting a pair of memory modules. The first conductive path extends from the control element at least through the corresponding second patterned conductive layer and the first patterned conductive layer to the pair of first internal electrical connectors. | 2021-12-02 |
20210378096 | ELECTRONIC DEVICE INCLUDING MULTIPLE PRINTED CIRCUIT BOARDS - An electronic device is provided. The electronic device includes a first printed circuit board having a first surface and a second surface, a second printed circuit board having a first surface and a second surface disposed to be spaced apart from the first printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, a first connection member to electrically connect the first printed circuit board and the second printed circuit board, and a second connection member to electrically connect the first printed circuit board and the second printed circuit board, wherein the first connection member and the second connection member may be arranged to at least partially overlap at a portion passing by the battery. | 2021-12-02 |
20210378097 | REDUNDANT PRINTED CIRCUIT BOARD WITH BUILT IN ISOLATION - An apparatus for an electronic power steering system includes a printed circuit board and a first sensor. The printed circuit board comprising: a first surface and a second surface opposite the first surface; a first processor section extending in a first direction on the first surface; a second processor section extending in a second direction opposite the first direction on the second surface; and a void disposed between the first surface and the second surface, the first processor section and the second processor section being separated by the void. | 2021-12-02 |
20210378098 | ELECTRONIC COMPONENT - An electronic device and a method of forming such an electronic device are disclosed. The electronic device can include an integrated device package and a component. The integrated device package includes a substrate and a package body over the substrate, and a hole formed through the package body to expose a conductive pad of the substrate. The component is mounted over the package body, and includes a component body and a lead extending from the component body through the hole. The lead includes an insulated portion and a distal exposed portion, and the insulated portion includes a conductor and an insulating layer disposed about the conductor, wherein the distal exposed portion is uncovered by the insulating layer such that the conductor is exposed at the distal portion. The electronic device can also include a conductive material that electrically connects the distal exposed portion to the conductive pad of the substrate. | 2021-12-02 |
20210378099 | MAGNETICALLY SECURED SEMICONDUCTOR CHIP PACKAGE LOADING ASSEMBLY - An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink. | 2021-12-02 |
20210378100 | DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER SOURCE - A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment. | 2021-12-02 |
20210378101 | FLEXIBLE ELECTRONIC STRUCTURE AND METHOD FOR PRODUCING SAME - A flexible electronic structure includes a first film, made of a first polymer or glass, and a second film, made of a second polymer, in which at least one electronic component is arranged. The second film covers the first film. The flexible electronic structure also includes at least one electrically conductive track arranged between the first film and the second film, and each electrically connected to one of the electronic components, by a respective interconnection element. Optionally, the flexible electronic structure includes a third film, made of a third polymer or glass, covering the second film. The interconnection element is arranged near the neutral plane of the structure, and the structure includes at least one compensation layer, so as to position the neutral plane at a desired location. | 2021-12-02 |
20210378102 | ELECTRICAL ASSEMBLY - An electrical assembly may include a contactor, a bus bar connected to the contactor, a bracket connected to the bus bar, a flexible circuit electrically connected to the contactor, and/or a cooling member connected to the bracket. A method of assembling an electrical assembly may include disposing a flexible circuit at least partially on and/or in the bracket, connecting a bus bar with the one or more contactors, connecting the bus bar with the bracket, electrically connecting the flexible circuit to the one or more contactors, disposing a cooling member on or about the bracket, and/or connecting the cooling member with the bracket. | 2021-12-02 |
20210378103 | METHOD FOR PRODUCING WIRING SUBSTRATE - The present disclosure provides a method for producing a wiring substrate. A seeded substrate is first prepared. The seeded substrate includes an insulation substrate, a conductive undercoat layer having a hydrophilic surface and provided on the insulation substrate, a conductive seed layer provided on a first region of the surface of the undercoat layer, the first region having a predetermined pattern, and a water-repellent layer on the second region of the surface of the undercoat layer, the second region being a region other than the first region. Subsequently, a metal layer is formed on the seed layer. A voltage is applied between the anode and the seed layer while a solid electrolyte membrane being disposed between the seeded substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the water-repellent layer and the undercoat layer are etched. | 2021-12-02 |
20210378104 | AUTOCLAVABLE ELECTRONICS UNIT FOR AN ENDOSCOPE, METHOD FOR PRODUCING AN AUTOCLAVABLE ELECTRONICS UNIT AND ENDOSCOPE - An autoclavable electronics unit for an endoscope, the autoclavable electronics unit including: a multi-layer printed circuit board having a rigid region and a flexible region, the rigid region being reinforced by stiffener material to have a greater rigidity than the flexible region and the flexible region is configured to be bendable. Where the multi-layer printed circuit board is formed from structured layers made of conductive and non-conductive materials adhered together, in which the conductive structures form conductor tracks and contact surfaces; the rigid region is provided with one or more electronic components; and the rigid region is covered by an epoxy resin. | 2021-12-02 |
20210378105 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD - A circuit board includes a conductive plate held by a holding member, an insulation sheet provided on one side of the conductive plate, and a circuit component that is placed on the conductive plate and that has a terminal, and a void portion is formed in the insulation sheet, and a conductive material for electrically connecting the conductive plate and the terminal to each other is applied to a region that is exposed from the void portion on the one side of the conductive plate. | 2021-12-02 |
20210378106 | Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies - A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture. | 2021-12-02 |
20210378107 | DISPLAY DEVICE AND METHOD FOR FABRICATING DISPLAY DEVICE - A display device includes a display panel comprises a display area and a non-display area surrounding the display area; a cover panel disposed on a rear surface of the display panel and comprising a front surface, a first side surface connected to the front surface and bent along a first bending line, a second side surface connected to the front surface and bent along a second bending line intersecting the first bending line, and a first corner located between the first side surface and the second side surface; and an alignment notch defined at the first corner of the cover panel. | 2021-12-02 |
20210378108 | AIR BAG CONTROL UNIT - The present invention relates to an airbag control unit capable of improving waterproof performance while forming a slim airbag control unit by improving a coupling structure between parts of an airbag control unit. The present invention discloses an airbag control unit including a housing that is in an enclosure shape and has an opening formed at an end thereof; a PCB that is coupled to the housing by coupling to a corner portion in the opening and an electrical connection structure in which a terminal pin is inserted into a terminal pin hole so that it is energized; and a cover that is provided in a shape covering the opening and includes an edge joined and fixed along an edge of the opening. | 2021-12-02 |
20210378109 | DISPLAY DEVICE - A display device includes a display module which is foldable and includes a first non-folding area, a folding area and a second non-folding area, in order, a first plate corresponding to the first non-folding area, a second plate corresponding to the second non-folding area and spaced apart from the first plate, and a cover film facing the display module with both the first plate and the second plate therebetween. The cover film includes a first film corresponding to each of the first non-folding area, the folding area and the second non-folding area, the first film attached to each of the first and second plates, and at the folding area, a second film attached to the first film. The display module which is folded disposes the second film between the first film and the first plate and between the first film and the second plate. | 2021-12-02 |
20210378110 | Irrigation Controller - Described herein is an irrigation controller having a rotating user interface where the front side of the user interface can be rotated 180 degrees so that it faces the inside of the controller housing. This functionality allows the user to install or modify the irrigation wiring while also programming the irrigation settings and/or schedule. | 2021-12-02 |
20210378111 | LED DISPLAY PANEL - An LED display panel includes main frame made of a lightweight material, a supporting component and a control box. The main frame includes a first end surface for mounting a display screen and a second end surface opposing the first end surface. The supporting component includes a supporting tube and a plurality of supporting members. Fixing parts are arranged on peripheral edges of the second end surface, and the plurality of supporting members are correspondingly mounted on the fixing parts. A tube fixing part is arranged on an end of the supporting member far away from the second end surface, and the supporting tube is fixed on the tube fixing part. A power supply, a control system and a signal transmission system are arranged in the control box, and the control system and the signal transmission system are electrically connected to the power supply. | 2021-12-02 |
20210378112 | STRUCTURE FOR CONNECTING TERMINAL TO CIRCUIT SUBSTRATE WITHIN CASE - In a structure for connecting a terminal to a circuit substrate within a case, a resin holder to which a plurality of terminal members are insert bonded is insert bonded to a resin case member having a connector portion and configuring part of the case. Each terminal member has one end part connected to the circuit substrate housed in the case, another end part of the terminal member being disposed within the connector portion. The holder is insert bonded to the case member while leaving an exposure hole as a cavity. Formed in the case member is an open hole communicating with the exposure hole and opening on a housing chamber side. Accordingly, it is possible to prevent a short circuit due to moisture from occurring between the terminal members retained by the holder. | 2021-12-02 |
20210378113 | DISPLAY DEVICE AND DISPLAY APPARATUS - An embodiment of the present disclosure provides a display device and a display apparatus, the display device includes: a transparent structure and a display screen; the transparent structure including a first light transmission plate and a second light transmission plate which are oppositely set, edge regions of the first light transmission plate and the second light transmission plate being packaged by a seal assembly, to form a closed cavity; the display screen being set within the closed cavity, and an edge of the display screen being fixed to an inner wall of the closed cavity; the closed cavity being filled with inert gas. | 2021-12-02 |
20210378114 | Deployable Hardened Housing Units - The present application describes apparatuses, systems, and methods for robust, adaptable, and deployable computing devices and radio systems. In one aspect, the present application describes a chassis for housing electronic componentry. The chassis includes a frame with a top plate and a bottom plate, an interface panel located on the chassis frame; a back panel located on the chassis frame opposite the interface panel, and a protective protrusion located at a corner of the chassis frame extending beyond the top plate and the bottom plate. | 2021-12-02 |
20210378115 | SLIDING FLEXIBLE DISPLAY DEVICE - A sliding flexible display device is provided. The sliding flexible display device includes a flexible display panel and a sliding component for carrying the flexible display panel. The sliding component includes a plurality of sliding modules that may slide relatively. The display device has a contraction and stretching function under action of the sliding modules. The display device may be freely changed from a flat state to a retracted state and a folded state. The flexible display panel exhibits different folding forms as the states change, and achieves display screen continuity of the flexible display panel. | 2021-12-02 |
20210378116 | ELECTRONIC DEVICE AND INSULATING PIECE THEREOF - An insulating piece for an electronic device is provided. The electronic device includes a first housing component and a second housing component. The first housing component includes at least one hook portion connected to the second housing component. The insulating piece includes a first covering portion, a second covering portion and at least one concave structure. The first and second covering portions extend in different directions. The concave structure is connected between the first and second covering portions. The concave structure and the second housing component form an accommodating space therebetween to accommodate the hook portion. The first and second covering portions cover inner sides of the first and second housing components respectively. | 2021-12-02 |
20210378117 | TEXTURED GLASS COMPONENT FOR AN ELECTRONIC DEVICE ENCLOSURE - The disclosure provides textured glass components as well as electronic device cover assemblies and enclosures which include the textured glass components. In some cases, a protruding portion of the glass component includes a textured region provided over a camera assembly of the electronic device. One or more openings may be provided in the textured region. The textured region may be configured to provide a translucent or hazy appearance to the electronic device while providing a desirable “feel” to the electronic device and level of cleanability. | 2021-12-02 |
20210378118 | CASING AND MANUFACTURING METHOD THEREOF - A manufacturing method of a casing including the following steps is provided. A magnesium alloy substrate is provided first. Next, a protective film is formed on the magnesium alloy substrate. A grinding treatment, a cutting treatment, or an engraving treatment is then performed to remove portions of the protective film and portions of the magnesium alloy substrate. An electrophoretic coating treatment is performed afterwards to form a light-transmissive coating layer covering the protective film and the magnesium alloy substrate. A casing is also provided. | 2021-12-02 |
20210378119 | DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER SOURCE - A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment. | 2021-12-02 |
20210378120 | TRIPLE SEALING DEVICE FOR ELECTRONICS HOUSING OF SMART INSTRUMENTATION - The triple sealing device for an electronics housing of smart instrumentation includes: an electronic board; a first housing which has the electronic board disposed therein and includes a first inlet port to allow a cable to pass therethrough; a second housing which is provided above the first inlet port of the first housing and coupled to the first housing, and includes a second inlet port to allow a cable to pass therethrough; an elastic block provided on an inner circumferential surface of the second inlet port; and a cable which is connected to the electronic board and extends outward after passing through the first inlet port and the second inlet port. | 2021-12-02 |
20210378121 | CONNECTOR, IC PACKAGE, AND METHOD OF MOUNTING CONTACTS TO HOUSING OF CONNECTOR - A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes. | 2021-12-02 |
20210378122 | MOUNT CAGE FOR DISK DRIVE - A mount cage configured to mount disk drive to rack and including first cage part, second cage part, first positioning pillar and second positioning pillar. First cage part includes first plate portion, second plate portion, and third plate portion. Second plate portion and third plate portion stand on same side of first plate portion and spaced apart from each other. Second cage part includes fourth plate. Fourth plate is pivotally connected to a side of second plate portion located away from first plate portion to be detachably engaged with a side of third plate portion located away from first plate portion. First plate portion, second plate portion, third plate portion, and fourth plate together form accommodation space and two apertures connected to accommodation space. First positioning pillar is fixed in first positioning hole of disk drive. Second positioning pillar is fixed in second positioning hole of disk drive. | 2021-12-02 |
20210378123 | INFORMATION HANDLING SYSTEM WITH A BATTERY TAB MECHANISM TO OPTIMIZE BATTERY FLEXIBILITY - A system includes a chassis assembly, a snap holder secured to the chassis assembly, and a second snap holder secured to the chassis assembly. A first tab clip may be snap-fitted onto the first snap holder to secure the first tab clip to the first snap holder, and a second tab clip may be snap-fitted onto the first snap holder to secure the second tab clip to the second snap holder. Each tab clip includes a soft component portion within the tab clip. A battery may be affixed to the first and second tab clips after the tab clips are secured to the snap holders. | 2021-12-02 |
20210378124 | BLIND-MATE CONNECTION DESIGN FOR LIQUID-COOLED ELECTRONIC RACKS - A holder for connecting a rack manifold of an electronic rack and a room manifold of a data center room to provide liquid cooling to the electronic rack includes an L-shaped frame with a first arm having a first end and a second end, and a second arm extending from the second end of the first arm and substantially perpendicular to the first arm. The holder additionally includes a pivot point to be coupled to a pivot connector on a panel to pivotally move the L-shaped frame between a first position and a second position. The holder further includes a first blind-mate connector disposed on the L-shaped frame to be coupled to a second blind-mate connector at an engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the L-shaped frame moving to the second position in response to contact with the electronic rack. | 2021-12-02 |
20210378125 | FOOLPROOF FRAME ASSEMBLY AND SERVER CHASSIS INCLUDING THE SAME - A foolproof frame assembly includes a blocking component fixed on a case, and first and second frames disposed on opposite sides of the case. Each of the first and second frames has a foolproof component fixed to one of two side plates thereof and blocking one of two through holes on its bottom plate. When the first frame is in a first mounting position, the blocking component passes through another through hole and form a space with another side plate of the first frame for one of two mounting side plates of the mounting frame to be disposed therethrough. When the second frame is in the first mounting position, a space occupied by its foolproof component overlaps a space occupied by the blocking component. When the first and second frames are respectively in the first and second mounting positions, the foolproof components block the two mounting side plates. | 2021-12-02 |
20210378126 | SERVER CHASSIS - A server chassis including rack and mount cage. Mount cage includes cage part and handle. Cage part is fixed on a side of the rack. Handle includes pivot part, handheld part, and protruding part. Handheld part and protruding part are respectively connected to two opposite sides of pivot part, and pivot part is pivotally connected to cage part. Protruding part has first side surface located on a side of protruding part that is located away from pivot part. An axis of pivot part is spaced apart from first side surface by first distance along first direction. Pivot part is spaced apart from first side surface by second distance along second direction. First direction is different from the second direction, and first distance is different from second distance. | 2021-12-02 |
20210378127 | TRAY FOR ELECTRONIC COMPONENTS - A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space. | 2021-12-02 |
20210378128 | RACK ADAPTED FOR RECEIVING A COMPONENT AND SYSTEM INCLUDING THE RACK AND THE COMPONENT - A rack adapted for receiving one or more components is disclosed. The rack includes a backplane, a pair of side panels extending from the backplane and internal support members on each side to receive and mechanically guide an initial alignment of components upon their initial insertion in the rack. A pair of male connectors mounted to the backplane is configured to mate with a corresponding pair of female connectors of each component to mechanically guide a final alignment of each component when the component is further inserted in the rack. Mechanical guidance may also be provided by, or supplemented with, a connection capable of providing liquid cooling to the rack. A system including the rack and the component inserted in the rack is also disclosed. | 2021-12-02 |
20210378129 | SERVER STRUCTURE - A server structure includes an outer frame, a drawer box, a wire harness, and at least one wire harness bracket. The outer frame has a bottom plate and a fixed wall and forms an opening opposite to the fixed wall. The drawer box is passed into the outer frame through the opening. The wire harness has folded portions and is folded at each folded portion and disposed between the fixed wall and drawer box. The wire harness contains a signal cable and a power cable. The wire harness bracket ties the wire harness and has a sliding mat pressing at the bottom plate. When being removed from the opening, the drawer box moves away from the fixed wall and drives the wire harness to spread out each folded portion. The sliding mat supports the wire harness to separate the wire harness and bottom plate to facilitate movements and stretches. | 2021-12-02 |
20210378130 | CLIP FOR SECURING CABLES AND PERFORMING CABLE MAINTENANCE - A clip for securing one or more cables in a cable aisle of a computing device comprises a housing portion and a sliding portion. The housing portion has a first sidewall and a second sidewall that are coupled via a base. A cable channel is defined between the first sidewall and the second sidewall. The cable channel is configured to accommodate the one or more cables. The sliding portion is coupled to the first sidewall of the housing portion. The sliding portion has a lifting member extending across the cable channel from the first sidewall to the second sidewall. The sliding portion is configured to be moveable between a lowered position and a raised position. The lifting member moves from a first end of the cable channel to a second end of the cable channel, when the sliding portion moves from the lowered position to the raised position. | 2021-12-02 |
20210378131 | TRANSPORTABLE DATACENTER - Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment. | 2021-12-02 |
20210378132 | Thermal Management of Battery Units on Data Center Racks - A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material (“PCM”) attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips. | 2021-12-02 |
20210378133 | Surface Mounted Heat Buffer - An assembly ( | 2021-12-02 |
20210378134 | RAISED PATHWAY HEAT SINK - Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board. | 2021-12-02 |
20210378135 | CASE ASSEMBLY AND ELECTRONIC DEVICE - A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other. | 2021-12-02 |
20210378136 | SERVER FAN WITH AIRFLOW SHIELDING STRUCTURE - A fan module includes a fan body and metal plates. The fan body has a fan seat, and the fan seat is provided with coupling holes. The metal plates enclose the fan body and expose an outlet side. The position assembly includes a position frame and position members. The position frame has an air outlet and is fixed on the outlet side. The airflow shielding structure includes shutter plates and a connection rod. One side of the shutter plates are pivoted at the position frame, and the shuttle plates are capable of turning simultaneously for opening and closing the air outlet so as to maintain the normal operation of the server fan. | 2021-12-02 |
20210378137 | UNINTERRUPTIBLE POWER SUPPLY HAVING A LIQUID COOLING DEVICE - An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof. | 2021-12-02 |
20210378138 | MINIATURE HEAT DISSIPATION SYSTEM - A miniature heat dissipation system applicable for a smart communication device includes a sensing module, a heat dissipation module and a control module. The sensing module is disposed on a processing member and detects a temperature of the processing member to generate a first temperature information. The heat dissipation module includes a substrate unit, a rotor unit, a plurality of stator units, and a fan unit. One side of the substrate unit is connected to the sensing module that is located between the processing member and the substrate unit. The rotor unit is disposed on another side of the substrate unit. The plurality of stator units are disposed on the another side of the substrate unit and surround the rotor unit. The fan unit is connected to the rotor unit. The control module is electrically connected to the sensing module and the heat dissipation module. | 2021-12-02 |
20210378139 | Impinging Jet Manifold For Chip Cooling Near Edge Jets - Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities. | 2021-12-02 |
20210378140 | EXTERNAL ROBOTIC SYSTEM FOR LIQUID IMMERSION COOLING PLATFORM - An autonomous vehicle is disclosed which can map a facility and navigate its way to a particular liquid cooling system. The vehicle can be in communication with a central server, which can control the vehicle. The vehicle can align itself against the liquid cooling system and receive a computing device on a platform of the vehicle. The platform can be lowered and secured in an enclosure of the vehicle. Then, the vehicle can transport the computing device to a storage facility. | 2021-12-02 |
20210378141 | COMPLETE BLIND-MATE CONNECTION SYSTEM FOR LIQUID COOLING - A holder for an electronic rack includes a pivot point and a first end of the holder having a first blind-mate connector to be coupled to a second blind-mate connector at a first engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack. The holder additionally includes a second end of the holder having a third blind-mate connector to be coupled to a fourth blind-mate connector at a second engagement interface. The third blind-mate connector and the fourth blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack. | 2021-12-02 |
20210378142 | HEAT DISSIPATION DEVICE AND SERVER USING SAME - A server with a cooling system which can maintain a constant and preferred operating temperature for the server includes a computer and a heat dissipation device for dissipating heat generated by the computer. The heat dissipation device includes a liquid tank and a heat exchange device. The liquid tank defines an accommodating cavity for accommodating non-conductive cooling liquid and the computer. The heat exchange device is connected to the liquid tank to exchange heat with the non-conductive cooling liquid in the liquid tank. | 2021-12-02 |
20210378143 | LIQUID DISTRIBUTION MODULE AND HEAT DISSIPATION SYSTEM - A liquid distribution module is configured to be connected to a cold plate. The liquid distribution module includes a main body, an inlet manifold, a flow control valve, and an outlet manifold. The inlet manifold is disposed on the main body and connected to the cooling liquid source. The inlet manifold includes a plurality of liquid inlets, wherein the plurality of liquid inlets are configured to connect a plurality of cold plate inlets of the cold plate respectively. The flow control valve is connected to the inlet manifold. The outlet manifold is disposed on the main body and includes a plurality of liquid outlets, wherein the plurality of liquid outlets are configured to connect a plurality of cold plate outlets of the cold plate respectively. | 2021-12-02 |
20210378144 | RADIATOR - A radiator is provided having high heat dissipation performance while being compact and lightweight. A radiator | 2021-12-02 |
20210378145 | ELECTRONIC DEVICE - An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge. | 2021-12-02 |
20210378146 | Equipment Shelf - An equipment shelf includes at least one power supply unit (PSU) positioned in an upper region of the equipment shelf. The equipment shelf also includes at least one battery backup unit (BBU) positioned in a lower region of the equipment shelf. An airflow path extends through the equipment shelf between the upper region and the lower region. The airflow path separates the upper region of the equipment shelf from the lower region of the equipment shelf and thermally isolates the at least one PSU in the upper region from the at least one BBU in the lower region when air flows through the airflow path. Other example equipment shelves are also disclosed. | 2021-12-02 |
20210378147 | UNINTERRUPTIBLE POWER SUPPLY HAVING A LIQUID COOLING DEVICE - A liquid cooling device for cooling at least one target component includes a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device. The base member defines a plurality of pockets spaced apart from one another. A plurality of cover members are connected to the base member and are at least partially received in a corresponding pocket. Each cover member has a fluid inlet and outlet. The cover and base members define together a plurality of fluid conduits that are independent from one another. Each fluid conduit is defined between a cover member and the base member such that a number of the fluid conduits is equal to a number of the cover members. Each fluid conduit respectively receives and discharges fluid through the fluid inlet and the fluid outlet of the corresponding cover member. | 2021-12-02 |
20210378148 | LIQUID IMMERSION COOLING TANK AS A HIGH DENSITY AGGREGATED SERVER CHASSIS FOR MODULAR BLADES - The disclosed computer cooling system includes a liquid immersion cooling tank configured as a server chassis with an integrated power bus, control bus and data bus. The server chassis tank receives and services a plurality of modular blades including disaggregated single server components dedicated to similar functions and resembling a beekeeper's box of vertical and spaced operation, insertion and extraction. The modular blades include at least one management blade, interfaces and peripherals blade, storage blade, CPU blade and one or more GPU blades and other processors. Each blade configures hottest operating components lowest in a heat flow via transverse mounted brackets and vented ends. A blade extraction mechanism includes movable winches for manipulating the plurality of modular blades from a top side of the heat flow and a hydraulic lift for pushing each modular blade from a bottom of the heat flow out of the liquid immersion cooling tank. | 2021-12-02 |
20210378149 | HIGH RESILIENT DEPLOYMENT BASED COOLING SYSTEM FOR ELECTRONIC RACKS - A cooling system for an electronic rack of a data center, such as an IT rack or PoD, is disclosed. The system includes a coolant distribution unit (CDU) coupled to a rack manifold of the electronic rack through a fluid cooling loop. The CDU supplies cooling fluid that is distributed to the IT rack or PoD, and receives returning warm/hot fluid from the IT rack or PoD. The system further includes an enhancing cooling unit to receive a first part of a first distributed portion of the cooling fluid and to further cool the first part of the first distributed portion of the cooling fluid to a lower temperature value than the one of the supplied cooling fluid through an enhancing cooling loop. The system further includes a first external cooling unit connected to the CDU through a cooling fluid loop to supply the cooling fluid to the CDU. The system further includes an air cooling unit to receive a second distributed portion of the cooling fluid and to use the second distributed portion of the cooling fluid to cool the airflow for IT rack or PoD. The system is arranged in five portions, and fluids and cooling units are shared among the portions within distributing loops. | 2021-12-02 |
20210378150 | INTELLIGENT REFRIGERATION-ASSISTED DATA CENTER LIQUID COOLING - A cooling system for a datacenter is disclosed. The datacenter cooling system includes a refrigerant cooling loop to extract heat from a secondary cooling loop that is located within the datacenter or to provide supplemental cooling to one or more components of the datacenter that are coupled to the secondary cooling loop. | 2021-12-02 |
20210378151 | BACKUP COOLING FOR A DATA CENTER AND SERVERS - Cooling arrangement of data center configured for backup operation, the arrangement including an active cooling system having: fluid cooling systems. The arrangement further including an intake louvers assuming a closed position separating interior space of the data center from the exterior environment during normal mode of operation and an open position enabling free flow of outside air into the interior space during backup operation; exhaust louvers assuming a closed position separating interior space of the data center from the exterior environment and an open position enabling free flow of interior air out to the exterior environment; and controller configured to direct the intake louvers and exhaust louvers to assume the open position when electrical power supply to the active cooling system has been interrupted. The arrangement further includes a fluid system which functions as an open loop in the normal mode and a closed loop in the backup mode. | 2021-12-02 |
20210378152 | ACOUSTIC AIR PUMP - A cooling device generating unidirectional air flow to cool an electrical component. The cooling device is an equivalent of an electrical acoustic diode to make air flow only one direction. A speaker generates air flow in a first passageway to a cavity, and then expels air out from the cavity through a second passageway. An electrical component is cooled by the air flow, and may be positioned adjacent the passageways, or positioned in the cavity. In one example, eyewear having an electrical component positioned in a temple is cooled by the cooling device. | 2021-12-02 |
20210378153 | HEAT DISSIPATING SYSTEM AND POWER CABINET - A heat dissipating system and a power cabinet are provided. The heat dissipating system includes a cabinet, a first circulating fan and a heat exchanger. The cabinet has an outer circulating air duct and a sealed inner circulating air duct. The air inlet and the air outlet connected to the outside are arranged in the outer circulating air duct, and the heat exchanger is arranged in the cabinet and configured to exchange heat between the inner circulating air duct and the outer circulating duct. The first circulating fan is arranged outside the air inlet of the outer circulating air duct or arranged inside the outer circulating air duct, and configured to supply air to the outer circulating air duct. The heat dissipation efficiency of the inner circulating air duct is improved. | 2021-12-02 |
20210378154 | CONFORMAL HEAT PIPE ASSEMBLIES - A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate. | 2021-12-02 |
20210378155 | HEAT DISSIPATION FILM LAYER AND DISPLAY DEVICE HAVING THE SAME - A heat dissipation film layer and a display device having the heat dissipation film layer are disclosed. The heat dissipation film layer includes a first metal layer, a second metal layer, and a heat storage layer disposed between the first metal layer and the second metal layer. In the designed structure, heat generation of a display and temperature abnormality inside the display device are improved, and service life issues, arising from the display and other components due to excessive temperatures, are overcome. The design provides a proper temperature to increase comfort of holding the display device. | 2021-12-02 |
20210378156 | APPARATUS AND METHODS FOR PACKAGING ELECTRONIC COMPONENTS USING A TAPE HAVING DESICCANT ENTRAINED POLYMER ON A REEL - Disclosed is an apparatus. The apparatus includes a reel, a carrier tape wrapped about the reel and a cover tape disposed over the carrier tape. The cover tape and the carrier tape are configured to contain a plurality of electronic components, e.g., integrated circuits. At least one of the carrier tape and the cover tape is made of desiccant entrained polymer, or has desiccant entrained polymer provided on it. | 2021-12-02 |