49th week of 2019 patent applcation highlights part 71 |
Patent application number | Title | Published |
20190371726 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2019-12-05 |
20190371727 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-12-05 |
20190371728 | Integrated Circuitry, Memory Integrated Circuitry, And Methods Used In Forming Integrated Circuitry | 2019-12-05 |
20190371729 | PARASITIC CAPACITANCE REDUCTION IN GaN-ON-SILICON DEVICES | 2019-12-05 |
20190371730 | ELECTRONIC COMPONENTS FOR SOFT, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR | 2019-12-05 |
20190371731 | SEMICONDUCTOR PACKAGE | 2019-12-05 |
20190371732 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-12-05 |
20190371733 | WIRING STRUCTURE AND SEMICONDUCTOR DEVICE | 2019-12-05 |
20190371734 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2019-12-05 |
20190371735 | LOW RESISTANCE INTERCONNECT STRUCTURE WITH PARTIAL SEED ENHANCEMENT LINER | 2019-12-05 |
20190371736 | INTERCONNECT STRUCTURES WITH REDUCED CAPACITANCE | 2019-12-05 |
20190371737 | ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 2019-12-05 |
20190371738 | SEGMENTED SHIELDING USING WIREBONDS | 2019-12-05 |
20190371739 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2019-12-05 |
20190371740 | INTEGRATED MODULE WITH ELECTROMAGNETIC SHIELDING | 2019-12-05 |
20190371741 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | 2019-12-05 |
20190371742 | SEMICONDUCTOR DEVICE | 2019-12-05 |
20190371743 | GUARD RING STRUCTURES AND THEIR METHODS OF FABRICATION | 2019-12-05 |
20190371744 | MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGES | 2019-12-05 |
20190371745 | SEMICONDUCTOR MODULE | 2019-12-05 |
20190371746 | MATCHING CIRCUIT FOR INTEGRATED CIRCUIT DIE | 2019-12-05 |
20190371747 | LAUNCH STRUCTURES FOR RADIO FREQUENCY INTEGRATED DEVICE PACKAGES | 2019-12-05 |
20190371748 | SEMICONDUCTOR CHIP | 2019-12-05 |
20190371749 | METHODS OF FORMING AND OPERATING MICROELECTRONIC DEVICES INCLUDING DUMMY CHIPS | 2019-12-05 |
20190371750 | CARRIER-FOIL-ATTACHED ULTRA-THIN COPPER FOIL | 2019-12-05 |
20190371751 | SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME | 2019-12-05 |
20190371752 | FLUXES EFFECTIVE IN SUPPRESSING NON-WET-OPEN AT BGA ASSEMBLY | 2019-12-05 |
20190371753 | CHIPLETS WITH CONNECTION POSTS | 2019-12-05 |
20190371754 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2019-12-05 |
20190371755 | SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIATED SYSTEMS AND METHODS | 2019-12-05 |
20190371756 | SEMICONDUCTOR CHIP STACK AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP STACK | 2019-12-05 |
20190371757 | SEMICONDUCTOR DEVICE | 2019-12-05 |
20190371758 | BACK SIDE METALLIZATION | 2019-12-05 |
20190371759 | PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING SAME, AND PHYSICAL QUANTITY MEASUREMENT ELEMENT | 2019-12-05 |
20190371760 | SHIELDED ELECTRONIC COMPONENT PACKAGE | 2019-12-05 |
20190371761 | DIE PROCESSING | 2019-12-05 |
20190371762 | SEMICONDUCTOR DEVICE | 2019-12-05 |
20190371763 | DIE STACKING FOR MULTI-TIER 3D INTEGRATION | 2019-12-05 |
20190371764 | ELECTRONIC DEVICE | 2019-12-05 |
20190371765 | SYSTEMS AND METHODS FOR FLASH STACKING | 2019-12-05 |
20190371766 | INTEGRATED CIRCUIT DIE STACKS | 2019-12-05 |
20190371767 | INTERPOSER DESIGN IN PACKAGE STRUCTURES FOR WIRE BONDING APPLICATIONS | 2019-12-05 |
20190371768 | WHITE LIGHT EMITTING DIODE MODULE AND LIGHTING APPARATUS | 2019-12-05 |
20190371769 | LED UNIT | 2019-12-05 |
20190371770 | METHODS OF MAKING LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION | 2019-12-05 |
20190371771 | LIGHT EMITTING DIODE ARRAY STRUCTURE AND DISPLAY DEVICE | 2019-12-05 |
20190371772 | HIGH VOLTAGE SOLID-STATE TRANSDUCERS AND SOLID-STATE TRANSDUCER ARRAYS HAVING ELECTRICAL CROSS-CONNECTIONS AND ASSOCIATED SYSTEMS AND METHODS | 2019-12-05 |
20190371773 | SEMICONDUCTOR MODULE | 2019-12-05 |
20190371774 | Display Device | 2019-12-05 |
20190371775 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE | 2019-12-05 |
20190371776 | UNIPLANAR (SINGLE LAYER) PASSIVE CIRCUITRY | 2019-12-05 |
20190371777 | IMAGE DISPLAY DEVICE | 2019-12-05 |
20190371778 | MULTI-CHIP PACKAGING | 2019-12-05 |
20190371779 | METHOD OF MANUFACTURING DISPLAY MODULE USING LED | 2019-12-05 |
20190371780 | Hybrid Bonding with Uniform Pattern Density | 2019-12-05 |
20190371781 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2019-12-05 |
20190371782 | SEMICONDUCTOR DEVICES | 2019-12-05 |
20190371783 | INTEGRATED CIRCUIT FILLER AND METHOD THEREOF | 2019-12-05 |
20190371784 | METHOD AND SYSTEM OF MANUFACTURING CONDUCTORS AND SEMICONDUCTOR DEVICE WHICH INCLUDES CONDUCTORS | 2019-12-05 |
20190371785 | TRANSIENT VOLTAGE SUPPRESSION DEVICE | 2019-12-05 |
20190371786 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE | 2019-12-05 |
20190371787 | ELECTROSTATIC DISCHARGE CIRCUIT FOR CROSS DOMAIN ESD PROTECTION | 2019-12-05 |
20190371788 | ESD PROTECTION CIRCUIT | 2019-12-05 |
20190371789 | METHODS OF FORMING CIRCUIT-PROTECTION DEVICES | 2019-12-05 |
20190371790 | CIRCUIT-PROTECTION DEVICES | 2019-12-05 |
20190371791 | HIGH HOLDING HIGH VOLTAGE (HHHV) FET FOR ESD PROTECTION WITH MODIFIED SOURCE AND METHOD FOR PRODUCING THE SAME | 2019-12-05 |
20190371792 | MONOLITHIC SINGLE CHIP INTEGRATED RADIO FREQUENCY FRONT END MODULE CONFIGURED WITH SINGLE CRYSTAL ACOUSTIC FILTER DEVICES | 2019-12-05 |
20190371793 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-12-05 |
20190371794 | Power Semiconductor Device Having Different Channel Regions | 2019-12-05 |
20190371795 | Methods of Manufacturing Transistor Gate Structures by Local Thinning of Dummy Gate Stacks using an Etch Barrier | 2019-12-05 |
20190371796 | TRANSISTOR FINS WITH DIFFERENT THICKNESS GATE DIELECTRIC | 2019-12-05 |
20190371797 | METHOD AND STRUCTURE OF FORMING STRAINED CHANNELS FOR CMOS DEVICE FABRICATION | 2019-12-05 |
20190371798 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2019-12-05 |
20190371799 | MEMORY CELL, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2019-12-05 |
20190371800 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ANTENNA DIODES AND METHOD OF MAKING THEREOF | 2019-12-05 |
20190371801 | EFUSE | 2019-12-05 |
20190371802 | ANTI-FERROELECTRIC CAPACITOR MEMORY CELL | 2019-12-05 |
20190371803 | THREE-DIMENSIONAL MEMORY DEVICE WITH SEMICIRCULAR METAL-SEMICONDUCTOR ALLOY FLOATING GATE ELECTRODES AND METHODS OF MAKING THEREOF | 2019-12-05 |
20190371804 | HIGH-DENSITY FLASH MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-12-05 |
20190371805 | COMPACT NON-VOLATILE MEMORY DEVICE OF THE TYPE WITH CHARGE TRAPPING IN A DIELECTRIC INTERFACE | 2019-12-05 |
20190371806 | EMBEDDED SONOS WITH A HIGH-K METAL GATE AND MANUFACTURING METHODS OF THE SAME | 2019-12-05 |
20190371807 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SOURCE CONTACT TO BOTTOM OF VERTICAL CHANNELS OF AND METHOD OF MAKING THE SAME | 2019-12-05 |
20190371808 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE | 2019-12-05 |
20190371809 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | 2019-12-05 |
20190371810 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-12-05 |
20190371811 | SEMICONDUCTOR MEMORY | 2019-12-05 |
20190371812 | SEMICONDUCTOR MEMORY | 2019-12-05 |
20190371813 | SEMICONDUCTOR MEMORY | 2019-12-05 |
20190371814 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-12-05 |
20190371815 | Arrays Of Elevationally-Extending Strings Of Memory Cells Having A Stack Comprising Vertically-Alternating Insulative Tiers and Wordline Tiers and Horizontally-Elongated Trenches in the Stacks | 2019-12-05 |
20190371816 | Integrated Structures Comprising Vertical Channel Material and Having Conductively-Doped Semiconductor Material Directly Against Lower Sidewalls of the Channel Material, and Methods of Forming Integrated Structures | 2019-12-05 |
20190371817 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-12-05 |
20190371818 | SYSTEMS INCLUDING MEMORY CELLS ON OPPOSING SIDES OF A PILLAR | 2019-12-05 |
20190371819 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2019-12-05 |
20190371820 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2019-12-05 |
20190371821 | SEMICONDUCTOR DEVICE | 2019-12-05 |
20190371822 | Sub-Fin Removal for SOI Like Isolation with Uniform Active Fin Height | 2019-12-05 |
20190371823 | PHOTOSENSITIVE ELEMENT AND MANUFACTURING METHOD THEREOF | 2019-12-05 |
20190371824 | OXIDE SEMICONDUCTOR, THIN FILM TRANSISTOR, AND DISPLAY DEVICE | 2019-12-05 |
20190371825 | STACK STRUCTURE AND PREPARATION METHOD THEREOF | 2019-12-05 |