49th week of 2018 patent applcation highlights part 70 |
Patent application number | Title | Published |
20180350693 | SEMICONDUCTOR DEVICE AND METHOD | 2018-12-06 |
20180350694 | SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF | 2018-12-06 |
20180350695 | VERTICAL FIELD EFFECT TRANSISTOR (FET) WITH CONTROLLABLE GATE LENGTH | 2018-12-06 |
20180350696 | METHOD OF MANUFACTURING A CMOS TRANSISTOR | 2018-12-06 |
20180350697 | FINFET DEVICE WITH DIFFERENT LINERS FOR PFET AND NFET AND METHOD OF FABRICATING THEREOF | 2018-12-06 |
20180350698 | Semiconductor Device and Method of Forming the Semiconductor Device | 2018-12-06 |
20180350699 | Process Monitoring Of Deep Structures With X-Ray Scatterometry | 2018-12-06 |
20180350700 | PROCESS OF FORMING SEMICONDUCTOR SUBSTRATE | 2018-12-06 |
20180350701 | FLEXIBLE DISPLAY DEVICE | 2018-12-06 |
20180350702 | TIME TEMPERATURE MONITORING SYSTEM | 2018-12-06 |
20180350703 | LOW-COST PACKAGING FOR FLUIDIC AND DEVICE CO-INTEGRATION | 2018-12-06 |
20180350704 | HOUSING FOR AN OPTOELECTRONIC DEVICE, AND METHOD FOR PRODUCING SAME, AND LID FOR A HOUSING | 2018-12-06 |
20180350705 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2018-12-06 |
20180350706 | SYSTEM IN PACKAGE PROCESS FLOW | 2018-12-06 |
20180350707 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS | 2018-12-06 |
20180350708 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2018-12-06 |
20180350709 | ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER | 2018-12-06 |
20180350710 | SEMICONDUCTOR DEVICE, AND POWER MODULE | 2018-12-06 |
20180350711 | INVERSION-TYPE PACKAGE STRUCTURE FOR FLIP CHIP AND FLIP CHIP HAVING THE SAME | 2018-12-06 |
20180350712 | STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES | 2018-12-06 |
20180350713 | SEMICONDUCTOR DEVICE | 2018-12-06 |
20180350714 | POWER MODULE | 2018-12-06 |
20180350715 | POWER SEMICONDUCTOR CHIP MODULE | 2018-12-06 |
20180350716 | LID COVER SPRING DESIGN | 2018-12-06 |
20180350717 | RETAINER | 2018-12-06 |
20180350718 | THERMAL CONDUCTION STRUCTRURE AND MANUFACTURING METHOD THEREOF | 2018-12-06 |
20180350719 | SYSTEMS AND METHODS FOR OPTIMIZING INFORMATION HANDLING SYSTEM COMPONENT TEMPERATURE FOR PERFORMANCE | 2018-12-06 |
20180350720 | PEDESTAL SURFACE FOR MOSFET MODULE | 2018-12-06 |
20180350721 | HEAT SINK AND HEAT SINK ASSEMBLY | 2018-12-06 |
20180350722 | INTERCONNECT STRUCTURE HAVING SPACER DISPOSED ON SIDEWALL OF CONDUCTIVE LAYER, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR STRUCTURE | 2018-12-06 |
20180350723 | Semiconductor Structure and Method of Making the Same | 2018-12-06 |
20180350724 | SEMICONDUCTOR PACKAGES | 2018-12-06 |
20180350725 | Electronic Device With a Plurality of Component Carrier Packages Being Electrically and Mechanically Connected | 2018-12-06 |
20180350726 | SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS | 2018-12-06 |
20180350727 | PACKAGE WITH COMPONENT CONNECTED AT CARRIER LEVEL | 2018-12-06 |
20180350728 | Integrated Circuit Device with Plating on Lead Interconnection Point and Method of Forming the Device | 2018-12-06 |
20180350729 | METHOD AND FIXTURE FOR CHIP ATTACHMENT TO PHYSICAL OBJECTS | 2018-12-06 |
20180350730 | SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS | 2018-12-06 |
20180350731 | PACKAGE SUBSTRATE AND PACKAGE STRUCTURE | 2018-12-06 |
20180350732 | SMALL VIAS IN A POLYMER LAYER DISPOSED ON A SUBSTRATE | 2018-12-06 |
20180350733 | THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE | 2018-12-06 |
20180350734 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2018-12-06 |
20180350735 | METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE USING GANGED CONDUCTIVE CONNECTIVE ASSEMBLY AND STRUCTURE | 2018-12-06 |
20180350736 | NON-PLANAR METAL-INSULATOR-METAL CAPACITOR FORMATION | 2018-12-06 |
20180350737 | LOCALIZED HIGH DENSITY SUBSTRATE ROUTING | 2018-12-06 |
20180350738 | Interconnect Structure and Methods Thereof | 2018-12-06 |
20180350739 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | 2018-12-06 |
20180350740 | SEMICONDUCTOR PACKAGE DEVICES INTEGRATED WITH INDUCTOR | 2018-12-06 |
20180350741 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2018-12-06 |
20180350742 | Integrated Circuit Structures Comprising Conductive Vias And Methods Of Forming Conductive Vias | 2018-12-06 |
20180350743 | STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT | 2018-12-06 |
20180350744 | FIELD-EFFECT TRANSISTOR, METHOD OF MANUFACTURING THE SAME, AND RADIO-FREQUENCY DEVICE | 2018-12-06 |
20180350745 | CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME | 2018-12-06 |
20180350746 | Rectangular semiconductor package and a method of manufacturing the same | 2018-12-06 |
20180350747 | FAN-OUT SEMICONDUCTOR DEVICE | 2018-12-06 |
20180350748 | ELECTRICAL INTERCONNECT FOR A FLEXIBLE ELECTRONIC PACKAGE | 2018-12-06 |
20180350749 | SEMICONDUCTOR DEVICE INCLUDING SUPERCONDUCTING METAL THROUGH-SILICON-VIAS AND METHOD OF MANUFACTURING THE SAME | 2018-12-06 |
20180350750 | OVERLAY MARK | 2018-12-06 |
20180350751 | MICROELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING | 2018-12-06 |
20180350752 | SEMICONDUCTOR DEVICE | 2018-12-06 |
20180350753 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-12-06 |
20180350754 | Thermal Interface Material Having Different Thicknesses In Packages | 2018-12-06 |
20180350755 | Thermal Interface Material Having Different Thicknesses in Packages | 2018-12-06 |
20180350756 | Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices | 2018-12-06 |
20180350757 | TAMPER-PROOF ELECTRONIC PACKAGES WITH STRESSED GLASS COMPONENT SUBSTRATE(S) | 2018-12-06 |
20180350758 | Semiconductor Package with Integrated Harmonic Termination Feature | 2018-12-06 |
20180350759 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2018-12-06 |
20180350760 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2018-12-06 |
20180350761 | Semiconductor Device with Metal Structure Electrically Connected to a Conductive Structure | 2018-12-06 |
20180350762 | MERGED POWER PAD FOR IMPROVING INTEGRATED CIRCUIT POWER DELIVERY | 2018-12-06 |
20180350763 | Semiconductor Structure and Method of Forming | 2018-12-06 |
20180350764 | PACKAGING DEVICE AND METHOD OF MAKING THE SAME | 2018-12-06 |
20180350765 | SEMICONDUCTOR PACKAGE STRUCTURE WITH CONDUCTIVE LINE AND METHOD FOR FORMING THE SAME | 2018-12-06 |
20180350766 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE | 2018-12-06 |
20180350767 | BALL GRID ARRAY SOLDER ATTACHMENT | 2018-12-06 |
20180350768 | Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection | 2018-12-06 |
20180350769 | ANISOTROPIC CONDUCTIVE BONDING MEMBER, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 2018-12-06 |
20180350770 | Integrated Fan-Out Package Structures with Recesses in Molding Compound | 2018-12-06 |
20180350771 | Packaged Semiconductor Devices and Packaging Methods | 2018-12-06 |
20180350772 | MICROELECTRONIC DEVICES DESIGNED WITH EFFICIENT PARTITIONING OF HIGH FREQUENCY COMMUNICATION DEVICES INTEGRATED ON A PACKAGE FABRIC | 2018-12-06 |
20180350773 | DIE AND PACKAGE, AND MANUFACTURING METHOD FOR DIE AND PRODUCING METHOD FOR PACKAGE | 2018-12-06 |
20180350774 | STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH REDISTRIBUTION LAYERS | 2018-12-06 |
20180350775 | 3D Chip Sharing Clock Interconnect Layer | 2018-12-06 |
20180350776 | MEMORY DEVICES WITH CONTROLLERS UNDER MEMORY PACKAGES AND ASSOCIATED SYSTEMS AND METHODS | 2018-12-06 |
20180350777 | SEMICONDUCTOR DEVICE | 2018-12-06 |
20180350778 | Singulation and Bonding Methods and Structures Formed Thereby | 2018-12-06 |
20180350779 | SEMICONDUCTOR PACKAGE | 2018-12-06 |
20180350780 | An Electronic Device Package | 2018-12-06 |
20180350781 | SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARRIER DIODE | 2018-12-06 |
20180350782 | DISPLAY DEVICE AND METHOD FOR FORMING THE SAME | 2018-12-06 |
20180350783 | LED MODULE AND METHOD FOR FABRICATING THE SAME | 2018-12-06 |
20180350784 | Package Structure and Method of Forming the Same | 2018-12-06 |
20180350785 | THREE DIMENSIONAL INTEGRATED CIRCUIT | 2018-12-06 |
20180350786 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME | 2018-12-06 |
20180350787 | DISPLAY UNIT, DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY UNIT | 2018-12-06 |
20180350788 | DEVICE INCLUDING AT LEAST ONE OPTOELECTRONIC SEMICONDUCTOR COMPONENT | 2018-12-06 |
20180350789 | MULTI-PHASE POWER CONVERTER WITH COMMON CONNECTIONS | 2018-12-06 |
20180350790 | CAPACITOR | 2018-12-06 |
20180350791 | SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR | 2018-12-06 |
20180350792 | SEMICONDUCTOR DEVICE | 2018-12-06 |