49th week of 2021 patent applcation highlights part 79 |
Patent application number | Title | Published |
20210385969 | WATER-COOLING GRID - The utility model discloses a water-cooling grid, and relates to the technical field of radiators. The water-cooling grid includes a water pump component, a first liquid pipe, a lower water tank, an upper water tank, second liquid pipes and fins. The utility model mainly solves the problem that a water-cooling head is extremely large in volume, and can effectively reduce the volume of the water-cooling head and avoid occupation of the space. | 2021-12-09 |
20210385970 | LEAK SENSOR DRIP TRAY - Systems and methods are provided for a leak sensor drip tray. In some embodiments, an Information Handling System (IHS) may include: a component; a cold plate disposed above the component; a leak sensor board disposed above the cold plate; and a drip tray disposed above the leak sensor, wherein the drip tray is configured to capture a fluid leak from a fitting coupled to the cold plate. | 2021-12-09 |
20210385971 | SYSTEM DEVICE AGGREGATION IN A LIQUID COOLING ENVIRONMENT - Examples described herein relate to a system. The system can include a container that contains fluid to provide two phase immersion liquid cooling (2PILC) for a system within the container. The container can enclose a first circuit board with a first side of the first circuit board is conductively coupled to at least one device. The container can enclose a motherboard conductively coupled to a second side of the first circuit board with a first side of the motherboard is conductively coupled to the second side of the first circuit board. The motherboard can include at least four edges. Connectors can conductively connect the motherboard with a second circuit board. The second circuit board can include at least four edges and an edge of the motherboard is oriented approximately 90 degrees to an edge of the second circuit board. At least one device can include one or more of: a processor, memory device, accelerator device, or network interface. | 2021-12-09 |
20210385972 | FLUID HEAT DISSIPATION DEVICE - A fluid heat dissipation device is provided. The fluid heat dissipation device includes a heat sink body and a plurality of pasting elements. The heat sink body is a porous structure, and pores of the heat sink body are configured to enable the heat sink body to absorb a working fluid that can be liquid or gas. The pasting elements are fixed on a first surface of the heat sink body. The pasting elements include polymer materials and are sheet-like colloids. The heat sink body is fixedly attached onto an outer surface of an electronic device through the pasting elements. A thickness gap of the pasting element is a vaporization chamber, and the working fluid in the pores can absorb heat from the electronic device and then be vaporized to remove heat through the heat sink body. | 2021-12-09 |
20210385973 | LOOP HEAT PIPE FOR LOW VOLTAGE DRIVES - A loop heat pipe includes: an evaporator having an enclosure with a heat receiving side and side walls with openings forming an evaporator chamber, the evaporator chamber including a primary capillary structure adjacent to the heat receiving side of the enclosure and extending to the side walls of the evaporator chamber, a plurality of grooves in the primary capillary structure, each of which extends from an opening in one of the side walls to an opening in an opposite side wall, the plurality of grooves transporting vapor from the primary capillary structure to the openings; and a condenser. | 2021-12-09 |
20210385974 | Enclosure for Providing Liquid Film Cooling - An enclosure for providing liquid film cooling to heat generating components includes a chassis, a sump, a first pump, a plumbing system, tube plates, and a heat exchanger. The chassis includes cassettes that hold one or more heat generating components. The sump stores a liquid to be supplied to the heat generating components. The first pump draws the liquid from the sump and supplies the liquid to the tube plates through the plumbing system. Each tube plate is positioned between two cassettes to deliver the liquid to the heat generating components. The tube plates directly spray the liquid onto the heat generating components by way of nozzles embedded on the tube plates. The liquid is evaporated into vapors upon contact with the plurality of heat generating components. The heat exchanger condenses the vapors into condensed liquid upon contact. The condensed liquid is collected in the sump to be re-circulated. | 2021-12-09 |
20210385975 | HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE - An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines. | 2021-12-09 |
20210385976 | ELECTRONIC EQUIPMENT ENCLOSURE - An electronic equipment enclosure includes a frame structure and a customizable side air dam kit. The frame structure includes a front frame, a rear frame, front-to-back frame members connecting corners of the front and rear frames together, reinforced bracket structures located near ends of the cross members, and extruded horizontal mounting rails parallel to, but inward from, the front-to-back frame members. The ends of the horizontal mounting rails are connected to the reinforced bracket structures. Panels are installed in longitudinal slots in the front-to-back frame members and horizontal mounting rails, each of which is extruded. The customizable side air dam kit includes a framework of horizontal and vertical frame pieces, adapted to connect to the frame structure, and a customizable air dam panel supported by the framework. A plurality of the frame pieces are provided to an installer for use in constructing the framework to fit the specific frame structure. | 2021-12-09 |
20210385977 | MODULAR THERMOELECTRIC-BASED COOLING DEVICE FOR HETEROGENEOUS PACKAGES - A cooling device for a heterogeneous microchip is fabricated such that different cooling profiles can be provided for different chips. A housing is made of thermal conductive material, the housing having a plurality of channels formed therein. Electric contacts are provided inside each of the channels. Each channel can fit either a thermoelectric cooling device or a metallic block to provide different cooling profiles and design requirements. The cooling device is inserted between a liquid cooling plate and the chip to adjust and enhance heat transfer from the chip to the cooling plate. Alternatively, the cooling plate itself can serve as the housing with the channels, in which case the housing is provided with coupling for liquid pipes or hoses. | 2021-12-09 |
20210385978 | LIQUID DISTRIBUTION FOR ELECTRONIC RACKS - According to one embodiment, a liquid distribution system includes a main liquid supply and return unit, a mounting rail that extends along at least a portion of a height of the electronic rack, and a connecting unit that is slidably coupled to the mounting rail and is coupled to the main liquid supply and return unit via a flexible supply line and a flexible return line, the connecting unit is arranged to couple to a piece of information technology (IT) equipment to circulate coolant from the main liquid supply and return unit through the piece of IT equipment to create a heat-transfer loop that transfers thermal energy away from the piece of IT equipment and into the coolant. | 2021-12-09 |
20210385979 | PASSIVE CONTROL VALVE AND SYSTEM FOR REGULATING FLOW OF FLUID TO A HEAT SOURCE IN A COMPUTER PROCESSOR SYSTEM IN RESPONSE TO THE TEMPERATURE OF THE SOURCE, AND METHOD - A method of cooling or heating a plurality of computer processor heat sources, such as processors in a data center or the like, is disclosed with individual sources having a control valve associated therewith. Individual heat sources are in communication with a supply of a coolant fluid and individual control valves have an inlet for receiving coolant fluid from its respective computer processor heat source reflective of the heat source temperature. The control valve has a chamber with an inlet that receives coolant, and an outlet. A valve member within the chamber is movable in response to changes in temperature of the coolant fluid within the chamber between a closed position and an open position. The valve member is of a material that changes shape in response to changes in temperature. The coolant is carbon dioxide (CO | 2021-12-09 |
20210385980 | CONVERTER HAVING A SEPARATE INTERIOR - A converter includes a housing having a first interior and a second interior. The first interior is arranged separately from the second interior. Part of the first interior protrudes into the second interior and forms a heat-exchanger duct. A gaseous heat flow circuit is established within the first interior and flows in through an inlet opening of the heat-exchanger duct and flows out through an outlet opening of the heat-exchanger duct. The second interior forms a cooling duct. A gaseous cooling flow flowing through the cooling duct is established and flows around the heat-exchanger duct. The cooling duct is arranged in a region of overlap with the heat-exchanger duct in such a way that a first flow direction of the gaseous heat flow circuit runs substantially perpendicularly or parallel to a second flow direction of the gaseous cooling flow. | 2021-12-09 |
20210385981 | THERMOELECTRIC COOLERS FOR ELECTRONICS COOLING - An apparatus for cooling electronic components includes a chassis having a hot side compartment having one or more first electrical components and a cold side compartment having one or more second electrical components. A coolant channel is connected to the cold side compartment. At least one thermoelectric cooler (TEC) is positioned within the cold side compartment. The TEC has a cold plate and a hot plate, the hot plate being connected to the coolant channel and the cold plate being connected to the one or more second electrical components. A method for cooling electronic components using at least one TEC includes identifying an amount of heat to be removed from the one or more second electronic components and determining the TEC with the peak performance based on a best Delta T. The method includes monitoring the Delta T and adjusting the input voltage to maintain the optimum Delta T. | 2021-12-09 |
20210385982 | APPARATUS FOR USE IN ELECTRONIC EQUIPMENT - Apparatus for use in electronic equipment includes a cap of nonconductive material positioned to collect and retain metallic particles produced by installation of metallic fasteners during assembly of the electronic equipment. | 2021-12-09 |
20210385983 | ELECTROMAGNETIC INTERFERENCE SHIELDS - The present disclosure relates to an electromagnetic interference shield. The electromagnetic interference shield comprises a composite film that comprises a first carbon layer comprising an electrically conducting carbon material; a second carbon layer comprising an electrically conducting carbon material; and a porous layer between the first carbon layer and second carbon layer. | 2021-12-09 |
20210385984 | MULTIFUNCTIONAL FLEXIBLE LAMINATES, RELATED ARTICLES, AND METHODS - The present disclosure is directed to a multifunctional flexible laminate, an electronic device comprising the multifunctional flexible laminate, and methods for making and using the multifunctional flexible laminate in the electronic device. | 2021-12-09 |
20210385985 | Phalaenopsis plant named 'CLIFFHANGER' - A new and distinct cultivar of | 2021-12-09 |
20210385986 | PHALAENOPSIS PLANT NAMED 'GALLERY PLAY' - A new and distinct cultivar of | 2021-12-09 |
20210385987 | PHALAENOPSIS PLANT NAMED 'IMPULSIVE' - A new and distinct cultivar of | 2021-12-09 |
20210385988 | PHALAENOPSIS PLANT NAMED 'PRECIOUS LOVE' - A new and distinct cultivar of | 2021-12-09 |
20210385989 | PHALAENOPSIS PLANT NAMED 'STRANGE MAGIC' - A new and distinct cultivar of | 2021-12-09 |
20210385990 | PHALAENOPSIS PLANT NAMED 'FORBIDDEN FRUIT' - A new and distinct cultivar of | 2021-12-09 |
20210385991 | PHALAENOPSIS PLANT NAMED 'GRAND DESSERT' - A new and distinct cultivar of | 2021-12-09 |
20210385992 | PHALAENOPSIS PLANT NAMED 'SECRET MESSAGES' - A new and distinct cultivar of | 2021-12-09 |
20210385993 | PHALAENOPSIS PLANT NAMED 'SPEECHLESS ELEGANCE' - A new and distinct cultivar of | 2021-12-09 |
20210385994 | PHALAENOPSIS PLANT NAMED 'TRUE HERO' - A new and distinct cultivar of | 2021-12-09 |
20210385995 | PHALAENOPSIS PLANT NAMED 'GOOD KARMA' - A new and distinct cultivar of | 2021-12-09 |
20210385996 | PHALAENOPSIS PLANT NAMED 'GYPSY KISS' - A new and distinct cultivar of | 2021-12-09 |
20210385997 | PHALAENOPSIS PLANT NAMED 'FIERY FLAMES' - A new and distinct cultivar of | 2021-12-09 |
20210385998 | PHALAENOPSIS PLANT NAMED 'PURE LOVE' - A new and distinct cultivar of | 2021-12-09 |
20210385999 | Phalaenopsis plant named 'SANDMAN' - A new and distinct cultivar of | 2021-12-09 |
20210386000 | PHALAENOPSIS PLANT NAMED 'MOONLIGHT SERENADE' - A new and distinct cultivar of | 2021-12-09 |
20210386001 | x DORITAENOPSIS PLANT NAMED 'FRUIT PUNCH' - A new and distinct cultivar of | 2021-12-09 |
20210386002 | x DORITAENOPSIS PLANT NAMED 'LADIES DAY' - A new and distinct cultivar of | 2021-12-09 |
20210386003 | x DORITAENOPSIS PLANT NAMED 'LADY FANTASY' - A new and distinct cultivar of | 2021-12-09 |
20210386004 | x DORITAENOPSIS PLANT NAMED 'UNTOLD STORIES' - A new and distinct cultivar of | 2021-12-09 |
20210386005 | BEGONIA PLANT NAMED 'BeTesnogat' - A new and distinct cultivar of | 2021-12-09 |
20210386006 | BEGONIA PLANT NAMED 'BeTesorang' - A new and distinct cultivar of | 2021-12-09 |