50th week of 2011 patent applcation highlights part 36 |
Patent application number | Title | Published |
20110306187 | METHOD AND APPARATUS FOR SILICON REFINEMENT - A method and respect material for the production of chlorosilanes (primarily: trichlorosilane) and the deposition of high purity poly-silicon from these chlorosilanes. The source for the chlorosilane production consists of eutectic or hypo-eutectic copper-silicon, the concentration range of said copper-silicon is between 10 and 16 wt % silicon. The eutectic or hypo-eutectic copper-silicon is cast in a shape suitable for a chlorination reactor, where it is exposed to a process gas, which consists, at least partially, of HCl. The gas reacts at the surface of the eutectic or hypo-eutectic copper-silicon and extracts silicon in the form of volatile chlorosilane. The depleted eutectic or hypo-eutectic material might be afterwards recycled in such a way that the amount of extracted silicon is replenished and the material is re-cast into the material shape desired. | 2011-12-15 |
20110306188 | MANUFACTURING METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE - In a manufacturing method of a silicon carbide semiconductor device, a semiconductor substrate made of single crystal silicon carbide is prepared, an amorphous layer is formed on a portion of the semiconductor substrate where an electrode is to be formed, a metal layer is formed on the amorphous layer, and the electrode including the metal layer and a silicide layer is formed by irradiating the metal layer with a laser light in such a manner that a part of the metal layer reacts with the amorphous layer and forms the silicide layer. | 2011-12-15 |
20110306189 | METHOD FOR ETCHING AND FILLING DEEP TRENCHES - A method of etching and tilling deep trenches is disclosed, which includes: forming an ONO(oxide-nitride-oxide) sandwich layer on a semiconductor substrate; forming deep trenches by using top oxide of the sandwich layer as a stop layer; removing the top oxide and middle SiN of the sandwich layer; tilling the deep trenches with epitaxial film or polysilicon film; polishing the wafer to get a planarized surface by stopping at the surface of the bottom oxide layer; removing the bottom oxide layer. | 2011-12-15 |
20110306190 | Method for producing n-type Group III nitride semicondutor - The present invention provides a method for producing an n-type Group III nitride semiconductor product having a high Si concentration and exhibiting favorable crystallinity. In the production method, specifically, an AlN buffer layer is formed on a sapphire substrate by MOCVD, and then a first layer (thickness: 2 μm) is formed from undoped GaN on the buffer layer by MOCVD at 1,140° C. Subsequently, a second layer (thickness: 200 nm) is formed from SiO | 2011-12-15 |
20110306191 | METHOD OF MANUFACTURING SUPER-JUNCTION SEMICONDUCTOR DEVICE - A method of manufacturing a super-junction semiconductor device facilitates increasing the epitaxial growth rate without increasing the manufacturing steps greatly. In substitution for the formation of alignment mark in the surfaces of the second and subsequent non-doped epitaxial layers, patterning for forming a new alignment mark is conducted simultaneously with the resist pattering for selective ion-implantation into the second and subsequent non-doped epitaxial layers in order to form the new alignment mark at a position different from the position, at which the initial alignment mark is formed, and to form the new alignment mark in every one or more repeated epitaxial layer growth cycles. | 2011-12-15 |
20110306192 | METHOD FOR FORMING IMPURITY REGION OF VERTICAL TRANSISTOR AND METHOD FOR FABRICATING VERTICAL TRANSISTOR USING THE SAME - A method for forming an impurity region of a vertical transistor includes forming an impurity ion junction region within a semiconductor substrate, and forming a trench by etching the semiconductor substrate in which the impurity ion junction region is formed. The etching process is performed to remove a portion of the impurity ion junction region, so that a remaining portion of the impurity ion junction region is exposed to a lower side wall of the trench to serve as a buried bit line junction region. | 2011-12-15 |
20110306193 | SYSTEM AND METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES BY THE IMPLANTATION OF CARBON CLUSTERS - A process is disclosed which incorporates implantation of a carbon cluster into a substrate to improve the characteristics of transistor junctions when the substrates are doped with Boron and Phosphorous in the manufacturing of PMOS transistor structures in integrated circuits. There are two processes which result from this novel approach: ( | 2011-12-15 |
20110306194 | FABRICATION METHOD OF SELF-ALIGNED TRENCHED POWER SEMICONDUCTOR STRUCTURE - A fabrication method of a self-aligned power semiconductor structure is provided. Firstly, a trenched polysilicon gate is formed in a silicon substrate. Then, a self-aligned polysilicon extending structure is formed on the trenched polysilicon gate. A width of the self-aligned polysilicon extending structure is smaller than that of the trenched polysilicon gate. Thereafter, the self-aligned polysilicon extending structure is oxidized to form a silicon oxide protruding structure on the trenched polysilicon gate. Then, a first spacer is formed on a sidewall of the silicon oxide protruding structure to define a source contact window. | 2011-12-15 |
20110306195 | METHOD OF MANUFACTURING VERTICAL SEMICONDUCTOR DEVICES - In a vertical semiconductor device and a method of manufacturing a vertical semiconductor device, sacrificial layers and insulating interlayers are repeatedly and alternately stacked on a substrate. The sacrificial layers include boron (B) and nitrogen (N) and have an etching selectivity with respect to the insulating interlayers. Semiconductor patterns are formed on the substrate through the sacrificial layers and the insulating interlayers. The sacrificial layers and the insulating interlayers are at least partially removed between the semiconductor patterns to form sacrificial layer patterns and insulating interlayer patterns on sidewalls of the semiconductor patterns. The sacrificial layer patterns are removed to form grooves between the insulating interlayer patterns. The grooves expose portions of the sidewalls of the semiconductor patterns. A gate structure is formed in each of the grooves. | 2011-12-15 |
20110306196 | METHOD TO FORM A SEMICONDUCTOR DEVICE HAVING GATE DIELECTRIC LAYERS OF VARYING THICKNESS - A method for fabricating an integrated circuit device is disclosed which includes providing a substrate having first, second, and third regions; and forming first, second, and third gate structures in the first, second, and third regions, respectively. The first, second, and third gate structures include a gate dielectric layer, the gate dielectric layer being a first thickness in the first gate structure, a second thickness in the second gate structure, and a third thickness in the third gate structure. Forming the gate dielectric layer of the first, second, and third thicknesses can include forming an etching barrier layer over the gate dielectric layer in at least one of the first, second, or third regions while forming the first, second, and third gate structures, and/or prior to forming the gate dielectric layer in at least one of the first, second, or third regions, performing an implantation process on the at least one region. | 2011-12-15 |
20110306197 | Methods of Manufacturing Semiconductor Devices - Method of manufacturing semiconductor device are provided including forming an insulation layer having a pad on a substrate; forming an etch stop layer on the insulation layer and the pad; forming a mold structure having at least one mold layer on the etch stop layer; forming a first supporting layer on the mold structure; etching the first supporting layer and the mold structure to form a first opening exposing the etch stop layer; forming a spacer on a sidewall of the first opening; etching the etch stop layer using the spacer as an etching mask to form a second opening, different from the first opening, exposing a first portion of the pad having a first associated area; etching the etch stop layer using the spacer as an etching mask to form a third opening exposing a second portion of the pad having a second associated area, the second associated area being larger than the first associated area; and etching the mold structure to form a fourth opening having a width larger than a width of the third opening. | 2011-12-15 |
20110306198 | METHOD OF FABRICATING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A method of fabricating a semiconductor integrated circuit device includes forming a gate pattern on a semiconductor substrate, the gate pattern having a gate insulation film and a gate electrode. A spacer is formed on sidewalls of the gate pattern. A silicide layer is formed by a silicide process on at least one portion of the semiconductor substrate exposed by the gate pattern and the spacer, the silicide layer being formed using a silicide process. A stress buffer layer is formed on a resultant structure having the silicide layer. A stress film is formed on the stress buffer layer. | 2011-12-15 |
20110306199 | METHOD FOR MANUFACTURING NONVOLATILE MEMORY DEVICE - According to one embodiment, a method is disclosed for manufacturing a nonvolatile memory device. The nonvolatile memory device includes a memory cell connected to a first interconnect and a second interconnect. The method can include forming a first electrode film on the first interconnect. The method can include forming a layer including a plurality of carbon nanotubes dispersed inside an insulator on the first electrode film. At least one carbon nanotube of the plurality of carbon nanotubes is exposed from a surface of the insulator. The method can include forming a second electrode film on the layer. In addition, the method can include forming a second interconnect on the second electrode film. | 2011-12-15 |
20110306200 | METHODS FOR FORMING INTERCONNECT STRUCTURES - Methods for forming interconnect structures are provided herein. In some embodiments, a method for forming an interconnect on a substrate may include depositing a material atop an upper surface of the substrate and atop one or more surfaces of a feature disposed in the substrate by a first deposition process that deposits the material at a faster rate on the upper surface than on a bottom surface of the feature; depositing the material atop the upper surface of the substrate and atop one or more surfaces of the feature by a second deposition process that deposits the material at a greater rate on the bottom surface of the feature than on the upper surface of the substrate; and heating the deposited material to draw the deposited material towards the bottom surface of the feature to at least partially fill the feature with the deposited material. | 2011-12-15 |
20110306201 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device includes a first metal layer provided above a semiconductor substrate, an interlayer insulating film provided above the first metal layer, a second metal layer that is provided in an opening formed in the interlayer insulating film and is in contact with an underlying layer, the second metal layer being connected to the first metal layer, and a first barrier layer that is provided between the second metal layer and the interlayer insulating film and has a different main composition from that of the underlying layer. | 2011-12-15 |
20110306202 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device includes: forming a plurality of photoresist patterns over a substrate structure; forming an insulation layer for a spacer over a structure including the photoresist patterns; forming a plurality of spacers on sidewalls of the photoresist patterns by anisotropically etching the insulation layer, and forming a first opening through the insulation layer; and forming second openings in the insulation layer to expose the substrate structure. | 2011-12-15 |
20110306203 | INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING A DAMASCENE STRUCTURE - An interconnect structure is provided, including a layer of dielectric material having at least one opening and a first barrier layer on sidewalls defining the opening. A ruthenium-containing second barrier layer overlays the first barrier layer, the second barrier layer having a ruthenium zone, a ruthenium oxide zone, and a ruthenium-rich zone. The ruthenium zone is interposed between the first barrier layer and the ruthenium oxide zone. The ruthenium oxide zone is interposed between the ruthenium zone and the ruthenium-rich zone. | 2011-12-15 |
20110306204 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE - A fabricating method of a semiconductor device includes forming an interlayer insulation layer on a substrate, the interlayer insulation layer including a storage node contact plug, forming an etch stop layer on the interlayer insulation layer, the etch stop layer including a silicon layer or a silicon germanium layer, forming a molding insulation layer on the etch stop layer, forming a hole in the molding insulation layer by selectively etching the molding insulation layer until a portion of the etch stop layer is exposed, forming a first conductive layer conformally on an inner surface of the hole and on a top surface of the molding insulation layer, and forming a metal silicide pattern in a predetermined area of the etch stop layer exposed by the molding insulation layer by annealing the first conductive layer and the etch stop layer. | 2011-12-15 |
20110306205 | Semiconductor Device and Method of Fabricating the Same - Methods of forming a semiconductor device include providing a substrate having an area including a source and a drain region of a transistor. A nickel (Ni) metal film is formed on the substrate area including the source and the drain region. A first heat-treatment process is performed including heating the substrate including the metal film from a first temperature to a second temperature at a first ramping rate and holding the substrate including the metal film at the second temperature for a first period of time. A second heat-treatment process is then performed including heating the substrate including the metal film from a third temperature to a fourth temperature at a second ramping rate and holding the substrate at the fourth temperature for a second period of time. The fourth temperature is different from the second temperature and the second period of time is different from the first period of time. The sequentially performed first and second heat-treatment processes convert the Ni metal layer on the source and drain regions into a NiSi layer on the source and drain regions and a NiSi | 2011-12-15 |
20110306206 | Methods Of Forming Contact Openings And Methods Of Increasing Contact Area In Only One Of X and Y Axes In The Fabrication Of Integrated Circuitry - A method of forming contact openings in the fabrication of integrated circuitry includes forming a mask which includes at least one of photoresist and amorphous carbon received over a plurality of spaced conductive line constructions. The conductive line constructions include insulative caps and insulative sidewalls. The mask includes a plurality of spaced lines and trench spaces between adjacent of the spaced lines. The spaced lines and the trench spaces angle relative to the conductive line constructions. The trench spaces are received over node locations which are received between adjacent of the conductive line constructions. The at least one of photoresist and amorphous carbon is treated with a plasma to reduce lateral width of the spaced lines and to increase lateral width of the trench spaces. After the treating, contact openings are etched to the node locations selectively relative to the insulative caps and the insulative sidewalls. | 2011-12-15 |
20110306207 | METHOD OF FABRICATING METAL-BEARING INTEGRATED CIRCUIT STRUCTURES HAVING LOW DEFECT DENSITY - A method of fabricating metal-bearing structures in an integrated circuit such as metal-polysilicon capacitors using conductive metal compounds. Defects due to organometallic polymers formed during the etch of a hard mask material are minimized by using a process that includes a plasma etch for the hard mask that achieves a predominantly chemical character using a fluorine-based etch chemistry. Using a low-temperature liquid-phase strip of the hard mask photoresist instead of an ash prevents further cross-linking of polymers formed during the plasma etch. Etching the metal-bearing material using a hot fully-concentrated mixture of ammonium hydroxide and hydrogen peroxide allows short etch times that are particularly shortened for tantalum nitride films deposited with a nitrogen concentration of about 30 percent or greater. | 2011-12-15 |
20110306208 | Method for Fabricating Semiconductor Device - Methods for forming a mold for a storage electrode in a semiconductor device include forming an interlayer dielectric layer including a contact plug on a substrate. A first mold dielectric layer is formed of a first material on the interlayer dielectric layer. A second mold dielectric layer is formed of a second material on the first mold dielectric layer. The second material has a different etch selectivity than the first material. A first opening is formed that penetrates the first and second mold dielectric layers. The first opening is dry etched to define a second opening having a larger width in the first mold dielectric layer than in the second mold dielectric layer based on the different etch selectivity of the first and second mold dielectric layers to define the mold for the storage electrode. | 2011-12-15 |
20110306209 | GROUP III NITRIDE SUBSTRATE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED GROUP III NITRIDE SUBSTRATE - A group III nitride substrate in one embodiment has a surface layer. The surface layer contains 3 at. % to 25 at. % of carbon and 5×10 | 2011-12-15 |
20110306210 | Method for cleaning substrates utilizing surface passivation and/or oxide layer growth to protect from pitting - A process/method for cleaning wafers that eliminates and/or reduces pitting caused by standard clean 1 by performing a pre-etch and then passivating the wafer surface prior to the application of the standard clean 1. The process/method may be especially useful for advanced front end of line post-CPM cleaning. In one embodiment, the invention is a method of processing a substrate comprising: a) providing at least one substrate; b) etching a surface of the substrate by applying an etching solution; c) passivating the etched surface of the substrate by applying ozone; and d) cleaning the passivated surface of the substrate by applying an aqueous solution comprising ammonium hydroxide and hydrogen peroxide. | 2011-12-15 |
20110306211 | Stabilized Chemical Mechanical Polishing Composition And Method Of Polishing A Substrate - A chemical mechanical polishing composition, comprising, as initial components: water; 0.1 to 40 wt % abrasive having an average particle size of 5 to 150 nm; 0.001 to 1 wt % of an adamarityl substance according to formula (II); 0 to 1 wt % diquaternary substance according to formula (I); and, 0 to 1 wt % of a quaternary ammonium compound. Also, provided is a method for chemical mechanical polishing using the chemical mechanical polishing composition. | 2011-12-15 |
20110306212 | SUBSTRATE PROCESSING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SUBSTRATE MANUFACTURING METHOD - Embodiments described herein relate to a substrate processing apparatus includes a reaction tube, a processing chamber provided inside the reaction tube to process a substrate therein, an induction target provided inside the reaction tube to surround the processing chamber and configured to heat the substrate, a heat insulator provided inside the reaction tube to surround the induction target, an induction target provided outside the reaction tube to inductively heat at least the induction target, a first gas supply unit for supplying a first gas into the processing chamber, and a second gas supply unit for supplying a second gas to a first gap provided between the induction target and the heat insulator. | 2011-12-15 |
20110306213 | OZONE PLENUM AS UV SHUTTER OR TUNABLE UV FILTER FOR CLEANING SEMICONDUCTOR SUBSTRATES - A quartz window with an interior plenum is operable as a shutter or UV filter in a degas chamber by supplying the plenum with an ozone-containing gas. Pressure in the plenum can be adjusted to block UV light transmission into the degas chamber or adjust transmittance of UV light through the window. When the plenum is evacuated, the plenum allows maximum transmission of UV light into the degas chamber. | 2011-12-15 |
20110306214 | Method of selectively etching an insulation stack for a metal interconnect - A method of patterning an insulation layer is described. The method includes preparing a film stack on a substrate, wherein the film stack comprises a cap layer, a SiCOH-containing layer overlying the cap layer, and a hard mask overlying the SiCOH-containing layer. The method further includes transferring a pattern through the film stack by performing a series of etch processes in a plasma etching system, wherein the series of etch processes utilize a temperature controlled substrate holder in the plasma etching system according to a substrate temperature control scheme that achieves etch selectivity between the SiCOH-containing layer and the underlying cap layer. | 2011-12-15 |
20110306215 | METHODS OF PROCESSING SUBSTRATES HAVING METAL MATERIALS - Methods of processing substrates having metal layers are provided herein. In some embodiments, a method of processing a substrate comprising a metal layer having a patterned mask layer disposed above the metal layer, the method may include etching the metal layer through the patterned mask layer; and removing the patterned mask layer using a first plasma formed from a first process gas comprising oxygen (O | 2011-12-15 |
20110306216 | MASK HOLDING DEVICE - A holding device adapted for holding a mask and a substrate during processing of the substrate is provided. The holding device includes a mask frame adapted for supporting the mask and a substrate carrier adapted for carrying the substrate to be processed. The substrate carrier has at least one recess adapted for receiving the mask frame which holds the mask. | 2011-12-15 |
20110306217 | THIN FILM FORMING APPARATUS AND METHOD - According to one embodiment, the thin film forming apparatus includes a boat capable of holding two wafers, in each of which a cutout portion is provided in an outer peripheral edge portion, in a groove portion for holding a wafer in a state where back surfaces face each other. Moreover, the thin film forming apparatus includes a reactor that accommodates the boat and form a coating on each of surfaces of the two wafers by a vapor deposition reaction. The positions in the groove portion, at which the two wafers are held, respectively, are displaced in a direction parallel to the surfaces of the wafers. | 2011-12-15 |
20110306218 | POWER CONNECTION SOCKET UNIT SEWED ON FABRIC - This invention relates to a power connection socket unit sewed on fabric, which is mainly sewed onto clothing or fabric object in need of connecting to power source. The socket unit has a holder for wrapping over the power connection socket and a combination sheet extending outwardly from the periphery of the holder for sewing together with the fabric, and a power cord of the socket extends out from the back of the combination sheet. In this way, when fabric or clothing is combined with electrical parts such as electric heating piece, power supply function is achieved by means of the power connection socket unit sewed on fabric or clothing. Further, the power cord is not exposed to outside so as to obtain good looking effect. | 2011-12-15 |
20110306219 | ALIGNMENT FRAME FOR RETAINING A MODULE ON A CIRCUIT BOARD - An alignment frame is provided. The frame includes a plurality of frame members coupled together to form a base. The base is configured to surround an electronic module to provide a protective cover for the electronic module. The base includes corners formed at intersections of the frame members. An alignment member is positioned on at least one corner of the base. The alignment member is configured to align an electronic module with respect to an electrical connector on a circuit board. A coupling member extends from at least one corner of the base. The coupling member is configured to be through-hole mounted to an aperture in the circuit board. The coupling member includes a retention feature configured to create a press-fit with an inner surface of the aperture. | 2011-12-15 |
20110306220 | LAMP SOCKET HAVING BOARD SUPPORTING MEANS - A lamp socket includes an insulative housing defining a base, a lamp receiving portion extending upward form the base with a lamp receiving cavity, a board receiving portion extending downward from the base with a board receiving cavity and a side opening communicating with the board receiving cavity. A contact includes an engaging portion retained in the base, a clamp arm extending upward from the retaining portion and received in the board receiving cavity for contacting with a lamp and an contacting arm extending downward from the retaining portion and protruded in the board receiving cavity; A bottom cover is associated with the board receiving portion and defines a supporting arm protruded upwards in the board receiving cavity. | 2011-12-15 |
20110306221 | ELECTRIC CONNECTION BOX - For an object of providing an electric connection box which can relax limitation of arranging electric components and connectors of a wiring harness, the electric connection box includes a box main body having a plurality of cassette blocks in which a relay is mounted. | 2011-12-15 |
20110306222 | ELECTRICAL CONNECTOR HAVING IMPROVED BLOCKING MEMBER - An electrical connector ( | 2011-12-15 |
20110306223 | CLOSURE DEVICE FOR AN ELECTRICAL PLUG-IN COUPLING MEANS ARRANGED ON A MOTOR VEHICLE OR A CHARGING STATION - A closure device for an electrical plug-in coupling means arranged on a motor vehicle or a charging station. A locking means is provided for locking the plug coupled to the plug-in coupling means. The locking means can be operated via a gear mechanism between the drive motor and the closure flap. The locking means comprises a locking element which, when the closure flap is transferred from an intermediate open position, in which the plug can be coupled to the plug-in coupling means, into the final open position, can be brought into a locked position which prevents the removal of the plug from the plug-in coupling means. | 2011-12-15 |
20110306224 | ELECTRICAL CARD CONNECTOR HAVING IMPROVED CARD LOCKING ELEMENT - An electrical card connector ( | 2011-12-15 |
20110306225 | CONNECTOR - A wet-mateable connector for making a connection underwater comprises a male component | 2011-12-15 |
20110306226 | PROTRUDING CONTACT RECEIVER FOR MULTI-CONDUCTOR COMPRESSION CABLE CONNECTOR - A multi-conductor cable connector is provided, the connector including a contact receiver, having a first end and a second end, disposed substantially within an outer housing of a multi-conductor cable connector, wherein a portion of the contact receiver extends an axial distance beyond the outer housing, a plurality of openings configured to receive a plurality of non-concentrically aligned electrical contacts, the plurality of openings being surrounded by the contact receiver, and a securing mechanism positioned proximate the contact receiver, the securing mechanism having a latch arm, wherein axial compression of the contact receiver establishes and maintains firm electrical and physical contact with the received non-concentrically aligned electrical contacts and biases the latch arm of the securing mechanism. Furthermore, an associated method is also provided. | 2011-12-15 |
20110306227 | CONNECTOR - There is disclosed a connector, such as a wet-mateable connector, comprising first and second components having first and second contacts respectively and arranged to be coupled together such that the first and second contacts make a connection. The connector comprises a shuttle associated with the first component and moveable between at least a decoupled position in which the shuttle protects the first contact and a coupled position in which the first contact is exposed. During coupling of the first and second components the shuttle is moved to the coupled position so as to expose the first contact such that it can make an electrical connection with the second contact. The connector also comprises a latch arranged to latch the second component to the shuttle such that upon decoupling of the first and second components, the shuttle is returned to the decoupled position. | 2011-12-15 |
20110306228 | ELECTRICAL CONNECTOR ASSEMBLY WTH LATCH MECHANISM EASILY OPERATED - An electrical connector assembly ( | 2011-12-15 |
20110306229 | CONNECTOR ASSEMBLY - A connector assembly includes a plug connector including a plug housing and an engaging portion that outwardly protrudes from each of side-surfaces of the plug housing, and a receptacle connector including a receptacle housing and a metal fitting that is formed at each of side walls of the receptacle housing, the metal fitting including a retaining portion that is formed at a lower part of the metal fitting and is exposed at a lower part of each of the side walls, and a beam portion that is formed at an upper part of the metal fitting and inwardly projects from each of the side walls of the receptacle housing at a height above a bottom surface of the receptacle housing, the beam portion forming a space with the bottom surface of the receptacle housing to receive the engaging portion of the plug connector. | 2011-12-15 |
20110306230 | CONNECTOR ARRANGEMENT WITH MATE-ASSIST DEVICE - The present application relates to a connector arrangement, including a first connector housing and a complementary second connector housing and a mate assist device. The mate assist device includes an actuating arm movably mountable to the first connector housing, wherein the actuating arm includes at least one cam slot and the second connector housing includes at least one corresponding cam peg to engage the cam slot, such that upon actuating of the mate assist device the cam slot can draw the cam peg towards the first connector housing to move the second connector housing towards the first connector housing. The actuating arm is provided with at least one blocking wing, which arranged movable with respect to the actuating arm and prevents from actuating the mate assist device, when the second connector housing is not at least partially mated with the first connector housing. | 2011-12-15 |
20110306231 | FASTENER FOR A SOCKET CONNECTOR - A fastener for a socket connector includes a frame and a pressing assembly. The frame has an opening and a plurality of protrusions. The protrusions extend from inner edges of the frame toward the opening. The pressing assembly has a cover and a buckling piece. The cover is pivotally connected to the frame. The buckling piece locks the cover on the frame. Using the above arrangement, the protrusions are used to accurately align the socket connector within the opening, thus the inter edge surface of the frame is aligned with the outer peripheral surface of the socket connector. In this way, the pressing assembly of the frame can be operated accurately to lock and press a chip module on the socket connector. | 2011-12-15 |
20110306232 | Insulation Displacement Connector - An insulation displacement connector having two deformable tangs forming a receiving pocket in which a wire may be placed, the deformable tangs adapted to be curled around the wire to create a secure connection that is resistant to disconnection by movement. Also disclosed is a method for creating the secure connection. A solenoid assembly that employs the disclosed insulation displacement connector that reduces the risk of a disconnection is also described. Also disclosed is a device that secures wires to the disclosed insulation displacement connector. | 2011-12-15 |
20110306233 | CONNECTING DEVICE - A connecting device includes a cable transmitting a signal, a carrier receiving the cable, a sliding member slidable on the carrier, and a resilient component. The carrier includes a first side plate and a second side plate opposite to the first side plate, and a fixing post is secured in the carrier adjacent to the first side plate. The resilient component is secured to the fixing post and the sliding member, and the cable runs between the fixing post and the sliding member, wherein the resilient component is elastically deformable between a first state and a second state. In the first state, the resilient component is in an original state, substantially all of the cable is in the carrier, and the sliding member abuts the second side plate. In the second state, the resilient component is in elastically deformed, substantially all of the cable is exposed from the carrier, and the sliding member slides adjacent to the first side plate. | 2011-12-15 |
20110306234 | Quick Mounting Device with Modules - A quick mounting device for appliances that is quickly and easily engaged and disengaged mechanically without the use of tools and has at least one modular connection. | 2011-12-15 |
20110306235 | Cable connection structure and cable connection method - A cable connection structure includes a multi-core coaxial cable connected to a board. The multi-core coaxial cable includes a plurality of parallel-arranged coaxial cables each including a center conductor and an inner insulator, an outer conductor and an outer insulator sequentially formed on an outer periphery of the center conductor. The board includes a signal electrode connected to the center conductor and a ground electrode connected to the outer conductor. The cable connection structure further includes a positioning member lying between the signal electrode and the ground electrode for positioning the center conductor while the inner insulator is attached to the positioning member. | 2011-12-15 |
20110306236 | "F" type electronic connector - A connector plug for attaching to a coaxial cable, by which the user strips the cable sheath through the jacket, braid, and dielectric, exposing a length of the signal conductor, and inserts the cable with exposed conductor into a hollow connector plug until the cut face of the cable abuts an insulator that is integral to the plug, and the signal conductor passes through a bore in the insulator. The insulator acts in place of the cable dielectric on a conventionally trimmed cable. An open faced “F” type nut is electrically connected to the body of the plug, forward of the insulator, and the exposed signal conductor extends through the nut. A screw on the plug body is then tightened, cutting through the jacket and making contact with the cable braid, thereby completing the ground connection between jacket and nut. | 2011-12-15 |
20110306237 | Coaxial connector having a dielectric material for impedance matching - A coaxial connector that includes: a first inner conductor and a second inner conductor; a capacitor that is electrically coupled to the first inner conductor and the second inner conductor; an outer conductor that surrounds the first and second inner conductors, and the capacitor; a first support member that fixes the first inner conductor to the outer conductor; a second support member that fixes the second inner conductor to the outer conductor; a first dielectric material that is provided between the outer conductor and the first inner conductor and between the outer conductor and the second inner conductor, and a second dielectric material that is provided between the outer conductor and the capacitor. | 2011-12-15 |
20110306238 | Electrical Connector - An electrical connector including an insulator body, a shield, and an upper and lower rows of terminals held in the insulator body. One of the two rows of terminals is a row of low speed circuit terminals, and the other one is a row of high speed circuit terminals. The row of high speed circuit terminals includes two pairs of high speed differential signal terminals, and each of the high speed differential signal terminals has a contact portion, an insertion portion and a connection portion between the contact portion and the insertion portion. A part of the connection portion of the high speed differential signal terminal is folded away from the low speed circuit terminal to form a folding section. It increases the space between the high speed differential signal terminal and the low speed circuit terminal and effectively reduces the capacitive coupling crosstalk therebetween. | 2011-12-15 |
20110306239 | Electrical Connector - The present invention discloses an electrical connector having an insulator body, a shield, and an upper and a lower rows of terminals. The shield is constructed to enclose the insulator body. The upper and a lower rows of terminals are held in the insulator body, wherein one of the two rows of terminals is a row of low speed circuit terminals and the other is a row of high speed circuit terminals having two pairs of high speed differential signal terminals and a first ground terminal. At least a portion of the first ground terminal has a width larger than a corresponding portion of each of high speed differential signal terminals. The ground terminal of the high speed circuit is widened compared with high speed differential signal terminals, and it can effectively reduce the inductive coupling crosstalk between the high speed differential signal terminals. | 2011-12-15 |
20110306240 | HIGH SPEED MODULAR JACK - A modular jack ( | 2011-12-15 |
20110306241 | HIGH SPEED MODULAR JACK - A modular jack ( | 2011-12-15 |
20110306242 | HIGH SPEED MODULAR JACK - A modular jack ( | 2011-12-15 |
20110306243 | DIRECT-CONNECT FUSE UNIT FOR BATTERY TERMINAL - An object of the present invention is to provide a direct-connect fuse unit for a battery terminal that can restrain from being upsized and can mount various kinds of electrical components. A conducting hardware is integrally provided with a connecting terminal. The connecting terminal is bent in a plate thickness direction of the conductive hardware to project from a surface of a casing. An electrical component housing contains and holds an external electrical component connected to the connecting terminal. The electrical component housing is separated from the casing and is adapted to be fitted in the casing. | 2011-12-15 |
20110306244 | CABLE CONNECTOR ASSEMBLY HAVING AN ADAPTER PLATE FOR GROUNDING - A cable connector assembly ( | 2011-12-15 |
20110306245 | ELECTRICAL CONNECTOR FOR RESTRICTING CONTACTS REVERSED - An electrical connector includes an insulative housing and a plurality of contacts secured in the insulative housing. The insulative housing defines a mating face and a plurality of receiving passageways running through the mating face for receiving the contacts and arranged along a first direction thereof Each contact defines a contacting portion protruding out of the receiving passageway from the mating face. The electrical connector further includes a baffled stick assembled in the mating face and across the receiving passageways along the first direction of the insulating housing. | 2011-12-15 |
20110306246 | ELECTRICAL CONNECTOR FOR BROADSIDE COUPLED OR EDGE COUPLED MATING WITH MATING CONNECTOR - An electrical connector ( | 2011-12-15 |
20110306247 | COMPRESSION CONNECTOR FOR MULTI-CONDUCTOR CABLE - A multi-conductor cable connector is provided, the connector including a cable connection portion, wherein the cable connection portion receives a prepared multi-conductor cable having a plurality of conductive strands concentrically sharing a common central axis, and a multi-contact portion coupled to the cable connection portion, the multi-contact portion having a plurality of contacts non-concentrically aligned with the cable connection portion. Furthermore, an associated method is also provided. | 2011-12-15 |
20110306248 | CONNECTOR - A connector includes a plug connector and a jack connector configured to be connected with the plug connector. The plug connector includes a plug ground electrode, and a pair of plug terminals configured to transmit electric signals and having plug terminal connecting parts formed at first ends of the plug terminals. The jack connector includes a jack ground electrode, and a pair of jack terminals configured to transmit electric signals and having jack terminal connecting parts formed at first ends of the jack terminals. The jack terminal connecting parts are configured to be inserted between the plug terminal connecting parts and brought into contact with opposing surfaces of the plug terminal connecting parts when the jack connector is connected with the plug connector. | 2011-12-15 |
20110306249 | ELECTRICAL CONNECTOR HAVING VERSATILE CONTACT MATING SURFACES - An electrical contact ( | 2011-12-15 |
20110306250 | ELECTRICAL CONNECTORS HAVING OPEN-ENDED CONDUCTORS - An electrical connector including a connector body that is configured to mate with a plug connector and a contact sub-assembly that is held by the connector body. The contact sub-assembly includes a plurality of mating conductors that are configured to transmit signal current along an interconnection path. The contact sub-assembly also includes a plurality of open-ended conductors. Each of the open-ended conductors is electrically connected to a corresponding mating conductor of the plurality of mating conductors. The open-ended conductors are configured to capacitively couple select mating conductors thereby providing a compensation region that is electrically parallel to the interconnection path. | 2011-12-15 |
20110306251 | CONNECTOR WITH A LATERALLY MOVING CONTACT - A connector includes a housing, a contact, an angled interface, and a resilient member. The contact is disposed in the housing and includes a mating end and an interface end. The angled interface includes a sliding surface that is oriented at an oblique angle with respect to the longitudinal axis. The resilient member is coupled with the contact and the housing and is configured to apply a force to the contact in a direction that is angled with respect to the longitudinal axis. The mating end of the contact engages a conductive element of a mating connector and the interface end of the contact slides along the sliding surface of the angled interface when the contact is moved in a mating direction toward the conductive element. The angled interface translates movement of the contact in the mating direction into lateral movement across the conductive element. | 2011-12-15 |
20110306252 | SPRING FINGER GROUNDING COMPONENT AND METHOD OF MANUFACTURE - A grounding component is provided for grounding electronic components. The grounding component includes: a base; a channel formed within the base; and a spring finger extending from the base, the spring finger having a fixed end and a free end. When the spring finger is in a first undepressed position, a knuckled portion of the spring finger lies proud of the base, and the free end of the spring finger lies substantially within the channel. A method for manufacturing the grounding component is also provided. | 2011-12-15 |
20110306253 | ELECTRONIC CONNECTOR - An electronic connector includes a connector body which is fixed to a board and to be connected to another connector; a cage which is formed by die-casting a metal and shaped to cover entire side surfaces of the connector body and the other connector; and a pressure cover which includes fixed terminals for fixing the pressure cover to the board, wherein the pressure cover is connected to the cage, and the cage is connected to the board by the fixed terminals of the pressure cover. | 2011-12-15 |
20110306254 | WATER JACKETED MARINE EXHAUST COMPONENTS HAVING MULTIPLE STREAM SPRAY RING CONFIGURATIONS - A water jacketed exhaust component includes an exhaust pipe having a radially inwardly tapered tail end, a water jacket disposed in surrounding relation with the exhaust pipe, and a generally V-shaped spray ring. The spray ring includes a first and second set of apertures that create diverging streams of cooling water. A first set of apertures creates an annularly disposed series of streams that are directed downstream and radially inward. These streams are generally directed toward the outer surface of the exhaust pipe structure which extends downstream of the spray ring. A second set of apertures creates an annularly disposed series of streams that are directed downstream and radially outward. These streams are generally directed toward the inner surface of the water jacket structure extending downstream of the spray ring. By providing a water jacketed exhaust component with a spray ring that creates diverging streams of cooling water, the present invention provides a water jacketed marine exhaust component that provides improved exhaust gas cooling over a wider range of engine operating conditions. An alternate embodiment includes a V-shaped spray ring configured to create converging streams of cooling water. | 2011-12-15 |
20110306255 | Strong Materials of Construction and Coatings Comprising Inorganic Binders with Fibre Reinforcement - The invention relates to a composition including an acid-stable inorganic binder and fibres. The composition includes at least one inorganic binder and fibres, wherein the inorganic binder comprises water glass, the fraction of the composition which is attributable to water glass preferably being in the range from 2% to 99% by weight or 6% to 94% by weight or 11% to 89% by weight or 21% to 79% by weight. The fibre material is present as a weave and/or knit and/or scrim and/or net and/or brous nonwoven web and/or as hollow fibres. Owing to its high strength coupled with low weight, this material of construction is very useful for fabricating ready-made components for structural and civil engineering. In addition, it is also very easy to produce structural components and engineered structures on site. It is possible to realize very light components, to achieve very delicate geometries and, owing to the favourable strength-to-weight ratio, to build unusually high structures. | 2011-12-15 |
20110306256 | CREEP-RESISTANT COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - The present invention relates to the field of composite structures comprising a fibrous material, a matrix resin and a portion made of a surface resin composition, wherein the compositions are chosen from compositions comprising one or more thermoplastic resins selected from polyesters, polyamides and mixtures thereof and nanoclays. | 2011-12-15 |
20110306257 | LONG-TERM OUTDOOR EXPOSURE RESISTANT POLYESTER COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein are ultraviolet light stabilized thermoplastic polyester composite structures wherein the surface has at least a portion made of a surface resin composition, and comprise a fibrous material impregnated with a matrix resin composition, wherein the surface resin composition is selected from polyester compositions comprising a) one or more polyester resins, and b) at least three UV stabilizers. | 2011-12-15 |
20110306258 | FLAME RETARDATION OF TEXTILES BY HALOGENATED ARYL PHOSPHONATES - The present invention discloses novel halogenated flame retardant formulations that effectively flame retard textiles at low binder and/or the flame retardant synergist contents, novel modes of application thereof on textiles, and flame-retarded textile fibers and fabrics which are treated by these formulations. | 2011-12-15 |
20110306259 | CLOTH MATERIAL IN A RAW FABRIC STATE, AND METHOD FOR EXPOSING CONDUCTIVE FIBER IN THAT CLOTH MATERIAL - A cloth material in a raw fabric state includes a conductive fiber, and another fiber that is nonconductive. The conductive fiber is arranged along a width direction of the cloth material in a raw fabric state. A first weave portion that is used to create a product such as a seat cover is established at a center, in the width direction, of the cloth material in a raw fabric state. A second weave portion, in which the conductive fiber is arranged in a non-interfering way so as to not go over and under, or be intertwined with, the other fiber in the second weave portion, extends from both ends of the first weave portion. | 2011-12-15 |
20110306260 | HIGHLY WATER REPELLENT CONJUGATE FIBER AND HIGH BULK NONWOVEN FABRIC USING THE SAME - The present invention provides a fiber that can exhibit both excellent antistatic properties and high water repellency, and a high bulk nonwoven fabric with a good texture that exhibits high water repellency. More specifically, the present invention is a highly water repellent fiber that is a conjugate fiber having a plurality of thermoplastic resins as the primary component thereof and having a fiber treatment agent comprising at least Component (A) and Component (B) below deposited thereon at 0.1 to 1.0 wt % in relation to the weight of the fiber, with Component (A) accounting for 75 to 97 wt % and Component (B) accounting for 25 to 3 wt % of the fiber treatment agent: Component (A): polysiloxane Component (B): alkane sulfonate metal salt. | 2011-12-15 |
20110306261 | METHOD FOR PRODUCING FLEXIBLE METAL CONTACTS - To produce flexible electrical and/or thermal metal contacts for connecting electrical, electronic or thermal components, metal fibers, metal fiber nonwovens or metal fiber wovens with an average fiber diameter in the range from 1 to 500 μm are compacted by rolling, pressing or extruding involving cold working to form fibrous sheets. | 2011-12-15 |
20110306262 | LONG-TERM OUTDOOR EXPOSURE RESISTANT OVERMOLDED POLYESTER COMPOSITE STRUCTURES AND PROCESSES FOR THEIR PREPARATION - Disclosed herein is an ultraviolet light stabilized overmolded composite structures comprising polyester compositions comprising i) a first component having a least a portion of its surface made of a surface resin composition and comprising a fibrous material being impregnated with a matrix resin composition, and ii) a second component comprising an overmolding resin composition, adhered to the first component over at least a portion of the surface of the first component, wherein the surface resin composition is selected from polyester compositions comprising a) one or more polyester resins, and b) at least three UV stabilizers. | 2011-12-15 |
20110306263 | Method for aligning film sheets and rectangular panels in display panel manufacturing system - A method for aligning film sheets and rectangular panels in a continuous manufacturing system of display panels, each of the film sheets being formed between two longitudinally adjacent slit lines, one on an upstream side and the other on a downstream side, and extending in a transverse direction with respect to a feeding direction of a strip shaped film laminate, such that the rectangular panels conveyed to the lamination position are overlapped with the film sheets conveyed to the lamination position. The method includes steps of; angularly adjusting the rectangular panel conveyed to the lamination position such that a center line extending in the feeding direction of the rectangular panels is parallel to the center line extending in the feeding direction of the film sheets conveyed to the lamination position; and position adjusting the angularly adjusted rectangular panels by shifting for a displacement from a position of the film sheets conveyed to the lamination position. | 2011-12-15 |
20110306264 | Method of manufacturing rhenium alloy emission filaments - A new Rhenium alloy usable for improving the performance of emission filaments used in mass spectrometers or other similar scientific instruments, which is made by adding low level concentrations of Yttrium Oxide to Rhenium of less than 10%. This new alloy has demonstrated superior performance characteristics compared to pure Rhenium for this purpose. Filaments made from the Yttria/Rhenium alloy exhibit the same voltage, current and emission properties as Rhenium but have the added advantage of greatly decreasing warping during use. The Rhenium alloy filaments are usable with various shapes and configurations including straight filaments, multiple coiled filaments and pin shaped filaments. Electron microscopy and microscopy studies verify that the Yttria/Rhenium material of the new alloy has a smaller grain size and increased strength when compared to pure Rhenium, which accounts for the enhanced structural strength. | 2011-12-15 |
20110306265 | BATHTUB FOAM GENERATING DEVICE - A bathtub foam generating device, including a sealed motor housing ( | 2011-12-15 |
20110306266 | Sculpting device - A sculpting device, including a number of fibers disposed parallel to one another and in sliding engagement with one another, is disclosed. A rubber band snugly encircles the fibers so as to hold the fibers together in the form of a bundle. The bundle has opposed ends and at least one of the opposed ends bears printed indicia. | 2011-12-15 |
20110306267 | Creative illustration book - A creative illustration book is provided that has a story page that has pre-printed text of a written story. An illustration page is included that does not have any of the pre-printed text of the written story thereon. The illustration page is removable from the book so that the entire written story is retained in the book after removal of the illustration page. The illustration page is provided for use in having a user draw an illustration thereon. | 2011-12-15 |
20110306268 | COMBINATION PAPER TOP - A combination paper top includes a first paperboard and a second paperboard. One of the first and second paperboards is precut with a separable top top board, a separable top bottom board and a separable top sideboard. Printed layers are laid on surfaces of the first and second paperboards. The printed layers are printed with various colorful figures or words to combine education with recreation. After separated from the first and second paperboards, the top top board, the top bottom board and the top sideboard can be DIY assembled to form a hollow top main body. A support pin is inserted through the centers of the top top board and the top bottom board. A first end of the support pin serves as a spinning section, while a second end of the support pin serves as a tip of the top. The combination paper top also serves as a decoration. | 2011-12-15 |
20110306269 | SPINNER FOR TOY TOP - A spinner for a toy top enables a launching position of a toy top to be easily set and held in place even when a rack belt is vigorously pulled out. The spinner includes an elongated rack belt having a rack gear, and a spinner main body formed with an insertion hole through which the rack belt is inserted. The spinner main body includes a toy top mounting part rotatably provided on one surface thereof. Inside the spinner main body, a rotating mechanism that is actuated by pulling out the rack belt to impart a rotational force to the toy top mounting part is provided. The rack belt can be inserted into and pulled out from the insertion hole in a same direction an axis of rotation of the toy top mounting part. | 2011-12-15 |
20110306270 | TOY DEVICE - A toy device that enables a transformable toy to be played individually and in combination with another transformable toy. The toy device includes a transformable toy with a form which can be reversibly changed by turning a plurality of pivotable members, and a base unit on which the transformable toy is mountable. The transformable toy includes a pivoting mechanism for turning the plurality of pivotable members and an actuator for actuating the pivoting mechanism. The base unit includes an actuating part to which the actuator is coupled and an operating part for externally operating the actuating part. When the operating part is operated, the actuator operates via the actuating part, and the pivoting mechanism is actuated to turn the plurality of pivotable members, thereby changing the form of the transformable toy. | 2011-12-15 |
20110306271 | Swimming Pool Water Toy - A toy for receiving and shooting a constant stream of water is comprised of a tubular connection port or mounting means, and a hollow foam tube. The hollow foam tube is connected to a return line of a swimming pool circulation system via the tubular connection port, wherein a first end of the connection port is sized to connect to the return line and a second end of the connection port is sized to connect to the proximal end of the hollow foam tube, and wherein water flows from the return line, through the connection port and the channel of the hollow foam tube, and then out of the distal end of the tube when connected, to provide a constant flow of water shooting out of the toy. | 2011-12-15 |
20110306272 | BOTTOM BOARD FOR A BEEHIVE - A beehive bottom board is disclosed that includes recessed areas at the front of the bottom board defining openings for the hive entrance. The size of the hive entrance may be adjusted by sliding a mounted hive body forwards or backwards. | 2011-12-15 |
20110306273 | CENTERLESS CYLINDRICAL GRINDING MACHINE AND CENTERLESS GRINDING METHOD WITH HEIGHT-ADJUSTABLE REGULATING WHEEL - The present invention pertains to a centerless cylindrical grinding machine with a grinding wheel and a regulating wheel that can be laterally displaced toward a work piece that can be held between these wheels, and with a rest blade for supporting the work piece that is realized rigid in the vertical direction and arranged and dimensioned such that a rotational axis of the work piece and a rotational axis of the grinding wheel lie in a common plane, wherein a height adjustment of the rotational axis of the regulating wheel beyond the plane is kinematically decoupled from the lateral displacement of the regulating wheel and can be varied in order to position the regulating wheel on the supported work piece. | 2011-12-15 |
20110306274 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus has a polishing section ( | 2011-12-15 |
20110306275 | COMPONENT FINISHING TOOL - An example finishing tool form assembly includes a base and a superabrasive bonded to a surface of the base. The superabrasive is configured to be reciprocated with the base relative to a longitudinally extending recess of a component to finish at least one surface of the component. | 2011-12-15 |
20110306276 | SPLICING TECHNIQUE FOR FIXED ABRASIVES USED IN CHEMICAL MECHANICAL PLANARIZATION - An abrasive article includes a support pad, a first abrasive element, a second abrasive element and a fixation mechanism. The support pad has a first major surface, a second major surface, a first edge, a second edge and a channel. The channel is formed within the first major surface and extends from the first edge to the second edge. The first and second abrasive elements are each positionable over a portion of the support pad. The fixation mechanism is positioned within the channel ad secures an edge of the first abrasive element and an edge of the second abrasive element to the support pad. | 2011-12-15 |
20110306277 | COMPLEX APPARATUS AND METHOD FOR POLISHING AN INGOT BLOCK - A compound chamfering device that manufactures prism-shaped ingot blocks of excellent surface smoothness is disclosed. The four-corner round surfaces and the four sides of a prism-shaped ingot obtained by using a pair of rotary blades of a slicer to perform four-side peeloff of a cylindrical ingot block are chamfered by rough grinding with a pair of cup wheel type rough grinding grindstones. A pair of cup wheel type finishing grinding grindstones are used to chamfering by finishing grinding the four-corner round surfaces and the four sides of the block. | 2011-12-15 |
20110306278 | Wall polishing machine - A wall polishing machine comprises a handle. The handle comprises at least two longitudinally arranged rod components. Each of the rod components is disposed with a dust guiding pipe therein. In any pair of adjacent rod components, the dust guiding pipe of a first rod component is exposed from the first rod component and has an outwardly exposed end which is inserted into a second rod component to connect to the dust guiding pipe of the second rod component, and secure connection is attained by means of a clamping component. As the handle is designed as being formed by at least two longitudinally arranged rod components connected via a clamping component, each of the rod components can be packed after being disassembled when the machine is not in use, therefore offering convenience in storage and carrying to users. | 2011-12-15 |
20110306279 | Blasting nozzle for a device for blast-machining or abrasive blasting objects | 2011-12-15 |
20110306280 | Rotatable Disc Head As Well As Floor Treatment Machine Comprising Such Disc Head - A rotatable disc head for a floor treatment device includes a pair of coupling members which are pivotably connected to each other according to pivot axes which are transversely oriented with respect to each other. A rotation axis is defined which is transversely oriented with respect to the pivot axes. The coupling members are furthermore connected to each other by means of at least one elastically deformable connection element. One of the coupling members includes fitting means for mounting the coupling member to the rotary drive of the floor treatment device and the other coupling member includes carrier means onto which a floor treatment element, such as a grinding disc, can be mounted. The connection of the connection elements to one of the coupling members is an adjustable connection allowing displacements which are oriented transversely with respect to the rotation axis. | 2011-12-15 |
20110306281 | FINISHING APPARATUS - The disclosure relates to a finishing apparatus for finish machining of rotationally symmetric workpiece surfaces having a finish belt guide which has a guiding body for guiding the finish belt, wherein the guiding body comprises a shell-like guiding surface along which the finish belt can be guided or is guided between an insertion end of the finish belt and a withdrawal end of the finish belt, wherein the guiding surface is mounted in a resiliently elastic manner in the radial direction, wherein, when seen in the circumferential direction, the guiding surface extends in a continuous manner between the insertion end of the finish belt and the withdrawal end of the finish belt over at least a part of the width of said guiding surface and is mounted in a resiliently elastic manner. | 2011-12-15 |
20110306282 | Adjustable Belt Sander - The invention relates to an adjustable belt sander, comprising a continuous sanding belt ( | 2011-12-15 |
20110306283 | MULTI-PURPOSE EXTENDED REACH TOOL - An apparatus adapted to be coupled to a power source having a rotary drive shaft is provided. The apparatus comprises an adapter, an extension pole, and a tool head. The adapter has a drive shaft and a fluid passage. A first end of the adapter drive shaft is adapted to be coupled to the power source drive shaft. The adapter fluid passage is adapted to receive fluid flowing from a source of fluid and to permit flow of fluid there through. The extension pole has a drive shaft and a fluid passage. A first end of the extension pole drive shaft is adapted to be coupled to a second end of the adapter drive shaft. The extension pole fluid passage is adapted to receive fluid flowing from the adapter and to permit flow of fluid there through. The tool head is adapted to be coupled to the extension pole. | 2011-12-15 |
20110306284 | CHIP-SORTING DEVICE WITH CHIP REMOVAL UNITS - A casino chip-sorting device may comprise a transport disc, a drive, an ejector, a cam, and a blade. The drive may be operably coupled to the transport disc, for rotating the transport disc, and the transport disc may have multiple recesses for collecting individual chips. The ejector may be extendable into a recess from beneath the transport disc to move a disc that is in the recess and the cam may be selectively rotatable by the drive to push the ejector into the recess. The blade may have an upper surface positioned to receive a casino chip moved by the ejector. Additionally, a processor associated with the casino chip-sorting device may be programmed to recognize a jam. | 2011-12-15 |
20110306285 | Method And System For Emergency Ventilation Of An Aircraft Cabin - The invention relates to a method for emergency ventilation of an aircraft cabin ( | 2011-12-15 |
20110306286 | GRAIN BIN AERATION DUCT - An aeration duct apparatus for a grain bin has an air chamber with louvered side walls, which comprise a plurality of wall slats that extend the length of the chamber and slope from inner side edges thereof downward and outward to outer side edges thereof, and are spaced apart to form air gaps between adjacent slats. The slats prevent grain from flowing through the air gaps into the air chamber. In one embodiment the outer side edge of each slat is closer to a center of the air chamber than the outer side edge of an adjacent slat below, and farther from the center than the outer side edge of an adjacent slat above, such that the right and left louvered side walls each slope inward toward the center of the air chamber from lower edges thereof to upper edges thereof. The duct is well suited to hopper bottom bins. | 2011-12-15 |