51st week of 2015 patent applcation highlights part 70 |
Patent application number | Title | Published |
20150366073 | THREE-DIMENSIONAL CONDUCTIVE PATTERNS AND INKS FOR MAKING SAME - The invention generally relates to polymerizable conductive ink formulations comprising at least one metal source, at least one monomer and/or oligomer and a polymerization initiator, and uses thereof for printing three-dimensional functional structures. In particular a method of fabricating a three-dimensional conductive pattern on a substrate is disclosed, the method comprising: a) forming a pattern on a surface region of a substrate by using an ink comprising at least one metal source, at least one liquid polymerizable monomer and/or oligomer, and at least one polymerization initiator; b) polymerizing at least a portion of said liquid monomer and/or oligomer; c) rendering the metal source a continuous percolation path for electrical conductivity (sintering); d) repeating steps (a), (b) and optionally (c) to obtain a three-dimensional conductive pattern. | 2015-12-17 |
20150366074 | Conductive Formulations For Use In Electrical, Electronic And RF Applications - Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microparticles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials. | 2015-12-17 |
20150366075 | MULTI-LEVEL METALIZATION ON A CERAMIC SUBSTRATE - The invention relates to a method for producing a copper multi-level metallization on a ceramic substrate ( | 2015-12-17 |
20150366076 | A Method Of Encapsulating An Electric Component - An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell. | 2015-12-17 |
20150366077 | METHOD FOR PRODUCING MOUNTED STRUCTURE - A method for producing a mounted structure according to an embodiment of the present invention includes a step of forming a circuit substrate, which includes an insulation layer and a conductive layer, on a support member by alternately stacking the insulation layer and the conductive layer on the support member; a step of forming a mounted structure, which includes the circuit substrate and an electronic component, on the support member by mounting the electronic component on the circuit substrate; and a step of removing the support member from the mounted structure. As a result, the efficiency in producing the mounted structure can be increased. | 2015-12-17 |
20150366078 | OVERVOLTAGE PROTECTION CIRCUIT - Universal Serial Bus (USB) protection circuits are provided. A circuit includes a plurality of first transistors connected in series between a pad and ground. The circuit also includes a plurality of second transistors connected in series between the pad and a supply voltage. The circuit further includes a control circuit that applies respective bias voltages to each one of the plurality of first transistors and to each one of the plurality of second transistors. The bias voltages are configured to: turn off the plurality of first transistors and turn off the plurality of second transistors when a pad voltage of the pad is within a nominal voltage range; sequentially turn on the plurality of first transistors when the pad voltage increases above the nominal voltage range; and sequentially turn on the plurality of second transistors when the pad voltage decreases below the nominal voltage range. | 2015-12-17 |
20150366079 | HEAT-BONDING APPARATUS AND METHOD OF MANUFACTURING HEAT-BONDED PRODUCTS - A heat-bonding apparatus and method of manufacturing a heat-bonded product without overheating during cooling thereof after the completion of the heat-bonding, where the object can be cooled in a shorter time than the conventional when the heat-bonding is performed in a vacuum. A heat-bonding apparatus having a vacuum chamber for housing an object to be heat-bonded and a buffer part, a heater for applying heat to the buffer part placed into contact with the object, an object temperature sensor for detecting a temperature of the object heated through the buffer part, a buffer temperature sensor for detecting a temperature of the buffer part, a vacuum breaker for breaking the vacuum, and a controller for operating the vacuum breaker to break the vacuum when a temperature difference between a temperature detected by the object temperature sensor and a temperature detected by the buffer temperature sensor falls within a range of specified temperature difference. | 2015-12-17 |
20150366080 | METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE FOR HAVING BGA-TYPE COMPONENT THEREON - In a method for manufacturing a multilayer substrate for having a BGA-type component thereon, a conductive through hole for restricting a signal interference and a resist film are formed on the multilayer substrate, an occurrence of a fault caused by a residual of a resist in the conductive through hole is reduced. In the method for manufacturing the multilayer substrate for having the BGA-type component thereon, a step of forming the resist film includes an applying step of applying a photosensitive resist to an entirety of a front surface portion of a base. The applying step is performed while restricting the resist from entering the conductive through hole by supplying a high pressure air to a rear surface of the base to pass through the conductive through hole using an air supply mechanism. | 2015-12-17 |
20150366081 | MANUFACTURING METHOD FOR CIRCUIT STRUCTURE EMBEDDED WITH ELECTRONIC DEVICE - A manufacturing method for a circuit structure embedded with an electronic device including the following steps is provided. A first dielectric material is provided. At least one electronic device is disposed on the first dielectric material. A second dielectric material is laminated on the first dielectric material, and two conductive materials are disposed on the first dielectric material and the second dielectric material respectively, such that the electronic device is embedded between the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are respectively located between the electronic device and the corresponding conductive material, and the first dielectric material, the second dielectric material, the electronic device and the two conductive materials form a core board. An inner-layer circuit is formed on the core board, and the inner-layer circuit is connected with the electronic device. | 2015-12-17 |
20150366082 | DISPLAY DEVICE - Provided is a display device. The display device includes: a display panel which displays an image; and a housing which supports the display panel, wherein the housing includes: a bottom plate which includes edge regions; and a plurality of sidewalls which are located on the edge regions of the bottom plate and face the display panel, wherein the plurality of sidewalls include a first region and a second region adjacent to the first region and overlap an edge portion of the display panel, and an average height of at least one of the sidewalls on the first region is greater than an average height of at least one of the sidewalls on the second region. | 2015-12-17 |
20150366083 | Wireless Video Transmission System for Liquid Crystal Display - The exemplary embodiments herein provide a sealed transparent LCD assembly having a front and rear glass panel with a spacer positioned between the two panels to provide a sealed cavity containing a liquid crystal display (LCD). A wireless transmitter/receiver may be placed within the sealed cavity to receive image or video data wirelessly. The sealed transparent LCD assembly may be used with a display case which defines a cavity housing a second wireless transmitter/receiver which can push the image or video data to the wireless transmitter/receiver contained within the sealed cavity between the two glass panels. | 2015-12-17 |
20150366084 | INTRINSIC SAFE IN-LINE ADAPTOR WITH INTEGRATED CAPACITIVE BARRIER FOR CONNECTING A WIRELESS MODULE WITH ANTENNA - An intrinsic safe in-line adaptor with an integrated capacitive barrier for connecting a wireless module with an antenna. The in-line adaptor (e.g., N-type to N-type) can be designed to include an intrinsic safe circuit and the integrated capacitive barrier. The intrinsic safe circuit further includes a multi-layer PCB and the PCB can be potted and sealed with a mechanical metal casing. The intrinsic safe capacitive barrier can be integrated with a coaxial connector and mounted as part of a flameproof enclosure to meet an explosion safety standard and an intrinsic safety requirement. The mechanical metal casing can be isolated by the enclosure (e.g., rubber) to meet isolation requirements. The wireless module can be directly connected with the antenna utilizing the in-line adaptor via the coaxial connector and without any specific cable assembly. | 2015-12-17 |
20150366085 | PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant. | 2015-12-17 |
20150366086 | Vehicle-Mounted Electronic Module - There is provided an on-vehicle electronic module that includes an external connecting function and environment resistant reliability similar to a previous on-vehicle electronic module and that simultaneously achieves downsizing without a male connector housing component and cost reduction due to reduction of the number of components and assembly man-hours. There are included a circuit board | 2015-12-17 |
20150366087 | Electronic Apparatus - A vehicle-mounted display apparatus includes a substrate and a sheet-metal holder. The substrate has through-holes penetrating a substrate surface of the substrate. In contrast, the sheet-metal holder includes a guide portion extending upright from a main surface of the sheet-metal holder, and projections projecting from the main surface of the sheet-metal holder and configured to define the position of the substrate with respect to the guide portion by an engagement with the through-holes. In a manufacturing process of the vehicle-mounted display apparatus, the substrate abuts against the guide portion in a state in which the substrate surface is inclined with respect to the main surface of the sheet-metal holder. Subsequently, the substrate rotates about the guide portion until the substrate surface becomes substantially parallel to the main surface of the sheet-metal holder, causing the through-holes and the projections to engage each other. | 2015-12-17 |
20150366088 | COMPOSITE PLATE STRUCTURE AND MANUFACTURING METHOD THEREOF - A composite plate structure includes a composite plate and a resin component. The composite plate includes a first fiber layer, a second fiber layer and a core layer. The second fiber layer has a first region, wherein an area of the second fiber layer is smaller than an area of the first fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer, wherein the core layer is exposed at the first region. The resin component is connected to the composite plate, wherein the resin component is combined with the core layer at the first region. In addition, a manufacturing method of the composite plate is also provided. | 2015-12-17 |
20150366089 | ELECTRONIC DEVICE INCLUDING FLEXIBLE DISPLAY - An electronic device is provided including: a flexible display; a first housing member; a second housing member; a hinge module coupled to the first housing member and the second housing member; and a support body disposed between the flexible display and the first and second housing members, wherein the second housing member is adapted to pivot about the hinge module relative to the first housing member. | 2015-12-17 |
20150366090 | WIRE CONTROLLED SUPPORT ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME - An electronic device includes a housing with a base wall, a support unit and a control wire unit. The support unit includes a connecting member and a supporting member. The connecting member is connected to the base wall and has a connection portion. The supporting member has an engaging piece connected to the connection portion to vary an included angle between the supporting member and the base wall. The control wire unit includes a winding mechanism, a wire member and a control mechanism. The control mechanism is operable to control the winding mechanism to adjust an unwound length of the wire member for controlling the included angle between the supporting member and the base wall. | 2015-12-17 |
20150366091 | CONVERTER - A converter includes an amplifier case main body having an amplifier main body accommodated therein, and a safety cover attached to the amplifier case main body. The safety cover has a plurality of through-holes for as removal. | 2015-12-17 |
20150366092 | Media Patching System - Improved media patching systems and related methods of use are provided. The present disclosure provides improved systems/methods for the design and use of patching systems configured to support multiple media connections (e.g., high density, mixed media connections). The present disclosure provides advantageous systems/methods for the design and use of patching systems having one or more bracket members (e.g., Z-shaped bracket members) configured to facilitate cable management. In exemplary embodiments, the bracket members allow a panel assembly to move relative to the bracket members for cable management purposes. The improved systems/assemblies of the present disclosure provide users with the ability to install multiple media connections (e.g., copper-based and/or fiber optic connections) in the same patching system/enclosure. | 2015-12-17 |
20150366093 | Case For Portable Electronic Device With Integral Detachable Power Converter And USB Connector - A case for portable electronic devices is disclosed, providing physical protection from abrasion and mishandling and also including an integral power conversion module with integral ac power mains blades and a USB connector and small form factor. The power conversion module with integral USB connector is provided to recharge the internal batteries of the portable electronic device and is stored within the outline envelope of the case when not in use. The power conversion module is removable from the case for connection to a wall power receptacle or a mating USB connector on another device, and is connected to the case by a retractable cord. The power conversion module ac power mains blades are retractable to minimize the overall volume when stored within the case envelope. | 2015-12-17 |
20150366094 | Electronics Cabinet - An electronics cabinet having a cabinet frame, a front equipment rail, and a structural air dam. The cabinet frame includes a first pair of front-to-back beams connected to a pair of top side-to-side beams to form a top frame, a second pair of front-to-back beams connected to a pair of bottom side-to-side beams to form a bottom frame, and a plurality of vertical post connected to the top frame and the bottom frame. The front equipment rail is removably connected to one of the first pair of front-to-back beams and to one of the second pair of front-to-back beams. The structural air dam is connected to the front equipment rail and to one of the plurality of vertical posts. | 2015-12-17 |
20150366095 | COMPUTING ASSEMBLY HAVING A MOVEABLE STORAGE BAY AND METHOD FOR PROVIDING THE SAME - A computing assembly comprises an enclosure body having opposite first and second planar surfaces, one or more storage bays operably coupled with the enclosure body (where the one or more storage bays pivot relative to the enclosure body to protrude outward from the first planar surface of the enclosure body), one or more computing node devices at least partially disposed within the enclosure body (where the one or more computing node devices include one or more circuits) and one or more memory devices disposed within the one or more storage bays. | 2015-12-17 |
20150366096 | PROVISIONING OF LIGHTWEIGHT CONFIGURABLE SERVERS WITH CHASSIS BASE AND COVER DESIGNED FOR NESTED STACKING - An information handling system (IHS) has a lightweight server (LWS) chassis that is user selectable from multiple LWS chasses. Each LWS chassis includes a chassis base having structural configuration that enables placement of the LWS chassis in a nested, stacked configuration with a second LWS chassis placed atop the LWS chassis and a third LWS chassis placed below the LWS chassis. Multiple LWS chasses can be stacked in a vertical space whose height is less than a sum of individual heights of each of the multiple LWS chasses. The IHS further includes compute components inserted into the LWS chassis and one or more connecting cabling interconnecting the at least two compute components. | 2015-12-17 |
20150366097 | IMPERMEABLE PROTECTIVE COATINGS THROUGH WHICH ELECTRICAL CONNECTIONS MAY BE ESTABLISHED AND ELECTRONIC DEVICES INCLUDING THE IMPERMEABLE PROTECTIVE COATINGS - Protective coatings are disclosed that are configured to cover electronic components within an electronic device, while enabling electrical connections to be established with electrical contacts that are covered by the protective coatings. Such a protective coating may comprise a parylene, or a poly(p-xylylene), protective coating that has a thickness of at least 0.1 μm and at most about 2 μm. Electronic devices that include such a protective coating are also disclosed. | 2015-12-17 |
20150366098 | Wrist Band Attachment for a Wearable Device - A wearable device includes an electronics module having a first peripheral mating surface extending around a periphery of the electronics module. The first peripheral mating surface includes a first level portion and a second level portion. The second level portion is substantially concentric with the first level portion. The second level portion is configured to meet the first level portion at the periphery of the electronics module to form a step. The wearable device also includes a strap configured for removable placement about an external body surface. The wearable device further includes a holder coupled to the strap. The holder defines a frame configured to receive the electronics module. The frame includes a second peripheral mating surface opposing the first peripheral mating surface of the electronics module. The second peripheral mating surface includes a respective step configured to mate with the step of the first peripheral mating surface. | 2015-12-17 |
20150366099 | WIRELESS COMMUNICATION MODULE - A wireless communication module can reduce the number of components through optimum design and improve transmission efficiency by implementing a short wiring. The wireless communication module may include a first front-end module, a second front-end module, and a wiring unit arranged between the first front-end module and the second front-end module to supply power to the first front-end module and the second front-end module. At least one capacitor may be connected to the wiring unit. | 2015-12-17 |
20150366100 | Cable Trough - Improved cable troughs and related methods of use are provided. The present disclosure provides improved cable troughs configured to support media cables, and related methods of use. More particularly, the present disclosure provides advantageous systems/methods for the design and use of cable troughs configured to support media cables associated with a rack or the like. Disclosed herein is an advantageous cable trough having front and rear walls extending from a bottom wall, with the front, rear and bottom walls defining a channel that is configured and dimensioned to support and/or at least partially house media cables or the like. The exemplary cable trough includes attachment features/structures that are advantageously configured and dimensioned to releasably mount with respect to a supporting structure. Moreover, the attachment features/structures of the cable trough allow the cable trough to be releasably mounted at various angled positions relative to the supporting structure. | 2015-12-17 |
20150366101 | Heat Exchanger for an Electronic Display - A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image. | 2015-12-17 |
20150366102 | ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT APPARATUS - An electronic circuit apparatus includes a circuit substrate, a heat generating component positioned on the circuit substrate, a metal plate forming a portion of an inner layer of the circuit substrate and protruding from a side surface of the circuit substrate such that the metal plate has an exposed portion exposed to outside the circuit substrate, and an external component connected to the exposed portion of the metal plate and including one of an external heat dissipation component and an external cooling component. | 2015-12-17 |
20150366103 | Signal Transmission Device and Cooling Device - The heat generating elements are more effectively cooled by improving a heat radiating property of the heat generating elements provided so as to be adjacent to each other. An extending direction of fins of a second heat sink corresponding to a second communication-use LSI is made to intersect with an extending direction of fines of a third heat sink corresponding to a third communication-use LSI. Thus, a cooling air that has passed through the second heat sink is prevented from passing through the third heat sink. Therefore, a cooling air that is not warmed can be supplied to both of the second heat sink and the third heat sink. Thus, each heat radiating property of the second and third communication-use LSIs provided so as to be adjacent to each other can be improved. As a result, both of the second and third communication-use LSIs can be efficiently cooled. | 2015-12-17 |
20150366104 | METHOD FOR CONTROLLING TEMPERATURE OF INVERTER SYSTEM BY CONTOLLING A FAN - A method for controlling temperature of an inverter system having an inverter and a cooling fan is provided, the method including: obtaining an internal temperature of the inverter and a DC (Direct Current)-link voltage of the inverter; and outputting a fan driving control signal for driving the fan or maintaining the fan being driven to the fan, when the internal temperature is above a predetermined fan drive setting temperature and the DC-link voltage is above a predetermined fan drive setting voltage. | 2015-12-17 |
20150366105 | CONFIGURABLE HEAT TRANSFER GRIDS AND RELATED METHODS - Configurable heat transfer grids that provide cooling to computing components are discussed herein. Some embodiments may include a configurable heat transfer grid comprising a cooling frame and one or more cooling elements. The cooling frame may define a plurality of receptacles that are each configured to receive one or more cooling elements. The one or more cooling elements may include an elongated shape and may be configured to be disposed within one or more of the plurality of receptacles, such as through apertures at outer ends of the cooling frame. The cooling elements may include heat pipes and/or heat spreaders. Some embodiments may provide for configurable heat transfer grids that include split cooling frames that can be opened for cooling element placement. Some embodiments may further provide for configuring a configurable heat transfer grid to implement effective and inexpensive heat removal for a wide range of specific printed circuit board assembly (PCBA) layouts, dimensions, and component types. | 2015-12-17 |
20150366106 | WIRE BRANCH STRUCTURE - A wire branch structure ( | 2015-12-17 |
20150366107 | PANEL FOR BROADBAND ELECTROMAGNETIC SHIELDING - A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers. | 2015-12-17 |
20150366108 | METHOD FOR MANUFACTURING A PANEL FOR A REFLECTIVE BROADBAND ELECTROMAGNETIC SHIELD - A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers. | 2015-12-17 |
20150366109 | SHIELDING CAGE WITH OVERINSERTION PREVENTION ASPECT - A shielding cage is disclosed that has an EMI gasket integrally formed on its exterior. In order to prevent the over-insertion of the cage into a faceplate opening, a plurality of stop members are formed integrally with the cage walls and comprise angled tabs that are bent outwardly away from the cage walls at an angle of between about 30 and 90. The stop members are flanked by a pair of EMI gasket spring fingers and are positioned so that they are located above the centers of modules inserted into module-receiving bays of the shielding cage. | 2015-12-17 |
20150366110 | CAMERA DEVICE AND ELECTRONIC DEVICE WITH THE SAME - According to various embodiments of the present disclosure, a camera device comprises a camera housing where a camera assembly is mounted; a decoration part covering the camera housing; and a fixing part provided along a periphery of the camera housing and fixing the decoration part, wherein the fixing part includes a path part along which static electricity introduced through the decoration part moves a discharge module mounted adjacent to the camera housing. Various other embodiments are possible as well. | 2015-12-17 |
20150366111 | NOISE-REDUCING SHIELDED CABLE - As a noise-reducing shielded cable according to the present invention, provided is a shielded cable having an inverter ( | 2015-12-17 |
20150366112 | KNIT EMI SHIELD AND METHOD OF CONSTRUCTION THEREOF - An electromagnetic interference (EMI) shield assembly and method of construction is provided. The assembly includes a body having a wall of warp knit nonmetallic yarn having opposite sides extending generally parallel with one another between opposite ends and a plurality of weft inserted metal wires. The wire is inserted to provide discrete bundles each arranged in side-by-side relation with one another and extending beyond the opposite sides of the wall to provide a plurality of exposed free ends. The nonmetallic yarn is looped about the wires, thereby fixing the wire relative to the nonmetallic yarn and to other wires in an optimal EMI shielding position. Metal brackets adapted for ready attachment to a source of electrical ground are attached to the exposed free ends. The individual bundles of wires extend parallel to one another, with a gap having a predetermined width extending between the adjacent bundles. | 2015-12-17 |
20150366113 | LAYERED ASSEMBLIES - An assembly structure is formed of generally rigid layers of material bonded to generally flexible layers so as to form apparatus including hinges, bearings, and other translating and rotating subunits along with embedded functional devices. | 2015-12-17 |
20150366114 | SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING APPARATUS AND SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING METHOD - A support pin arrangement determination assisting apparatus includes: a display unit which displays a board image indicating an already mounted component; a position input unit through which an arrangement position of a support pin is input to the displayed image; and a pin image display processing unit which causes the display unit to display a composite image in which a pin arrangement image indicating the input arrangement position is superimposed on the board image. A planar image of the support pin in the pin arrangement image includes an image of a top portion of a shaft erected in a board holding unit and an image of a contact portion which is located on a tip side of the top portion, which has a sectional shape smaller than that of the top portion, and which contacts and supports a lower surface of the board. | 2015-12-17 |
20150366115 | Papaya tree named 'AURORA' - A new and distinct variety of | 2015-12-17 |
20150366116 | Peach tree named 'Supechnineteen' - A new and distinct peach tree variety, | 2015-12-17 |
20150366117 | Peach tree named 'Supechtwenty' - A new and distinct peach tree variety, | 2015-12-17 |
20150366118 | Grapevine 'IFG Twenty-one' - This invention is a new and distinct grapevine variety denominated ‘IFG Twenty-one’. The new grapevine is characterized by producing small naturally seedless red berries having an elliptic shape with a unique combination of muscat and labrusca flavor. The strong fruity flavor is reminiscent of strawberries. Fruits normally ripen very early season about early to mid-July near Delano Calif. Fruits are fairly low in acidity, with medium dense, firm texture. Berries color readily even in hot climatic conditions and produce completely colored bright red berries. | 2015-12-17 |
20150366119 | Oak Tree Named Joan Lionetti - A new and distinct | 2015-12-17 |
20150366120 | Euphorbia plant named 'Floreupred' - A new and distinct cultivar of | 2015-12-17 |
20150366121 | Gentiana plant named 'RI0405128' - A new and distinct | 2015-12-17 |