51st week of 2018 patent applcation highlights part 65 |
Patent application number | Title | Published |
20180366311 | MASS SPECTROMETER WITH A LASER DESORPTION ION SOURCE, AND LASER SYSTEM WITH A LONG SERVICE LIFE | 2018-12-20 |
20180366312 | MASS SPECTROMETER AND METHOD FOR TIME-OF-FLIGHT MASS SPECTROMETRY | 2018-12-20 |
20180366313 | IMAGING MASS SPECTROMETER | 2018-12-20 |
20180366314 | Si PRECURSORS FOR DEPOSITION OF SiN AT LOW TEMPERATURES | 2018-12-20 |
20180366315 | Film Forming Method, Film Forming Apparatus, and Storage Medium | 2018-12-20 |
20180366316 | METHOD FOR CLEANING SEMICONDUCTOR DEVICE | 2018-12-20 |
20180366317 | Wafer Treatment For Achieving Defect-Free Self-Assembled Monolayers | 2018-12-20 |
20180366318 | SELECTIVE DEPOSITION PROCESS UTILIZING POLYMER STRUCTURE DEACTIVATION PROCESS | 2018-12-20 |
20180366319 | SILICON-BASED HARDMASK | 2018-12-20 |
20180366320 | DISPLAY PANEL AND METHOD FOR FORMING MICRO COMPONENT SUPPORT | 2018-12-20 |
20180366321 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | 2018-12-20 |
20180366322 | In-Situ Formation of Non-Volatile Lanthanide Thin Film Precursors and Use in ALD and CVD | 2018-12-20 |
20180366323 | METHOD OF FORMING OXIDE LAYER | 2018-12-20 |
20180366324 | REPLACEMENT CONTACT CUTS WITH AN ENCAPSULATED LOW-K DIELECTRIC | 2018-12-20 |
20180366325 | METHODS OF EXFOLIATING SINGLE CRYSTAL MATERIALS | 2018-12-20 |
20180366326 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2018-12-20 |
20180366327 | LASER ANNEALING METHOD, LASER ANNEALING APPARATUS, AND THIN FILM TRANSISTOR SUBSTRATE | 2018-12-20 |
20180366328 | PROCESS INTEGRATION METHOD TO TUNE RESISTIVITY OF NICKEL SILICIDE | 2018-12-20 |
20180366329 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | 2018-12-20 |
20180366330 | SUBSTRATE TREATMENT METHOD FOR SEMICONDUCTOR DEVICE FABRICATION | 2018-12-20 |
20180366331 | UNIFORM CMP POLISHING METHOD | 2018-12-20 |
20180366332 | CONTROLLED RESIDENCE CMP POLISHING METHOD | 2018-12-20 |
20180366333 | BIASED PULSE CMP GROOVE PATTERN | 2018-12-20 |
20180366334 | SUBSTRATE TREATMENT METHOD | 2018-12-20 |
20180366335 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE | 2018-12-20 |
20180366336 | CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING | 2018-12-20 |
20180366337 | METHOD OF ETCHING FILM | 2018-12-20 |
20180366338 | PLASMA ETCHING METHOD FOR SELECTIVELY ETCHING SILICON OXIDE WITH RESPECT TO SILICON NITRIDE | 2018-12-20 |
20180366339 | Chamber Cleaning and Semiconductor Etching Gases | 2018-12-20 |
20180366340 | METHOD FOR MAKING A WELL DISPOSED OVER A SENSOR | 2018-12-20 |
20180366341 | Process for Making Multi-Gate Transistors and Resulting Structures | 2018-12-20 |
20180366342 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2018-12-20 |
20180366343 | CONTROL OF DIRECTIONALITY IN ATOMIC LAYER ETCHING | 2018-12-20 |
20180366344 | MANUFACTURING METHOD OF REDISTRIBUTION LAYER | 2018-12-20 |
20180366345 | WIRE AND METHOD FOR MANUFACTURING THE SAME | 2018-12-20 |
20180366346 | SEMICONDUCTOR DEVICE | 2018-12-20 |
20180366347 | INTEGRATED FAN-OUT PACKAGE HAVING MULTI-BAND ANTENNA AND METHOD OF FORMING THE SAME | 2018-12-20 |
20180366348 | SUBSTRATE DRYING APPARATUS, FACILITY OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF DRYING SUBSTRATE | 2018-12-20 |
20180366349 | Process Chamber and Substrate Processing Apparatus Including the Same | 2018-12-20 |
20180366350 | SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD | 2018-12-20 |
20180366351 | OXYGEN COMPATIBLE PLASMA SOURCE | 2018-12-20 |
20180366352 | METHOD AND DEVICE FOR THE THERMAL TREATMENT OF SUBSTRATES AND HOLDING UNIT FOR SUBSTRATES | 2018-12-20 |
20180366353 | CHIP-BONDING SYSTEM AND METHOD | 2018-12-20 |
20180366354 | IN-SITU SEMICONDUCTOR PROCESSING CHAMBER TEMPERATURE APPARATUS | 2018-12-20 |
20180366355 | SUBSTRATE PROCESSING SYSTEMS, APPARATUS, AND METHODS WITH FACTORY INTERFACE ENVIRONMENTAL CONTROLS | 2018-12-20 |
20180366356 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM | 2018-12-20 |
20180366357 | AUTOMATIC IN-LINE INSPECTION SYSTEM | 2018-12-20 |
20180366358 | SEMICONDUCTOR PROCESSING EQUIPMENT ALIGNMENT APPARATUS AND METHODS USING REFLECTED LIGHT MEASUREMENTS | 2018-12-20 |
20180366359 | METHOD AND APPARATUS FOR DE-CHUCKING A WORKPIECE USING A SWING VOLTAGE SEQUENCE | 2018-12-20 |
20180366360 | ELECTROSTATIC ATTRACTION METHOD | 2018-12-20 |
20180366361 | ELECTROSTATIC CHUCK FOR HIGH TEMPERATURE PROCESSING CHAMBER | 2018-12-20 |
20180366362 | METHOD OF PROCESSING WAFER | 2018-12-20 |
20180366363 | THERMAL PROCESSING SUSCEPTOR | 2018-12-20 |
20180366364 | INTERCONNECT STRUCTURE | 2018-12-20 |
20180366365 | ELECTRONIC CIRCUIT COMPRISING ELECTRICALLY INSULATING TRENCHES | 2018-12-20 |
20180366366 | METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES | 2018-12-20 |
20180366367 | EFFECTIVE SUBSTITUTION OF GLOBAL DISTRIBUTED HEAD SWITCH CELLS WITH CLUSTER HEAD SWITCH CELLS | 2018-12-20 |
20180366368 | METHOD FOR FORMING CONTACT STRUCTURE | 2018-12-20 |
20180366369 | SEMICONDUCTOR STRUCTURE HAVING ETCH STOP LAYER AND METHOD OF FORMING THE SAME | 2018-12-20 |
20180366370 | SELF-ALIGNED INTERCONNECTION FOR INTEGRATED CIRCUITS | 2018-12-20 |
20180366371 | METHOD OF CUTTING WORKPIECE | 2018-12-20 |
20180366372 | INTEGRATED CIRCUIT STRUCTURE WITH STEPPED EPITAXIAL REGION | 2018-12-20 |
20180366373 | SOURCE AND DRAIN EPITAXY RE-SHAPING | 2018-12-20 |
20180366374 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2018-12-20 |
20180366375 | Isolation Manufacturing Method for Semiconductor Structures | 2018-12-20 |
20180366376 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | 2018-12-20 |
20180366377 | ARRAY SUBSTRATE FOR DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | 2018-12-20 |
20180366378 | PLASMA HEALTH DETERMINATION IN SEMICONDUCTOR SUBSTRATE PROCESSING REACTORS | 2018-12-20 |
20180366379 | Edge Seal Configurations For A Lower Electrode Assembly | 2018-12-20 |
20180366380 | SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS | 2018-12-20 |
20180366381 | SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | 2018-12-20 |
20180366382 | CIRCUIT BOARD | 2018-12-20 |
20180366383 | POWER MODULE | 2018-12-20 |
20180366384 | CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | 2018-12-20 |
20180366385 | GLASS INTERPOSER MODULE, IMAGING DEVICE, AND ELECTRONIC APPARATUS | 2018-12-20 |
20180366386 | METHOD AND APPARATUS FOR IMPROVED ETCH STOP LAYER OR HARD MASK LAYER OF A MEMORY DEVICE | 2018-12-20 |
20180366387 | CHIP PACKAGE AND CHIP PACKAGING METHOD | 2018-12-20 |
20180366388 | CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF | 2018-12-20 |
20180366389 | COMPENSATION OF AN ARC CURVATURE GENERATED IN A WAFER | 2018-12-20 |
20180366390 | PRESS MEMBER FOR SEMICONDUCTOR STACK UNIT | 2018-12-20 |
20180366391 | HEAT TRANSFER ASSEMBLY FOR A HEAT EMITTING DEVICE | 2018-12-20 |
20180366392 | LOW CTE COMPONENT WITH WIRE BOND INTERCONNECTS | 2018-12-20 |
20180366393 | CHIP PACKAGING METHOD AND PACKAGE STRUCTURE | 2018-12-20 |
20180366394 | IMPLANT DEVICE AND METHOD OF MAKING THE SAME | 2018-12-20 |
20180366395 | PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF | 2018-12-20 |
20180366396 | Integrated Circuit Package with Pre-wetted Contact Sidewall Surfaces | 2018-12-20 |
20180366397 | SEMICONDUCTOR DEVICE | 2018-12-20 |
20180366398 | BGA PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 2018-12-20 |
20180366399 | MULTI-LAYER MOLDED SUBSTRATE WITH GRADED CTE | 2018-12-20 |
20180366400 | POWER MODULE BASED ON MULTI-LAYER CIRCUIT BOARD | 2018-12-20 |
20180366401 | METHODS AND APPARATUS FOR 3D MIM CAPACITOR PACKAGE PROCESSING | 2018-12-20 |
20180366402 | WIRING STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SAME | 2018-12-20 |
20180366403 | EMBEDDED SILICON SUBSTRATE FAN-OUT TYPE 3D PACKAGING STRUCTURE | 2018-12-20 |
20180366404 | Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnect | 2018-12-20 |
20180366405 | CIRCUIT STRUCTURE | 2018-12-20 |
20180366406 | SEMICONDUCTOR DEVICE STRUCTURES | 2018-12-20 |
20180366407 | OVER-MOLDED IC PACKAGES WITH EMBEDDED VOLTAGE REFERENCE PLANE & HEATER SPREADER | 2018-12-20 |
20180366408 | SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE | 2018-12-20 |
20180366409 | SEMICONDUCTOR DEVICE | 2018-12-20 |
20180366410 | INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME | 2018-12-20 |