51st week of 2017 patent applcation highlights part 73 |
Patent application number | Title | Published |
20170367149 | METHOD FOR MANUFACTURING PLASTIC WINDOW AND PLASTIC WINDOW - A method for manufacturing a plastic window includes a mold preparation step for preparing a first mold, a second mold, and a third mold, a film preparation step for preparing a functional film, a conductive portion, and a bus bar, a placement step for placing the functional film, a first injection step, wherein an intermediate product provided with the cover on the functional film in an integral manner is made, and a second injection step, wherein a product provided with the intermediate product on the second surface in an integral manner is made. The first mold surface has a first forming portion forming the back surface of the cover and a second forming portion forming the second surface of the transparent body. In the placement step, the conductive portion is placed on the second forming portion and the bus bar is placed on the first forming portion. | 2017-12-21 |
20170367150 | WINDOW GLASS HEATING DEVICE - A window glass heating device includes: a battery mounted in a vehicle; a power supply source configured to supply electric power to the battery; a heating wire configured to generate heat upon reception of electric power, the heating wire being disposed to heat a particular part of a window glass of the vehicle; and a control unit configured to control a supply state of electric power supplied to the heating wire. The control unit is configured to: set the supply state to a first state, when the power supply source supplies electric power to the battery; and set the supply state to a second state, when the power supply source does not supply electric power to the battery, the second state being smaller in an amount of electric power supplied to the heating wire than the first state. | 2017-12-21 |
20170367151 | COOKING SUPPORT METHOD AND COOKING SUPPORT SYSTEM - A cooking support method for a cooking support system, for supporting cooking by a user, connected through a network to a thermal image camera installed to take, from obliquely above the cookware, a thermal image of a region including a cookware during cooking and to a notification device capable of notifying the user of information includes: acquiring a thermal image of the region including the cookware at predetermined time intervals from the thermal image camera through the network; calculating a value indicating a change in level of a content in the cookware from the acquired thermal image; and determining whether the calculated value is not less than a predetermined threshold, determining that the content will possibly boil over the cookware when the calculated value is determined as not less than the predetermined threshold, and transmitting notification information to notify the user of the possibility of boil-over to the notification device. | 2017-12-21 |
20170367152 | HEATER AND HEATING DEVICE - A heater according to an embodiment generally includes a base, a protrusion, a heat generating layer, a first protective layer, and an electrode layer. The protrusion protrudes from the base. The heat generating layer is disposed on the protrusion. The first protective layer is disposed on the heat generating layer. The electrode layer is disposed on the base to drive the heat generating layer. | 2017-12-21 |
20170367153 | POWER OPTIMIZATION FOR BATTERY POWERED STREET LIGHTING SYSTEM - A network is disclosed of a plurality of outdoor lighting units. Each lighting unit comprises a light fixture, for example a LED lamp; a power generating means, such as a solar panel or a wind turbine; and a storage means for electric energy, for example a battery. | 2017-12-21 |
20170367154 | LED DRIVER AND LED DRIVING METHOD - A method of driving an LED can include: (i) controlling a main power switch by a control circuit of an LED driver; (ii) turning on an auxiliary power switch when the main power switch is turned on such that a DC bus voltage is provided to the main power switch through the auxiliary power switch, and the main power switch outputs a driving current to a load; (iii) charging a capacitor by the DC bus voltage through the auxiliary power switch when the main power switch is turned off, where the capacitor is charged until a voltage across the capacitor reaches a predetermined stable voltage; (iv) clamping the voltage across the capacitor at the predetermined stable voltage; and (v) using the clamping voltage across the capacitor as a supply voltage for the control circuit. | 2017-12-21 |
20170367155 | REDUCING POWER DISSIPATION IN DRIVER CIRCUITS - In one example, a method includes generating, by a current source of a device, a first portion of a power signal that drives one or more load elements. In this example, a second portion of the power signal is generated by one or more components that are external to the device and are in parallel to the current source such that the second portion of the power signal does not flow through the current source. | 2017-12-21 |
20170367156 | LED Driver Adapted for Gang Boxes - A power and control assembly is disclosed. An LED driver is sized and adapted to fit within a single compartment of an electrical gang box, such as a two-gang box. An alternating current (AC) dimmer or other component is installed in an adjacent compartment. The AC dimmer supplies its output to the LED driver, which converts the AC power to an appropriate direct current (DC) power for LED lighting fixtures. The LED driver is typically recessed into the compartment, and is covered by a switch or another control element. In some cases, the switch may be a mechanical dummy selected for its aesthetic or fascial characteristics. In other cases, the switch or control element may be functional. With similar multiple-gang boxes, a number of drivers may be installed in the gang box and switches may allow both dimming and zone control. | 2017-12-21 |
20170367157 | OPTOELECTRONIC CIRCUIT COMPRISING LIGHT-EMITTING DIODES - An optoelectronic circuit for receiving a variable voltage containing alternating increasing and decreasing phases, the optoelectronic circuit including a plurality of groups of light-emitting diodes and a switching device for allowing or interrupting the circulation of a current through each group, the switching device also being suitable for detecting whether said variable voltage is supplied by a dimmer. | 2017-12-21 |
20170367158 | Linear Lighting with Distributed Onboard Power Conversion and Filtering - A strip of linear lighting with distributed power conversion is disclosed. The linear lighting includes a flexible PCB. The flexible PCB is divided into repeating blocks, which are arranged electrically in parallel with one another between power and ground. Each repeating block includes power conversion and conditioning circuits. A plurality of LED light engines are connected to the outputs of the power conversion and conditioning circuits, electrically in series with one another. The power conversion and conditioning circuits typically include at least a full-bridge rectifier, and a filter may be connected to each of the LED light engines. A pair of conductors run the length of the PCB adjacent to it and are connected to each of the repeating blocks. A flexible, transparent covering surrounds the PCB and pair of conductors. | 2017-12-21 |
20170367159 | CONTROL UNIT FOR A LED ASSEMBLY AND LIGHTING SYSTEM - A control unit for an LED assembly comprising a first and second LED unit, said LED units being serial connected is described. The LED assembly, in use, is powered by a switched mode power supply. The control unit being arranged to receive an input signal representing a desired output characteristic of the LED assembly, determine a first and second duty cycle for respective LED units associated with a nominal current of the switched mode power supply, for providing the desired output characteristic, determine the largest of the first and second duty cycles for respective LED units, determine a reduced current based on at least the largest of the duty cycles, adjust the first and second duty cycle for respective LED units based on the reduced current, provide an output signal for the LED assembly and the switched mode power supply based on the adjusted first and second duty cycles and the reduced current for obtaining the desired characteristic. | 2017-12-21 |
20170367160 | DRIVING SEVERAL LIGHT SOURCES - A device for driving several light sources is provided, wherein the several light sources are arranged in a matrix structure; wherein the several light sources of the matrix structure are connected to a semiconductor device; wherein a portion of the semiconductor device corresponds to a light source of the matrix structure, wherein the portion of the semiconductor device comprises a diagnosis function which when activated is arranged for supplying an output diagnosis signal. | 2017-12-21 |
20170367161 | PERFORMANCE LIGHTING AND CONTROL METHOD - The lighting coordinator of an information handling system may associate quantitative values of a state parameter that describes a state of operation of a component of the information handling system with lighting effects. The lighting effect associated with a quantitative value may be indicative of a range of the quantitative value. The lighting coordinator may receive a signal indicative of a quantitative value of the state parameter and may transmit control signals to generate the lighting effect associated with the quantitative value of the state parameter. The lighting coordinator may receive user input to configure the association of quantitative values of the state parameter with the lighting effects. The lighting coordinator may also represent an attribute of a character or other aspect of a video game by another lighting effect. The components may include a CPU and GPU. | 2017-12-21 |
20170367162 | LED DRIVING CIRCUIT AND PROTECTION CIRCUIT FOR DC/DC CONVERTOR - A protection circuit for an LED driver and a DC/DC converter. The LED driver includes a DC/DC converter and a protection circuit. The DC/DC converter is used to convert the input voltage of the DC voltage input terminal into an output voltage, which comprises a high frequency switch and an inductor. The protection circuit comprises a detection module, a trigger module and a locking module. The detection module is coupled to the inductor for detecting the output voltage and outputting the voltage detection signal. The trigger module is used to receive the voltage detection signal and output a voltage trigger signal when the voltage detection signal is a negative voltage and the absolute value of the negative voltage is greater than or equal to the preset value. The locking module is coupled to the trigger module and stops the high frequency switch from operating after receiving the voltage trigger signal. | 2017-12-21 |
20170367163 | SYSTEMS AND METHODS FOR REMOTELY CONTROLLING AN IMITATION CANDLE DEVICE - Imitation candle devices and systems with enhanced features are described that facilitate remote operation and usage of electronic candles. The disclosed features include application programs running on a processor of a mobile device and a detachable wireless transceiver included within an imitation candle to facilitate the electronic candle to be turned on or off remotely. In some embodiments, when a user blows into the microphone of the mobile device the imitation flame of the electronic candle is moved according to the speed of the blow. In some implementations, parameters such as a flicker speed, a flicker color, a duration of flickering, are changed using signals that are received from the mobile device. | 2017-12-21 |
20170367164 | IDENTIFYING AND CONTROLLING SIGNAL INFLUENCE ON ONE OR MORE PROPERTIES OF EMITTED LIGHT - Systems, and methods are described herein for identifying and/or controlling influence and/or potential influence of one or more signals on one or more properties of light emitted by one or more lighting units ( | 2017-12-21 |
20170367165 | NIGHT-LIGHT AND ALERT SYSTEM - Among other things, a system for lighting a light for an individual rising from a bed is provided. In particular embodiments, the system can include a mat and a light unit wirelessly connected, so that when an individual steps on the mat as he or she rises from the bed a signal is sent to the light unit, activating the light. A weight sensor in the mat can measure the weight placed on the mat, so that unintentional lighting can be avoided and so that weight information can be recorded. Embodiments can also include a signal transmitter to send weight and activation information to a remote receiver. | 2017-12-21 |
20170367166 | CONTROL DEVICE AND METHOD FOR ASSIGNING ID NUMBER - A control device which is connected to luminaires includes: a storage which stores associations between types of luminaires and identification (ID) number ranges for each of the types; an identifying unit which identifies a type of each of the luminaires; and an assigning unit which, by reference to the associations, assigns, to each of the luminaires, an ID number in an ID number range for the type identified by the identifying unit such that, among the luminaires, luminaires of a same type have consecutive ID numbers in the ID number range. | 2017-12-21 |
20170367167 | Beam Trap, Beam Guide Device, EUV Radiation Generating Apparatus, and Method for Absorbing a Beam - The disclosure relates to a beam trap including: a reflector for reflecting a beam, in particular a laser beam, that is incident on a surface of the reflector, and an absorber device for absorbing the beam reflected at the surface of the reflector. The surface of the reflector is segmented and has a plurality of reflector regions that are configured for reflecting a respective partial beam of the incident beam into an absorber region of the absorber device that is associated with the respective reflector region. The disclosure also relates to a beam guide device having a beam trap of this type, an EUV radiation generation apparatus having a beam guide device of this type, and an associated method for absorbing a beam, in particular for absorbing a laser beam. | 2017-12-21 |
20170367168 | THERMALLY ISOLATED THERMIONIC HOLLOW CATHODES - Embodiments relate to a hallow cathode with integral layers of radiation shielding. The hollow cathode includes an inner cathode tube that forms a gas feed to direct gas toward a downstream end, where the directed gas forms plasma. A heater element is positioned at the downstream end of the inner cathode tube, the heater element to heat the plasma. The hollow cathode further includes an outer cathode tube with a keeper electrode to sustain a bias voltage across a gap at a downstream end of the outer cathode tube for igniting the plasma. The integral layers of radiation shielding are connected by offset radial supports and are incorporated as a single element with either the inner or outer cathode tube, where the integral layers are nested with torturous conductive paths to reduce radiation and conduction losses from the downstream end of the inner cathode tube. | 2017-12-21 |
20170367169 | PLASMA PROCESSING APPARATUS AND MICROWAVE OUTPUT DEVICE - A plasma processing apparatus includes: a high voltage power supply for supplying a high voltage power to a magnetron; and a detector for detecting a microwave output from the magnetron, wherein based on a result of comparing a signal, which is obtained by adding an output from the detector to an AC component of a current detected from an output of the high voltage power supply, with a setting value of the output of the high voltage power supply, the output of the high voltage power supply is adjusted. | 2017-12-21 |
20170367170 | TARGET ASSEMBLY AND ISOTOPE PRODUCTION SYSTEM HAVING A GRID SECTION - Target assembly includes a target body having a production chamber and a beam passage. The target body includes first and second grid sections that are disposed in the beam passage. Each of the first and second grid sections has front and back sides. The back side of the first grid section and the front side of the second grid section abut each other with an interface therebetween. The back side of the second grid section faces the production chamber. The target assembly also includes a foil positioned between the first and second grid sections. Each of the first and second grid sections has interior walls that define grid channels through the first and second grid sections. The particle beam is configured to pass through the grid channels toward the production chamber. The interior walls of the first and second grid sections engage opposite sides of the foil. | 2017-12-21 |
20170367171 | Apparatus for mm-wave radiation generation utilizing whispering gallery mode resonators - An apparatus for generating high frequency electromagnetic radiation includes a whispering gallery mode resonator, coupled to an output waveguide through a coupling aperture. The resonator has a guiding surface, and supports a whispering gallery electromagnetic eigenmode. An electron source is configured to generate a velocity vector-modulated electron beam, where each electron in the velocity vector-modulated electron beam travels substantially perpendicular to the guiding surface, while interacting with the whispering gallery electromagnetic eigenmode in the whispering gallery mode resonator, generating high frequency electromagnetic radiation in the output waveguide. | 2017-12-21 |
20170367172 | Modular Deformable Platform - A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene. | 2017-12-21 |
20170367173 | METHOD OF MANUFACTURING DISPLAY DEVICE - Discussed is a method of manufacturing a display device. The method of manufacturing the display device according to one example includes providing a first substrate including a display part, a bending part at one side of the display part, and a pad part at an end of the bending part. The method further includes providing a second substrate facing-coupled to the display part, providing a back film, and adhering the back film to a portion corresponding to the display part and the pad part on a bottom of the first substrate. | 2017-12-21 |
20170367174 | VOLTAGE DIVIDER CIRCUIT ASSEMBLY AND METHOD - A voltage divider circuit assembly includes resistors, an external electrostatic shield, and internal electrostatic shield(s). The resistors are in series with each other between input terminals that receive an input voltage. An external resistor is disposed between sensing terminals that conduct an output voltage that is the input voltage divided by the resistors in the series. The external shield is conductively coupled with the series of the resistors with the external resistor disposed outside of the external shield and the other resistor(s) inside the external shield. The internal shield(s) are conductively coupled with the resistors and disposed inside the external shield. A first internal resistor is disposed inside the external shield and outside of the internal shield(s). One or more remaining resistors are inside the internal shield(s). The shields divide parasitic capacitances to enable the measurement of dynamically changing high voltage input signals. | 2017-12-21 |
20170367175 | ELECTRONIC APPARATUS AND HEAT DISSIPATION AND EMI SHIELDING STRUCTURE THEREOF - An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element. | 2017-12-21 |
20170367176 | VERTICALLY EMBEDDED DISCRETE COMPONENT - Embodiments are directed to a method of embedding a discrete component in a substrate. The method includes forming a cavity in the substrate. The method further includes inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal. The method further includes positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate. The method further includes forming an intermediate conductive material within the cavity and over the top terminal. The method further includes forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal. | 2017-12-21 |
20170367177 | ELECTRICAL INTERFACE FOR PRINTED CIRCUIT BOARD, PACKAGE AND DIE - A circuit board and package assembly electrically connecting a die to a circuit board. The circuit board has signal paths terminating in a signal pad located on an insulating layer. The circuit board also includes a ground pad on the insulating layer that has a concave shaped side forming a recess, the with a signal pad at least partially within the recess. A package has package ground pads aligned with the circuit board ground pads and package signal pads aligned with circuit board signal pads. The package ground pads extend through the package to connect to package ground paths, which extend toward the die. The package signal pads extend through the package to connect to package signal paths and the package signal paths extend toward the die, maintaining a consistent distance from the package ground paths. Multiple-tier bond wires connect the package bond locations to the die bond pads. | 2017-12-21 |
20170367178 | CIRCUIT ARRANGEMENT FOR REDUCING THE MAXIMUM ELECTRICAL FIELD STRENGTH, HIGH VOLTAGE GENERATION UNIT WITH SUCH A CIRCUIT ARRANGEMENT AND X-RAY GENERATOR WITH SUCH A HIGH VOLTAGE GENERATION UNIT - The disclosure specifies a circuit arrangement having electronic first components arranged on a circuit board and lying at high-voltage potential. The circuit arrangement includes functionless, electronic second components lying at high-voltage potential, which are arranged on the circuit board adjacent to the electronic first components, and configured to reduce the maximum electrical field strength between the first components and a reference potential and/or between pads of the circuit board and the reference potential. Through the additional, functionless components, the maximum electrical field strength between electronic components at high voltage and at a reference potential will be reduced. The disclosure also specifies a high voltage generation unit and an x-ray generator. | 2017-12-21 |
20170367179 | FLEXIBLE INTERCONNECT - Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device. | 2017-12-21 |
20170367180 | ARRAY TYPE DISCRETE DECOUPLING UNDER BGA GRID - Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB. | 2017-12-21 |
20170367181 | RESIN SUBSTRATE AND ELECTRONIC DEVICE - A resin substrate includes an insulating substrate, and first and second signal conductors that partially extend in parallel or substantially in parallel with each other along a signal transmission direction. The first signal conductor includes a parallel portion that extends in parallel or substantially in parallel with the second signal conductor along the signal transmission direction, and a first connection portion. In a portion where the first signal conductor and the second signal conductor extend in parallel or substantially in parallel with each other, the first signal conductor and the second signal conductor are disposed at a same position in the thickness direction of the insulating substrate, and the first connection portion is disposed at a different position from the second signal conductor in the thickness direction and a width direction of the insulating substrate. | 2017-12-21 |
20170367182 | LASER DIRECT STRUCTURED MATERIALS AND THEIR METHODS OF MAKING - The present disclosure relates to LDS materials comprising a first coating layer comprising a first LDS additive, and a base substrate, wherein the coating layer contacts the base substrate. Articles formed from the LDS materials are also disclosed that include a conductive path and a metal layer deposited on the activated path. Methods for making the LDS materials and corresponding articles are also described. | 2017-12-21 |
20170367183 | CIRCUIT BOARD WITH VIA CAPACITOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME - A circuit board with via capacitor structure is introduced herein, including a base, a deposition layer, disposed on the base, having at least a via in the deposition layer, at least a thin film capacitor, each thin film capacitor disposed in each via, each thin film capacitor having a body, a second terminal, and a first terminal, the second terminal and the first terminal located on two opposite sides of the body; at least a first electrode, each first electrode electrically connected to the first terminal of each thin film capacitor; and at least a second electrode, each second electrode electrically connected to the second terminal of each thin film capacitor. | 2017-12-21 |
20170367184 | HIGH-FREQUENCY TRANSFORMER - A transformer is configured to include a pair of cores and that each have an inner leg, wherein a primary winding that is wound around a bobbin having a hollow into which the inner legs of the cores and are inserted, and a secondary winding that has a hollow into which the inner legs of the cores and are inserted and that is constituted of a conductor formed by die-cutting a metal plate into a ring, are dispersedly arranged over the inner legs of the cores and. The bobbin has bobbin support portions that come into contact with a surface of a printed circuit board on which the transformer is implemented. | 2017-12-21 |
20170367185 | PRINTED CIRCUIT BOARD INCLUDING A THICK-WALL VIA AND METHOD OF MANUFACTURING SAME - A method of manufacturing a printed circuit board includes providing a printed circuit board (PCB) substrate including at least one insulating layer and first and second conductive layers separated from one another by the at least one insulating layer, forming a first via hole in the PCB substrate extending from the first conductive layer to the second conductive layer, where the first via hole is defined by a first sidewall of the PCB substrate, forming a second via hole in the PCB substrate, where the second via hole is defined by a second sidewall of the PCB substrate, and selectively plating the first sidewall and the second sidewall to form a first via and a second via, respectively, where the first via and the second via have different via sidewall thicknesses. | 2017-12-21 |
20170367186 | MULTILAYER CAPACITOR AND BOARD HAVING THE SAME - A multilayer capacitor include dielectric layers stacked in a direction perpendicular to a mounting surface of a capacitor body, and internal electrodes and an equivalent series inductance (ESL) control pattern formed on upper and lower portions of the dielectric layers, respectively. The internal electrodes have an area larger than that of the ESL control pattern, and the ESL control pattern is exposed to a mounting surface of a capacitor body. | 2017-12-21 |
20170367187 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A multilayer ceramic electronic component includes: a ceramic body including: an active part with dielectric layers interposed with a plurality of first and second internal electrodes; an upper cover part above the active part; a lower cover part below the active part and having a thickness greater than that of the upper cover part; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, wherein the first and second external electrodes are disposed on respective end surfaces of the ceramic body in a length direction and on a lower surface of the ceramic body in a thickness direction and are not disposed on an upper surface of the ceramic body in the thickness direction. | 2017-12-21 |
20170367188 | CAPACITOR COMPONENT - A capacitor component includes a body including a plurality of dielectric layers having a stacked structure and a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with dielectric layers disposed therebetween. A first external electrode is on a first surface and a second surface of the body, on the opposing side of the body, and connected to the plurality of first internal electrodes. A second external electrode is on a third surface and a fourth surface of the body, opposing each other, and connected to one or more of the plurality of second internal electrodes. | 2017-12-21 |
20170367189 | CIRCUIT STRUCTURE - A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face thereof; a conductive member fixed to the other face of the substrate; an electronic component that has first terminals and of a plurality of terminals, that are electrically connected to the conductive member, and a second terminal of the plurality of terminals that is electrically connected to the conductive pattern provided on the substrate; and a relay member for electrically connecting the second terminal and the conductive pattern provided on the substrate, at least a portion of the relay member being fixed to the conductive member via an insulating material. | 2017-12-21 |
20170367190 | Display and Multi-Layer Printed Circuit Board with Shared Flexible Substrate - An electronic device may be provided with a display and a multi-layer printed circuit. Integrated circuits and other components may be mounted to the multi-layer printed circuit. The display and multi-layer printed circuit may share a common layer formed from a flexible substrate. The flexible substrate may have portions that are integrated into the display and portions that are integrated into the multi-layer printed circuit board. The flexible substrate may contain patterned conductive traces that are used to route signals from components in the multi-layer printed circuit to display circuitry such as a display driver integrated circuit. An array of thin-film transistors may be used to control the emission of light from the display and may be formed on portions of the flexible substrate that are integrated into the display. The display may be a flexible display that includes an array of organic light-emitting diodes. | 2017-12-21 |
20170367191 | PRINTED CIRCUIT BOARD - A printed circuit board includes a base layer, a first conductive pattern, and a first surface treatment patterned layer formed on a portion of a surface of the first conductive pattern. The first conductive pattern includes a first copper foil layer on one side of the base layer and a first conductive layer on a portion of a surface of the first copper foil layer. The first conductive pattern which is covered by the first surface treatment patterned layer has sidewalls obliquely tilted with respect to the base layer. The first conductive pattern covered with the first surface treatment patterned layer has a cross section that is trapezoidal shaped, and a width which gradually decreases from the base layer to the first conductive layer. | 2017-12-21 |
20170367192 | METHOD FOR COATING DEVICES AND RESULTING PRODUCTS - A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm. | 2017-12-21 |
20170367193 | METHOD FOR COATING A DEVICE AND DEVICES HAVING NANOFILM THEREON - A device includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm. | 2017-12-21 |
20170367194 | METHOD FOR COATING DEVICE AND RESULTING DEVICE - A method includes steps of forming an inner coating on an object and forming an outer coating in contact with the inner coating. A first solution including metal oxide nanoparticles and a first solvent is applied onto the object. The first solvent is removed to form the inner coating with the metal oxide nanoparticles. A second solution having silicon dioxide nanoparticles and a second solvent is applied onto the object. The second solvent is removed to form the outer coating with the silicon dioxide nanoparticles. The interfacial binding force between the metal oxide nanoparticles and the silicon dioxide nanoparticles is then strengthened, for example, by applying a third solution such as water, ethanol or a mixture thereof to the inner coating and the outer coating. | 2017-12-21 |
20170367195 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - The manufacturing method includes (a) preparing first printed circuit board and second printed circuit board, the first printed circuit board being provided with a plurality of first terminals, the second printed circuit board being provided with a plurality of second terminals, and the first terminals or the second terminals being coated with solders; and (b) connecting the first terminals and the second terminals, respectively, via respective solders by performing thermocompression on connecting portions of the first printed circuit board and the second printed circuit board. Each second terminal includes a first end portion and a second end portion in a long axis direction, and in the step (b), pressure is applied to each second terminal such that the height of each of the first end portion and second end portion is larger than the height in another portion of the second terminal. | 2017-12-21 |
20170367196 | ELECTRICAL CONTACTS IN LAYERED STRUCTURES - Provided herein are layered structures and methods for forming the same, the layered structures including a conductive layer and an overcoat layer formed on a surface thereof, one or more electrical contacts formed on the surface of the conductive layers and via openings extending through the overcoat layer and reaching the electrical contacts. | 2017-12-21 |
20170367197 | MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD - A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes. | 2017-12-21 |
20170367198 | Rollable Display - A rollable display includes a flexible display panel that can be rolled up and down, a back cover that rolls up and down along with the flexible display panel, with one edge fixed to one edge of the flexible display panel, and a flexible magnet fixed to either the flexible display panel or the back cover and interposed between the flexible display panel and the back cover. | 2017-12-21 |
20170367199 | ELECTRICAL UNIT - An electrical unit ( | 2017-12-21 |
20170367200 | Mechatronic Component and Method for the Production Thereof - The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side . A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly. | 2017-12-21 |
20170367201 | WATERPROOF CASE - A protective case for an electronic device includes a main housing and a lid. The main housing and lid are removably joined to define a water tight volume receiving an electronic device. The electronic device includes an earpiece having a speaker and microphone positioned thereon. The lid includes an earpiece port formed therein proximate the earpiece of the electronic device. A membrane assembly is attached to the lid by a compliant adhesive, the membrane assembly transmitting sound to the ear piece port. A noise isolating assembly attached to the lid. The noise isolating assembly is positioned about a periphery of the earpiece isolating the earpiece from an additional sound source. | 2017-12-21 |
20170367202 | DISPLAY DEVICE - A display device includes a front frame, a display module installed in the front frame, and a rear cover connected with the front frame. The front frame includes a plurality of securing rods connected one by one. Each securing rod defines a receiving groove and a plurality of grabs. The display module includes a plurality of limiting plates. The rear cover includes a plurality of latch blocks. The limiting plate is received in the receiving groove. The latch block is inserted into the grab. | 2017-12-21 |
20170367203 | ELECTRONIC APPARATUS HAVING A DOOR STRUCTURE FOR ACCESSING COMMUNICATION SOCKET - The present application discloses an electronic apparatus including an apparatus frame having an aperture; a door movably secured to the apparatus frame and configured to be movable between a first position at which the aperture is accessible and a second position at which the aperture is substantially closed; and a communication socket at least partially enclosed by the apparatus frame; the communication socket having a plurality of communication terminals configured to be accessible for electrical connection with an external apparatus through the aperture. The communication socket includes a first member, the door includes a second member, the first member and the second member being magnetically attractive to each other and cooperatively configured to secure the door in the second position. | 2017-12-21 |
20170367204 | HERMETIC STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A hermetic structure includes a hermetic body having a through-hole passing through a high pressure side and a low pressure side, the through-hole having a tapered portion whose diameter increases from the low pressure side toward the high pressure side, a conductor inserted through the through-hole, a protector component fit in the tapered portion, the protector component having a hole for inserting the conductor, and a glass member provided in the through-hole, on the low pressure side from the protector component, so as to seal the conductor. | 2017-12-21 |
20170367205 | HERMETIC SEALING LID MEMBER AND ELECTRONIC COMPONENT HOUSING PACKAGE - This hermetic sealing lid member ( | 2017-12-21 |
20170367206 | ELECTRONIC DEVICE - An electronic device is provided, including a first circuit board, a second circuit board, a supporting member, and a first locking member. The first circuit board has a first hole. The second circuit board has a second hole, a pin, and a metal connector, wherein the pin is connected to the first circuit board. The supporting member has a first portion disposed in the first hole, a second portion, and a screw hole extending from the first portion to the second portion, wherein the diameter of the first portion is less than that of the second portion. The first locking member passes through the second hole and enters the screw hole to affix the second circuit board to the supporting member. The second portion is disposed between the first circuit board and the second circuit board to form a gap therebetween. | 2017-12-21 |
20170367207 | RACK SYSTEM AND SLIDE RAIL ASSEMBLIES THEREOF - A rack system includes first and second slide rail assemblies mounted respectively on first and second posts of a rack. The first and second posts define a width therebetween. Each slide rail assembly includes a first rail with a first channel, a second rail displaceable with respect to the first rail, and a third rail movably provided between the first channel of the first rail and the second rail. The first rail of each slide rail assembly has a rail-thickness-wise cross section outside the space in which the width defined by the rack extends, whereas the second and third rails of each slide rail assembly are within the space in which the width defined by the rack extends. | 2017-12-21 |
20170367208 | RAIL-MOUNTED CONTROL SYSTEM WITH IMPROVED COOLING - A control system for mounting to a vertically-extending rail. The control system includes a plurality of bases, each having a channel formed therein that is adapted for mounting to the rail. A plurality of modules are provided for removable mounting to the bases, respectively. Each module has circuitry for processing control signals and a housing enclosing the circuitry. At least a bottom end of each housing has openings therein to permit air to flow into the housing and over the circuitry. A plurality of air flow deflectors are provided for mounting to the bases, respectively. When the modules and the air flow deflectors are mounted to the bases, the air flow deflectors form pockets with the bottom ends of the modules. The pockets have enlarged openings disposed parallel to sides of the modules. | 2017-12-21 |
20170367209 | Top-Down/Bottom-Up Enclosure Cabling - Mechanisms are provided for cabling a set of enclosures. Using a set of cables that comprises eight physical layers (PHYs), the set of enclosures are coupled together such that: for a first enclosure and each intermediate enclosure in the set of enclosures, at least four PHYs of the eight PHYs terminate within a Serial Attached Small Computer System Interface (SCSI) (SAS) expander of the first enclosure and a SAS expander of each intermediate enclosure white passing through a remaining four PHYs of the eight PHYs without connecting to the respective SAS expander; and, for a last enclosure in the set of enclosures, all of the eight PHYs terminate in the SAS expander of the last enclosure. | 2017-12-21 |
20170367210 | INDIVIDUAL FRONT HOT-PLUGGABLE POWER SUPPY UNIT WITH CABLE ROUTING - Server rack assembly having a chassis and two or more power supply units configured to be received within the chassis. Each power supply unit configured to be coupled with a power distribution unit by a power cord and having an aperture formed on a front surface to receive the power cord. A chassis channel formed within the chassis to receive each power cord extending substantially the length of the chassis. Each of the two or more power supply units can be independently removable from the chassis. | 2017-12-21 |
20170367211 | STRUCTURAL ELECTRICAL GROUNDING FOR DATA MANAGEMENT SYSTEMS AND RELATED METHODS - A data management system includes a chassis metalwork that is electrically conductive. The chassis metalwork is electrically coupled to the power supply to form a return power path. The return power path may include a sub-chassis frame and a drawer frame. The return power path may also include uninsulated return power cables. The return power cables may be maintained in a cable chain along with outgoing power cables and data cables. The return power cables may be coupled to the drawer frame and the sub-chassis frame. | 2017-12-21 |
20170367212 | LATCH ASSEMBLY FOR A COMPUTING DEVICE - A computing device is disclosed. The example computing device includes an enclosure that houses an electrical component. The example computing device also includes a latch assembly disposed on the enclosure, the latch assembly to facilitate coupling the enclosure to a rack. The latch assembly includes an antenna which is communicatively coupled to the electrical component. | 2017-12-21 |
20170367213 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device, including preparing a heat-dissipating base, performing a first initial warping or a second initial warping of the heat-dissipating base, soldering a laminated substrate, including a circuit board provided on an insulating board, on the heat-dissipating base after the first or second initial warping, and soldering a semiconductor chip on the circuit board. The first initial warping includes performing shot peening on the rear surface of the heat-dissipating base to form a hardened layer, and subsequently plating the front and rear surfaces of the heat-dissipating base, including the hardened layer formed thereon, with a metal material. The second initial warping includes plating the front and rear surfaces of the heat-dissipating base with the metal material to form a plating layer, and subsequently performing the shot peening on the rear surface of the heat-dissipating base, including the plating layer formed thereon, with the metal material. | 2017-12-21 |
20170367214 | DISPLAY MODULE WITH INTEGRATED THERMAL MANAGEMENT STRUCTURE - Described herein is a display module for an electronic device having a thermal management structure integrated on a backside of the display module. Also described herein are techniques for manufacturing a display module with an integrated thermal management structure. By integrating the thermal management structure on the backside of the display module, the display module itself becomes a passive thermal management solution for an electronic device. Accordingly, the thermal management structure described herein can be considered a part of the display component stack. | 2017-12-21 |
20170367215 | COOLING SYSTEMS AND SYNTHETIC JETS CONFIGURED TO HARVEST ENERGY AND VEHICLES INCLUDING THE SAME - A cooling system includes a diaphragm, at least one conductor layer disposed on the diaphragm, at least one dielectric film layer, and a controller. The controller is programmed to operate the cooling system in a contact mode and in a non-contact mode. In the contact mode, the diaphragm is controlled to oscillate at a first amplitude such that the conductor layer contacts the dielectric film layer. In the non-contact mode, the diaphragm is controlled to oscillate at a second amplitude such that the conductor layer does not contact the dielectric film layer while the diaphragm oscillates. | 2017-12-21 |
20170367216 | WATER COOLING DEVICE - The present invention relates to a water cooling device which comprises a liquid storing shell body having a liquid chamber and a pump having a stator and a rotor. The stator has a coil set disposed electrically on a circuit board. The circuit board and the coil set thereon are both disposed on at least one inner wall of the liquid chamber or integrally overmolded in the liquid storing shell body. The rotor and a propeller oppositely connected to the rotor are received in the liquid chamber and exposed in the cooling liquid. The propeller is provided with a plurality of blades made of metal. At least one magnetic pole region is magnetized on each of the blades opposite to the coil set. Therefore, a thinning effect can be achieved. | 2017-12-21 |
20170367217 | Liquid Cooling Radiation System and Liquid Radiator Thereof - Disclosed is a liquid cooling radiation system. The technical solution used by the present invention to solve the technical problem is: the liquid cooling radiation system comprises: a radiation device, comprising cooling pipes and a radiation structure device arranged on the cooling pipes; a pumping device, integrally arranged between the cooling pipes and generating power so that a coolant circulates within the cooling pipes; a heat absorption device, attached to a heating device and having a heat conduction effect with the heating device; a pipeline, used for connecting the radiation device and the heat absorption device. On the basis of existing products, the present invention utilises a solution wherein a liquid pump main body and a radiator are integrally arranged together. Thus, the radiation of a fan is used to take away heat on the radiator and heat generated by a pump power main body (i.e. a motor) itself is also taken away, thereby extending the service life of the motor. In addition, the occupied space is significantly reduced, the heat transfer effect is significantly improved, and the production and assembly costs are reduced, so that product assembly is convenient and efficiency is high. | 2017-12-21 |
20170367218 | HEAT EXCHANGER INCLUDING PASSAGEWAYS - A heat exchanger includes a core defining a first passageway and a second passageway. The core includes a plurality of unit cells coupled together. Each unit cell of the plurality of unit cells includes a first wall and a second wall. The second wall is spaced from the first wall. The first wall at least partially defines a first passageway portion and a second passageway portion. The second wall at least partially defines the second passageway portion. The second wall extends about the first wall such that the first passageway portion is nested within the second passageway portion. | 2017-12-21 |
20170367219 | VAPOR CHAMBER STRUCTURE - A vapor chamber structure includes a main body, a fan and perforations. The main body has a heat absorption section, a heat dissipation section and a chamber. The heat absorption section and the heat dissipation section are respectively horizontally disposed on left and right sides of the main body. The heat absorption section is attached to at least one heat source. The chamber is positioned at the heat absorption section and partially extends to the heat dissipation section. The chamber has a capillary structure and at least one perforated section. The perforated section is connected between an upper side and a lower side of the chamber. The fan is disposed on one side of the heat dissipation section. The perforations are formed through the parts of the main body, which parts are free from the chamber and the parts of the main body, where the perforated section is disposed. | 2017-12-21 |
20170367220 | MOTOR CONTROLLER AND FAN SYSTEM COMPRISING THE SAME - A fan system including a volute, a wind wheel, a motor, and a motor controller. The motor controller includes a control box including a plurality of fins for dissipating heat of the motor controller, and controls the operation of the motor to drive the wind wheel. The wind wheel is adapted to suck ambient air to form an air flow which passes through the plurality of fins. | 2017-12-21 |
20170367221 | THERMAL MANAGEMENT SYSTEM FOR AN AIRCRAFT AVIONICS BAY - A system for managing heat transfer is provided by the present disclosure, which in one form includes a cavity having an inner wall portion, at least one heat-generating component disposed within the cavity, and a plurality of heat conducting members disposed adjacent one another. Each heat conducting member includes a resilient core and an outer shell wrapped around at least a portion of the resilient core. The outer shell is made of a material having a relatively high thermal conductivity, and the plurality of heat conducting members are positioned between the heat-generating component and the inner wall portion of the cavity. | 2017-12-21 |
20170367222 | LIQUID-ASSISTED AIR COOLING OF ELECTRONIC RACKS WITH MODULAR FAN AND HEAT EXCHANGERS - An electronic rack includes a stack of one or more information technology (IT) components disposed therein to form a frontend and a backend of the electronic rack. The electronic rack further includes a fan unit detachably mounted on the backend of the electronic rack. The fan unit generates an air flow flowing from the frontend to the backend past through an air space of the stack of IT components to reduce a temperature of the IT components. The electronic rack further includes a heat exchange unit detachably mounted on the backend of the electronic rack to exchange heat generated from the IT components. The heat exchange unit includes one or more tubes forming a heat exchange screen. The one or more tubes allow a cool liquid to travel therein to exchange the heat carried by the air flow past through the heat exchange screen. | 2017-12-21 |
20170367223 | MIXING CHAMBER FOR AIR HANDLING IN AN INFORMATION HANDLING SYSTEM - A mixing module may be used in a modular data center to provide cooling of air by mixing exterior environment air with warm air exhausted from information handling systems in other modules of the modular data center. The mixing module may include a mixing aisle that provides a low-impedance path for warm and cool air to mix and for a homogenous air mass for cooling IT equipment. The mixing aisle may be divided into two portions separated by dampers to allow for control over the mixing of air in the mixing aisle. The dampers in the mixing aisle, as well as dampers on an intake and exhaust from the mix module, may be controlled to obtain a desired temperature and/or humidity level. | 2017-12-21 |
20170367224 | SHIELD STRUCTURE FOR STORING ELECTRONIC CIRCUIT, AND ELECTRONIC DEVICE - A shield structure includes a main body portion and a lid portion. An electronic circuit is stored in the main body portion. The lid portion is attached to the main body portion in a detachable manner, and includes a first contact portion. The main body portion includes an opening portion, a second contact portion, and a pressurizing portion. When the first contact portion moves in a direction perpendicular to a direction of the lid portion attached to the main body portion, in a state of being inserted in the opening portion, the first contact portion is elastically deformed in a first direction by contacting the second contact portion and comes into pressure contact with the second contact portion. When the first contact portion is inserted in the opening portion, the pressurizing portion contacts and pressurizes the first contact portion in a second direction opposite to the first direction. | 2017-12-21 |
20170367225 | METHOD OF PROVIDING COMPARTMENT EMI SHIELDS ON PRINTED CIRCUIT BOARD USING A VACUUM - A method is provided for forming an internal electromagnetic interference (EMI) shield in a mold cap formed over a printed circuit board (PCB). The method includes forming a trench in the mold cap, the trench extending continuously from a first edge of the mold cap to a second edge of the mold cap, where the trench defines a trench pattern corresponding to desired locations of the internal EMI shield. The method further includes sealing an elastomeric pad on a top surface of the mold cap to form a channel, the channel including at least the trench formed in the mold cap; and filling the channel with a conductive epoxy using a vacuum configured to draw the conductive epoxy from a dispenser, connected to the first edge of the mold cap, through the channel to the second edge of the mold cap based on pressure differential. | 2017-12-21 |
20170367226 | CARRIER TAPE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING RFID TAG - A method for manufacturing a carrier tape housing a plurality of electronic components with seal materials includes forming housing holes in tape-shaped main body with first and second principal surfaces along a longitudinal direction of the tape-shaped main body, the housing holes penetrating from the first principal surface to the second principal surface, affixing an adhesive layer of a tape-shaped seal material to the second principal surface of the tape-shaped main body to cover the housing holes, forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions, and providing chip-shaped electronic component into each of the housing holes of the tape-shaped main body and fixing the electronic component to the adhesive layer of the seal material exposed in each of the housing holes. | 2017-12-21 |
20170367227 | COMPONENT PLACEMENT MACHINE AND ATTACHMENT - A component placement machine which picks up a component supplied by a tape feeder and installs the component on a board, includes a block part that includes a fitting hole to which a protrusion extending to a rear side from the tape feeder is fitted and a connection member that is provided in the block part, and connects the protrusion to the block part by elastically pressing a side surface of the protrusion fitted to the fitting hole. | 2017-12-21 |
20170367228 | Component Stability Structure - An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board. | 2017-12-21 |
20170367229 | INSPECTION APPARATUS AND COMPONENT MOUNTING SYSTEM HAVING THE SAME - A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step. | 2017-12-21 |
20170367230 | Apple Tree Named 'Luiza' - ‘Luiza’ apple tree ( | 2017-12-21 |
20170367231 | Apple Tree Named 'Venice' - ‘Venice’ apple tree ( | 2017-12-21 |
20170367232 | Acer palmatum tree named 'Chacer01' - A new and distinct | 2017-12-21 |
20170367233 | Loropetalum plant named 'Gekkou' - A new and distinct | 2017-12-21 |
20170367234 | Lagerstroemia plant named 'Like a Latte' - The new and distinct crape myrtle plant named | 2017-12-21 |
20170367235 | LAGERSTROEMIA PLANT NAMED 'SWEET MACCHIATO' - The new and distinct crape myrtle plant named | 2017-12-21 |
20170367236 | Chysanthemum plant named 'CIFZ0034' - A new garden type | 2017-12-21 |
20170367237 | Pelargonium plant named 'KLEPZ16424' | 2017-12-21 |
20170367238 | Pelargonium plant named 'KLEPP16382' | 2017-12-21 |
20170367239 | Pelargonium plant named 'KLEPP16381' | 2017-12-21 |
20170367240 | Hosta plant named 'Beyond Glory' - A new and distinct | 2017-12-21 |
20170367241 | Hosta plant named 'Angel Falls' - The new and distinct | 2017-12-21 |
20170367242 | Spathiphyllum plant named 'SPAMOBLA' - A new and distinct cultivar of | 2017-12-21 |
20170367243 | Anthurium plant named 'ANTHEUBP' - A new compact | 2017-12-21 |
20170367244 | Guzmania plant named 'Primavera' - A new and distinct cultivar of | 2017-12-21 |
20170367245 | Monarda plant named 'Rockin' Raspberry' - The new and distinct cultivar of ornamental cultivar of bee balm plant named | 2017-12-21 |
20170367246 | MONARDA PLANT NAMED 'COTTON CANDY' - The new and distinct cultivar of ornamental cultivar of bee balm plant named | 2017-12-21 |
20170367247 | Sutera plant named 'G13340' - A new and distinct cultivar of | 2017-12-21 |