52nd week of 2020 patent applcation highlights part 80 |
Patent application number | Title | Published |
20200404802 | VAPOR CHAMBER, ELECTRONIC DEVICE, METALLIC SHEET FOR VAPOR CHAMBER AND MANUFACTURING METHOD OF VAPOR CHAMBER - A liquid flow path portion of a vapor chamber according to the present invention includes a plurality of main flow grooves which each extend in the first direction and through which working fluid in liquid form passes. A convex array which includes a plurality of liquid flow path convex portions arranged in the first direction via a communicating groove, is provided between a pair of the main flow grooves adjacent to each other. Each of the communicating grooves allows communication between the corresponding pair of the main flow grooves. The width of the communicating groove is larger than the width of the main flow groove. | 2020-12-24 |
20200404803 | CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX - A circuit assembly includes a substrate having a thermally conductive portion that passes through a substrate in the plate-thickness direction thereof, and that includes an electrically conductive path. A semiconductor package is mounted to the substrate and includes a chip. A resin portion covers the chip. A first lead portion is connected to the chip and is exposed on the substrate side of the resin portion. A second lead portion is connected to the chip and is exposed to the side opposite to the substrate side of the resin portion. A heat dissipating member is arranged facing the side opposite to the semiconductor package with respect to the substrate and is connected to the thermally conductive portion in such a way as to conduct heat. An electrically conductive member connects the second lead portion and the thermally conductive portion. | 2020-12-24 |
20200404804 | SYSTEM, METHOD, AND APPARATUS FOR INTEGRATING HIGH POWER DENSITY POWER ELECTRONICS ON A MOBILE APPLICATION - A motor drive converter includes a cold plate having a first side and a second side, the first side being opposite to the second side. The motor drive converter may further include at least one motor phase power electronics disposed on the first side of the cold plate, and a capacitor array disposed on the second side of the cold plate. The cold plate may include slots therethrough for a conductor to pass through the cold plate. The conductor may be configured to electrically coupling the capacitor array and the at least one motor phase power electronics. | 2020-12-24 |
20200404805 | ENHANCED COOLING DEVICE - A cooling device can include an evaporation chamber in fluid connection with a condensing chamber through one or more vapor channels and one or more liquid channels, the evaporation chamber being at a bottom of the cooling device and the condensing chamber being above the evaporation chamber. A cooling member of the device can be thermally connected to and located above the condensing chamber or the condensing chamber and cooling member can be designed as one unit. A fluid can be disposed and trapped in the connected chambers to undergo phase changes due to heat transfer. During operation, the fluid extracts heat and changes phase from liquid to vapor. The vapor travels up the one or more vapor channels into the condensing chamber where the vapor is cooled and changes phase to liquid. The liquid travels down the one or more liquid channels back to the evaporation chamber. | 2020-12-24 |
20200404806 | CRYOGENIC PACKAGING FOR THERMALIZATION OF LOW TEMPERATURE DEVICES - A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip. | 2020-12-24 |
20200404807 | HEAT SINK MODULE AND MANUFACTURING METHOD THEREOF - In a heat sink module and a manufacturing method thereof, the method includes steps of: forming a heat dissipation fin set by aluminum extrusion process, wherein the heat dissipation fin set includes a plate, a plurality of fins extending from one side of the plate and being arranged spaced apart from one another, and a joint portion formed on the other side of the plate; placing the plate in a mold; injecting molten metal into the mold; forming a base by die-casting of the molten metal. The plate and the joint portion are wrapped by the base. The joint portion forms a connection structure including a bump and a notch fitted with the bump, so as to connect and fix the base and the heat dissipation fin set. The heat sink module has the strengthened connection structure and the fins with a superior aspect ratio. | 2020-12-24 |
20200404808 | HEAT RADIATING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME - An electronic device according to various embodiments of the present invention may comprise: a housing including a front plate, a rear plate oriented in a direction opposite to the front plate, and a side member for surrounding a space between the front plate and the rear plate; a display exposed to the outside through the front plate, wherein the side member includes at least one through hole; a middle plate disposed between the display and the rear plate and including a surface oriented toward the rear plate; and a speaker structure disposed in the space which is adjacent to the through hole and is disposed between the middle plate and the rear plate, wherein the speaker structure includes: a metal plate attached to the surface of the middle plate; a yoke disposed apart from the metal plate toward the rear plate; a heat conducting member (TIM) disposed between and in contact with the metal plate and the yoke; and a vibration plate disposed apart from the yoke toward the rear plate; and a magnet disposed between the yoke and the vibration plate. Various other embodiments may also be possible. | 2020-12-24 |
20200404809 | CARBON NANOTUBE-BASED THERMAL INTERFACE MATERIALS AND METHODS OF MAKING AND USING THEREOF - Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs). | 2020-12-24 |
20200404810 | MULTI-COMPARTMENT ELECTRICAL APPARATUS WITH SHARED COOLING ASSEMBLY - An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow. | 2020-12-24 |
20200404811 | LIQUID-COOLED COLD PLATE DEVICE - The present disclosure discloses a liquid-cooled cold plate device, comprising a microchannel cold plate for dissipating heat of the electronic system, at least two microchannel groups, disposed inside the microchannel cold plate; at least one liquid inlet, provided on the microchannel cold plate and used for the cooling liquid to flow in; at least one liquid outlet provided on the microchannel cold plate and used for the cooling liquid to flow out; the cooling liquid entering the liquid inlet is divided into one cooling liquid branch; the cooling liquid branch flows bidirectionally through the microchannels group. The present disclosure uses a combination of microchannel cold plates and microchannel groups, greatly improves the heat dissipation efficiency, reduces the influence of thermal cascade, thus is beneficial to the efficient heat dissipation of electronic system. | 2020-12-24 |
20200404812 | COOLING MODULE DESIGN FOR SERVERS - In one embodiment, a cooling module includes a base frame, a fluid supply channel disposed on the base frame to receive cooling fluid from an external cooling fluid source, a fluid return channel disposed on the base frame to return the cooling fluid, multiple cold plates disposed on the base frame, wherein the cold plates are to be attached to a plurality of data processing modules. The cooling module also includes multiple distribution channels to distribute the cooling fluid received from the fluid supply channel to the cold plates to exchange heat generated by the heat generating modules and to return the cooling fluid carrying the exchanged heat back to the external cooling fluid source via the fluid return channel. The base frame, the fluid supply and return channels, the fluid distribution channels, and the cold plates are integrated as a single integrated cooling unit. | 2020-12-24 |
20200404813 | COOLING SYSTEM DESIGN FOR DATA CENTERS - In one embodiment, a data center cooling system includes one or more information technology (IT) rooms having multiple electronic racks that generate heat. An external cooling unit is positioned above the IT rooms and is configured to provide cooling fluid and to exchange heat carried by the cooling fluid. The external cooling unit has a supply line to distribute cooling fluid downwardly to the IT rooms. As the cooling fluid cools the electronic racks, the cooling fluid heats up and at least partially turns to vapor which rises due to convection. The external cooling unit also has a return line to return the rising vapor to the external cooling unit, which cools the vapor. The vapor changes phase to liquid and is recirculated to the IT rooms. | 2020-12-24 |
20200404814 | EMP Protection for Structures Having Coal Combustion Residual Components - An electromagnetic emission shield for protecting a facility having a volume comprised of coal combustion residue. The shield includes a carbon-based material positioned inside an interior space of the coal combustion residue proximate to and interposed between a potential source of electromagnetic emission and the facility. | 2020-12-24 |
20200404815 | ELECTRONIC DEVICE HAVING SHIELD CAN STRUCTURE - An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component. The conductive shield can structure may include: a first conductive plate including a first edge portion, a second edge portion spaced apart from the first edge portion, and a third edge portion extending between the first and second edge portions, and in top view of the one face of the printed circuit board, including a first flat portion parallel to the printed circuit board and constructing a recess together with the first to third edge portions; a second conductive plate including a fourth edge portion extending substantially parallel to the third edge portion, and in top view of the one face of the printed circuit board, including a second flat portion to be attached to the first flat part while at least partially overlapping the first flat portion; a first side portion extending along the first edge portion and substantially vertical to the first flat portion; a second side portion extending along the second edge portion and substantially vertical to the first flat portion; and a third side portion bent from the fourth edge portion while surrounding the third edge portion, and substantially vertical to the first flat portion. | 2020-12-24 |
20200404816 | High-Frequency Module - A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board. | 2020-12-24 |
20200404817 | MOUNTING DEVICE AND MOUNTING METHOD - A mounting device for executing a mounting process of mounting a component on a board includes: a mounting head that includes at least one pickup section for picking up the component and moves the picked up component; a storage section configured to store at least a first correction value determined at a first position on XYZ axes on which the mounting head works and a second correction value determined at a second position different from the first position; and a control section configured to execute the mounting process by using the first correction value and/or the second correction value stored in the storage section. | 2020-12-24 |
20200404818 | COMPONENT REPLENISHMENT MANAGEMENT SYSTEM AND COMPONENT MOUNTING SYSTEM - This component replenishment management system is provided with an acquisition unit, a setting unit, a component supply monitoring unit, and a replenishment target specifying unit. The acquisition unit acquires a management start time for replenishing reels corresponding to each of a plurality of component supply devices. The setting unit sets a specified period until a specified time after a predetermined specified length of time has elapsed from the management start time. The component supply monitoring unit specifies, for each component supply device, a replenishment possibility time at which said component supply device can be replenished with a new reel. The replenishment target specifying unit specifies a component supply device in which the replenishment possibility time is an earlier time than the specified time as a component replenishment target device to be replenished with a new reel within the specified period. | 2020-12-24 |
20200404819 | COMPONENT REPLENISHMENT MANAGEMENT APPARATUS, COMPONENT MOUNTING SYSTEM AND COMPONENT REPLENISHMENT MANAGEMENT METHOD - The attachment possible period during which the attachment operation of the component supply reel can be performed is predicted for each of the tape feeders equipped in the component mounting apparatus, and the attachment time indicating a timing of the attachment operation is set to overlap the attachment possible periods of the candidate feeders, out of the tape feeders. Therefore, a frequency of the component replenishment operation of the operator can be suppressed. Further, the execution mode of the attachment operation for the candidate feeder corresponding to the attachment time is determined based on the number of the components planned to be supplied in accordance with the production planning by the candidate feeder. Therefore, a number of the components suitable for the production planning of the components-mounted boards can be replenished. | 2020-12-24 |
20200404820 | COMPONENT MOUNTING SYSTEM AND COMPONENT GRASPING METHOD - A component mounting system comprising: a stage configured to scatter components; a holding tool configured to move over the stage and hold components from the stage; a storage device configured to store positional information of components on the stage that the holding tool failed to hold; and a control device configured to control the operation of the holding tool so that components are held while excluding components in the positional information stored in the storage device from becoming holding targets. | 2020-12-24 |
20200404821 | AVOCADO TREE NAMED 'SHSR-04' - A new and distinct cultivar of Avocado tree named ‘SHSR-04’ is disclosed. The new variety is characterized by forming greyed-purple colored young leaves, providing ovoid shaped fruit which is rounded at the stalk end, and exhibiting high resistance to | 2020-12-24 |
20200404822 | Grapevine plant named 'IFG Forty-four' - This invention is a new and distinct grapevine variety denominated ‘IFG Forty-four’. The new grapevine is characterized by producing small naturally seedless reddish black berries having an ellipsoid shape with a Concord like labrusca flavor. Fruits normally ripen early-season, about mid to late July near Delano Calif. Fruits are fairly low in acidity, with a soft to slightly firm texture. Berries color readily even in hot climatic conditions and produce completely colored dark reddish black berries. Vines are very productive and can be pruned to short spurs. | 2020-12-24 |
20200404823 | Potentilla plant named 'Minjau03' - A new and distinct cultivar of | 2020-12-24 |
20200404824 | Potentilla plant named 'Mincrero04' - A new and distinct cultivar of | 2020-12-24 |
20200404825 | Potentilla plant named 'Mincrero01' - A new and distinct cultivar of | 2020-12-24 |
20200404826 | Anigozanthos plant 'Ramboprise' - A new and distinct cultivar of | 2020-12-24 |