52nd week of 2008 patent applcation highlights part 17 |
Patent application number | Title | Published |
20080315386 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first semiconductor package, a second semiconductor package. The first semiconductor package includes a first semiconductor package base having a first cavity formed therein, a first mount component mounted in the first cavity, and a first magnet disposed on the first semiconductor package base. The second semiconductor package includes a second semiconductor package base having a second cavity formed therein, a second mount component mounted in the second cavity, and a second magnet disposed on the second semiconductor package base so as to adsorb the first magnet. The first semiconductor package and the second semiconductor package are stacked by an adsorption of magnetic force between the first magnet and the second magnet. | 2008-12-25 |
20080315387 | Semiconductor Package-on-Package System Including Integrated Passive Components - A semiconductor system ( | 2008-12-25 |
20080315388 | VERTICAL CONTROLLED SIDE CHIP CONNECTION FOR 3D PROCESSOR PACKAGE - In some embodiments, vertical controlled side chip connection for 3D processor package is presented. In this regard, an apparatus is introduced having a substrate, a substantially horizontal, in relation to the substrate, integrated circuit device coupled to the substrate, and a substantially vertical, in relation of the substrate, integrated circuit device coupled to the substrate and adjacent to one side of the substantially horizontal integrated circuit device. Other embodiments are also disclosed and claimed. | 2008-12-25 |
20080315389 | Bumpless Flip-Chip Assembly With a Complaint Interposer Contractor - Consistent with an example embodiment, an integrated circuit device (IC) is assembled on a package substrate and encapsulated in a molding compound. There is a semiconductor die having a circuit pattern with contact pads. A package substrate having bump pad landings corresponding to the contact pads of the circuit pattern, has an interposer layer sandwiched between them. The interposer layer includes randomly distributed mutually isolated conductive columns of spherical particles embedded in an elastomeric material, wherein the interposer layer is subjected to a compressive force from pressure exerted upon an underside surface of the semiconductor die. The compressive force deforms the interposer layer causing the conductive columns of spherical particles to electrically connect the contact pads of the circuit pattern with the corresponding bump pad landings of the package substrate. The compressive force may be obtained from forces generated by thermal expansion properties of the molding compound and package substrate, metal clips or combinations, thereof. | 2008-12-25 |
20080315390 | Chip Scale Package For A Micro Component - A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example, CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor cap structure is attached to the sensor die. The front side of the cap structure is attached to the sensor die by a seal ring to hermetically encapsulate an area of the sensor die where the micro component is located. The bond pads on the sensor die are located outside the area encapsulated by the seal ring. Electrical leads, which extend along outer side edges of the semiconductor cap structure from its front side to its back side, are coupled to the micro component via the bond pads. | 2008-12-25 |
20080315391 | INTEGRATED STRUCTURES AND METHODS OF FABRICATION THEREOF WITH FAN-OUT METALLIZATION ON A CHIPS-FIRST CHIP LAYER - Electronic modules and methods of fabrication are provided implementing a first metallization level directly on a chips-first chip layer. The chips-first layer includes chips, each with a pad mask over an upper surface and openings to expose chip contact pads. Structural dielectric material surrounds and physically contacts the side surfaces of the chips, and has an upper surface which is parallel to an upper surface of the chips. A metallization layer is disposed over the front surface of the chips-first layer, residing at least partially on the pad masks of the chips, and extending over one or more edges of the chips. Together, the pad masks of the chips, and the structural dielectric material electrically isolate the metallization layer from the edges of the chips, and from one or more electrical structures of the chips in the chips-first layer. | 2008-12-25 |
20080315392 | RF POWER TRANSISTOR PACKAGES WITH INTERNAL HARMONIC FREQUENCY REDUCTION AND METHODS OF FORMING RF POWER TRANSISTOR PACKAGES WITH INTERNAL HARMONIC FREQUENCY REDUCTION - A packaged RE power device includes a transistor having a control terminal and an output terminal and configured to operate at a fundamental operating frequency, an RF signal input lead coupled to the control terminal, and an RF signal output lead coupled to the output terminal. A harmonic reducer is coupled to the control terminal and/or the output terminal of the transistor and is configured to provide a short circuit or low impedance path from the control terminal and/or the output terminal to ground for signals at an Nth harmonic frequency of the fundamental operating frequency, where N>1. The device further includes a package that houses the transistor and the harmonic reducer, with the input lead and the output lead extending from the package. Multi-chip packages are also disclosed. | 2008-12-25 |
20080315393 | RF TRANSISTOR PACKAGES WITH INTERNAL STABILITY NETWORK AND METHODS OF FORMING RF TRANSISTOR PACKAGES WITH INTERNAL STABILITY NETWORKS - A packaged RF transistor device includes an RF transistor die including a plurality of RF transistor cells. Each of the plurality of RF transistor cells includes a control terminal and an output terminal. The RF transistor device further includes an RF input lead, and an input matching network coupled between the RF input lead and the RF transistor die. The input matching network includes a plurality of capacitors having respective input terminals. The input terminals of the capacitors are coupled to the control terminals of respective ones of the RF transistor cells. | 2008-12-25 |
20080315394 | SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME - A semiconductor package and a method for manufacturing the same capable of supplying power easily without an increase in the number of pads for power supply. The semiconductor package includes a semiconductor chip having a plurality of pads including pads for power supply disposed in a center portion and an internal wiring disposed to be exposed to outside; an insulating film formed on the semiconductor to expose the pads for power supply and the internal wirings; and re-distribution lines formed on the insulating film to connect between the exposed portions of the pads for power supply and the internal wiring. | 2008-12-25 |
20080315395 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a stacked semiconductor package and a method for manufacturing the same. The method for manufacturing a stacked semiconductor package includes preparing a substrate formed with a seed metal layer; laminating semiconductor chips having via holes aligned with one another on the seed metal layer to form a semiconductor chip module; and growing a conductive layer inside of the via holes using the seed metal layer to form a conductive growth layer inside of the via holes. | 2008-12-25 |
20080315396 | Mold compound circuit structure for enhanced electrical and thermal performance - According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate and having a top surface. The overmolded semiconductor package further includes a first patterned conductive layer situated on the top surface of the mold compound. The overmolded semiconductor package can further include at least one conductive interconnect situated in the mold compound, where the at least one conductive interconnect is electrically connected to the first patterned conductive layer. The first patterned conductive layer can include at least one passive component. | 2008-12-25 |
20080315397 | DIE MOUNTING STRESS ISOLATOR - One method of the present invention includes preparing a die with traces and pads as desired for the intended use of the die. A MEMS device is mounted to the die. The die is then mounted to a substrate of the same material as the die. The substrate is then mounted to a package. The die and/or the substrate may be flip-chip mounted. | 2008-12-25 |
20080315398 | PACKAGING SUBSTRATE WITH EMBEDDED CHIP AND BURIED HEATSINK - An embedded chip package includes a substrate having a dielectric interposer, a first metal foil on a first surface and a second metal foil on a second surface of the substrate, wherein the substrate has a cavity recessed into the first surface; a metal heatsink embedded within the cavity; a semiconductor die mounted on a flat bottom of the metal heatsink; a dielectric layer covering the first surface of the substrate; at least one built-up circuit trace layer on the dielectric layer; a solder resist layer on the built-up circuit trace layer and on the dielectric layer; a heat-dissipating metal layer on the second metal foil; and heat-dissipating plugs connecting the flat bottom of the metal heatsink and the heat-dissipating metal layer. | 2008-12-25 |
20080315399 | Semiconductor Device Having Through Contacts Through a Plastic Housing Composition and Method for the Production Thereof - The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device. | 2008-12-25 |
20080315400 | MICROELECTROMECHANICAL SYSTEMS DESIGN FEATURE - A device for reducing the chance that a microelectromechanical systems (MEMS) device with moving parts will have those parts stick to a glass cover of the MEMS device, and a method for making the device. An example embodiment of the invention includes a MEMS device wafer, a substrate wafer, and a glass cover. The MEMS device wafer includes perforations corresponding to the location(s) of exposed glass on the cover. An example embodiment of a method of the invention includes applying metal layers to a glass cover, perforating a device wafer at locations corresponding to areas of exposed glass on the glass cover, mounting the device wafer to the substrate wafer, and anodically bonding the glass cover to the substrate wafer or to the device wafer. | 2008-12-25 |
20080315401 | Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module - A power semiconductor module has a silicon nitride insulated substrate, a metal circuit plate made of Cu or a Cu alloy, which is disposed on one surface of the silicon nitride insulated substrate, a semiconductor chip mounted on the metal circuit plate, and a heat dissipating plate made of Cu or a Cu alloy, which is disposed on the other surface of the silicon nitride insulated substrate; a carbon fiber-metal composite made of carbon fiber and Cu or a Cu alloy is provided between the silicon nitride insulated substrate and the metal circuit plate; the thermal conductivity of the carbon fiber-metal composite in a direction in which carbon fiber of the carbon fiber-metal composite is oriented is 400 W/m·k or more. Accordingly, a power semiconductor module that has a low thermal resistance between the semiconductor chip and a heat dissipating mechanism and also has improved cooling capacity is provided. | 2008-12-25 |
20080315402 | PRINTED CIRCUIT BOARD, MEMORY MODULE HAVING THE SAME AND FABRICATION METHOD THEREOF - A printed circuit board, a memory module having the same, and a fabrication method thereof. The printed circuit board includes an interconnection substrate on which electronic components are mounted and in which a plurality of signal lines are arranged. The signal lines are electrically coupled to the electronic components. A heat sink is disposed on one surface of the interconnection substrate to dissipate heat of the electronic components, and in which no signal lines are arranged. The printed circuit board includes a bending substrate coupling the interconnection substrate to the heat sink, and formed of a flexible material configured to be bent. | 2008-12-25 |
20080315403 | APPARATUS AND METHODS FOR COOLING SEMICONDUCTOR INTEGRATED CIRCUIT CHIP PACKAGES - Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers. | 2008-12-25 |
20080315404 | INTEGRATED THERMAL STRUCTURES AND FABRICATION METHODS THEREOF FACILITATING IMPLEMENTING A CELL PHONE OR OTHER ELECTRONIC SYSTEM - Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer is disposed over the front surface of the multichip layer and includes interconnect metallization electrically connected to contact pads of the chips and to conductive structures extending through the structural material. A redistribution layer, disposed over the back surface of the multichip layer, includes a redistribution metallization also electrically connected to conductive structures extending through the structural material. Input/output contacts are arrayed over the redistribution layer, including over the lower surfaces of at least some integrated circuit chips within the multichip layer, and are electrically connected through the redistribution metallization, conductive structures, and interconnect metallization to contact pads of the integrated circuit chips of the multichip layer. | 2008-12-25 |
20080315405 | HEAT SPREADER IN A FLIP CHIP PACKAGE - A microelectronic package with enhanced thermal management using an embedded heat spreader is disclosed. The microelectronic package comprises a die mounted on a substrate, a thermal interface material disposed in thermal conductive communication with the die and a heat spreader disposed in thermal conductive communication with the thermal interface material. A mold material is provided to enclose the die and the thermal interface material, and partially embedding the heat spreader to expose at least a surface of the heat spreader to an ambient environment. The heat spreader may include an anchor portion to reinforce coupling of the heat spreader to the mold material. If and when required, the heat spreader may be coupled in thermal communication with an external heat sink. | 2008-12-25 |
20080315406 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE - An integrated circuit package system includes a base substrate having a base substrate cavity, attaching a junction integrated circuit package over the base substrate with a portion of the junction integrated circuit package in the base substrate cavity, and attaching a base integrated circuit over the junction integrated circuit package and the base substrate. | 2008-12-25 |
20080315407 | THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USING TWO-DIMENSIONAL FABRICATION - Stackable integrated circuit devices include an integrated circuit die having interconnect pads on an active (front) side, the die having a front side edge at the conjunction of the front side of the die and a sidewall of the die, and a back side edge at the conjunction of back side of the die and the sidewall; the die further includes a conductive trace which is electrically connected to an interconnect pad and which extends over the front side edge of the die. In some embodiments the conductive trace further extends over the sidewall, and, in some such embodiments the conductive trace further extends over the back side edge of the die, and in some such embodiments the conductive trace further extends over the back side of the die. One or both of the die edges may be chamfered. Also, methods for making such a device. Also, assemblies including such a device electrically interconnected to underlying circuitry (e.g., die-to-substrate); and assemblies including a stack of at least two such devices interconnected die-to-die, or such a stack of devices electrically interconnected to underlying circuitry. Also, apparatus and methods for testing such a die. | 2008-12-25 |
20080315408 | Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same - Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups. | 2008-12-25 |
20080315409 | DIRECT EDGE CONNECTION FOR MULTI-CHIP INTEGRATED CIRCUITS - The present invention allows for direct chip-to-chip connections using the shortest possible signal path. | 2008-12-25 |
20080315410 | Substrate Including Barrier Solder Bumps to Control Underfill Transgression and Microelectronic Package including Same - A microelectronic substrate and a microelectronic package including the substrate and a die bonded thereto. The substrate includes a substrate panel having a die-side surface including a die-attach region; a system of interconnects extending through the substrate panel and adapted to allow a connection of the substrate to external circuitry; and a plurality of solder bumps including: die-attach solder bumps electrically coupled to the system of interconnects and disposed in the die-attach region; and barrier solder bumps isolated from the system of interconnects, the barrier solder bumps being disposed outside of the die-attach region and being adapted to substantially limit a flow of underfill away from the die-attach region. | 2008-12-25 |
20080315411 | INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING - An integrated circuit package system that includes: providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system; stacking a first device, a second device, and a third device between and over the electrical interconnect system; connecting the first device and the second device to the inner lead-finger system; and connecting the third device to the outer lead-finger system. | 2008-12-25 |
20080315412 | Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same - The invention discloses a novel package structure of integrate circuit or discrete device and packaging method, and includes the lead pins adjacent to the island; another metal layer formed at the bottom of the island; another metal layer formed at the bottom of lead pins; chip mounted on the island; wires bonded between the chip and the lead pins; the molded body encapsulating the top surface and side surface of the island and the lead pins, small protrusions of the island and the lead pins below the molded body; in the individual package, the number of the island can be one or more, lead pins can be arrayed at one side of the island, also can be arrayed at two sides or three sides of the island, one or two rows of lead pins can be located around the island. The invention provides strong welding, good quality, low cost, smooth production, wide applicability, flexible arrangement of the chips. | 2008-12-25 |
20080315413 | ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE - There are provided the steps of forming a bump | 2008-12-25 |
20080315414 | ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE - There are provided the steps of forming a bump | 2008-12-25 |
20080315415 | Semiconductor device and manufacturing method thereof - The present invention provides a double-sided electrode package of a structure excellent in the reliability of connection and moisture resistance to another package, which is capable of being manufactured simply and at low cost. The present invention also provides a double-sided electrode package of a structure capable of forming inner wirings (electrode pads) in arbitrary layouts according to the number of pins of a semiconductor chip and the size thereof, which package is capable of being manufactured simply and at low cost. A copper foil is attached onto a core material formed with electrode pads, wirings, through electrodes, lands and a solder resist. The copper foil is wet-etched in several stages to form surface side terminals which stand on the wirings approximately vertically and each of which includes a plurality of protrusions (convex portions continuous in the circumferential direction) formed at their side faces over the full circumference along the circumferential direction. The peripheries of the surface side terminals are sealed with a sealing resin, and the end faces of the surface side terminals are exposed from a sealing resin layer, whereby redistribution wiring is performed at the surface of the sealing resin layer. | 2008-12-25 |
20080315416 | A SEMICONDUCTOR PACKAGE WITH PASSIVE ELEMENTS EMBEDDED WITHIN A SEMICONDUCTOR CHIP - A semiconductor package includes a semiconductor chip having bonding pads formed on a top surface and a first via hole and a second via hole formed on both-side edges; a passive element formed within the first via hole; a via wiring formed within the second via hole; a first wiring connected to the bonding pad at one end and connected to the passive element and the via wiring on a top surface of the semiconductor chip; a second wiring formed on a back surface of the semiconductor chip and formed to connect with the passive element and the via wiring; a first passivation film formed in such a way to expose one portion of the first wiring on a top surface of the semiconductor chip; and a second passivation film formed in such a way to expose one portion of the second wiring on a bottom surface of the semiconductor chip. | 2008-12-25 |
20080315417 | CHIP PACKAGE - A chip package includes a patterned conductive layer, a first solder resist layer, a second solder resist layer, a chip, bonding wires and a molding compound. The patterned conductive layer has a first surface and a second surface opposite to each other. The first solder resist layer is disposed on the first surface. The second solder resist layer is disposed on the second surface, wherein a part of the second surface is exposed by the second solder resist layer. The chip is disposed on the first solder resist layer, wherein the first solder resist layer is disposed between the patterned conductive layer and the chip. The bonding wires are electrically connected to the chip and the patterned conductive layer exposed by the second solder resist layer. The molding compound encapsulates the pattern conductive layer, the first solder resist layer, the second solder resist layer, the chip and the bonding wires. | 2008-12-25 |
20080315418 | Methods of post-contact back end of line through-hole via integration - Presented are methods of fabricating three-dimensional integrated circuits that include post-contact back end of line through-hole via integration for the three-dimensional integrated circuits. In one embodiment, the method comprises forming metal plug contacts through a hard mask and a premetal dielectric to transistors in the semiconductor. The method also includes etching a hole for a through-hole via through the hard mask to the semiconductor using a patterned photoresist process, removing the patterned photoresist and using a hard mask process to etch the hole to an amount into the semiconductor. The method further includes depositing a dielectric liner to isolate the hole from the semiconductor, depositing a gapfill metal to fill the hole, and planarizing the surface of the substrate to the hard mask. Another aspect of the present invention includes three-dimensional integrated circuits fabricated according to methods of the present invention. | 2008-12-25 |
20080315419 | CHROMIUM/TITANIUM/ALUMINUM-BASED SEMICONDUCTOR DEVICE CONTACT - A contact to a semiconductor including sequential layers of Cr, Ti, and Al is provided, which can result in a contact with one or more advantages over Ti/Al-based and Cr/Al-based contacts. For example, the contact can: reduce a contact resistance; provide an improved surface morphology; provide a better contact linearity; and/or require a lower annealing temperature, as compared to the prior art Ti/Al-based contacts. | 2008-12-25 |
20080315420 | Metal pad formation method and metal pad structure using the same - A metal pad formation method and metal pad structure using the same are provided. A wider first pad metal is formed together with a first metal. A dielectric layer is then deposited thereon. A first opening and a second opening are formed in the dielectric layer to respectively expose the first metal and the first pad metal. Then, the first opening is filled by W metal to generate a first via. Finally, a second metal and a second pad metal are formed to respectively cover the first via and the first pad metal to generate the metal pad. | 2008-12-25 |
20080315421 | Die backside metallization and surface activated bonding for stacked die packages - Methods and apparatus to provide die backside metallization and/or surface activated bonding for stacked die packages are described. In one embodiment, an active metal layer of a first die may be coupled to an active metal layer of a second die through silicon vias and/or a die backside metallization layer of the second die. Other embodiments are also described. | 2008-12-25 |
20080315422 | Methods and apparatuses for three dimensional integrated circuits - Methods and apparatuses for fabricating three-dimensional integrated circuits having through hole vias are provided. One aspect of the present invention is a method of gapfill for through hole vias for three-dimensional integrated circuits. The method comprises providing a semiconductor wafer having a plurality of holes for through hole vias and depositing a conformal metal layer to partially fill the holes to leave open voids. The method also includes purging the voids and cleaning the surface of the voids and using a dry deposition process to fill or close the voids. Another aspect of the present invention is an electronic device structure for a three-dimensional integrated circuit. | 2008-12-25 |
20080315423 | SEMICONDUCTOR DEVICE - A semiconductor device includes a carrier, a chip including a first face having a contact area, where the chip is attached to the carrier such that the contact area faces away from the carrier, a copper connector configured for attachment to the contact area, and a solder material configured to couple the copper connector to the contact area. | 2008-12-25 |
20080315424 | Structure and manufactruing method of chip scale package - A Chip Scale Package (CSP) and a method of forming the same are disclosed. Single chips without the conventional ball mountings, are first attached to an adhesive-substrate (adsubstrate) composite having openings that correspond to the input/output (I/O) pads on the single chips to form a composite chip package. Ball mounting is then performed over the openings, thus connecting the I/O pads at the chip sites to the next level of packaging directly. In another embodiment, the adhesive layer is formed on the wafer side first to form an adwafer, which is then die sawed in CSPs. Then the CSPs with the adhesive already on them are bonded to a substrate. The composite chip package may optionally be encapsulated with a molding material. The CSPs provide integrated and shorter chip connections especially suited for high frequency circuit applications, and can leverage the currently existing test infrastructure. | 2008-12-25 |
20080315425 | Semiconductor Devices and Methods for Fabricating the Same - Semiconductor devices and methods of fabricating the same are disclosed. An illustrated semiconductor device fabricating method includes forming a titanium and titanium-nitride (Ti/TiN) metal layer on a lower oxide layer; forming an aluminum metal layer on the Ti/TiN metal layer; forming an indium tin oxide (ITO) layer on the aluminum metal layer; and patterning the ITO layer, the aluminum metal layer, and the Ti/TiN metal layer by photolithography to form a metal layer pattern and to expose a surface of the lower oxide layer, thereby facilitating a process of filling inter-wiring spaces occurring between adjacent lines of a metal layer pattern by producing a metal layer pattern having a reduced aspect ratio. | 2008-12-25 |
20080315426 | METAL CAP WITH ULTRA-LOW k DIELECTRIC MATERIAL FOR CIRCUIT INTERCONNECT APPLICATIONS - An interconnect structure is provided that has enhanced electromigration reliability without degrading circuit short yield, and improved technology extendibility. The inventive interconnect structure includes a dielectric material having a dielectric constant of about 3.0 or less. The dielectric material has at least one conductive material embedded therein. A noble metal cap is located directly on an upper surface of the at least one conductive region. The noble metal cap does not substantially extend onto an upper surface of the dielectric material that is adjacent to the at least one conductive region, and the noble cap material does not be deposited on the dielectric surface. A method fabricating such an interconnect structure utilizing a low temperature (about 300° C. or less) chemical deposition process is also provided. | 2008-12-25 |
20080315427 | SUBSTRATE BONDING METHOD AND SEMICONDUCTOR DEVICE - (a) A first Sn absorption layer ( | 2008-12-25 |
20080315428 | Thin Film Transistor and Display Device, and Method for Manufacturing Thereof - The present invention discloses a display device and a manufacturing method thereof by which a manufacturing process can be simplified. Further, the present invention discloses technique for manufacturing a pattern such as a wiring into a desired shape with good controllability. A method for forming a pattern for constituting the display device according to the present invention comprises the steps of forming a first region and a second region; discharging a composition containing a pattern formation material to a region across the second region and the first region; and flowing a part of the composition discharged to the first region into the second region; wherein wettability with respect to the composition of the first region is lower than that of the second composition. | 2008-12-25 |
20080315429 | METHOD FOR IMPROVING THE SELECTIVITY OF A CVD PROCESS - A method of forming a noble metal cap on a conductive material embedded in a dielectric material in an interconnect structure. The method includes the step of contacting (i) a conductive material having a bare upper surface partially embedded in a dielectric material and (ii) vapor of a noble metal containing compound, in the presence of carbon monoxide and a carrier gas. The contacting step is carried out at a temperature, pressure and for a length of time sufficient to produce a noble metal cap disposed directly on the upper surface of the conductive material without substantially extending into upper surface of the dielectric material or leaving a noble metal residue onto the dielectric material. | 2008-12-25 |
20080315430 | NANOWIRE VIAS - A method of fabricating an integrated circuit including arranging a nanowire with a first end portion thereof at a first contact surface of a first electrical contact and with a second end portion sticking up from the first contact surface, and embedding at least part of the nanowire in dielectric material. | 2008-12-25 |
20080315431 | Mounting substrate and manufacturing method thereof - A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting. | 2008-12-25 |
20080315432 | Electrical Shielding in Stacked Dies by Using Conductive Die Dttach Adhesive - In example embodiment, there is an integrated circuit (IC) device ( | 2008-12-25 |
20080315433 | SELF-ALIGNED WAFER OR CHIP STRUCTURE, SELF-ALIGNED STACKED STRUCTURE AND METHODS FOR FABIRCATING THE SAME - A self-aligned wafer or chip structure including a substrate, at least one first concave base, at least one second concave base, at least one connecting structure and at least one bump is provided. The substrate has a first surface and a second surface, and at least one pad is formed on the first surface. The first concave base is disposed on the first surface and electrically connected to the pad. The second concave base is disposed on the second surface. The connecting structure passes through the substrate and disposed between the first and second concave bases so as to be electrically connected to the first and second concave bases. The bump is filled in the second concave base and protrudes out of the second surface. | 2008-12-25 |
20080315434 | WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS - An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board). | 2008-12-25 |
20080315435 | METHODS FOR STACKING WIRE-BONDED INTEGRATED CIRCUIT DICE ON FLIP-CHIP BONDED INTEGRATED CIRCUIT DICE - An inventive electronic device, such as a multi-chip module (MCM), a Single In-line Memory Module (SIMM), or a Dual In-line Memory Module (DIMM), includes a base, such as a printed circuit board, having a surface on which flip-chip pads and wire-bondable pads are provided. The flip-chip pads define an area on the surface of the base at least partially bounded by the wire-bondable pads. A first integrated circuit (IC) die is flip-chip bonded to the flip-chip pads, and a second IC die is back-side attached to the first IC die and ten wire-bonded to the wire-bondable pads. As a result, the flip-chip mounted first IC die is stacked with the second IC die in a simple, novel manner. | 2008-12-25 |
20080315436 | SEMICONDUCTOR WAFER THAT SUPPORTS MULTIPLE PACKAGING TECHNIQUES - Methods, systems, and apparatuses for semiconductor wafers and integrated circuit chip packaging techniques are provided. A wafer is fabricated that supports multiple different packaging techniques. The wafer is formed to have a plurality of integrated circuit regions. A first plurality of terminals is formed on a surface of the wafer in a central region of each integrated circuit region. A second plurality of terminals is formed on the surface of the wafer in a peripheral region of each integrated circuit region. For each integrated circuit region, each terminal of the second plurality of terminals is electrically coupled through the wafer to at least one terminal of the first plurality of terminals. The integrated circuit regions can be separated into chips that can be packaged in multiple ways. In an aspect, a wafer may be fabricated that supports wire-bond packaging or wafer level ball grid array (WLBGA) packaging for a common chip/die configuration of the wafer. | 2008-12-25 |
20080315437 | Tape wiring substrate and chip-on-film package using the same - A chip-on-film package may include a tape wiring substrate, a semiconductor chip mounted on the tape wiring substrate, and a molding compound provided between the semiconductor chip and the tape wiring substrate. The tape wiring substrate may include a film having upper and lower surfaces. Vias may penetrate the film. An upper metal layer may be provided on the upper surface of the film and include input terminal patterns and/or output terminal patterns. The input terminal patterns may include ground terminal patterns and/or power terminal patterns. A lower metal layer may be provided on the lower surface of the film and include a ground layer and/or a power layer. The ground layer and the power layer may cover at least a chip mounting area. | 2008-12-25 |
20080315438 | SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER - An integrated circuit includes a first surface configured for mounting to a carrier, an active area of the integrated circuit spaced from the first surface, a bond pad disposed over and in electrical communication with the active area, and a ceramic inorganic stress-buffering layer disposed between the active area and the bond pad. | 2008-12-25 |
20080315439 | QUAD FLAT NON-LEADED CHIP PACKAGE - A Quad Flat Non-leaded (QFN) chip package including a patterned conductive layer, a first solder resist layer, a chip, a plurality of bonding wires and a molding compound is provided. The patterned conductive layer has a first surface and a second surface opposite to each other. The first solder resist layer is disposed on the first surface, wherein a part of the first surface is exposed by the first solder resist layer. The chip is disposed on the first solder resist layer, wherein the first solder resist layer is between the patterned conductive layer and the chip. The bonding wires are electrically connected to the chip and the patterned conductive layer exposed by the first solder resist layer. The molding compound encapsulates the pattern conductive layer, the first solder resist layer, the chip and the bonding wires. | 2008-12-25 |
20080315440 | Method of Manufacturing a Plurality of Semiconductor Devices and Carrier Substrate - Individual devices ( | 2008-12-25 |
20080315441 | Oxygen Generator - An oxygen generator including: a humidifier tank moves up and down according to a horizontal movement of an adjustment knob so that the humidifier tank can be readily detachable, and thus a user can securely and conveniently use the oxygen generator without any water leakage from the humidifier tank during an operation of the oxygen generator. Also, it is possible to reduce noise according to driving of a compressor, noise according to the nitrogen exhaustion, and noise according to driving of a fan portion when the oxygen generator operates, to display purity information about the discharged oxygen, sensed by an oxygen sensor, as a digitalized numerical value on a display portion so that a user may readily recognize a current oxygen purity, and to drive the compressor at a low power consumption based on a discharge flow rate of oxygen and thereby reduce the power consumption. | 2008-12-25 |
20080315442 | Method and Apparatus for Replicating Microstructured Optical Masks - The invention relates to a method and an apparatus for replicating planar, thin-layered, and microstructured flat lens system and optical mask (LM) that are provided with such microstructured lens system which are hardened from a highly viscous transparent fluid on a supporting substrate plate (TP). The fluid is introduced between a plate-shaped master plate (M) and a movable supporting substrate plate and remains joined to said substrate plate after hardening. The inventive method is carried out in a non-rotational manner while the molding space is not delimited by sidewalls or similar in the direction of expansion of the fluid. The inventive flat lens systems or optical masks are embodied as lenticular arrays, field lenses, or Fresnel lenses. The final shape of the mask is homogeneous, has a geometrically accurate layer thickness, and is free from air pockets. The inventive method and apparatus allow for controlled replication at great geometrical accuracy and extremely good optical quality. | 2008-12-25 |
20080315443 | Adjustment Method, Particularly a Laser Adjustment Method, and an Actuator Suitable for the Same - The invention relates to an adjustment method, especially for the adjustment of optical or fibre optical components, whereby a partial region of an actuator is locally heated in such a defined manner that compressive stresses are created therein as a result of the restricted thermal expansion of said heated partial region, caused by at least one other partial region of the actuator. If the yielding point σ of the material of the partial region is exceeded, said compressive stresses lead to the plastic compression of the heated partial region. Furthermore, said heated partial region is contracted during cooling and leads to a defined modification of the geometry of the actuator following the cooling process. Tensile stresses are created as a result of a restriction of said contraction by means of at least one other partial region in the previously heated partial region, and compressive stresses are frozen in the at least one other region. During the adjustment process, essential regions of the actuator, in which the tensile stresses or compressive stresses are frozen after cooling, are brought to a critical temperature in relation to the operating temperature of the actuator, at least until flow processes of the material are ended at the critical temperature. | 2008-12-25 |
20080315444 | Moulding Process - A highly effective and cost-effective method and apparatus for manufacturing soft contact lenses by physically forming the lenses form sheet (or other solid) material in a batch or continuous process. | 2008-12-25 |
20080315445 | INJECTION MOLDING FLOW CONTROL APPARATUS AND METHOD - In an injection molding machine having upstream and downstream channels communicating with each other for delivering fluid material to one or more mold cavities, apparatus for controlling delivery of the melt material from the channels to the one or more mold cavities, each channel having an axis, the downstream channel having an axis intersecting a gate of a cavity of a mold, the upstream channel having an axis not intersecting the gate and being associated with an upstream actuator interconnected to an upstream melt flow controller disposed at a selected location within the upstream channel, the apparatus comprising a sensor for sensing a selected condition of the melt material at a position downstream of the upstream melt flow controller; an actuator controller interconnected to the upstream actuator, the actuator controller comprising a computer interconnected to a sensor for receiving a signal representative of the selected condition sensed by the sensor, the computer including an algorithm utilizing a value indicative of the signal received from the sensor as a variable for controlling operation of the upstream actuator; wherein the upstream melt flow controller is adapted to control the rate of flow of the fluid material at the selected location within the upstream channel according to the algorithm. | 2008-12-25 |
20080315446 | Method and Device for Controlling the Quality During the Production of an Extruded Polymer Product - A method and a device for controlling the quality during the production of an extruded polymer product from a synthetic intermediate product. The production of the polymer product takes place continuously in several successive process steps; whereby a process parameter and/or a product parameter is/are detected in at least one of the process steps and is/are compared with a target value or target value range. A quality signal for determining the quality of the polymer product and/or a control signal for controlling one of the process steps is generated in accordance with this comparison. According to the invention, a measuring time and a throughput time are assigned to the process parameter and/or the product parameter, the throughput time characterizing the current material flow for the respective process step up to the production of the finished polymer product. Changes in quality can thus be identified in advance and can be taken into account for statistical process control. | 2008-12-25 |
20080315447 | METHOD OF MAKING A MICROPOROUS MATERIAL - A method for producing a microporous material comprising the steps of: providing an ultrahigh molecular weight polyethylene (UHMWPE); providing a filler; providing a processing plasticizer; adding the filler to the UHMWPE in a mixture being in the range of from about 1:9 to about 15:1 filler to UHMWPE by weight; adding the processing plasticizer to the mixture; extruding the mixture to form a sheet from the mixture; calendering the sheet; extracting the processing plasticizer from the sheet to produce a matrix comprising UHMWPE and the filler distributed throughout the matrix; stretching the microporous material in at least one direction to a stretch ratio of at least about 1.5 to produce a stretched microporous matrix; and subsequently calendering the stretched microporous matrix to produce a microporous material which exhibits improved physical and dimensional stability properties over the stretched microporous matrix. | 2008-12-25 |
20080315448 | Method of Producing Slabs of Artificial Stone and Polymerisable Resin Having a Veined Effect By Means of Vibro-Compression Under Vacuum - The invention relates to a process for manufacturing artificial stone boards with polymerizable resins with a “veined effect” by means of the vibro-compaction under vacuum system comprising a first grinding phase of the different materials forming the filler, a second phase containing a resin with the catalyst and optionally a third phase consisting of the mixing of the two previous phases until the homogenization of the materials with the resin, a fourth phase of moulding and compaction of the obtained paste by vibro-compression under vacuum, a fifth hardening phase by polymerization of the resin by means of heating and a last cooling, cutting and polishing phase. | 2008-12-25 |
20080315449 | METHOD AND APPARATUS FOR FORMING HIGH STRENGTH PRODUCTS - A system and method are presented in which a flow of plastic is extruded to obtain nano-sized features by forming multiple laminated flow streams, flowing in parallel through the system. Each of the parallel laminated flow streams are subjected to repeated steps in which the flows are divided, and overlapped to amplify the number of laminations. The parallel amplified laminated flows are rejoined to form a cumulated laminated output with nano-sized features. | 2008-12-25 |
20080315450 | Composition and Method For Manufacturing a Product - A composition for manufacturing a product, comprises: finely subdivided inert materials, a metal oxide, a metal chloride, a resin, a thickening agent, a surfactant; a method for manufacturing a product comprises: mixing a solution of metal chloride with a metal oxide and finely subdivided inert materials, so as to obtain a mixture; adding to said mixture a resin, an a surfactant; pouring said mixture into a mould in such a way as to impregnate a fibre material sheet positioned inside said mould; enabling said mixture to solidify, so as to manufacture said product. | 2008-12-25 |
20080315451 | Beverage container insulators and methods for making the same - Methods for making a molded beverage container insulator from a slurry including water and a polysaccharide by presenting at least one male mold, which may have an elliptical cross section, therein and causing a portion of the slurry to temporarily adhere to the at least one mold. After a suitable period of time, removing the mold from the slurry and then removing the insulator. At such time, and particularly if the mold is not characterized as elliptical in cross section, the insulator is subject to bidirectional compression in order to collapse the same. Opposing hinge elements may be formed in the insulator, either at the time of molding or subsequently, to localize stresses resulting from the collapsing of the insulator. The resulting insulator is fully recyclable/compostable and possesses a constricting bias to mitigate container slip issues. | 2008-12-25 |
20080315452 | Unit and Method for Molding Opening Devices for Application to Packages of Pourable Food Products - A molding unit for producing an opening device, wherein a web having plural holes is fed to the unit, and the opening device has a spout closed by a membrane, a neck portion projecting from the spout, and a pull ring extending from the membrane inside the neck portion. The unit includes first and second mold devices cooperating with the web to define a closed cavity, and movable to be detached from the web. The unit also has a first and a second matrix which can be set to a configuration in which they are located inside the cavity to define a first and second volume. The matrices are movable relative to the web to disengage the opening device from the volumes and permit removal of the opening device by feeding forward the web. A single actuator moves one of the mold device and the matrices to/from the web. | 2008-12-25 |
20080315453 | PROCESS FOR THE PRODUCTION OF POLYESTER NANOCOMPOSITES - A method for dispersing sepiolite-type clay particles in a polyester matrix by melt-compounding a mixture of: sepiolite-type clay, at least one linear polyester oligomer, and at least one polyester polymer to produce a nanocomposite composition; and, optionally, subjecting said nanocomposite composition to solid state polymerization to increase polyester molecular weight. Further described is a method for preparing a polyester nanocomposite composition from a masterbatch, comprising melt-compounding a mixture of: sepiolite-type clay, at least one polyester oligomer, and at least one polyester polymer to produce a nanocomposite composition containing a greater concentration of sepiolite-type clay than is desired in the final resin composition; optionally, subjecting said nanocomposite composition to solid state polymerization to increase the polyester molecular weight; and further melt compounding said nanocomposite composition with polyester polymer and, optionally, additional ingredients. | 2008-12-25 |
20080315454 | METHOD OF MAKING MELTBLOWN FIBER WEB WITH STAPLE FIBERS - A method of making a nonwoven web is described, wherein the web contains meltblown fibers and staple fibers. The meltblown fibers may be present as a bimodal mixture of microfibers and mesofibers, and comprise an intermingled mixture with staple fibers further intermingled therein. | 2008-12-25 |
20080315455 | METHOD OF COOLING MATERIAL USING AN EXTRUDER SCREW CONFIGURED FOR IMPROVED HEAT TRANSFER - A method of cooling material in a screw extruder having a barrel including providing at least one extruder screw having a central shaft. The at least one extruder screw includes at least one screw flight including at least one interruption in the screw flight to form at least one discontinuity by which a portion of the screw flight is circumferentially displaced from the remainder of the screw flight. Material is turned from near the central shaft outwards toward the inner surface of the screw extruder barrel through the at least one discontinuity. | 2008-12-25 |
20080315456 | Process for the Manufacturing of a Valve - A process for the manufacturing of a valve ( | 2008-12-25 |
20080315457 | Joint in Fluid Device and Method of Manufacture - In a manufacturing method of a joint in a fluid device, in which the joint is provided with an attaching portion attached to a connection port of the fluid device and a hose installation portion to which one end of a hose is installed, and the hose installation portion is provided with an outer diameter bulge portion in an intermediate portion in a range to which the hose is installed, an outer surface of a leading end side portion including the bulge portion of the hose installation portion is formed by an annular outer mold. | 2008-12-25 |
20080315458 | Apparatus and method for forming tapered products - The present invention relates to an apparatus and method for forming molded tapered products, such as masonry blocks, whereby high quality finished products are removed from their mold without the need for complex machinery for demolding. The mold may include one or more mold cavities having one or more movable cavity walls. The movable cavity walls may include an end liner having a planar product forming surface capable of moving from a vertical position to an angled position. Tapered products may be formed by moving the mold towards a pallet so that the pallet engages with the end liner and causes the end liner to move from the vertical position to the angled position. Moldable material may then be introduced into the mold cavity and may be allowed to remain in the mold cavity until it is self-sustaining. The mold may then be moved away from the pallet such that a molded product remains on the pallet, thereby allowing the end liner to move from the angled position to the vertical position. | 2008-12-25 |
20080315459 | ARTICLES AND METHODS FOR REPLICATION OF MICROSTRUCTURES AND NANOFEATURES - An article is provided that includes a mold comprising a pattern, a metal-containing layer in contact with the pattern, and a release agent that includes a functionalized perfluoropolyether bonded to the metal-containing layer. Also provided is a method of replication that includes the mold. | 2008-12-25 |
20080315460 | MOLDING DIE AND CONTROL METHOD THEREOF - The present invention provides a molding die and a control method thereof aimed at shortening cycle time from heating to cooling of a molding cavity of the die with a simple and inexpensive configuration. In a molding die equipped with a molding cavity to mold a base material, a magnetic die material is used for the molding cavity, cooling means to feed a refrigerant is installed inside the molding cavity along a molding face and heating means by high-frequency induction is installed around the cooling means, and the molding cavity is alternately heated and cooled repeatedly by the heating means and the cooling means when the base material is molded with the molding cavity. Here, the cooling means includes a tubular body installed in the molding cavity, feeds a refrigerant when the molding cavity is cooled, and is in a hollow state of not containing the refrigerant when the molding cavity is heated. | 2008-12-25 |
20080315461 | Rapid Prototyping Apparatus and Method of Rapid Prototyping - The invention relates to a method of illuminating at least one rapid prototyping medium (RPM) wherein said illuminating is performed by at least two simultaneous individually modulated light beams (IMLB) projected onto said rapid prototyping medium (RPM) and wherein said rapid prototyping medium is illuminated with light beams (IMLB) having at least two different wavelength contents (WLC | 2008-12-25 |
20080315462 | SYSTEMS AND METHODS FOR MONITORING A COMPOSITE CURE CYCLE - A system for monitoring at least one of a resin infusion process and a composite cure cycle of a composite article is provided. The system includes an ultrasonic transmitter configured to deliver an acoustic wave to a resin-infused fiber preform and an ultrasonic receiver configured to receive the acoustic wave propagated through the resin-infused fiber preform. The system also includes a processor configured to estimate at least one parameter using the received acoustic wave and to use the at least one parameter to determine an extent to which at least one resin has infused into the resin-infused fiber preform. | 2008-12-25 |
20080315463 | Process and Apparatus for Quality Control of a Process for Producing Concrete Articles - Methods and apparatus are presented for quality control of a process to produce concrete goods products. The quality control is effected on the basis of measurements that are carried out on the concrete goods products in an intermediate step of the process after shaping and compacting in the fresh concrete phase. Measurement values are determined on a test fresh concrete product from the intermediate step of the process, which measurement values comprise a measure of the bulk density and the gas permeability of the test fresh concrete product. Subsequently, an estimated value for a quality measure of the hardened concrete product is determined on the basis of a predetermined predictive model. The predictive model relates the measurement values of fresh concrete products from the intermediate step of the process to the quality measure of the corresponding hardened concrete products. | 2008-12-25 |
20080315464 | METHOD OF MANUFACTURING A COMPOSITE FILTER MEDIA - A method of making a composite filter media includes, in an exemplary embodiment, forming a nonwoven fabric mat that includes a plurality of synthetic fibers by a spunbond process, and calendaring the nonwoven fabric mat with embossing calendar rolls to form a bond area pattern comprising a plurality of substantially parallel discontinuous lines of bond area to bond the synthetic fibers together to form a nonwoven fabric, the nonwoven fabric having a minimum filtration efficiency of about 50%, measured in accordance with ASHRAE 52.2-1999 test procedure. The method also includes applying a nanofiber layer by electro-blown spinning a polymer solution to form a plurality of nanofibers on at least one side of the nonwoven fabric mat to form the composite filter media, the composite filter media having a minimum filtration efficiency of about 75%, measured in accordance with ASHRAE 52.2-1999 test procedure. | 2008-12-25 |
20080315465 | METHOD OF MANUFACTURING COMPOSITE FILTER MEDIA - A method of making a composite filter media includes, in an exemplary aspect, forming a nonwoven fabric substrate that includes a plurality of bicomponent synthetic fibers by a spunbond process, calendering the nonwoven fabric substrate with embossing calender rolls to form a bond area pattern having a plurality of substantially parallel discontinuous lines of bond area to bond the synthetic bicomponent fibers together to form a nonwoven fabric. The nonwoven fabric having a minimum filtration efficiency of about 50%, measured in accordance with ASHRAE 52.2-1999 test procedure. The method also includes applying a nanofiber layer by electro-blown spinning a polymer solution to form a plurality of nanofibers on at least one side of the nonwoven fabric. The composite filter media having a filtration efficiency of at least about 75%, measured in accordance with ASHRAE 52.2-1999 test procedure. The method further includes corrugating the composite filter media using opposing corrugating rollers at a temperature of about 90° C. to about 140° C. | 2008-12-25 |
20080315466 | High Speed Manufacturing Using Shape Memory Polymer Composites - Structurally strong composites are formed with shape memory polymer resins to create composites with shape memory properties. A system and method for using these composite structures to quickly manufacture composite products involves: 1) creating a preform composed of a shape memory polymer composite; 2) heating or otherwise activating the shape memory polymer; 3) using a mold to deform the composite material to a desired shape; 4) cooling or otherwise deactivating the shape memory polymer so that the composite structure retains the desired mold shape. | 2008-12-25 |
20080315467 | Method of manufacturing a plastic sleeve - A method of manufacturing a plastic sleeve, particularly an expanding sleeve, includes injection molding the plastic sleeve with an inserted core in an injection molding tool, subsequently pulling the core and inserting the metal pin without heads, cones or the like into the bore of the plastic sleeve placed in the injection molding tool, and subsequently injection molding in the same injection molding tool the heads, cones or the like on both ends of the metal pin, and subsequently injecting the plastic sleeve with inserted metal pin from the tool. | 2008-12-25 |
20080315468 | Honeycomb structure and manufacturing method thereof - A honeycomb structure is made of cordierite and has a plurality of cells separated from each other by porous partition walls and functioning as fluid passages. The honeycomb structure has a thermal expansion coefficient of 0.25×10 | 2008-12-25 |
20080315469 | METHOD OF PROVIDING A MOISTURE VAPOR BARRIER LAYER TO A CORE OF A GOLF BALL - A method of forming a water vapor barrier layer to a core of a golf ball is provided. The method includes placing the core of the golf ball into a vapor barrier composition, withdrawing the lifting device, and spinning and optionally oscillating the core within the composition for a time sufficient for the composition to form a layer on the core. The present invention also provides an apparatus that can be used to form a water vapor barrier layer on the core. | 2008-12-25 |
20080315470 | Gas spring - The invention relates to a gas spring which uses a compensating medium acting on a compensating piston in order to compensate the dependence on temperature of its characteristic. According to a first aspect of the invention, a compensating medium ( | 2008-12-25 |
20080315471 | System And Method For Damping Vibration In A Drill String - A system for damping vibration in a drill string can include a valve assembly having a supply of a fluid, a first member, and a second member capable of moving in relation to first member in response to vibration of the drill bit. The first and second members define a first and a second chamber for holding the fluid. Fluid can flow between the first and second chambers in response to the movement of the second member in relation to the first member. The valve assembly can also include a coil or a valve for varying a resistance of the fluid to flow between the first and second chambers. | 2008-12-25 |
20080315472 | LIQUID SEALED VIBRATION ISOLATING DEVICE - A liquid sealed vibration isolating device having a first mounting member to be mounted on the side of a vibration source, a second mounting member to be mounted on the side to be vibrated, and an insulator being placed between said first and second mounting members so as to absorb vibration. A liquid chamber uses the insulator as a part of a wall thereof and is filled with a hydraulic liquid. A partition member partitions the liquid chamber into a primary liquid chamber and a secondary liquid chamber. A passage is provided between the primary and secondary liquid chambers. A valve portion is provided on a diaphragm enclosing the secondary liquid chamber to open and close a port of the passage. The valve portion has an annular thick wall portion which comes into contact with a valve seat portion provided around the port of the passage and a central movable elastic diaphragm portion which is provided on an inside of the annular thick wall portion and is thinner than the annular thick wall portion so as to be elastically deformable by a liquid pressure of the hydraulic liquid. The hydraulic liquid passing through the passage causes orifice resonance when passage is opened by the valve portion. The diaphragm, including the valve portion, is adapted to membrane-resonate at a frequency in the vicinity of a resonance frequency of the orifice resonance. | 2008-12-25 |
20080315473 | TORQUE ROD - A torque rod having an arm portion, a ring portion formed on each end of the arm portion in a longitudinal direction of the arm portion, and a rubber bushing that is integrally provided with the ring portion. The arm portion is formed from a material that is lower in specific gravity than iron. A weight is provided in a portion of the rubber bushing other than a principal spring portion. The principal spring portion, which absorbs principal vibration to be isolated, is formed by an elastic arm portion that extends radially outwardly from an inner cylinder located substantially in a center of the rubber bushing and is connected to the ring portion. An aperture, which is a separation space, is provided between the elastic arm portion and the ring portion. | 2008-12-25 |
20080315474 | Jounce bumper assembly and gas spring assembly including same - A jounce bumper assembly includes a jounce bumper and a bumper retainer. The jounce bumper includes opposing end walls and a side wall extending therebetween. The bumper retainer includes a side wall for engaging the side wall of the jounce bumper and thereby restricting radially outward deflection of the jounce bumper. A gas spring assembly and a vehicle suspension system including a jounce bumper assembly are included. A method of utilizing a jounce bumper assembly is also included. | 2008-12-25 |
20080315475 | Air Spring for Vehicle Closure - An air spring for use with a closure of a vehicle is disclosed. The air spring includes a rod and a tube axially slidable in the rod. The rod may include a housing having tube slots defining flexible arms with rod cam extensions extending therefrom. The rod cam extensions may have an extension rod cam surface that has a smaller angle than a retraction rod cam surface, with a rod peak between the two. The tube may include a tube cam extension having a tube peak with a diameter greater than the diameter of the rod peak. The tube cam extension may include an extension tube cam surface that has a smaller angle than a retraction tube cam surface. | 2008-12-25 |
20080315476 | Combinable positioning table - A combinable positioning table constructed from an assembly and a cradle. The assembly comprises means for rotating the cradle which includes attachable elements that can be rotated about first axis and capable of being attached to the sides of the cradle for rotating the cradle, wherein the cradle includes means for attaching to the attachable elements of the assembly and where in said cradle has a work holder and means for rotating the work holder in an axis of rotation perpendicular to the first axis of rotation and wherein said cradle can be separated from the assembly so that the separated assembly and separated cradle can operate as independent positioning tables. | 2008-12-25 |
20080315477 | PIN LOCATING ASSEMBLY - A locating pin assembly is provided. The assembly includes a body and a cylinder assembly for moving a ram in a reciprocally linear manner. A bearing is coupled to the ram and configured to engage a bearing wedge to reduce “play” between the ram and the assembly. Illustratively, the bearing and bearing wedge reduce or substantially eliminate this “play” to prevent axial rotation of the ram. | 2008-12-25 |
20080315478 | PIN CLAMP ASSEMBLY - A pin clamp assembly having a body, a locating pin, an actuator, a drive rod, a cam, and a finger is provided. The locating pin is coupled to the body and movable between extended and retracted positions. The drive rod is movable relative to the locating pin. The cam is movable relative to the locating pin and the drive rod. The finger is coupled to the drive rod and movable between extended and retracted positions. Actuation of the actuator causes the drive rod to move which extends the finger without moving the locating pin. Also, continued retraction of the drive rod after the finger has extended causes the cam to move out from the slot in the body to allow the locating pin to retract. | 2008-12-25 |
20080315479 | Positioning System for a Component, Adjustment Tool and Adjustment Method - System for positioning a component on a frame relative to a reference. | 2008-12-25 |
20080315480 | Vise or clamp attachment - An attachment for use with a clamp having a pair of jaws operable to clamp a workpiece therebetween, such attachment comprising a body member of such size as to be accommodated in a space between one of the jaws and the workpiece. The body member of the attachment has a first contact surface adapted to bear against a surface of the workpiece and a second, opposite contact surface adapted to bear against one of the jaws. The second contact surface is so configured as to enable the attachment body member to be substantially universally rockable relative to the jaw engaged by such attachment body member, thereby enabling the body member to occupy a position in engagement with and substantially parallel to that surface of the workpiece engaged by the attachment body member. | 2008-12-25 |
20080315481 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle stitch unit configured to stitch a center of a sheet bundle in which printed sheets are bundled, a fold unit configured to fold the center stitched by the saddle stitch unit and to form a fold line, and a fold reinforcing unit configured to reinforce the fold line formed by the fold unit, and the fold reinforcing unit includes a placement table on which the sheet bundle transported from the fold unit is placed, a band-like elastic member that is extended to face the fold line of the placed sheet bundle and is formed to be longer than the length of the fold line, and a roller unit that includes a reinforce roller and moves the reinforce roller along the direction of the fold line while pressing it to the fold line through the intervening elastic member. | 2008-12-25 |
20080315482 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle stitch unit configured to stitch a center of a sheet bundle in which printed sheets are bundled, a fold unit configured to fold the center stitched by the saddle stitch unit and to form a fold line, and a fold reinforcing unit configured to reinforce the fold line formed by the fold unit, the fold reinforcing unit includes a roller unit that includes a first roller and a second roller, nips the fold line of the sheet bundle transported from the fold unit between the first roller and the second roller, and moves along a direction of the fold line while pressing, and a drive unit configured to move the roller unit along the direction of the fold line from a standby position located at a position separate from an end of the sheet bundle, and the first roller and the second roller are separate from each other at the standby position, and approach each other to nip the fold line in a region where the fold line of the sheet bundle exists. | 2008-12-25 |
20080315483 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle stitch unit configured to stitch a center of a sheet bundle in which printed sheets are bundled, a fold unit configured to fold the center stitched by the saddle stitch unit and to form a fold line, a fold reinforcing unit that includes a reinforce roller, moves the reinforce roller along a direction of the fold line while applying pressure by the reinforce roller to the fold line of the sheet bundle transported from the fold unit, and reinforces the fold line, and a control unit configured to transport the sheet bundle from the fold unit to the fold reinforcing unit and to control to stop the fold line of the sheet bundle at a position of the reinforce roller, and the control unit changes, according to a thickness of the sheet bundle, a transport distance from a specified position in the fold reinforcing unit to the position where the sheet bundle is stopped. | 2008-12-25 |
20080315484 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle stitch unit configured to stitch a center of a sheet bundle, in which printed sheets are bundled, with a staple, a fold unit configured to fold the center stitched by the saddle stitch unit and to form a fold line, and a fold reinforcing unit configured to reinforce the fold line formed by the fold unit, the fold reinforcing unit includes a roller unit that includes a reinforce roller and moves along a direction of the fold line while applying pressure by the reinforce roller to the fold line of the sheet bundle transported from the fold unit, a drive unit configured to move the roller unit along the direction of the fold line, and a control unit configured to control a movement speed of the roller unit, and the control unit causes the roller unit to move at a first speed in an outside of a specified range including the edge of the staple, and causes the roller unit to move at a second speed not higher than the first speed in the specified range including the edge of the staple. | 2008-12-25 |
20080315485 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle stitch unit configured to stitch a center of a sheet bundle in which printed sheets are bundled, a fold unit configured to fold the center stitched by the saddle stitch unit and to form a fold line, and a fold reinforcing unit configured to reinforce the fold line formed by the fold unit, the fold reinforcing unit includes a roller unit that includes a first roller and a second roller, and moves along a direction of the fold line while nipping and pressing the fold line of the sheet bundle transported from the fold unit by the first roller and the second roller, a drive unit configured to move the roller unit along the direction of the fold line from a standby position located at a position separate from an end of the sheet bundle, and a nip unit that includes a first nip plate and a second nip plate, and configured to nip the sheet bundle transported from the fold unit at a position between the fold line and the fold unit, and in the nip unit, the first nip plate and the second nip plate are opened in a thickness direction of the sheet bundle when the roller unit is located at the standby position, and the first nip plate and the second nip plate are closed to nip the sheet bundle when the roller unit reinforces the fold line after the sheet bundle is transported to between the first nip plate and the second nip plate. | 2008-12-25 |