52nd week of 2016 patent applcation highlights part 76 |
Patent application number | Title | Published |
20160381768 | NETWORKING GROUPS OF PHOTOCONTROL DEVICES - Disclosed are various techniques for lighting control of groups of light fixtures by a remote device. The remote device receives, via a wireless network interface, an identifier from a photocontrol device that manages light output of the light fixture. The remote device transmits a request to establish a point-to-point communication session directly with the photocontrol device using the wireless network interface. Upon establishing the communication session, the remote device receives a list of photocontrols discovered by the photocontrol device via the photocontrol network. In response to input received, via a user interface of the remote device, to adjust a dimming schedule for a group of the photocontrols, the remote device instructs the photocontrol device to transmit, via the photocontrol network, an adjustment to a configuration for the group. | 2016-12-29 |
20160381769 | LUMINAIRE AND ILLUMINATION SYSTEM - A luminaire includes a light source; a wireless communication circuit for communicating with a dimming controller; a storage which stores an identifier of the dimming controller; and a control circuit for dimming light of the light source according to a dimming command transmitted from the dimming coat roller when the luminaire is in a paired state, i.e., a state in which the identifier of the dimming controller is stored in the storage of the luminaire. When the control circuit is in a communication check mode, i.e., a mode for checking whether or not the luminaire is able to communicate with the dimming controller, the control circuit, regardless of whether or not the luminaire is in the paired state with the dimming controller, brings the luminaire into a predetermined illumination state by dimming light of the light source when the wireless communication circuit receives a communication cheek command from the dimming controller. | 2016-12-29 |
20160381770 | ILLUMINATION CONTROLLER AND LUMINAIRE CONTROL METHOD - An illumination controller includes a communication interface circuit configured to communicate with a luminaire via radio waves; an input, device configured to obtain a manipulation instruction; and a control processor configured to generate at least a first command and a second command according to a corresponding manipulation instruction obtaining state of the input device, and transmit the command generated to the luminaire via the communication interface circuit, wherein, when the control processor has generated the first command according to the manipulation instruction obtaining state, the control processor is configured to repeatedly transmit the first command, generated to the luminaire at first transmission intervals, and when the control processor has generated the second command according to the manipulation instruction obtaining state, the control processor is configured to repeatedly transmit the second command generated to the luminaire at second transmission intervals different from the first transmission intervals. | 2016-12-29 |
20160381771 | WIRELESS DETECTION DEVICE AND LIGHTING DEVICE INCLUDING THE SAME - A wireless detection device may be applied to a lighting device. The wireless detection device may include a connection interface, a detection module, a processing module and a wireless communication module. The connection interface may be detachable coupled to the power conversion module of the lighting device, and coupled to the lighting module of the lighting device via the power conversion module. The detection module may be coupled to the connection module and may detect the change of the environment around the detection module to generate a detection signal. The processing module may be coupled to the detection module and the connection module. The wireless communication module may be coupled to the processing module. The detection module may transmit the detection signal to the power conversion module via the connection interface and/or transmit the detection signal to other lighting devices via the wireless communication module. | 2016-12-29 |
20160381772 | INFRARED EMITTER FOR AN AIRFIELD LIGHTING SYSTEM - In an example embodiment, there is disclosed herein an airfield lighting system that employs an IR emitter. The IR emitter can be located within an airfield lighting fixture or external to the lighting fixture. Activating the IR emitter can enable an Enhanced Flight Vision System (“EFVS”) to determine the location of lighting fixtures which may be undetectable by the EFVS, such as Light Emitting Diode (“LED”) fixtures. | 2016-12-29 |
20160381773 | SEMICONDUCTOR LIGHT SOURCE DRIVING APPARATUS - The semiconductor light source driving apparatus includes light source modules, a current control element, a second current detection element, a DC power supply, and a controller. The light source modules each include the following components connected in parallel: a semiconductor light source; a first constant-voltage diode; a series circuit of a first current detection element and a second constant-voltage diode with a lower breakdown voltage than the first constant-voltage diode; and a switching element. The controller controls the DC power supply based on a detection output of the second current detection element. After the first current detection element generates a output in response to an open fault in any of the semiconductor light sources, and then the current control element is turned off, the controller turns on the switching element of the light source module with the open fault, thereby allowing the current control element to be controlled. | 2016-12-29 |
20160381774 | METHODS AND SYSTEMS FOR CONTROLLING AN ELECTRICAL LOAD - An electronic dimming ballast or light emitting diode (LED) driver for driving a gas discharge lamp or LED lamp may be operable to control the lamp to avoid flickering and flashing of the lamp during low temperature or low mercury conditions. Such a ballast or driver may include a control circuit that is operable to adjust the intensity of the lamp. Adjusting the intensity of the lamp may include decreasing the intensity of the lamp. The control circuit may be operable to stop adjustment of the intensity of the lamp if a magnitude of the lamp voltage across the lamp is greater than an upper threshold, and subsequently begin to adjust the intensity of the lamp when the lamp voltage across the lamp is less than a lower threshold. Subsequently beginning to adjust the intensity of the lamp may include subsequently decreasing the intensity of the lamp. | 2016-12-29 |
20160381775 | ESD PROTECTION FOR FINGERPRINT SENSOR - A fingerprint sensor is provided. The fingerprint sensor includes a sensing array sensing fingerprint information of a user, an insulating surface disposed on the sensing array, and a printed circuit board (PCB) disposed under the sensing array. The PCB includes a substrate, a ground plane disposed on the second surface of the substrate, and an electrostatic discharge (ESD) ring disposed on the first surface of the substrate and surrounding the sensing array. The substrate includes a first surface and a second surface opposite the first surface. The ESD ring surrounds the sensing array. When an ESD event occurs, ESD energy is discharged from the ESD ring to the ground plane through a plurality of vias in the substrate without passing the sensing array. | 2016-12-29 |
20160381776 | High Efficiency Laser-Sustained Plasma Light Source - A system for generating laser sustained broadband light includes a pump source configured to generate a pumping beam, a gas containment structure for containing a gas and a multi-pass optical assembly. The multi-pass optical assembly includes one or more optical elements configured to perform a plurality of passes of the pumping beam through a portion of the gas to sustain a broadband-light-emitting plasma. The one or more optical elements are arranged to collect an unabsorbed portion of the pumping beam transmitted through the plasma and direct the collected unabsorbed portion of the pumping beam back into the portion of the gas. | 2016-12-29 |
20160381777 | INDUCTION PLASMA TORCH WITH HIGHER PLASMA ENERGY DENSITY - An induction plasma torch comprises a tubular torch body, a tubular insert, a plasma confinement tube and an annular channel. The tubular torch body has upstream and downstream sections defining respective inner surfaces. The tubular insert is mounted to the inner surface of the downstream section of the tubular torch body. The plasma confinement tube is disposed in the tubular torch body, coaxial therewith. The plasma confinement tube has a tubular wall having a thickness tapering off in an axial direction of plasma flow. The annular channel is defined between, on one hand, the inner surface of the upstream section of the tubular torch body and an inner surface of the insert and, on the other hand, an outer surface of the tubular wall of the plasma confinement tube. The cooling channel carries a fluid for cooling the plasma confinement tube. | 2016-12-29 |
20160381778 | PLASMA CUTTING APPARATUS - The present invention is a plasma cutting apparatus (A) configured such that a starting gas is switched to plasma gas at the stage when current is applied to an electrode provided to a plasma torch, and a plasma arc is produced at a preset current value on a material (B) to be cut, so as to extend the life of the electrode, wherein the apparatus is configured to have: a starting gas supply unit ( | 2016-12-29 |
20160381779 | METHOD AND APPARATUS FOR OPERATING TRAVELING SPARK IGNITER AT HIGH PRESSURE - An ignition circuit and a method of operating an igniter (preferably a traveling spark igniter) in an internal combustion engine, including a high pressure engine. A high voltage is applied to electrodes of the igniter, sufficient to cause breakdown to occur between the electrodes, resulting in a high current electrical discharge in the igniter, over a surface of an isolator between the electrodes, and formation of a plasma kernel in a fuel-air mixture adjacent said surface. Following breakdown, a sequence of one or more lower voltage and lower current pulses is applied to said electrodes, with a low “simmer” current being sustained through the plasma between pulses, preventing total plasma recombination and allowing the plasma kernel to move toward a free end of the electrodes with each pulse. | 2016-12-29 |
20160381780 | Superconducting Magnet Winding Structures for the Generation of Iron-Free Air Core Cyclotron Magnetic Field Profiles - A superconducting air core cyclotron that replaces the iron core flutter field structure with an active superconducting wire structure with a superconducting main coil generating an isochronous field, and superconducting compensation coils generating the magnetic shield for the magnetic structure. | 2016-12-29 |
20160381781 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board including a core layer having a first surface and a second surface opposite to the first surface; a first build-up layer and a second build-up layer formed on the first surface and the second surface of the core layer, respectively, and including a conductive pattern and a conductive via; and an outer layer formed on the surface of the first build-up layer and the second build-up layer, wherein at least one build-up layer of the first build-up layer and the second build-up layer comprises a photosensitive insulating layer in which a cavity is disposed and a thermal dissipation unit disposed in the cavity. | 2016-12-29 |
20160381782 | LIGHT EMITTING ELEMENT MODULE - A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer. | 2016-12-29 |
20160381783 | Boss-Type Metal-Based Sandwich Rigid-Flex Board and Preparation Method Thereof - A boss-type metal-based sandwich rigid-flex board and preparation method thereof are disclosed. The boss-type metal-based sandwich rigid-flex board comprises a rigid sub-plate, a flexible sub-plate, a dielectric layer, and a metal core layer, wherein the metal core layer has front and back sides on which at least one metal boss and at least one heat dissipation area are arranged respectively, the dielectric layer, and the rigid sub-plate and/or the flexible sub-plate are sequentially stacked on the front and back sides of the metal core layer respectively, and each of the rigid sub-plate, the flexible sub-plate and the dielectric layer is provided with a first window area fit with the metal boss, and a second window area corresponding to the heat dissipation area. The boss-type metal-based sandwich rigid-flex board (with a metal boss and a heat dissipation area arranged on the front side) prepared according to the present disclosure uses a metal core layer for heat dissipation. In this way, not only the need of heat dissipation of the locally heating electron components (through the metal boss) but also the heat dissipation of the high density wirings at work can be satisfied (through the metal core layer and the heat dissipation area) with good reliability. | 2016-12-29 |
20160381784 | COMMUNICATION MODULE AND METHOD OF MANUFACTURING COMMUNICATION MODULE - A communication module includes a flexible board having a first region, a second region, and a third region located between the first region and the second region, a communication circuit including a communication electronic component mounted on one surface of the first region, an antenna dielectric mounted on a portion of one surface of the second region, a matching circuit including a matching electronic component mounted on another portion of the one surface of the second region, and an antenna including a metal pattern formed in the other surface of the second region, the matching circuit matches the antenna with the communication circuit, the communication circuit is sealed with a resin, the third region is folded, and the resin and the antenna dielectric are brought into contact with each other. | 2016-12-29 |
20160381785 | MOLDING TYPE POWER MODULE - A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device. | 2016-12-29 |
20160381786 | FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided. | 2016-12-29 |
20160381787 | ESD PROTECTION OF ELECTRONIC DEVICE - An electronic device is provided. A first PCB includes a plurality of ground pads. A fingerprint sensor includes a sensing array, an insulating surface disposed on the sensing array, and a second PCB disposed between the sensing array and the first PCB. The sensing array senses fingerprint information of a user. The second PCB includes a substrate having a first surface and a second surface opposite the first surface, a metal trace disposed on the first surface and adjacent to the sensing array, and a plurality of ESD pads disposed on the second surface and coupled to the first ground pads of the first PCB, respectively. When an ESD event occurs, ESD energy is discharged from the metal trace to the first ground pads of the first PCB through a plurality of vias and the ESD pads without passing through the sensing array. | 2016-12-29 |
20160381788 | Method For Producing A Power Printed Circuit And Power Printed Circuit Obtained By This Method - The invention relates to a process for manufacturing a power circuit board in which, on the one hand, a printed circuit board including an insulating substrate and a conductive track on one of the sides of the substrate, and on the other hand, a bus bar element, are provided. The bus bar element is welded to the conductive track using a laser. In order to make it possible to produce the weld by laser welding, even with a relatively thick bus bar, the welding is carried out in a zone that is thinner relative to the maximum thickness of the bus bar. Thus, a printed circuit board is obtained with a bus bar having a thick zone for conducting high currents and a thinner zone in order to allow the bus bar to be welded to the conductive track by laser welding. | 2016-12-29 |
20160381789 | Controlled Buckling Structures in Semiconductor Interconnects and Nanomembranes for Stretchable Electronics - In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices. | 2016-12-29 |
20160381790 | ADHESIVE JOINT SYSTEM FOR PRINTED CIRCUIT BOARDS - An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap. | 2016-12-29 |
20160381791 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an inner layer including at least one insulating layer and wiring parts, and outer layers disposed on opposing sides of the inner layer, the outer layers including reinforcing layers and wiring parts, the reinforcing layers having a greater degree of rigidity than the insulating layer | 2016-12-29 |
20160381792 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board in accordance with an embodiment includes a core layer, a photo imagable dielectric layer, and an inner circuit layer. The core layer includes a core stiffener layer, a first metal layer formed on an upper surface of the core stiffener layer, and a second metal layer formed on a lower surface of the core stiffener layer. The photo imagable dielectric layer is formed on an upper surface and a lower surface of the core layer. The inner circuit layer is formed on the photo imagable dielectric layer. | 2016-12-29 |
20160381793 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board of the present disclosure includes an insulating layer and a wiring conductor. The wiring conductor is buried in an insulating layer in such a manner as to have a top surface exposed to a surface of the insulating layer. The wiring conductor includes, at a portion buried in the insulating layer, a wiring level difference part or a wiring inclined part having a width larger than a width of the top surface. | 2016-12-29 |
20160381794 | MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern. | 2016-12-29 |
20160381795 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - An electronic device includes: a substrate; a Cu-containing wiring layer formed over the substrate; a barrier metal layer that covers a surface of the Cu-containing wiring layer and suppresses diffusion of Cu; and a coating insulating layer that covers the barrier metal layer, wherein the barrier metal layer has a void that does not reach the Cu-containing wiring layer, and the void is filled with the coating insulating layer. | 2016-12-29 |
20160381796 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order. | 2016-12-29 |
20160381797 | CAPACITOR STRUCTURE AND CAPACITOR USING THE SAME - Embodiments of the present invention provide a capacitor structure. The capacitor structure comprises: a first plurality of metal plates that are vertically disposed with their surfaces being parallel to each other; a second plurality of metal plates that are interdigitated with the first plurality of metal plates with their surfaces being parallel to the surfaces of the first plurality of metal plates; a first port electrically connected to each of the first plurality of metal plates through a first plurality of port connecting strips and via a first port via interconnection; and a second port electrically connected to each of the second plurality of metal plates through a second plurality of port connecting strips and via a second port via interconnection. The first plurality of metal plates is connected together at an end of each of the first plurality of metal plates opposite to the end at which the first port is connected. The second plurality of metal plates is connected together at an end of each of the second plurality of metal plates opposite to the end at which the second port is connected. A direction in which the first plurality of port connecting strips extends is in a certain angle with the direction in which the second plurality of port connecting strips extends. | 2016-12-29 |
20160381798 | PEDESTAL MOUNTING OF SENSOR SYSTEM - Examples related to the incorporation of a sensor into an electronic device are disclosed. One example provides a system including a circuit board comprising a first side and a second side opposite the first side, a sensor housed in a package bonded to the first side of the circuit board, and a mounting pedestal coupled to the circuit board on the second side at a location opposite the package, the mounting pedestal configured to be mounted to a surface in an electronic device. | 2016-12-29 |
20160381799 | 3D ELECTRONIC MODULE COMPRISING A BALL GRID ARRAY STACK - A 3D electronic module comprises: two electrically tested electronic packages, each comprising at least one encapsulated chip and output balls on a single face of the package, referred to as the main face; two flexible circuits that are mechanically connected to one another, each being associated with a package, and which are positioned between the two packages, each flexible circuit comprising: on one face, first electrical interconnect pads facing the output balls of the associated package; at its end, a portion that is folded over a lateral face of the associated package; second electrical interconnect pads on the opposite face of this folded portion. | 2016-12-29 |
20160381800 | METHODS OF FORMING TRENCHES IN PACKAGES STRUCTURES AND STRUCTURES FORMED THEREBY - Methods of forming a package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one interconnect structure disposed on a peripheral region of the first substrate. A molding compound is disposed on a portion of the first substrate and on the first die, wherein a trench opening is disposed in the molding compound that is located between the at least one interconnect structure and the first die. | 2016-12-29 |
20160381801 | CONNECTION BODY AND CONNECTION BODY MANUFACTURING METHOD - Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body has an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent; the anisotropic conductive adhesive agent contains a binder resin layer in which conductive particles are regularly arranged; an inter-particle distance among the conductive particles in a space between connection electrodes formed on the electronic component being greater than the inter-particle distance among the conductive particles trapped between the connection electrodes and substrate electrodes formed on the circuit substrate. | 2016-12-29 |
20160381802 | MOUNTING SUBSTRATE - A multilayer ceramic capacitor connected to an output electrode and an input electrode of a mounting substrate includes a laminated body. In the laminating direction of the laminated body, the shortest distance from an outer first internal electrode to the surface of an external electrode on the side closer to a first principal surface, and the shortest distance from an outer second internal electrode to the surface of an external electrode on the side closer to a second principal surface are each about 40 μm or less. In the width direction of the laminated body, the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a first side surface, and the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a second side surface are each about 40 μm or less. | 2016-12-29 |
20160381803 | CONICAL INDUCTOR, PRINTED CIRCUIT BOARD, AND OPTICAL MODULE - A conical inductor provided in the present invention includes: a housing, a conical coil located inside the housing, a first pin and a second pin respectively connected to two ends of the conical coil, where one end of the first pin is connected to one end of the conical coil, the other end of the first pin is connected to a hole in a first side wall of the housing in a fastened manner, one end of the second pin is connected to the other end of the conical inductor, and the other end of the second pin is connected to a hole in a second side wall of the housing in a fastened manner; and each of the first pin and the second pin includes one segment of waveform segment fluctuating in a direction perpendicular to a top wall of the housing. | 2016-12-29 |
20160381804 | FLEXIBLE INTERCONNECT STRUCTURE FOR A SENSOR ASSEMBLY - This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor. | 2016-12-29 |
20160381805 | COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHOD OF PRODUCING ELECTRONIC DEVICES - The present invention provides a copper foil with a carrier including an ultra-thin copper layer having a thickness of 0.9 μm or less and capable of preferably preventing generation of pin holes during peeling of the carrier. A copper foil with a carrier including a carrier, an intermediate layer, and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer has a thickness of 0.9 μm or less, and the releasing strength during peeling of the carrier by a 90° releasing method according to JIS C 6471 8.1 is 10 N/m or less. | 2016-12-29 |
20160381806 | COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHOD OF PRODUCING ELECTRONIC DEVICES - The present invention provides a copper foil with a carrier including an ultra-thin copper layer having a thickness of 0.9 μm or less and capable of preferably preventing generation of pin holes during peeling of the carrier. A copper foil with a carrier including a carrier, an intermediate layer, and an ultra-thin copper layer in this order, wherein the ultra-thin copper layer has a thickness of 0.9 μm or less, the surface close to the ultra-thin copper layer of the carrier has an arithmetic average roughness Ra of 0.3 μm or less, as measured with a laser microscope according to JIS B0601-1994, and the releasing strength during peeling of the carrier by a 90° releasing method according to JIS C 6471 8.1 is 20 N/m or less. | 2016-12-29 |
20160381807 | Current Redistribution in a Printed Circuit Board - In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area. | 2016-12-29 |
20160381808 | Method of Reducing the Thickness of an Electronic Circuit - Disclosed is a method of reducing the thickness of an electronic circuit comprising a printed circuit and electronic components. The method includes the following operations: mounting electronic components in die form on the printed circuit, putting an insulating layer into place on the electronic components, and putting a conductive layer on the insulating layer. Various embodiments include an electronic circuit obtained by such a method; a thin plastic card, such as in a credit card format, including such an electronic circuit; and a bank card including such an electronic circuit. | 2016-12-29 |
20160381809 | FACE-UP SUBSTRATE INTEGRATION WITH SOLDER BALL CONNECTION IN SEMICONDUCTOR PACKAGE - Systems and methods relate to a semiconductor package comprising a first substrate or a 2D passive-on-glass (POG) structure with a passive component and a first set of one or more package pads formed on a face of a glass substrate. The semiconductor package also includes a second or laminate substrate with a second set of one or more package pads formed on a face of the second or laminate substrate. Solder balls are dropped, configured to contact the first set of one or more package pads with the second set of one or more package pads, wherein the first substrate or the 2D POG structure is placed face-up on the face of the second or laminate substrate. A printed circuit board (PCB) can be coupled to a bottom side of the second or laminate substrate. | 2016-12-29 |
20160381810 | FILM COMPOSITE HAVING ELECTRICAL FUNCTIONALITY FOR APPLYING TO A SUBSTRATE - A film composite with electrical functionality for application on a substrate includes at least one conductive structure, a first bonding coat, a film layer and a second bonding coat. The first bonding coat is disposed on an underside of the at least one conductive structure, wherein the first bonding coat has an adhesive effect for application of the at least one conductive structure on the substrate. The second bonding coat is disposed between an upper side of the at least one conductive structure and the film layer. The second bonding coat has an adhesive effect, by which the film layer adheres to the at least one conductive structure. | 2016-12-29 |
20160381811 | SEMICONDUCTOR DEVICE, RELATED MANUFACTURING METHOD, AND RELATED ELECTRONIC DEVICE - A semiconductor device may include the following elements: a first substrate; a second substrate; a dielectric layer, which may be positioned between the first substrate and the second substrate and may have a hole; a first conductive member, which may be positioned in the dielectric layer; a second conductive member, which may be positioned in the dielectric layer, may be spaced from the first conductive member, and may be positioned closer to the second substrate than the first conductive member; and a third conductive member, which may contact both the first conductive member and the second conductive member through the hole. | 2016-12-29 |
20160381812 | FOLDABLE DISPLAY DEVICE AND DISPLAY APPARATUS - A foldable display device and a display apparatus are provided. The foldable display device includes a supporting back plate and a display screen arranged in the front side of the supporting back plate. The supporting back plate includes a first supporting part and a second supporting part, and the first supporting part and the second supporting part may bend towards to the reverse side of the supporting back plate through a folding connection. One end of the display screen is fixedly connected to the first supporting part, and the other end of the display screen is slidably connected to the second supporting part. | 2016-12-29 |
20160381813 | DISPLAY DEVICE - Provided is a display device that includes a middle cabinet in which two display panels of which two rear sides are leaning on each other are safely held, and an incision is formed in at least a portion of a rim of the middle cabinet; a back cover is interposed between the two display panels and has an extension portion that is inserted through the incision and extends to an outside, and a fixing member in which control printed circuit boards that are coupled to the extension portion of the back cover and are connected to the two display panels respectively are embedded. | 2016-12-29 |
20160381814 | FLEXIBLE DISPLAY DEVICE - An embodiment of the present invention disclose a flexible display device, comprising: a housing; a supporting member, disposed inside the housing; a flexible display screen, having a first end and a second end opposite to each other, the first end being connected with the supporting member and being able to rotate around an axis; and at least one bracket rotationally connected with the housing and having a slot is arranged thereon, wherein, a side edge portion of the flexible display screen located between the first end and the second end is capable of moving along a direction of the slot under guidance of the bracket. | 2016-12-29 |
20160381815 | MOUNT BOARD TRAY AND ELECTRONIC DEVICE WITH MOUNT BOARD TRAY - A mount board tray is provided to hold multiple mount boards at different heights above and below the mount board tray. The mount board tray holds a topmost mount board placed at the topmost position among the multiple mount boards held by the mount board tray from below the topmost mount board. The mount board tray also holds a bottommost mount board placed at the bottommost position among the multiple mount boards from above the bottommost mount board at the same time. | 2016-12-29 |
20160381816 | MANAGED CONNECTIVITY IN ELECTRICAL SYSTEMS AND METHODS THEREOF - An electrical connector arrangement includes a storage device coupled to a connector housing. The storage device is configured to store physical layer information pertaining to the electrical connector arrangement. The storage device also has contacts that enable the physical layer information to be read from the storage device by a media reading interface. A connector assembly includes at least one receptacle assembly; a printed circuit board; and a media reading interface. | 2016-12-29 |
20160381817 | Method for Producing an Electronic Module having an Interlockingly Connected Housing Part Element - A method for producing an electronic module includes arranging a housing part element on a circuit board element after separately producing and preparing the housing part element. The housing part element is formed with a material that can be reversibly plasticized, such as a thermoplastic like polyamide. At least a portion of a surface of the housing part element is reversibly plasticized, for example via local heating or light irradiation. Arranging the housing part element on the circuit board element includes joining the plasticized portion of the surface of the housing part element to a microstructured portion of the circuit board element and then hardening the plasticized portion to form an interlocking and hermetically sealed connection therebetween. | 2016-12-29 |
20160381818 | WIRELESS ACCESS DEVICE ISOLATION CABINET - Technology is provided for a wireless access device isolation cabinet for use in software testing on multiple mobile devices. The wireless access device isolation cabinet isolates each wireless access device and the mobile devices communicating with the wireless access device from other nearby wireless access devices. The wireless access device isolation cabinet can include an enclosure having a plurality of walls configured to enclose an isolation region. The walls are electrically conductive to shield electromagnetic interference from entering or exiting the isolation region. A wireless access device is disposed in the isolation region to communicate with one or more mobile devices. A device tray comprising a non-conductive panel and a pair of support beams is mounted within the isolation region and configured to support the mobile devices. | 2016-12-29 |
20160381819 | DEVICE COVER AND ELECTRONIC PORT EXTENDER FOR AN ELECTRONIC DEVICE - A dongle or port extender and a cover design for electronic devices is provided. The port extender replicates a port on a given electronic device, and port extenders may be provided for all ports, including electrical and fiber optic ports. The replication of some or all of the ports by the separable port extender provides the ability to inexpensively repair a port by the replacement of the port extender. | 2016-12-29 |
20160381820 | ELECTRONIC DEVICE HAVING A WATERPROOF STRUCTURE - An electronic device according to the present invention comprises a main body including a pair of body chassis, a pair of cover panels disposed to cover the front face and the back face of the main body, a switch unit disposed on the side part of the main body, an operation button which is held between the pair of cover panels and has a pusher projecting therefrom, a housing recess which is formed on at least one of the body chassis and recessed on a joint surface with the other body chassis to form a housing chamber for the switch unit, a through hole penetrating the one body chassis from the side face toward the housing recess, and a bag-like waterproof packing member which is attached to the through hole and recessed toward the switch unit to house the pusher of the operation button. The pusher of the operation button passes through the through hole toward the switch unit, and the end of the waterproof packing member is pressed against the switch unit to fixedly hold the switch unit inside the housing recess. | 2016-12-29 |
20160381821 | DISPLAY PANEL, FABRICATION METHOD THEREOF AND DISPLAY DEVICE - A display panel, a fabrication method thereof and a display device are provided. The display panel has a display region ( | 2016-12-29 |
20160381822 | TERMINAL BLOCK WITH SEALED INTERCONNECT SYSTEM - A process variable transmitter for use in an industrial process includes a housing having a cavity formed therein. The housing has a barrier which divides the cavity into first and second cavities. Preferably, measurement circuitry in the first cavity is configured to measure a process variable of the industrial process. A terminal block assembly is positioned in the second cavity. The terminal block assembly forms a seal with the housing thereby forming a third cavity between the barrier and a circuit board of the terminal block assembly. | 2016-12-29 |
20160381823 | ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME - The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; and a first power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the circuit board, the chip and the first power converting module are stacked to form the assembly structure. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource. | 2016-12-29 |
20160381824 | OPEN CHASSIS AND SERVER MODULE INCORPORATING THE SAME - Technology is provided for an open chassis for use with server modules. The open chassis includes an end frame having opposed upper corner portions and opposed lower corner portions. A pair of lower beams, each having a proximal end portion, are connected to a respective lower corner portion of the end frame. A pair of upper beams, each having a proximal end portion, are connected to a respective upper corner portion of the end frame. First and second columns extend between distal end portions of the lower beams and the upper beams. A cross-member extends between the distal end portions of the lower beams. Each beam includes an outward facing surface and an inward facing surface, and at least one of the beams includes a relief formed in its corresponding inward facing surface. | 2016-12-29 |
20160381825 | MULTIPLE GRAPHICS PROCESSING UNIT PLATFORM - A multiple graphics processing unit (multi-GPU) platform including a cubby chassis and at least one multi-GPU sled. The cubby chassis includes partitions defining a plurality of sled positions. The multi-GPU sled includes a chassis having a vertical sidewall and a horizontal bottom wall with an open top and an open side. A side-plane PCB is mounted to the vertical sidewall and a plurality of dividers are attached to the bottom wall and oriented perpendicular to the side-plane PCB. One or more GPU cards are connected to the side-plane PCB and are supported on the plurality of dividers. The GPU cards include a GPU PCB having a first side facing the bottom wall and an outward facing second side. A cover is coupled to the horizontal bottom wall to enclose the open side of the sled chassis and help direct airflow across the GPU cards. | 2016-12-29 |
20160381826 | CONDITIONING UNIT OF THE FREE COOLING TYPE AND METHOD OF OPERATION OF SUCH A CONDITIONING UNIT - A conditioning unit of the free cooling type, particularly for conditioning computing centers, of the type comprising:
| 2016-12-29 |
20160381827 | PLASTIC CHASSIS FOR LIQUID COOLED ELECTRONIC COMPONENTS - A system for mounting liquid cooled electrical components includes a plastic chassis having a plurality of mounting sites. The plastic chassis defines at least one fluid circuit that extends through at least a portion of a length of the plastic chassis. The at least one fluid circuit includes an inlet configured to receive a cooling fluid from a fluid source, an outlet configured to return the cooling fluid to the fluid source, and at least one fluid channel extending between the inlet and the outlet. The system also includes a plurality of electrical components. Each of the plurality of electrical components is coupled with one of the plurality of mounting sites. Each of the plurality of mounting sites is in contact with the at least one fluid channel. | 2016-12-29 |
20160381828 | BENDABLE WATER-COOLING DEVICE - A bendable water-cooling device includes: a pump unit having a pump case and a driver. The pump case has a pump chamber, a first inlet and a first outlet. The pump case is formed with a first pivotal connection section on the same side as the first outlet; a heat exchange unit having a liquid reservoir case and a heat dissipation member, the liquid reservoir case having a heat exchange chamber, a second inlet and a second outlet, the liquid reservoir case being formed with a second pivotal connection section on the same side as the second inlet; and a pivot unit having a first mating section and a second mating section respectively pivotally connected with the first and second pivotal connection sections. The pump unit and the heat exchange unit are bendable around the pivot unit from a horizontal position to an upper and lower overlapping position. | 2016-12-29 |
20160381829 | COOLING DEVICE AND WIRELESS POWER SUPPLY SYSTEM - A cooling device of the present disclosure is attached to a park station where wireless power supply is performed to a vehicle using a coil and cools a coil provided on the vehicle by spraying a coolant. | 2016-12-29 |
20160381830 | ACTIVE PERFORATION FOR ADVANCED SERVER COOLING - Embodiments of the present disclosure generally relate to the thermal management and regulation of electronic equipment. Microfluidic channels are utilized to actively change the aerodynamics of a surface, which may allow for the ability to change a surface texture from flat to raised, or dimpled, or from open to closed. The changing of the surface texture influences the fluid flow over or through the surface, thus allowing for thermal regulation of the surface. The thermal regulation system further controls fluid flow through an electronic device via a coating, or layer, having a plurality of active perforations thereon. The active perforations may open and close to increase and decrease the inlet of air to the system in order to help balance the back pressure in the system and redirect airflow to more sensitive system components. Active perforations may be individually opened and/or closed depending on location and system component utilization. | 2016-12-29 |
20160381831 | BYPASSING A REMOVED ELEMENT IN A LIQUID COOLING SYSTEM - A source of liquid provided an input of liquid into a liquid cooling system. The liquid from the source of liquid flows through a check valve assembly which includes an input, a first output, and a second output. The second output includes a check valve configured to open when the pressure of the liquid exceeds a threshold pressure value. A connector is attached to the first output of the check valve assembly. The connector is a quick connect fitting equipped with a self-sealing valve. | 2016-12-29 |
20160381832 | DIFFERENTLY ORIENTED LAYERED THERMAL CONDUIT - A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path. | 2016-12-29 |
20160381833 | HEAT SINK, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAME - A heat sink includes a connecting member, a first substrate, a second substrate, and a cooling medium. The connecting member is sandwiched between the first substrate and the second substrate, and defines at least one hole passing through the connecting member. Each hole includes a first end and a second end respectively enclosed by the first substrate and the second substrate to define a cavity. The cooling medium is filled in each cavity. | 2016-12-29 |
20160381834 | MODULAR COOLING SYSTEM - Technologies for modular cooling systems for cooling electronic components installed in equipment racks are provided herein. A modular cooling system comprises a cold plate and a support manifold connected to the cold plate. Together, the support manifold and cold plate define a fluid path for cooling fluid from the support manifold to the cold plate. The modular cooling system also includes an equipment carrier including equipment cooled by the cold plate. | 2016-12-29 |
20160381835 | ARTIFICIAL REEF DATACENTER - Examples of the disclosure provide for an apparatus for actively promoting marine life. The apparatus includes a datacenter implemented in a body of water and coupled to a network, a pressure vessel that houses the datacenter, and one or more components coupled to the pressure vessel and adapted to actively promote reef life and sustain a surrounding ecosystem. | 2016-12-29 |
20160381836 | FACILITATING FRONT ACCESS TO REAR-MOUNTED ASSEMBLY IN EQUIPMENT CHASSIS - An equipment chassis includes a rear-mountable fan tray assembly (FTA) having a plurality of fans arranged into two or more FTA housing portions, the rear-mountable fan tray assembly being slidably insertable into and retractable from the equipment chassis for facilitating front-to-back airflow while providing ease of access. The FTA housing portions are articulatably coupled to each other and are arranged to follow a smooth motion path when traveling from a horizontal position to a vertical position and vice versa when the rear-mountable fan tray assembly is either inserted into or retracted from the equipment chassis, wherein a top FTA housing portion is guided by a top curvilinear tracking path and a bottom FTA housing portion is guided by a bottom curvilinear tracking path. | 2016-12-29 |
20160381837 | EXHAUST AIR DEFLECTING SYSTEM - An air deflecting system includes an air deflector that is physically mounted against a hot air exhaust vent of a network equipment element using a rack coupling mechanism that is adjustable to accommodate a variable lateral distance of the hot air exhaust vent from the computing rack. The air deflector receives an airflow from the hot air exhaust vent at a first direction and deflects the airflow in a second direction. | 2016-12-29 |
20160381838 | COOLING DEVICE AND ELECTRONIC DEVICE SYSTEM - A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator. | 2016-12-29 |
20160381839 | COOLING ELECTRONIC DEVICES IN A DATA CENTER - A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways. | 2016-12-29 |
20160381840 | UNDERWATER CONTAINER COOLING VIA INTEGRATED HEAT EXCHANGER - In one example, a portion of a shell includes a shell wall portion that has an interior wall portion and an exterior wall portion located near the interior wall portion. In addition, fluid passageways are disposed between the interior wall portion and the exterior wall portion. One or more of the fluid passageways are defined in part by one or both of the interior wall portion and the exterior wall portion. The fluid passageways form part of heat exchanger that is integrated in the shell. | 2016-12-29 |
20160381841 | UNDERWATER CONTAINER COOLING VIA EXTERNAL HEAT EXCHANGER - In one example, a shell includes walls that collectively define an interior space of the shell, the interior space sized and configured to receive heat generating equipment. An internal heat exchanger disposed within the interior space is arranged for thermal communication with heat generating equipment when heat generating equipment is located in the interior space. Additionally, an external heat exchanger is located outside of the shell and arranged for fluid communication with the internal heat exchanger. Finally, a prime mover is provided that is in fluid communication with the internal heat exchanger and the external heat exchanger, and the prime mover is operable to circulate a flow of coolant through the internal heat exchanger and the external heat exchanger. | 2016-12-29 |
20160381842 | MODULAR RADIO FREQUENCY SHIELDING - In an embodiment, a modular RF shielding is disclosed. According to an embodiment, a device is disclosed comprising: at least one radio frequency shielding block including: an electrically conductive wall configured to radio frequency shielding; an electrically conductive portion of a ceiling, wherein the portion of the ceiling is connected to the wall; at least one support element, or the shape of the modular block itself, is extending transversely from the wall and configured to uphold the wall, wherein the support element is configured to rest against a portion of a printed circuit board and a length of the support element is shorter than a length of the block; wherein the wall is configured next to an electrical component of the printed circuit board and wherein the electrical component is configured at least partly beneath the portion of the ceiling. Other embodiments relate to a mobile device and a manufacturing method for the modular RF shielding. | 2016-12-29 |
20160381843 | MULTILAYER MAGNETIC SHIELD - Provided is a multilayer magnetic shield | 2016-12-29 |
20160381844 | APPARATUS AND METHOD FOR THE MANUFACTURING OF PRINTED WIRING BOARDS AND COMPONENT ATTACHMENT - An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non- conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to accept PCB multilayer circuit board files and convert multilayer circuit board layout data of the PCB multilayer circuit board files to printing data files for controlling the function head to print conductive material and nonconductive material onto the substrate to produce a printed circuit effecting functionality of the multilayer circuit board layout data. | 2016-12-29 |
20160381845 | BUXUS 'Clair Curtis' - A New and distinct | 2016-12-29 |
20160381846 | Pieris plant named 'CABERNET' - A new and distinct cultivar of | 2016-12-29 |
20160381847 | Pieris plant named 'SINCERE' - A new and distinct cultivar of | 2016-12-29 |
20160381848 | Hibiscus Plant Named 'EXTRHOPIN2' - A new and distinct cultivar of | 2016-12-29 |
20160381849 | Hibiscus Plant Named 'Extrewhiteye' - A new and distinct cultivar of | 2016-12-29 |
20160381850 | Poinsettia Plant Named 'PER1295' - A new and distinct cultivar of Poinsettia plant named ‘PER1295’, characterized by its uniform, upright and mounded plant habit; moderately vigorous growth habit; freely and upright branching habit; very dark green-colored leaves; early flowering response; large inflorescences with crimson-colored flower bracts; and good post-production longevity. | 2016-12-29 |
20160381851 | Phalaenopsis orchid plant named 'PHALDUKAI' - A new and distinct variety of | 2016-12-29 |
20160381852 | Phalaenopsis orchid plant named 'PHALDASAJ' - A new and distinct variety of | 2016-12-29 |
20160381853 | Phalaenopsis orchid plant named 'PHALFLACAN' - A new and distinct variety of | 2016-12-29 |
20160381854 | Phalaenopsis orchid plant named 'PHALDESAL' - A new and distinct variety of | 2016-12-29 |
20160381855 | Dahlia plant named 'Peach Flamingo' - A new cultivar of | 2016-12-29 |
20160381856 | Heucherella plant named 'Infinity' - A new and distinct cultivar of | 2016-12-29 |
20160381857 | Lychnis plant named 'Lychjenpet' - A new and distinct cultivar of | 2016-12-29 |