Patent application number | Description | Published |
20130039813 | Systems and Methods for Sealing in Site-Isolated Reactors - Substrate processing systems and methods are described for site-isolated processing of substrates. The processing systems include numerous site-isolated reactors (SIRs). The processing systems include a reactor block having a cell array that includes numerous SIRs. A sleeve is coupled to an interior of each of the SIRs. The sleeve includes a compliance device configured to dynamically control a vertical position of the sleeve in the SIR. A sealing system is configured to provide a seal between a region of a substrate and the interior of each of the SIRs. The processing system can include numerous modules that comprise one or more site-isolated reactors (SIRs) configured for one or more of molecular self-assembly and combinatorial processing of substrates. | 02-14-2013 |
20130065796 | Advanced Mixing System for Integrated Tool Having Site-Isolated Reactors - An integrated processing tool is described comprising a full-wafer processing module and a combinatorial processing module. Chemicals for use in the combinatorial processing module are fed from a delivery system including a set of first manifolds. An output of each first manifold is coupled to at least one mixing vessel. An output of each mixing vessel feeds more than one of a set of second manifolds. An output of each set of second manifolds feeds one of multiple site-isolated reactors of the combinatorial processing module. | 03-14-2013 |
20130171802 | FULL WAFER PROCESSING BY MULTIPLE PASSES THROUGH A COMBINATORIAL REACTOR - Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing. | 07-04-2013 |
20140014184 | Effluent Management, Waste Dilution, Effluent Pre-Dilution, Acid Waste Handling - Multiple waste streams, including incompatible chemicals such as concentrated acids and/or strong base effluents, are handled together without the need for limiting or interrupting the processes run by the wafer processing tools. In some embodiments, waste tanks are primed with diluents, such as water, and a predetermined percentage of diluent is maintained in the waste tanks. In some embodiments, a diluent is flowed into the waste tanks concurrently with the waste pumping to generate a rinsing action for the waste tanks. Methods of the present disclosure accommodate both gravity type and vacuum type waste tanks. | 01-16-2014 |
20140124038 | Reactor cell isolation using differential pressure in a combinatorial reactor - Methods for combinatorially processing semiconductor substrates are provided. The methods may involve receiving a substrate into a combinatorial processing chamber and sealing a plurality of flow cells against a surface of the substrate. The plurality of flow cells is enclosed within the combinatorial processing chamber to define an enclosed external environment for the plurality of flow cells. A pressure differential is created between a reaction area of the plurality of flow cells of the combinatorial processing chamber and the external environment, wherein each flow cells of the plurality of flow cells defines a site isolating region of die substrate. The regions the substrate are then combinatorially processed. | 05-08-2014 |
20140127974 | Combinatorial Tool for Mechanically-Assisted Surface Polishing and Cleaning - Polishing and cleaning techniques are combinatorially processed and evaluated. A polishing system can include a reactor assembly having multiple reaction chambers, with at least a reaction chamber including a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Different downward forces can be applied to the polishing heads for evaluating optimum process conditions. Channels in the polishing pads can redistribute slurry and chemical to the polishing area. | 05-08-2014 |
20140133265 | Contactless Magnetically Driven Agitation Systems - Provided are liquid agitating systems having magnetically actuated agitating members that do not come in contact with internal surfaces of liquid holding vessels. As such, some mechanically weak materials, such as polytetrafluoroethylene and perfluoroalkoxy polymer, may be used for internal surfaces of these vessels. An agitating member may be held by a supporting member that allows the agitating member to move within a vessel without touching its bottom. The supporting member effectively controls the distance between the agitating member and some supporting point. An external magnet provided under the vessel may be used for magnetic actuation. The agitating member includes an internal magnet that is magnetically coupled to the external magnet and that follows the path of the external magnet thereby moving the agitating member and agitating the liquid. In some embodiments, multiple external magnets may be used to position one or more agitating member. | 05-15-2014 |
20140144471 | Contamination Control, Rinsing, and Purging Methods to Extend the Life of Components within Combinatorial Processing Systems - Methods and apparatuses for controlling contamination within processing modules and extending the life of system components within processing modules of combinatorial processing systems are disclosed. Methods include injecting a purging fluid into distribution lines within a processing module after one step of a process recipe. Further, injecting a flushing fluid into the distribution lines after the purging fluid is introduced therein. Furthermore, injecting the purging fluid and the flushing fluid into the fluid distribution line multiple times before initiating a next step of the process recipe. Finally, injecting a purging fluid into the distribution lines before initiating a next process step. | 05-29-2014 |
20140144512 | Methods and Systems for Dispensing Different Liquids for High Productivity Combinatorial Processing - Provided are methods and systems for dispensing different chemicals used for high productivity combinatorial processing. A dispense panel may include multiple inlet lines for supplying different chemicals. Each inlet line is connected to its own three-way valve that either allows the supplied chemical to flow from the inlet line towards a dispense valve connected to a dispense manifold (during dispensing of the supplied chemical) or allows another chemical to flow from the dispense valve to a waste manifold (during priming of the dispense manifold with this other chemical). Specifically, during priming a chemical supplied from its inlet line and is passed through a corresponding three-way valve and is directed to its dispense valve and then into the dispense manifold. Other dispense valves and three-way valves of the dispense panel allow this chemical to flow out of the dispense manifold, thereby priming remaining parts of the panel. | 05-29-2014 |
20140150245 | Pneumatic Clamping Mechanism for Cells with Adjustable Height - In some embodiments of the present disclosure, an apparatus for combinatorial wet processing includes: a chuck, a substrate located on the chuck, a cell located over the substrate; and a height adjustment mechanism for the cell above the substrate wherein applying compressed air on an O-ring in a gland prevents vertical movement of the cell relative to the position of the substrate. | 06-05-2014 |
20140166050 | Chuck for Mounting a Semiconductor Wafer for Liquid Immersion Processing - Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described. | 06-19-2014 |
20140166840 | Substrate Carrier - A substrate carrier is provided. The substrate carrier includes a base for supporting a substrate. A plurality of support tabs is affixed to a surface of the base. The plurality of support tabs have a cavity defined within an inner region of each support tab of the plurality of support tabs. A plurality of protrusions extends from the surface of the base, wherein one of the plurality of protrusions mates with one cavity to support one of the plurality of support tabs. A film is deposited over the surface of the base, surfaces of the plurality of support tabs and surfaces of the plurality of protrusions. | 06-19-2014 |
20140315370 | Full Wafer Processing By Multiple Passes Through A Combinatorial Reactor - Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing. | 10-23-2014 |