Patent application number | Description | Published |
20090183570 | Micromachined cross-differential dual-axis accelerometer - Micromachined accelerometer having one or more proof masses ( | 07-23-2009 |
20090241634 | Micromachined accelerometer and method with continuous self-testing - Micromachined accelerometer and method in which a proof mass is suspended above a substrate for movement in response to acceleration, electrodes form capacitors which change in capacitance in response to movement of the proof mass, processing circuitry responsive to the changes in capacitance provides an output signal corresponding to movement of the proof mass, a test signal is applied to the electrodes during use of the accelerometer to produce additional movement of the proof mass and a corresponding test signal component in the output signal, and the output signal is monitored to determine whether the accelerometer is operating normally by the presence of the test signal component in the output signal. | 10-01-2009 |
20090272189 | Robust Six Degree-of-Freedom Micromachined Gyroscope with Anti-Phase Drive Scheme and Mehtod of Operation of the Same - A method of operating an anti-phase six degree-of-freedom tuning fork gyroscope system comprises the steps of driving a first three degree-of-freedom gyroscope subsystem, and driving a second three degree-of freedom gyroscope subsystem in an anti-phase mode with the first gyroscope subsystem at an anti-phase resonant frequency. Acceleration or an angular rate of motion is sensed by means of the first and second three degree-of-freedom gyroscope subsystems operating in a flat frequency response range where the anti-phase resonant frequency is designed. Response gain and phase are stable and environmental and fabrication perturbations are avoided by such operation. A anti-phase six degree-of-freedom tuning fork gyroscope system which operates as described is also characterized. | 11-05-2009 |
20090282917 | Integrated multi-axis micromachined inertial sensing unit and method of fabrication - Integrated micromachined inertial sensing unit with multi-axis angular rate and acceleration sensors and method of fabricating the same. Micromachined angular rate and acceleration sensors are integrated together with an application-specific integrated circuit (ASIC) in one compact package. The ASIC combines many separate functions required to operate multiple rate sensors and accelerometers into a single chip. The MEMS sensing elements and the ASIC are die-stacked, and electrically connected either directly using ball-grid-arrays or wirebonding. Through the use of a single package and single ASIC for multiple angular rate and acceleration sensors, significant reduction in cost is achieved. | 11-19-2009 |
20100095768 | Micromachined torsional gyroscope with anti-phase linear sense transduction - Micromachined gyroscope having a pair of masses disposed generally in a plane and driven for out-of-plane torsional oscillation about a pair of drive axes in the plane for sensing rotation about an input axis perpendicular to the drive axes. The masses are mounted for in-plane torsional movement about sense axes perpendicular to the drive axes and the input axis in response to Coriolis forces produced by rotation of the masses about the input axis. A link connects the two masses together for movement of equal amplitude and opposite phase both about the drive axes and about the sense axes. The masses are connected to transducers having input electrodes constrained for linear in-plane movement relative to stationary electrodes, with that torsional movement of the masses about the sense axes producing changes in capacitance between the input electrodes and the stationary electrodes. | 04-22-2010 |
20110030473 | MICROMACHINED INERTIAL SENSOR DEVICES - A micromachined inertial sensor with a single proof-mass for measuring 6-degree-of-motions. The single proof-mass includes a frame, an x-axis proof mass section attached to the frame by a first flexure, and a y-axis proof mass section attached to the frame by a second flexure. The single proof-mass is formed in a micromachined structural layer and is adapted to measure angular rates about three axes with a single drive motion and linear accelerations about the three axes. | 02-10-2011 |
20110031565 | MICROMACHINED DEVICES AND FABRICATING THE SAME - Micromachined devices and methods for making the devices. The device includes: a first wafer having at least one via; and a second wafer having a micro-electromechanical-systems (MEMS) layer. The first wafer is bonded to the second wafer. The via forms a closed loop when viewed in a direction normal to the top surface of the first wafer to thereby define an island electrically isolated. The method for fabricating the device includes: providing a first wafer having at least one via; bonding a second wafer having a substantially uniform thickness to the first wafer; and etching the bonded second wafer to form a micro-electromechanical-systems (MEMS) layer. | 02-10-2011 |
20110265564 | Micromachined piezoelectric x-axis gyroscope - This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device. | 11-03-2011 |
20110265565 | Micromachined piezoelectric X-axis gyroscope - This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Some gyroscopes include a drive frame, a central anchor and a plurality of drive beams disposed on opposing sides of the central anchor. The drive beams may connect the drive frame to the central anchor. The drive beams may include a piezoelectric layer and may be configured to cause the drive frame to oscillate torsionally in a plane of the drive beams. The gyroscope may also include a proof mass and a plurality of piezoelectric sense beams. At least some components may be formed from plated metal. The drive frame may be disposed within the proof mass. The drive beams may constrain the drive frame to rotate substantially in the plane of the drive beams. Such devices may be included in a mobile device, such as a mobile display device. | 11-03-2011 |
20110265566 | Micromachined piezoelectric z-axis gyroscope - This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a central anchor, a sense frame disposed around the central anchor, a plurality of sense beams configured for connecting the sense frame to the central anchor and a drive frame disposed around and coupled to the sense frame. The gyroscope may include pairs of drive beams disposed on opposing sides of the sense frame. The gyroscope may include a drive frame suspension for substantially restricting a drive motion of the drive frame to that of a substantially linear displacement along the first axis. The sense frame may be substantially decoupled from drive motions of the drive frame. Such devices may be included in a mobile device, such as a mobile display device. | 11-03-2011 |
20110270569 | Micromachined piezoelectric three-axis gyroscope and stacked lateral overlap transducer (slot) based three-axis accelerometer - This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using x-axis gyroscopes, y-axis gyroscopes, z-axis gyroscopes, two-axis accelerometers and three-axis accelerometers. Combining fabrication processes for such devices can enable the monolithic integration of six inertial sensing axes on a single substrate, such as a single glass substrate. Such devices may be included in a mobile device, such as a mobile display device. | 11-03-2011 |
20120234093 | MICROELECTROMECHANICAL SYSTEM DEVICE INCLUDING A METAL PROOF MASS AND A PIEZOELECTRIC COMPONENT - This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devices. For instance, the metal proof mass, which may have a density several times larger than that of silicon, is capable of reducing the quadrature and bias error in a MEMS gyroscope device, and capable of increasing the sensitivity of the MEMS gyroscope device. | 09-20-2012 |
20130139591 | MEMS MULTI-AXIS GYROSCOPE WITH CENTRAL SUSPENSION AND GIMBAL STRUCTURE - Various examples include microelectromechanical die for sensing motion that includes symmetrical proof-mass electrodes interdigitated with asymmetrical stator electrodes. Some of these examples include electrodes that are curved around an axis orthogonal to the plane in which the electrodes are disposed. An example provides vertical flexures coupling an inner gimbal to a proof-mass in a manner permitting flexure around a horizontal axis. | 06-06-2013 |
20130139592 | MEMS MULTI-AXIS GYROSCOPE Z-AXIS ELECTRODE STRUCTURE - Various examples include microelectromechanical die for sensing motion that includes symmetrical proof-mass electrodes interdigitated with asymmetrical stator electrodes. Some of these examples include electrodes that are curved around an axis orthogonal to the plane in which the electrodes are disposed. An example provides vertical flexures coupling an inner gimbal to a proof-mass in a manner permitting flexure around a horizontal axis. | 06-06-2013 |
20130192364 | MEMS PROOF MASS WITH SPLIT Z-AXIS PORTIONS - This document discusses among other things apparatus and methods for a proof mass including split z-axis portions. An example proof mass can include a center portion configured to anchor the proof-mass to an adjacent layer, a first z-axis portion configure to rotate about a first axis using a first hinge, the first axis parallel to an x-y plane orthogonal to a z-axis, a second z-axis portion configure to rotate about a second axis using a second hinge, the second axis parallel to the x-y plane, wherein the first z-axis portion is configured to rotate independent of the second z-axis portion. | 08-01-2013 |
20130192369 | MEMS MULTI-AXIS ACCELEROMETER ELECTRODE STRUCTURE - This document discusses, among other things, an inertial sensor including a single proof-mass formed in an x-y plane of a device layer, the single proof-mass including a single, central anchor configured to suspend the single proof-mass above a via wafer. The inertial sensor further includes first and second electrode stator frames formed in the x-y plane of the device layer on respective first and second sides of the inertial sensor, the first and second electrode stator frames symmetric about the single, central anchor, and each separately including a central platform and an anchor configured to fix the central platform to the via wafer, wherein the anchors for the first and second electrode stator frames are asymmetric along the central platforms with respect to the single, central anchor. | 08-01-2013 |
20130250532 | MULTI-DIE MEMS PACKAGE - This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via. | 09-26-2013 |
20130333175 | MICROMACHINED PIEZOELECTRIC Z-AXIS GYROSCOPE - This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a central anchor, a sense frame disposed around the central anchor, a plurality of sense beams configured for connecting the sense frame to the central anchor and a drive frame disposed around and coupled to the sense frame. The gyroscope may include pairs of drive beams disposed on opposing sides of the sense frame. The gyroscope may include a drive frame suspension for substantially restricting a drive motion of the drive frame to that of a substantially linear displacement along the first axis. The sense frame may be substantially decoupled from drive motions of the drive frame. Such devices may be included in a mobile device, such as a mobile display device. | 12-19-2013 |
20130341737 | PACKAGING TO REDUCE STRESS ON MICROELECTROMECHANICAL SYSTEMS - One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit. | 12-26-2013 |
20140013557 | MICROMACHINED PIEZOELECTRIC X-AXIS GYROSCOPE - This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device. | 01-16-2014 |
20140041174 | MICROMACHINED PIEZOELECTRIC X-AXIS GYROSCOPE - This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Some gyroscopes include a drive frame, a central anchor and a plurality of drive beams disposed on opposing sides of the central anchor. The drive beams may connect the drive frame to the central anchor. The drive beams may include a piezoelectric layer and may be configured to cause the drive frame to oscillate torsionally in a plane of the drive beams. The gyroscope may also include a proof mass and a plurality of piezoelectric sense beams. At least some components may be formed from plated metal. The drive frame may be disposed within the proof mass. The drive beams may constrain the drive frame to rotate substantially in the plane of the drive beams. Such devices may be included in a mobile device, such as a mobile display device. | 02-13-2014 |
Patent application number | Description | Published |
20130247666 | MICROMACHINED 3-AXIS ACCELEROMETER WITH A SINGLE PROOF-MASS - This document discusses, among other things, an inertial measurement system including a device layer including a single proof-mass 3-axis accelerometer, a cap wafer bonded to a first surface of the device layer, and a via wafer bonded to a second surface of the device layer, wherein the cap wafer and the via wafer are configured to encapsulate the single proof-mass 3-axis accelerometer. The single proof-mass 3-axis accelerometer can be suspended about a single, central anchor, and can include separate x, y, and z-axis flexure bearings, wherein the x and y-axis flexure bearings are symmetrical about the single, central anchor and the z-axis flexure is not symmetrical about the single, central anchor. | 09-26-2013 |
20130270657 | MICROMACHINED MONOLITHIC 6-AXIS INERTIAL SENSOR - The device layer of a 6-degrees-of-freedom (6-DOF) inertial measurement system can include a single proof-mass 6-axis inertial sensor formed in an x-y plane, the inertial sensor including a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards the edge of the inertial sensor, a central suspension system configured to suspend the 6-axis inertial sensor from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 6-axis inertial sensor about a z-axis normal to the x-y plane. | 10-17-2013 |
20130270660 | SEALED PACKAGING FOR MICROELECTROMECHANICAL SYSTEMS - One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit. | 10-17-2013 |
20130277773 | THROUGH SILCON VIA WITH REDUCED SHUNT CAPACITANCE - This document refers to apparatus and methods for a device layer of a microelectromechanical system (MEMS) sensor having vias with reduced shunt capacitance. In an example, a device layer can include a substrate having a pair of trenches separated in a horizontal direction by a portion of the substrate, wherein each trench of the pair of trenches includes first and second vertical layers including dielectric, the first and second vertical layers separated by a third vertical layer including polysilicon. | 10-24-2013 |
20130298671 | FLEXURE BEARING TO REDUCE QUADRATURE FOR RESONATING MICROMACHINED DEVICES - An example include microelectromechanical die for sensing motion that includes a fixed portion, an anchor coupled to the fixed portion, a first nonlinear suspension member coupled to anchor on a side of the anchor, a second nonlinear suspension member coupled to the anchor on the same side of the anchor, the second nonlinear suspension member having a shape and location mirroring the first nonlinear suspension member about an anchor bisecting plane and a proof-mass that is planar, the proof mass suspended at least in part by the first nonlinear suspension member and the second nonlinear suspension member such that the proof-mass is rotable about the anchor and is slideable in a plane parallel to the fixed portion. | 11-14-2013 |
20130328139 | MICROMACHINED MONOLITHIC 3-AXIS GYROSCOPE WITH SINGLE DRIVE - This document discusses, among other things, a cap wafer and a via wafer configured to encapsulate a single proof-mass 3-axis gyroscope formed in an x-y plane of a device layer. The single proof-mass 3-axis gyroscope can include a main proof-mass section suspended about a single, central anchor, the main proof-mass section including a radial portion extending outward towards an edge of the 3-axis gyroscope sensor, a central suspension system configured to suspend the 3-axis gyroscope from the single, central anchor, and a drive electrode including a moving portion and a stationary portion, the moving portion coupled to the radial portion, wherein the drive electrode and the central suspension system are configured to oscillate the 3-axis gyroscope about a z-axis normal to the x-y plane at a drive frequency. | 12-12-2013 |
20150185012 | MEMS PROOF MASS WITH SPLIT Z-AXIS PORTIONS - This document discusses among other things apparatus and methods for a proof mass including split z-axis portions. An example proof mass can include a center portion configured to anchor the proof-mass to an adjacent layer, a first z-axis portion configure to rotate about a first axis using a first hinge, the first axis parallel to an x-y plane orthogonal to a z-axis, a second z-axis portion configure to rotate about a second axis using a second hinge, the second axis parallel to the x-y plane, wherein the first z-axis portion is configured to rotate independent of the second z-axis portion. | 07-02-2015 |
20150321904 | MULTI-DIE MEMS PACKAGE - This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via. | 11-12-2015 |