Patent application number | Description | Published |
20090033467 | RF IDENTIFICATION DEVICE WITH NEAR-FIELD-COUPLED ANTENNA - An embodiment of a RF identification device is formed by a tag and by a reader. The tag is formed by a processing circuit and a first antenna, which has the function both of transmitting and of receiving data. The reader is formed by a control circuit and by a second antenna, which has the function both of transmitting and of receiving data. The processing circuit is formed by a resonance capacitor, a modulator, a rectifier circuit, a charge-pump circuit and a detection circuit. The antenna of the tag and the processing circuit are integrated in a single structure in completely monolithic form. The first antenna has terminals connected to the input of the rectifier circuit, the output of which is connected to the charge-pump circuit. The charge-pump circuit has an output connected to the detection circuit. | 02-05-2009 |
20100134133 | METHOD FOR PERFORMING AN ELECTRICAL TESTING OF ELECTRONIC DEVICES - A method of electrical testing electronic devices DUT, comprising: connecting at least an electronic device DUT to an automatic testing apparatus suitable for performing the testing of digital circuits or memories or of digital circuits and memories; sending electrical testing command signals to the electronic device DUT by means of the ATE apparatus; performing electrical testing of the electronic device DUT by means of at least one advanced supervised self testing system “Advanced Low Pin Count BIST” ALB which is built in the electronic device DUT, the ALB system being digitally interfaced with the ATE through a dedicated digital communication channel; and sending reply messages, if any, which comprise measures, failure information and reply data to the command signals from the electronic device DUT toward the ATE apparatus by means of the digital communication channel. | 06-03-2010 |
20100308855 | PROBE CARD FOR TESTING INTEGRATED CIRCUITS - An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested. | 12-09-2010 |
20110049728 | METHOD TO PERFORM ELECTRICAL TESTING AND ASSEMBLY OF ELECTRONIC DEVICES - A method performs electrical testing and assembly of an electronic device on a wafer and comprising a pad made in an oxide layer covered by a passivation layer. The method includes connecting the electronic device to a testing apparatus; providing said electronic device with a metallization layer extending on the passivation layer from the pad to a non-active area of said wafer. The method comprises-performing the electrical testing on wafer of the electronic device by placing a probe of on a portion of the extended metallization layer; performing the cut of said wafer, reducing the extension of the metallization layer to the edge of the electronic device; embedding the device inside a package, forming on the metallization layer an electrical connection configured to connect the metallization layer to a circuit in said package. | 03-03-2011 |
20110050267 | ELECTROMAGNETIC SHIELD FOR TESTING INTEGRATED CIRCUITS - An embodiment of a probe card is proposed. The probe card comprises a plurality of probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. Said plurality of probes includes at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. Said probe card comprises at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal. | 03-03-2011 |
20110089962 | TESTING OF ELECTRONIC DEVICES THROUGH CAPACITIVE INTERFACE - An embodiment of a test apparatus for executing a test of a set of electronic devices having a plurality of electrically conductive terminals, the test apparatus including a plurality of electrically conductive test probes for exchanging electrical signals with the terminals, and coupling means for mechanically coupling the test probes with the electronic devices. In an embodiment, the coupling means includes insulating means for keeping each one of at least part of the test probes electrically insulated from at least one corresponding terminal during the execution of the test. Each test probe and the corresponding terminal form a capacitor for electro-magnetically coupling the test probe with the terminal. | 04-21-2011 |
20110090030 | SIGNAL TRASMISSION THROUGH LC RESONANT CIRCUITS - An embodiment of an electronic system includes a first electronic circuit and a second electronic circuit. The electronic system further includes a resonant LC circuit having a resonance frequency for coupling the first electronic circuit and the second electronic circuit; each electronic circuit includes functional means for providing a signal at the resonance frequency to be transmitted to the other electronic circuit through the LC circuit and/or for receiving the signal from the other electronic circuit. The LC circuit also include capacitor means having at least one first capacitor plate included in the first electronic circuit and at least one second capacitor plate included in the second electronic circuit. The LC circuit further includes first inductor means included in the first electronic circuit and/or second inductor means included in the second electronic circuit. The at least one capacitor plate of each electronic circuit is coupled with the corresponding functional means through the possible corresponding inductor means. | 04-21-2011 |
20110156732 | PROCESS FOR CONTROLLING THE CORRECT POSITIONING OF TEST PROBES ON TERMINATIONS OF ELECTRONIC DEVICES INTEGRATED ON A SEMICONDUCTOR AND CORRESPONDING ELECTRONIC DEVICE - An embodiment for making a check of the electric type executed on wafer for testing the correct positioning or alignment of the probes of a probe card on the pads or bumps of the electronic devices integrated on semiconductor wafer. An embodiment consists in making a current circulate in at least part of the seal ring of at least one of the above devices, and in case it has to flow in the seal ring of more devices, these seal rings are suitably interconnected to each other. Thanks to an embodiment the seal ring may also be reinforced in the angle areas of the chip, and suitable circuits may be possibly inserted in the seal ring or between the seal rings. | 06-30-2011 |
20110186838 | CIRCUIT ARCHITECTURE FOR THE PARALLEL SUPPLYING DURING AN ELECTRIC OR ELECTROMAGNETIC TESTING OF A PLURALITY OF ELECTRONIC DEVICES INTEGRATED ON A SEMICONDUCTOR WAFER - A circuit architecture provides for the parallel supplying of power during electric or electromagnetic testing of electronic devices integrated on a same semiconductor wafer and bounded by scribe lines. The circuit architecture comprises a conductive grid interconnecting the electronic devices and having a portion external to the devices and a portion internal to the devices. The external portion extends along the scribe lines; and the internal portion extends within at least a part of the devices. The circuit architecture includes interconnection pads between the external portion and the internal portion of the conductive grid and provided on at least a part of the devices, the interconnection pads forming, along with the internal and external portions, power supply lines which are common to different electronic devices of the group. | 08-04-2011 |
20110202799 | PROCESS FOR MAKING AN ELECTRIC TESTING OF ELECTRONIC DEVICES - The disclosure relates to a process for making an electric testing of electronic devices DUT, of the type comprising the steps of: connecting at least one electronic device DUT to an automatic testing apparatus or ATE apparatus suitable for making the testing of digital circuits; sending, through said ATE apparatus, control signals for the electric testing to said electronic device DUT. Advantageously, the process also comprises the steps of: making the electric testing of said electronic device DUT through at least one reconfigurable digital interface RDI connected to said ATE apparatus through a dedicated digital communication channel and comprising a limited number of communication or connection lines strictly appointed to the exchange of the testing information; and sending from said electronic device DUT to said ATE apparatus response messages, if any, containing measures, failure information and data in response to said control signals and through said digital communication channel. | 08-18-2011 |
20110205028 | ELECTRONIC COMMUNICATIONS DEVICE WITH ANTENNA AND ELECTROMAGNETIC SHIELD - An embodiment of an electronic communications device, including: a body of semiconductor material defining at least one integrated electronic circuit and having a top surface; an electromagnetic shield; a radiant element; and a capacitive element formed by a first electrode and a second electrode, the radiant element being set on the top surface and being ohmically coupled to the first electrode and the second electrode by means of a first connection element and a second connection element, respectively, the electromagnetic shield being set between the radiant element and the top surface and forming at least the second electrode. | 08-25-2011 |
20110254580 | METHOD FOR AN IMPROVED CHECKING OF REPEATABILITY AND REPRODUCIBILITY OF A MEASURING CHAIN FOR SEMICONDUCTOR DEVICE TESTING - A method provides an improved checking of repeatability and reproducibility of a measuring chain, in particular for quality control by semiconductor device testing. The method includes testing steps provided for multiple and different devices to be subjected to measurement or control through a measuring system that includes at least one chain of measuring units between a testing apparatus (ATE) and each device to be subjected to measurement or control. Advantageously, the method comprises checking repeatability and reproducibility of each type of unit that forms part of the measuring chain and, after the checking, making a correlation between the various measuring chains as a whole to check repeatability and reproducibility, using a corresponding device subjected to measurement or control. | 10-20-2011 |
20110267086 | TEST CIRCUIT OF AN INTEGRATED CIRCUIT ON A WAFER - A test circuit is described of a circuit integrated on wafer of the type comprising at least one antenna of the embedded type comprising at least one test antenna associated with said at least one embedded antenna that realizes its connection of the wireless loopback type creating a wireless channel for said at least one embedded antenna and allows its electric test, transforming an electromagnetic signal of communication between said at least one embedded antenna and said at least one test antenna into an electric signal that can be read by a test apparatus. | 11-03-2011 |
20110279137 | PROBES FOR TESTING INTEGRATED ELECTRONIC CIRCUITS AND CORRESPONDING PRODUCTION METHOD - An embodiment of a method is proposed for producing cantilever probes for use in a test apparatus of integrated electronic circuits; the probes are configured to contact during the test corresponding terminals of the electronic circuits to be tested. An embodiment comprises forming probe bodies of electrically conductive materials. In an embodiment, the method further includes forming on a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe. | 11-17-2011 |
20120025344 | TRACEABLE INTEGRATED CIRCUITS AND PRODUCTION METHOD THEREOF - An embodiment of a method for producing traceable integrated circuits includes forming on a wafer of semiconductor material functional regions for implementing specific functionalities of corresponding integrated circuits, forming at least one seal ring around each functional region of the corresponding integrated circuit, and forming on each integrated circuit at least one marker indicative of information of the integrated circuit. Forming on each integrated circuit at least one marker may include forming the at least one marker on at least a portion of the respective seal ring that is visible. | 02-02-2012 |
20120081137 | TESTING METHOD FOR SEMICONDUCTOR INTEGRATED ELECTRONIC DEVICES AND CORRESPONDING TEST ARCHITECTURE - A testing method is described of at least one device provided with an integrated testing circuit and in communication with at least one tester where messages/instructions/test signals/information are exclusively sent from the tester to the device . A testing architecture is also described for implementing this testing method. | 04-05-2012 |
20120153745 | INDUCTIVE CONNECTION STRUCTURE FOR USE IN AN INTEGRATED CIRCUIT - An embodiment in a single structure combines a pad comprising a connection terminal suitable for coupling the circuit elements integrated in a chip to circuits outside the chip itself and at least one inductor that can be used to receive/transmit electromagnetic waves or to supply the chip with power or both. By combining a connection pad and an inductor in a single structure, it is possible to reduce the overall area that otherwise would be occupied exclusively by the inductors, thus reducing the cost and size of integrated circuits that include such a structure. | 06-21-2012 |
20120168520 | RF IDENTIFICATION DEVICE WITH NEAR-FIELD-COUPLED ANTENNA - An embodiment of a RF identification device is formed by a tag and by a reader. The tag is formed by a processing circuit and a first antenna, which has the function both of transmitting and of receiving data. The reader is formed by a control circuit and by a second antenna, which has the function both of transmitting and of receiving data. The processing circuit is formed by a resonance capacitor, a modulator, a rectifier circuit, a charge-pump circuit and a detection circuit. The antenna of the tag and the processing circuit are integrated in a single structure in completely monolithic form. The first antenna has terminals connected to the input of the rectifier circuit, the output of which is connected to the charge-pump circuit. The charge-pump circuit has an output connected to the detection circuit. | 07-05-2012 |
20120171953 | RF IDENTIFICATION DEVICE WITH NEAR-FIELD-COUPLED ANTENNA - An embodiment of a RF identification device is formed by a tag and by a reader. The tag is formed by a processing circuit and a first antenna, which has the function both of transmitting and of receiving data. The reader is formed by a control circuit and by a second antenna, which has the function both of transmitting and of receiving data. The processing circuit is formed by a resonance capacitor, a modulator, a rectifier circuit, a charge-pump circuit and a detection circuit. The antenna of the tag and the processing circuit are integrated in a single structure in completely monolithic form. The first antenna has terminals connected to the input of the rectifier circuit, the output of which is connected to the charge-pump circuit. The charge-pump circuit has an output connected to the detection circuit. | 07-05-2012 |
20130026466 | TESTING ARCHITECTURE OF CIRCUITS INTEGRATED ON A WAFER - An embodiment of a testing architecture of integrated circuits on a wafer is described of the type including at least one first circuit of a structure TEG realized in a scribe line providing separation between at least one first and one second integrated circuit. The architecture includes at least one pad shared by a second circuit inside at least one of these first and second integrated circuit and the first circuit, as well as a switching circuitry coupled to the at least one pad and to these first and second circuits. | 01-31-2013 |
20130027071 | ACTIVE PROBE CARD FOR ELECTRICAL WAFER SORT OF INTEGRATED CIRCUITS - A testing apparatus includes a tester and a probe card system that includes a probe card connected to the tester, and an active interposer connected to the probe card and wirelessly coupled with a device to be tested. The active interposer includes pads positioned on its free surface facing the device. The pads are positioned with respect to pads of the device so that each pad of the active interposer faces a pad of the device and is separated therefrom by a dielectric. Each pair of facing pads forms an elementary wireless coupling element which allows a wireless transmission between the active interposer and the device. The active interposer also includes an amplifier circuit configured to amplify wireless signals from the device before forwarding them to the tester. The probe card system includes a transmission element able to transmit a power voltage from the tester to the device. | 01-31-2013 |
20130057312 | SYSTEM AND METHOD FOR ELECTRICAL TESTING OF THROUGH SILICON VIAS (TSVs) - An embodiment of a testing system for carrying out electrical testing of at least one first through via extending, at least in part, through a substrate of a first body of semiconductor material. The testing system has a first electrical test circuit integrated in the first body and electrically coupled to the first through via and to electrical-connection elements carried by the first body for electrical connection towards the outside; the first electrical test circuit enables detection of at least one electrical parameter of the first through via through the electrical-connection elements. | 03-07-2013 |
20130109111 | METHOD TO PERFORM ELECTRICAL TESTING AND ASSEMBLY OF ELECTRONIC DEVICES | 05-02-2013 |
20130207781 | SECURITY SYSTEM FOR AT LEAST AN INTEGRATED CIRCUIT, SECURE INTEGRATED CIRCUIT CARD, AND METHOD OF SECURE WIRELESS COMMUNICATIONS - A security system includes an integrated circuit and a transceiver/transponder circuit. The integrated circuit includes an antenna for communicating with the transceiver/transponder circuit. An inhibiting element is associated with the integrated circuit for inhibiting communications with the transceiver/transponder circuit and for securing the data contained in the integrated circuit. The inhibiting element is an electromagnetic inhibiting element. The security system further includes a coupling element associated with the antenna of the integrated circuit for temporarily deactivating the electromagnetic inhibiting element to allow communications between the integrated circuit and the transceiver/transponder circuit. | 08-15-2013 |
20130241025 | ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND VERTICAL COMMUNICATION CHANNELS - An embodiment of an electronic system may be provided so as to have superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in PCBs coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced. | 09-19-2013 |
20130242636 | ELECTROMECHANICAL INTEGRATED MEMORY ELEMENT AND ELECTRONIC MEMORY COMPRISING THE SAME - An electromechanical memory element includes a fixed body and a deformable element attached to the fixed body. An actuator causes a deformation of the deformable element from a first position (associated with a first logic state) to a second position (associated with a second logic state) where a mobile element makes contact with a fixed element. A programming circuit then causes a weld to be formed between the mobile element and the fixed element. The memory element is thus capable of associating the first and second positions with two different logic states. The weld may be selectively dissolved to return the deformable element back to the first position. | 09-19-2013 |
20130255381 | MAGNETIC INERTIAL SENSOR AND METHOD FOR OPERATING THE SAME - An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis. | 10-03-2013 |
20130256661 | SYSTEM FOR ELECTRICAL TESTING OF THROUGH-SILICON VIAS (TSVs), AND CORRESPONDING MANUFACTURING PROCESS - An embodiment of a process for manufacturing a system for electrical testing of a through via extending in a vertical direction through a substrate of semiconductor material envisages integrating an electrical testing circuit in the body to enable detection of at least one electrical parameter of the through via through a microelectronic buried structure defining an electrical path between electrical-connection elements towards the outside and a buried end of the through via; the integration step envisages providing a trench and forming a doped buried region at the bottom of the trench, having a doping opposite to that of the substrate so as to form a semiconductor junction, defining the electrical path when it is forward biased; in particular, the semiconductor junction has a junction area smaller than the area of a surface of the conductive region in a horizontal plane transverse to the vertical direction, in such a way as to have a reduced reverse saturation current. | 10-03-2013 |
20130277803 | CONNECTION STRUCTURE FOR AN INTEGRATED CIRCUIT WITH CAPACITIVE FUNCTION - An embodiment, in a single structure, combines a pad including a connection terminal suitable for coupling the circuit elements integrated in a chip to circuits outside of the chip itself and at least one capacitor. By combining a connection pad and a capacitor in a single structure, it may be possible to reduce the overall area of the chip that otherwise in common integrated circuits would be greater due to the presence of the capacitor itself. In this way, the costs and size of the chip can be reduced. | 10-24-2013 |
20130285056 | SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REGIONS, AND METHOD OF REPAIRING A SEMICONDUCTOR STRUCTURE - A semiconductor structure includes at least a semiconductor body, a delimiting structure delimiting a cup-shaped recess in the body and a conductive region in the recess. The conductive region is made of a low-melting-temperature material, having a melting temperature lower than that of the materials forming the delimiting structure. | 10-31-2013 |
20130324041 | NETWORK OF ELECTRONIC DEVICES ASSEMBLED ON A FLEXIBLE SUPPORT AND COMMUNICATION METHOD - An embodiment of a network of electronic devices is formed on a flexible substrate by a plurality of electronic devices assembled on the flexible substrate. The electronic devices have an embedded antenna for mutual coupling of a wireless type. Each electronic device is formed by a chip or a complex system integrating a transceiver circuit coupled to the embedded antenna and a functional part coupled to the transceiver circuit and including at least one element chosen in the group comprising: a sensor, an actuator, an interface, an electrode, a memory, a control unit, a power-supply unit, a converter, an adapter, a digital circuit, an analog circuit, an RF circuit, a microelectromechanical system, an electrode, a well, a cell, a container for liquids. The flexible support may be a substrate of plastic material that incorporates the electronic devices or a garment having smart buttons that house the electronic devices. | 12-05-2013 |
20130334675 | PACKAGE STRUCTURE HAVING LATERAL CONNECTIONS - An embodiment of a packaged semiconductor device includes a communication pad formed in a side surface, which is operatively coupled to a communication circuit so as to enable the establishing of a wireless communication channel to an adjacently positioned packaged semiconductor device. The communication pad may be formed upon cutting a block including the packaged semiconductor device and an appropriately positioned and dimensioned conductor. Thus, well-established techniques for incorporating a lead frame or any other conductive system in a package may be applied in order to impart wireless lateral connectivity to packaged semiconductor devices in an electronic system. | 12-19-2013 |
20130342186 | INTEGRATED ELECTRONIC DEVICE FOR MONITORING PARAMETERS WITHIN A SOLID STRUCTURE AND MONITORING SYSTEM USING SUCH A DEVICE | 12-26-2013 |
20140001493 | INTEGRATED OPTOELECTRONIC DEVICE AND SYSTEM WITH WAVEGUIDE AND MANUFACTURING PROCESS THEREOF | 01-02-2014 |
20140001521 | HIGH-FREQUENCY OPTOELECTRONIC DETECTOR, SYSTEM AND METHOD | 01-02-2014 |
20140070345 | INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC INTERCONNECTION - An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna. | 03-13-2014 |
20140070834 | PROBE CARD FOR TESTING INTEGRATED CIRCUITS - An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested. | 03-13-2014 |
20140083206 | PLANAR ELECTRIC BOARD WITH PLIABLE WINGS AND SYSTEM FOR SENSING COMPONENTS ALONG THREE COORDINATE AXIS OF INNER FORCES IN A BLOCK MADE OF A BUILDING MATERIAL - A planar electric circuit board may include a planar support of a foldable material defining a base surface and wings coupled to the base surface along respective folding lines so that the wings, when folded along the folding lines, are erected with respect to the base surface and remain in that position. An auxiliary circuit is on the planar support and may include pairs of capacitive coupling plates defined on the wings and on the base surface, and electric communication lines coupled to corresponding ones of the pairs of capacitive coupling plates. | 03-27-2014 |
20140084909 | BLOCK MADE OF A BUILDING MATERIAL - A building structure includes a block of building material and a magnetic circuit buried in the block of building material. The structure also includes a plurality of sensing devices buried in the block of building material. Each sensing device may include a contactless power supplying circuit magnetically coupled with the magnetic circuit to generate a supply voltage when the magnetic circuit is subject to a variable magnetic field. | 03-27-2014 |
20140112617 | INTEGRATED OPTOELECTRONIC DEVICE AND SYSTEM WITH WAVEGUIDE AND MANUFACTURING PROCESS THEREOF - An integrated electronic device, delimited by a first surface and by a second surface and including: a body made of semiconductor material, formed inside which is at least one optoelectronic component chosen between a detector and an emitter; and an optical path which is at least in part of a guided type and extends between the first surface and the second surface, the optical path traversing the body. The optoelectronic component is optically coupled, through the optical path, to a first portion of free space and a second portion of free space, which are arranged, respectively, above and underneath the first and second surfaces. | 04-24-2014 |
20140145804 | MAGNETIC RELAY DEVICE MADE USING MEMS OR NEMS TECHNOLOGY - A magnetic relay device having a substrate of semiconductor material houses two through magnetic vias of electrically conductive ferromagnetic material. At least one coil is arranged underneath a first surface of the substrate in proximity of at least one between the first and second magnetic vias, and a contact structure, of ferromagnetic material, is arranged over a second surface of the substrate and is controlled by the magnetic field generated by the coil so as to switch between an open position, wherein the contact structure electrically disconnects the first and second magnetic vias, and a close position, wherein the contact structure electrically connects the first and second magnetic vias. | 05-29-2014 |
20140182390 | INTEGRATED ELECTRONIC DEVICE FOR MONITORING MECHANICAL STRESS WITHIN A SOLID STRUCTURE - The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction. | 07-03-2014 |
20140182394 | INTEGRATED ELECTRONIC DEVICE FOR DETECTING A LOCAL PARAMETER RELATED TO A FORCE EXPERIENCED IN A PREDETERMINED DIRECTION, WITHIN A SOLID STRUCTURE - The integrated electronic device is for detecting a local parameter related to a force experienced in a predetermined direction within a solid structure. The device includes a semiconductor substrate having a substantially planar region that defines a plane substantially perpendicular to the predetermined direction. At least one sensor detects the local parameter at least in the predetermined direction with a piezo-resistive effect. At least one substantially planar face is arranged in a portion of the integrated electronic device, the face belonging to a inclined plane by a predetermined angle relative to the plane perpendicular to the predetermined direction, which plane is defined by the substantially planar region of the substrate. The predetermined angle is defined such as to reduce forces acting in directions other than the predetermined direction at the portion of the device around the at least one sensor. | 07-03-2014 |
20140191779 | CROSSTALK SUPPRESSION IN WIRELESS TESTING OF SEMICONDUCTOR DEVICES - An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die. | 07-10-2014 |
20140217533 | MAGNETIC SENSOR INTEGRATED IN A CHIP FOR DETECTING MAGNETIC FIELDS PERPENDICULAR TO THE CHIP AND MANUFACTURING PROCESS THEREOF - An integrated magnetic sensor formed by a semiconductor chip having a surface and accommodating a magnetic via and a sensing coil. The magnetic via is formed by a cylindrical layer of ferromagnetic material that extends perpendicular to the surface of the first chip and has in cross-section an annular shape of a circular or elliptical or curvilinear type. The sensing coil surrounds the magnetic via at a distance and is connected to an electronic circuit. | 08-07-2014 |
20140333336 | TESTING OF ELECTRONIC DEVICES THROUGH CAPACITIVE INTERFACE - An embodiment of a test apparatus for executing a test of a set of electronic devices having a plurality of electrically conductive terminals, the test apparatus including a plurality of electrically conductive test probes for exchanging electrical signals with the terminals, and coupling means for mechanically coupling the test probes with the electronic devices. In an embodiment, the coupling means includes insulating means for keeping each one of at least part of the test probes electrically insulated from at least one corresponding terminal during the execution of the test. Each test probe and the corresponding terminal form a capacitor for electro-magnetically coupling the test probe with the terminal. | 11-13-2014 |
20140347244 | ELECTRONIC DEVICE FOR ELECTROMAGNETIC EXPANSION AND CONCENTRATION - An electronic device for electromagnetic expansion and concentration is described, including: —a module to be monitored including a first antenna and an integrated control circuitry, the first antenna being electrically coupled to the integrated control circuitry; an electromagnetic expansion and concentration module comprising a second antenna configured to communicate with a remote antenna of an external data collection and control device, relative to the electromagnetic expansion and concentration module, by an electromagnetic coupling, said electromagnetic expansion and concentration module comprising a third antenna electrically coupled to said second antenna, said third antenna being configured to communicate with said first antenna of the module to be monitored by a near-field magnetic coupling. The second antenna is configured to communicate with said remote antenna, relative to the electromagnetic expansion and concentration module by a far-field electromagnetic coupling. The electromagnetic expansion and concentration module further comprises a fourth antenna electrically coupled between said second antenna and said third antenna, said fourth antenna being configured to communicate with a further remote antenna of a further external data collection and control device, relative to the electromagnetic expansion and concentration module by a near-field magnetic coupling. | 11-27-2014 |
20140368394 | PACKAGED ELECTRONIC DEVICE WITH INTEGRATED ELECTRONIC CIRCUITS HAVING TRANSCEIVING ANTENNAS - A base carries a first chip and a second chip oriented differently with respect to the base and packaged in a package. Each chip integrates an antenna and a magnetic via. A magnetic coupling path connects the chips, forming a magnetic circuit that enables transfer of signals and power between the chips even if the magnetic path is interrupted, and is formed by a first stretch coupled between the first magnetic-coupling element of the first chip and the first magnetic-coupling element of the second chip, and a second stretch coupled between the second magnetic-coupling element of the first chip and the second magnetic-coupling element of the second chip. The first stretch has a parallel portion extending parallel to the faces of the base. The first and second stretches have respective transverse portions extending on the main surfaces of the second chip, transverse to the parallel portion. | 12-18-2014 |
20140375398 | SIGNAL TRASMISSION THROUGH LC RESONANT CIRCUITS - An embodiment of an electronic system includes a first electronic circuit and a second electronic circuit. The electronic system further includes a resonant LC circuit having a resonance frequency for coupling the first electronic circuit and the second electronic circuit; each electronic circuit includes functional means for providing a signal at the resonance frequency to be transmitted to the other electronic circuit through the LC circuit andor for receiving the signal from the other electronic circuit. The LC circuit also include capacitor means having at least one first capacitor plate included in the first electronic circuit and at least one second capacitor plate included in the second electronic circuit. The LC circuit further includes first inductor means included in the first electronic circuit andor second inductor means included in the second electronic circuit. The at least one capacitor plate of each electronic circuit is coupled with the corresponding functional means through the possible corresponding inductor means. | 12-25-2014 |
20150054538 | ELECTROMAGNETIC SHIELD FOR TESTING INTEGRATED CIRCUITS - A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal. | 02-26-2015 |