Arai, Kyoto
Izumi Arai, Kyoto JP
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20130030140 | POLYOL FOR POLYURETHANE PREPARATION AND POLYURETHANE PREPARATION METHOD USING SAME - A polyol (PL) for polyurethane preparation is disclosed that includes the polyol (a) and the strength-enhancing agent (b), as follows. Polyol (a): a polyoxyalkylene polyol that is the alkylene oxide adduct of an active hydrogen-containing compound (H), in which at least 40% of a hydroxyl group positioned on the terminal is a primary hydroxyl group-containing group represented by general formula (I). In general formula (I), R | 01-31-2013 |
Katsuhiro Arai, Kyoto JP
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20140175989 | CLOTHING ILLUMINATION DEVICE AND CLOTHING ILLUMINATION SYSTEM - A clothing illumination device is switchable between illumination with visible light only and illumination with visible light mixed with ultraviolet light. The clothing illumination device also has an LED light source and an IC tag reader. A clothing illumination system has a first and a second clothing illumination device which are each switchable between illumination with visible light only and illumination with visible light mixed with ultraviolet light, and which operate in a fashion coordinated with each other to perform the switching. | 06-26-2014 |
Katsujirou Arai, Kyoto JP
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20090053866 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE, METHOD FOR DRIVING THE SAME, AND METHOD FOR FABRICATING THE SAME - A p-type source region | 02-26-2009 |
Katsuya Arai, Kyoto JP
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20080210978 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a gate electrode formed above a semiconductor region; a drain region and a source region formed in portions of the semiconductor region located below sides of the gate electrode in a gate length direction, respectively; a plurality of drain contacts formed on the drain region to be spaced apart in a gate width direction of the gate electrode; and a plurality of source contacts formed on the source region to be spaced apart in the gate width direction of the gate electrode. The intervals between the drain contacts are greater than the intervals between the source contacts. | 09-04-2008 |
20090059453 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes an external pad, a ground line, a first protection circuit between the external pad and the ground line, and a second protection circuit between the external pad and the ground line. The second protection circuit is formed by a first protection element, a second protection element, and a resistor. With this structure, the resistance value of the resistor is set to an arbitrary value, so that an unnecessary current which would be generated at the time of power-off of the LSI can be decreased to a value which does not deteriorate the reliability of the LSI. | 03-05-2009 |
20100148267 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes: a well | 06-17-2010 |
20100207163 | SEMICONDUCTOR DEVICE INCLUDING ELECTROSTATIC-DISCHARGE PROTECTION CIRCUIT - A semiconductor device includes a protected circuit and an electrostatic-discharge protection circuit. The electrostatic-discharge protection circuit includes a first well of a first conductivity type and a second well of a second conductivity type formed in contact with each other in a semiconductor substrate, a first impurity diffusion layer of the first conductivity type and a third impurity diffusion layer of the second conductivity type formed apart from each other in the first well, and a second impurity diffusion layer of the second conductivity type and a fourth impurity diffusion layer of the first conductivity type formed apart from each other in the second well. The second and the third impurity diffusion layers are formed adjacent to each other interposing an element isolation region provided across a border between the first and the second wells. | 08-19-2010 |
20110102954 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes a first functional circuit block; a second functional circuit block; a relay circuit block; a first protection circuit block; and a second protection circuit block. The first protection circuit block includes an ESD protection circuit connected between either one of a first high-voltage power supply line and a first low-voltage power supply line, and either one of a third high-voltage power supply line and a third low-voltage power supply line. The second protection circuit block includes an ESD protection circuit connected between either one of a second high-voltage power supply line and a second low-voltage power supply line, and either one of the third high-voltage power supply line and the third low-voltage power supply line. | 05-05-2011 |
20110227197 | SEMICONDUCTOR INTEGRATED CIRCUIT COMPRISING ELECTRO STATIC DISCHARGE PROTECTION ELEMENT - An electro static discharge protection element being formed by a diode including a well region of a first conductivity type on a surface of a semiconductor substrate, and a first diffusion layer of a second conductivity type in the well region. The first diffusion layer is surrounded by a second diffusion layer of the first conductivity type in the well region. The first diffusion layer has a surface on which a first contact region connected to an input/output terminal is formed. The first diffusion layer has a surface on which a second contact region connected to a reference voltage terminal is formed. | 09-22-2011 |
20120169402 | SEMICONDUCTOR DEVICE - A semiconductor device includes an electric fuse circuit and a program protective circuit. The electric fuse circuit includes a fuse element and a transistor connected together in series and placed between a program power supply and a grounding, and controlling sections. The program protective circuit is placed in parallel with the electric fuse circuit and between the program power supply and the grounding. When a surge voltage is applied between the program power supply and the grounding, the foregoing structure allows a part of a surge electric current can flow through the program protective circuit. | 07-05-2012 |
Kazuo Arai, Kyoto JP
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20110164341 | STATIC ELIMINATING SHEET, STATIC ELIMINATING SYSTEM FOR SHEETS, AND SIMULTANEOUS DESIGN MOLDING METHOD, PRINTING METHOD, AND DEPOSITION METHOD USING STATIC ELIMINATING SHEET - There are provided a substrate sheet, a plurality of design portions arranged independently from each other along a longitudinal direction of the substrate sheet and each including at least a conductive material portion, and a band-shaped static eliminating band portion extending continuously along the longitudinal direction of the substrate sheet and electrically connecting the conductive material portions in the plurality of design portions to each other. | 07-07-2011 |
Mitsuru Arai, Kyoto JP
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20110102085 | DIFFERENTIAL AMPLIFIER - A high-gain differential amplifier that is capable of high speed operation is provided. A differential amplifier that outputs a signal representing a difference between signals respectively inputted to first and second input terminals and a phase-inverted signal thereof via first and second output terminals respectively, is provided with a first switching element that makes a short-circuit between the first input terminal and the second output terminal when turned on, a second switching element that makes a short-circuit between the second input terminal and the first output terminal when turned on, and a third switching element that makes a short-circuit between the first output terminal and the second output terminal when turned on. The third switching element is set to an ON state for a predetermined period while the first and second switching elements are set to an OFF state. Subsequently, the third switching element is switched to the OFF state and both of the first and second switching elements are switched to the ON state. | 05-05-2011 |
Shigenobu Arai, Kyoto JP
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20160087692 | INFORMATION READING SYSTEM, INFORMATION READING APPARATUS, STORAGE MEDIUM HAVING STORED THEREIN INFORMATION READING PROGRAM, AND INFORMATION READING METHOD - An information reading system performs near field communication with an information storage medium. The information reading system includes: an antenna structure including a plurality of antenna coils, each arranged across at least one of the others and each having a reading area; and a computer processor configured to perform near field communication with the information storage medium in each reading area, thereby reading information from the information storage medium in proximity to the reading area. | 03-24-2016 |
20160087693 | INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING APPARATUS, STORAGE MEDIUM HAVING STORED THEREIN INFORMATION PROCESSING PROGRAM, AND INFORMATION PROCESSING METHOD - An information processing system includes an information storage medium and an information processing apparatus for performing near field communication with the information storage medium. The information processing apparatus includes: at least one antenna coil; and a computer processor configured to: perform near field communication with the information storage medium via the antenna coil, thereby reading information from the information storage medium in proximity to the antenna coil; detect an orientation of the information storage medium that can perform the near field communication; and perform predetermined processing using the information read from the information storage medium and the orientation of the information storage medium. | 03-24-2016 |
Yasuyuki Arai, Kyoto JP
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20150084474 | RESIN MOLDED STATOR AND MANUFACTURING METHOD THEREOF - A method for manufacturing a resin molded stator may include: preparing a straight winding core in which neighboring partial core backs are coupled by a joint; bending the core at joints and causing distal ends of teeth to face an outer peripheral surface of a core metal to obtain a core metal assembly including a stator mounted on the core metal, arranging the core metal assembly in a mold; injecting resin into the mold, covering windings with resin, curing the resin; and removing the stator from the mold and the core metal. The core metal may include a plurality of ribs projecting outward from the outer peripheral surface, the number of the ribs being between three and the number of the teeth. Each rib may extend parallel to a center axis, and each rib may be located in a gap between the distal ends of adjacent teeth. | 03-26-2015 |
20150229191 | MOTOR AND METHOD OF MOLDING RESIN CASING - A method of molding a resin casing covering a stator of a motor may include preparing first and second molds; disposing the stator in the first mold; combining the molds; pouring a resin into the cavity; curing the resin; separating the molds; and taking the stator and resin casing from the mold. The stator may include a core, an insulator, and a coil. The core may include a core back surrounding and teeth that extend inward from the core back. The insulator may include wall portions inside the coil. The wall portions may be provided around the teeth and extend toward one side in an axial direction. One of the molds may include cylindrical surfaces contacting inner end faces of the teeth. The first mold may include wall supporting surfaces contacting or facing the inner surfaces of the wall portions. The wall supporting surfaces may be outside the cylindrical surfaces. | 08-13-2015 |
Yoshiyuki Arai, Kyoto JP
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20100014262 | MODULE WITH EMBEDDED ELECTRONIC COMPONENTS - In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions. | 01-21-2010 |