Patent application number | Description | Published |
20080245607 | AIR EXHAUST/INLET SOUND ATTENUATION MECHANISM - An attenuation mechanism for an electronic device is presented. The attenuation mechanism includes an outer member that has an inner member oriented axially within the outer member. The inner member has an axial twist that causes a line of sight blockage between an exterior and an interior of a housing of an electronic device when the attenuation mechanism is mounted through the housing, such that sound and electromagnetic radiation is attenuated without obstructing cooling air that is flowing through the housing. | 10-09-2008 |
20090056350 | BIMETALLIC HEAT SINK AIR DEFLECTORS FOR DIRECTED AIRFLOW FOR IMPROVED THERMAL TRANSFER AND DISSIPATION - A cooling apparatus, includes: one or more bimetallic deflectors attached to a mounting post, the mounting post configured for mating engagement with a protrusion of a heat sink, such that the one or more bimetallic deflectors are in thermal contact with the protrusion when the mounting post is engaged therewith; wherein the bimetallic deflectors are configured to deflect in response to thermal energy conducted from the protrusions so as to change a direction of airflow incident thereupon. | 03-05-2009 |
20090090281 | Anti-Tilt Pallet and Method for Shipping and Installing a Computer Rack Therewith - An anti-tilt pallet includes a first sub-frame and a second sub-frame. The first sub-frame has a first vertical support member, a first extension member and a second extension member. The second sub-frame has a second vertical support member, a third extension member and a fourth extension member. The first through fourth extension members each have an alignment hole therethrough. A plurality of first alignment members are disposed in the alignment holes of the first extension member and the third extension member to align the first extension member with the third extension member, and a plurality of second alignment members are disposed in the alignment holes of the second extension member and the fourth extension member to align the second extension member with the fourth extension member. A slot is configured to removably receive a weight in at least one of the first sub-frame and the second sub-frame. | 04-09-2009 |
20090205694 | Thermoelectric Generation Device for Energy Recovery - A thermoelectric generation device is configured for mounting on cooling tubes of a heat exchanger of a computer room air conditioning unit in a data center. A first type of Seebeck material and a second type of Seebeck material are arranged in a matrix and connected in series. An electrically insulating, but thermally conducting plate is located on either side of the device. The device is mounted physically on cooling tubes of the heat exchanger and exposed on the other side to the warm air environment. As a result of the temperature difference a voltage is generated that may be used to power an electrical load connected thereto. | 08-20-2009 |
20100226090 | TEMPERATURE CONTROL SYSTEM FOR AN ELECTRONIC DEVICE CABINET - An electronic device cabinet includes a first temperature control system positioned to direct a conditioned airflow into a first electronic device storage zone of the cabinet and a second temperature control system positioned to direct a conditioned airflow into a second electronic device storage zone of the cabinet. The first temperature control system includes a first plurality of vortex tubes having a compressed air inlet and a first cooling air outlet that guides cooling air into the first device storage zone. The second temperature control system includes a second plurality of vortex tubes having a compressed air inlet and a second cooling air outlet that guides cooling air into the second device storage zone. A controller selectively delivers compressed air to respective ones of the first and second temperature control systems upon sensing a demand for cooling in corresponding ones of the first and second electronic device storage zones. | 09-09-2010 |
20110063796 | ENDOTHERMIC REACTION APPARATUS FOR REMOVING EXCESS HEAT IN A DATACENTER - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 03-17-2011 |
20120111660 | IMPLEMENTING DYNAMIC NOISE ELIMINATION WITH ACOUSTIC FRAME DESIGN - A method, system and computer program product are provided for implementing dynamic noise elimination. A system frame includes a plurality of acoustical sensory devices monitoring the system for problem frequencies. The system frame includes a plurality of tubes. When the tube is open, airflow is allowed. When identified tubes are closed, quarter-wavelength attenuation is provided for a frequency in a range of frequencies, based upon a length of the tube when closed. Each of the plurality of tubes is selectively controlled to be operable open or closed at a particular length, responsive to identified problem frequencies. | 05-10-2012 |
20120327612 | CARD CONNECTOR WITH A SERVOMECHANICAL DEVICE FOR REPOSITIONING AN EXPANSION CARD - A card connector having a housing with a receiving slot and connector pins are provided. An expansion card having docking well regions, contact pads, and backup contact pads is inserted in the receiving slot. The connector pins are connected to the docking well regions on the expansion card. The expansion card is coupled to a servomechanical device that can slide the expansion card to connect the connector pins with the contact pads. Connector pins and contact pads are coated with an interface material that is subject to wearing. Worn interface material can cause weak electrical connections between connector pins and contact pads. Thus, a card connector with a servomechanical device is provided to slide an expansion card within a receiving slot of the card connector for an improved electrical connection between connector pins and contact pads. | 12-27-2012 |
20130003295 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
20130003296 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
20130008183 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-10-2013 |
20130010422 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-10-2013 |
20130016472 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-17-2013 |
20130045612 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 02-21-2013 |
20130130515 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 05-23-2013 |