Patent application number | Description | Published |
20080261071 | Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components - A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating. | 10-23-2008 |
20080278029 | ELECTROLESS PLATING PRODUCTION OF NICKEL AND COLBALT STRUCTURES - A method comprising forming a structural element | 11-13-2008 |
20090145764 | COMPOSITE COATINGS FOR WHISKER REDUCTION - There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles. | 06-11-2009 |
20090145765 | COMPOSITE COATINGS FOR WHISKER REDUCTION - There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles. | 06-11-2009 |
20100294669 | ELECTROLYTIC DEPOSITION OF METAL-BASED COMPOSITE COATINGS COMPRISING NANO-PARTICLES - A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface. | 11-25-2010 |
20110215068 | ELECTROLESS PLATING PRODUCTION OF NICKEL AND COBALT STRUCTURES - A method comprising forming a structural element | 09-08-2011 |
20120285834 | COMPOSITE COATINGS FOR WHISKER REDUCTION - There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles. | 11-15-2012 |
20130180768 | SILVER PLATING IN ELECTRONICS MANUFACTURE - Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability. | 07-18-2013 |