Patent application number | Description | Published |
20120115251 | PROCESS FOR SELECTIVELY PATTERNING A MAGNETIC FILM STRUCTURE - Processes for selectively patterning a magnetic film structure generally include selectively etching an exposed portion of a freelayer disposed on a tunnel barrier layer by a wet process, which includes exposing the freelayer to an etchant solution comprising at least one acid and an organophosphorus acid inhibitor or salt thereof, stopping on the tunnel barrier layer. | 05-10-2012 |
20120280338 | SPIN TORQUE MRAM USING BIDIRECTIONAL MAGNONIC WRITING - An apparatus is provided for bidirectional writing. A stack includes a reference layer on a tunnel barrier, the tunnel barrier on a free layer, and the free layer on a metal spacer. The apparatus includes an insulating magnet. A Peltier material is thermally coupled to the insulating magnet and the stack. When the Peltier/insulating magnet interface is cooled, the insulating magnet is configured to transfer a spin torque to rotate a magnetization of the free layer in a first direction. When the Peltier/insulating magnet interface is heated, the insulating magnet is configured to transfer the spin torque to rotate the magnetization of the free layer in a second direction. | 11-08-2012 |
20120281460 | NONCONTACT WRITING OF NANOMETER SCALE MAGNETIC BITS USING HEAT FLOW INDUCED SPIN TORQUE EFFECT - A mechanism is provided for noncontact writing. Multiple magnetic islands are provided on a nonmagnetic layer. A reference layer is provided under the nonmagnetic layer. A spin-current is caused to write a state to a magnetic island of the multiple magnetic islands by moving a heat source to heat the magnetic island. | 11-08-2012 |
20120281467 | MAGNONIC MAGNETIC RANDOM ACCESS MEMORY DEVICE - A mechanism is provided for bidirectional writing. A structure includes a reference layer on top of a tunnel barrier, a free layer underneath the tunnel barrier, a metal spacer underneath the free layer, an insulating magnet underneath the metal spacer, and a high resistance layer underneath the insulating layer. The high resistance layer acts as a heater in which the heater heats the insulating magnet to generate spin polarized electrons. A magnetization of the free layer is destabilized by the spin polarized electrons generated from the insulating magnet. A voltage is applied to change the magnetization of the free layer when the magnetization is destabilized. A polarity of the voltage determines when the magnetization of the free layer is parallel and antiparallel to a magnetization of the reference layer. | 11-08-2012 |
20140033516 | MAGNETIC RANDOM ACCESS MEMORY WITH SYNTHETIC ANTIFERROMAGNETIC STORAGE LAYERS - A method for fabricating a synthetic antiferromagnetic device, includes depositing a reference layer on a first tantalum layer and including depositing a first cobalt iron boron layer, depositing a second cobalt iron boron layer on the first cobalt iron boron layer, depositing a second Ta layer on the second cobalt iron boron layer, depositing a magnesium oxide spacer layer on the reference layer and depositing a cap layer on the magnesium oxide spacer layer. | 02-06-2014 |
20140037990 | MAGNETIC RANDOM ACCESS MEMORY WITH SYNTHETIC ANTIFERROMAGNETIC STORAGE LAYERS AND NON-PINNED REFERENCE LAYERS - A synthetic antiferromagnetic device includes a reference layer having a first and second ruthenium layer, a magnesium oxide spacer layer disposed on the reference layer, a cobalt iron boron layer disposed on the magnesium oxide spacer layer and a third ruthenium layer disposed on the cobalt iron boron layer, the third ruthenium layer having a thickness of approximately 0 angstroms to 18 angstroms. | 02-06-2014 |
20140037991 | MAGNETIC RANDOM ACCESS MEMORY WITH SYNTHETIC ANTIFERROMAGNETIC STORAGE LAYERS - A synthetic antiferromagnetic device includes a first tantalum layer, a reference layer disposed on the first tantalum layer and including a first cobalt iron boron layer, a second cobalt iron boron layer disposed on the first cobalt iron boron layer, a third cobalt iron boron layer and a second tantalum layer disposed between the second and third cobalt iron boron layers, a magnesium oxide spacer layer disposed on the reference layer and a cap layer disposed on the magnesium oxide spacer layer. | 02-06-2014 |
20140037992 | MAGNETIC RANDOM ACCESS MEMORY WITH SYNTHETIC ANTIFERROMAGNETIC STORAGE LAYERS - A synthetic antiferromagnetic device includes a reference layer, a magnesium oxide spacer layer disposed on the reference layer, a cobalt iron boron layer disposed on the magnesium oxide spacer layer, and a first ruthenium layer disposed on cobalt iron boron layer, the first ruthenium layer having a thickness of approximately 0 Å to 32 Å. | 02-06-2014 |
20140038309 | MAGNETIC RANDOM ACCESS MEMORY WITH SYNTHETIC ANTIFERROMAGNETIC STORAGE LAYERS AND NON-PINNED REFERENCE LAYERS - A method for fabricating a synthetic antiferromagnetic device, includes depositing a magnesium oxide spacer layer on a reference layer having a first and second ruthenium layer, depositing a cobalt iron boron layer on the magnesium oxide spacer layer; and depositing a third ruthenium layer on the cobalt iron boron layer, the third ruthenium layer having a thickness of approximately 0-18 angstroms. | 02-06-2014 |
20140038310 | MAGNETIC RANDOM ACCESS MEMORY WITH SYNTHETIC ANTIFERROMAGNETIC STORAGE LAYERS - A synthetic antiferromagnetic device includes a reference layer, a magnesium oxide spacer layer disposed on the reference layer, a cobalt iron boron layer disposed on the magnesium oxide spacer layer, and a first ruthenium layer disposed on cobalt iron boron layer, the first ruthenium layer having a thickness of approximately 0 Å to 32 Å. | 02-06-2014 |
20140151620 | SELF-ALIGNED WIRE FOR SPINTRONIC DEVICE - A method for fabricating a spintronic cell includes forming a cavity in a substrate, forming a wire in the cavity, depositing a spacer layer over exposed portions of the substrate and the conductive field line, depositing a layer of conductive material on a portion of the spacer layer, removing portions of the layer of conductive material to define a conductive strap portion, wherein the conductive strap portion has a first distal region a second distal region and a medial region arranged therebetween, wherein the medial region has a cross sectional area that is less than a cross sectional area of the first distal region and a cross sectional area of the second distal region, and forming an spintronic device stack on the conductive strap portion above the conductive field line. | 06-05-2014 |
20140151824 | SELF-ALIGNED WIRE FOR SPINTRONIC DEVICE - A method for fabricating a spintronic cell includes forming a cavity in a substrate, forming a wire in the cavity, depositing a spacer layer over exposed portions of the substrate and the conductive field line, depositing a layer of conductive material on a portion of the spacer layer, removing portions of the layer of conductive material to define a conductive strap portion, wherein the conductive strap portion has a first distal region a second distal region and a medial region arranged therebetween, wherein the medial region has a cross sectional area that is less than a cross sectional area of the first distal region and a cross sectional area of the second distal region, and forming an spintronic device stack on the conductive strap portion above the conductive field line. | 06-05-2014 |
20140191371 | Catalytic Etch With Magnetic Direction Control - A material can be locally etched with arbitrary changes in the direction of the etch. A ferromagnetic-material-including catalytic particle is employed to etch the material. A wet etch chemical or a plasma condition can be employed in conjunction with the ferromagnetic-material-including catalytic particle to etch a material through a catalytic reaction between the catalytic particle and the material. During a catalytic etch process, a magnetic field is applied to the ferromagnetic-material-including catalytic particle to direct the movement of the particle to any direction, which is chosen so as to form a contiguous cavity having at least two cavity portions having different directions. The direction of the magnetic field can be controlled so as to form the contiguous cavity in a preplanned pattern, and each segment of the contiguous cavity can extend along an arbitrary direction. | 07-10-2014 |
20140246652 | PLANAR QUBITS HAVING INCREASED COHERENCE TIMES - An interdigitated capacitor includes a substrate and a pair of comb-like electrodes both formed on the semiconductor substrate and horizontally arranged thereon, each of the pair of comb-like electrodes including finger electrodes having a curved profile. | 09-04-2014 |
20140264284 | FREQUENCY SEPARATION BETWEEN QUBIT AND CHIP MODE TO REDUCE PURCELL LOSS - A system, method, and chip to control Purcell loss are described. The chip includes qubits formed on a first surface of a substrate. The method includes determining frequencies of the qubits, and controlling a separation between the frequencies of the qubits and chip mode frequencies of the chip. | 09-18-2014 |
20140264287 | REMOVAL OF SPURIOUS MICROWAVE MODES VIA FLIP-CHIP CROSSOVER - A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate. | 09-18-2014 |
20140264664 | PARALLEL SHUNT PATHS IN THERMALLY ASSISTED MAGNETIC MEMORY CELLS - A thermally assisted magnetic memory cell device includes a substrate, a first electrode disposed on the substrate, a magnetic tunnel junction disposed on the first electrode, a second electrode disposed on the magnetic tunnel junction, a conductive hard mask disposed on the second electrode and a parallel shunt path coupled to the magnetic tunnel junction, thereby electrically coupling the first and second electrodes. | 09-18-2014 |
20140264787 | DIFFERENTIAL EXCITATION OF PORTS TO CONTROL CHIP-MODE MEDIATED CROSSTALK - A differential port and a method of arranging the differential port are described. The method includes arranging a first electrode to receive a drive signal, and arranging a second electrode to receive a guard signal, the guard signal having a different phase than the drive signal and the first electrode and the second electrode having a gap therebetween. The method also includes disposing a signal line from the first electrode to drive a radio frequency (RF) device. | 09-18-2014 |
20140266406 | SYMMETRIC PLACEMENT OF COMPONENTS ON A CHIP TO REDUCE CROSSTALK INDUCED BY CHIP MODES - A method and system to control crosstalk among qubits on a chip are described. The method includes placing two or more components symmetrically on the chip, the chip including the qubits, and driving two or more ports symmetrically to control the crosstalk based on controlling coupling of chip mode frequencies and qubit frequencies. | 09-18-2014 |
20140273282 | PARALLEL SHUNT PATHS IN THERMALLY ASSISTED MAGNETIC MEMORY CELLS - A thermally assisted magnetic memory cell device includes a substrate, a first electrode disposed on the substrate, a magnetic tunnel junction disposed on the first electrode, a second electrode disposed on the magnetic tunnel junction, a conductive hard mask disposed on the second electrode and a parallel shunt path coupled to the magnetic tunnel junction, thereby electrically coupling the first and second electrodes. | 09-18-2014 |
20140274725 | CHIP MODE ISOLATION AND CROSS-TALK REDUCTION THROUGH BURIED METAL LAYERS AND THROUGH-VIAS - A method for fabricating a chip surface base includes preparing a first substrate, preparing a plurality of vias in the first substrate, depositing metal fillings into the plurality of vias, preparing a second substrate, bonding the first and second substrates and exposing the metal fillings. A method for fabricating a chip surface base includes preparing a first and second substrate, depositing a metal on at least one of the first and second substrates, bonding the first and second substrates, preparing a plurality of vias in the first substrate, depositing metal fillings into the plurality of vias and exposing the metal fillings. A chip surface base device includes a first substrate, a second substrate, a metal layer disposed between the first and second substrates and a plurality vias disposed on the first substrate. | 09-18-2014 |
20140327120 | DIFFERENTIAL EXCITATION OF PORTS TO CONTROL CHIP-MODE MEDIATED CROSSTALK - A differential port and a method of arranging the differential port are described. The method includes arranging a first electrode to receive a drive signal, and arranging a second electrode to receive a guard signal, the guard signal having a different phase than the drive signal and the first electrode and the second electrode having a gap therebetween. The method also includes disposing a signal line from the first electrode to drive a radio frequency (RF) device. | 11-06-2014 |
20150044426 | CATALYTIC ETCH WITH MAGNETIC DIRECTION CONTROL - A material can be locally etched with arbitrary changes in the direction of the etch. A ferromagnetic-material-including catalytic particle is employed to etch the material. A wet etch chemical or a plasma condition can be employed in conjunction with the ferromagnetic-material-including catalytic particle to etch a material through a catalytic reaction between the catalytic particle and the material. During a catalytic etch process, a magnetic field is applied to the ferromagnetic-material-including catalytic particle to direct the movement of the particle to any direction, which is chosen so as to form a contiguous cavity having at least two cavity portions having different directions. The direction of the magnetic field can be controlled so as to form the contiguous cavity in a preplanned pattern, and each segment of the contiguous cavity can extend along an arbitrary direction. | 02-12-2015 |