Patent application number | Description | Published |
20100319881 | HEAT SPREADER WITH VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - The heat spreader includes a flattened casing which defines a vapor chamber therein, a wick structure formed on an inner face of the casing and a supporting frame received in the vapor chamber. The supporting frame includes a plurality of supporting wires. Each of the supporting wires has a column-spiral configuration. | 12-23-2010 |
20100326630 | HEAT SPREADER WITH VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a heat spreader includes steps of: providing an elongated and flat sectional material with a through hole defined therein; cutting the sectional material into a plurality of parts each in a predetermined length to form a plurality of casings, wherein each of the casings defines a vapor chamber therein and has at least an opening in a side thereof; forming a wick structure on an inner face of the casing; providing a plurality of supporting members; placing and fixing the supporting members into the vapor chamber of the casing; and injecting working liquid into the vapor chamber and sealing the casing. | 12-30-2010 |
20110005725 | PLATE TYPE HEAT PIPE AND HEAT SINK USING THE SAME - A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough. | 01-13-2011 |
20110232874 | HEAT DISSIPATION APPARATUS WITH HEAT PIPE - A heat dissipation apparatus includes an evaporator receiving heat from a heat source, a condenser releasing the heat of the heat source, and a pipeline inter connecting the evaporator and the condenser. The condenser defines a flat rectangular chamber therein. A working fluid is contained in the evaporator. The working fluid vaporizes upon receiving the heat of the heat source. The pipeline conducts the vaporized working fluid from the evaporator to the condenser. The vaporized working fluid condenses upon releasing the heat in the chamber. | 09-29-2011 |
20110240264 | PLATE-TYPE HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - An exemplary plate-type heat pipe includes a condensing plate, an evaporating plate and a spherical supporting. The evaporating plate engages with the condensing plate to define a hermetic container. Working fluid is contained in the container. The supporting portion in the container is sandwiched between the condensing plate and the evaporating plate and abuts against the condensing plate and the evaporating plate. | 10-06-2011 |
20120043059 | LOOP HEAT PIPE - A loop heat pipe includes an evaporator, a condenser, and a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A predetermined quantity of bi-phase working medium is contained in the closed loop. A separator connects the liquid line. A cross section of the separator is larger than a cross section of the liquid line. The separator separates the liquid state working medium from the vapor state working medium when the working medium flows therethrough. | 02-23-2012 |
20120043060 | LOOP HEAT PIPE - An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser. | 02-23-2012 |
20120111541 | PLATE TYPE HEAT PIPE AND HEAT SINK USING THE SAME - A plate-type heat pipe includes a sealed shell containing working liquid therein, and elongated wick structures arranged in the shell in a spaced manner. Channels are formed between the wick structures. The heat pipe has an evaporating section and a condensing section. Two ends of each wick structure are respectively located at the evaporating section and the condensing section. Top and bottom faces of each wick structure respectively contact top and bottom inner faces of the shell. | 05-10-2012 |
20120160812 | METHOD FOR SEALING VAPOR CHAMBER - An exemplary method for sealing a vapor chamber includes, firstly, providing a casing, wherein the casing has an opening. Then a metallic tube is inserted into the opening such that the tube is hermetically engaged in the opening. Next, a pressing mold is provided, wherein the pressing mold includes a positive pole and a negative pole opposite to the positive pole. A free end of the tube is pressed by the positive pole and the negative pole of the pressing mold to form a crimped sealing portion. Then electricity is charged between the positive pole and the negative pole. The electricity passes through the crimped sealing portion and heats an inner face of the crimped sealing portion to weld the crimped sealing portion. | 06-28-2012 |
20120241133 | VAPOR CHAMBER AND METHOD FOR MANUFACTURING THE SAME - A vapor chamber includes a heat absorbing plate and a heat dissipating plate attached to the heat absorbing plate. The heat absorbing plate includes a wick structure thereon facing the heat dissipating plate. The wick structure defines a plurality of first grooves and a plurality of second grooves intersecting the first grooves. The heat dissipating plate forms a hermetically sealed container in cooperation with the heat absorbing plate. The hermetically sealed container receives the wick structure therein. Working fluid is sealed inside the container and flows in the first grooves and the second grooves. | 09-27-2012 |
20120307452 | PORTABLE ELECTRONIC DEVICE WITH HEAT PIPE - An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board, the heat generating electronic component and a heat pipe therein. The heat pipe includes an evaporating side and a condensing side. The evaporating side thermally contacts the heat generating electronic component, and the condensing side thermally contacts the shell. | 12-06-2012 |
20120307453 | ELECTRONIC DEVICE WITH HEAT PIPE CHAMBER COVER FOR DISSIPATING HEAT - An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate. | 12-06-2012 |