Patent application number | Description | Published |
20090134925 | APPARATUS AND METHOD FOR HARDENING LATCHES IN SOI CMOS DEVICES - A method of determining one or more transistors within a particular circuit to be respectively replaced with a hardened transistor includes: identifying, as not requiring hardening, one or more transistors; identifying, as candidates for hardening, each transistor in the circuit not previously identified as not requiring hardening; and employing the hardened transistor in place of a transistor identified as a candidate for hardening. The circuit is a latch and the transistor is an SOI CMOS FET. The transistor is also an SOI transistor. The series transistor includes first and second series-connected transistors having a shared source/drain region whereby a drain of the first series-connected transistor is merged with a source of the second series-connected transistor. | 05-28-2009 |
20090135961 | System and Method for Scanning Sequential Logic Elements - System and Method for Scanning Sequential Logic Elements A digital system and method for scanning sequential logic elements are disclosed. The digital system may comprise a plurality of sequential logic elements subdivided into power domains, wherein at least one of the power domains is power gated; a scan chain configured for processing a scan data sequence; a scan enable switch configured for controlling a scan mode; and at least one shadow engine, wherein the at least one shadow engine comprises a control circuit. At least some of the power domains may be interconnected to the scan chain with the scan enable switch, and the scan enable switch may control the scan mode by asserting a scan enable signal. The at least one power gated power domain with one or more sequential logic elements to be power gated may be bypassed via the at least one shadow engine. | 05-28-2009 |
20090285046 | METHOD TO REDUCE LEAKAGE OF A SRAM-ARRAY - A structure and method to reduce leakage of a Static Random Access Memory (SRAM) array, wherein the array is subdivided into a set of sub-arrays, whose supply voltages can be controlled independently using a single voltage regulation circuit dedicated to the entire SRAM array. A switch fabric enables independent switching of individual sub-arrays between a virtual ground level and a system ground level based on whether the sub-array is operating in power saving mode or a high performance mode to reduce leakage current when a sub-array is configured in a power saving mode. | 11-19-2009 |
20110102042 | APPARATUS AND METHOD FOR HARDENING LATCHES IN SOI CMOS DEVICES - A method of determining one or more transistors within a particular circuit to be respectively replaced with a hardened transistor includes: identifying, as not requiring hardening, one or more transistors; identifying, as candidates for hardening, each transistor in the circuit not previously identified as not requiring hardening; and employing the hardened transistor in place of a transistor identified as a candidate for hardening. The circuit is a latch and the transistor is an SOI CMOS FET. The transistor is also an SOI transistor. The series transistor includes first and second series-connected transistors having a shared source/drain region whereby a drain of the first series-connected transistor is merged with a source of the second series-connected transistor. | 05-05-2011 |
20140140157 | Complementary Metal-Oxide-Semiconductor (CMOS) Min/Max Voltage Circuit for Switching Between Multiple Voltages - A voltage selection mechanism is provided for switching between multiple voltages without causing a direct current (DC) that may further stress storage elements due to excessive power consumption and electro-migration effects. The voltage selection mechanism comprises cross-coupled circuitry, which comprises a first positive-channel field effect transistor (PFET) and a second PFET. The voltage selection mechanism further comprises diode circuitry, which comprises a third PFET and a fourth PFET. | 05-22-2014 |
20160072461 | Current-Mode Sense Amplifier - A current sense amplifier comprises a reference current input terminal, a control line input terminal, a sense current input terminal, an output terminal, a first NAND gate, a transmission gate, and two cross coupled inverters each comprising a n-FET. The first NAND gate comprises an output terminal being coupled to the output terminal of the amplifier. The transmission gate comprises two transmission terminals and a gate terminal. The gate terminal is coupled to the control line terminal. Sources of the n-FETs are coupled to the sense current input terminal and the reference current input terminal, respectively. One of the transmission terminals is coupled to an input terminal of one of the inverters and the other transmission terminal is coupled to an input terminal of the other inverter. The input terminals of the first NAND gate are coupled to the control line terminal and one of the input terminals of the inverters, respectively. | 03-10-2016 |
20160118528 | SIGNAL DISTRIBUTION IN INTEGRATED CIRCUIT USING OPTICAL THROUGH SILICON VIA - An optical through silicon via is formed in a silicon substrate of an integrated circuit. A photo detector is formed within the integrated circuit and is optically coupled to a first side of the optical through silicon via. A light generating source optically coupled to a second side of the optical through silicon via is provided. The photo detector is configured to receive a light, generated by the light generating source, propagating through the optical through silicon via. The light, generated by the light generating source, is controlled by a signal generated by a signal generating source. | 04-28-2016 |
20160118529 | SIGNAL DISTRIBUTION IN INTEGRATED CIRCUIT USING OPTICAL THROUGH SILICON VIA - An optical through silicon via is formed in a silicon substrate of an integrated circuit. A photo detector is formed within the integrated circuit and is optically coupled to a first side of the optical through silicon via. A light generating source optically coupled to a second side of the optical through silicon via is provided. The photo detector is configured to receive a light, generated by the light generating source, propagating through the optical through silicon via. The light, generated by the light generating source, is controlled by a signal generated by a signal generating source. | 04-28-2016 |