Patent application number | Description | Published |
20130134585 | INTEGRATED CIRCUIT ASSEMBLY AND METHOD OF MAKING - An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate. | 05-30-2013 |
20140035129 | THIN INTEGRATED CIRCUIT CHIP-ON-BOARD ASSEMBLY AND METHOD OF MAKING - An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer. | 02-06-2014 |
20140319698 | Redistribution Layer Contacting First Wafer through Second Wafer - A semiconductor structure is formed with first and second semiconductor wafers and a redistribution layer. The first semiconductor wafer is formed with a first active layer and a first interconnect layer. The second semiconductor wafer is formed with a second active layer and a second interconnect layer. The second semiconductor wafer is inverted and bonded to the first semiconductor wafer, and a substrate is removed from the second semiconductor wafer. The redistribution layer redistributes electrical connective pad locations on a side of the second semiconductor wafer. The redistribution layer also electrically contacts the first interconnect layer through a hole in the second active layer and the second interconnect layer. | 10-30-2014 |
20150108640 | THIN INTEGRATED CIRCUIT CHIP-ON-BOARD ASSEMBLY AND METHOD OF MAKING - An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface, where the first surface of the insulating layer is less than 10 microns below an upper plane of the integrated circuit assembly. An active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the active layer and formed on the second surface of the insulating layer, and is also electrically connected to a printed circuit board. A method of fabricating an integrated circuit assembly includes coupling a handle wafer to the active layer of a semiconductor-on-insulator wafer, removing the substrate of the semiconductor-on-insulator, forming a bond pad connecting to the active layer on the exposed insulator surface, bonding the bond pad to a printed circuit board using a solder bump, and removing the handle wafer. | 04-23-2015 |
20150140782 | INTEGRATED CIRCUIT ASSEMBLY AND METHOD OF MAKING - An integrated circuit assembly includes an insulating layer having a having a first surface and a second surface. A first active layer contacts the first surface of the insulating layer. A metal bond pad is electrically connected to the first active layer and formed on the second surface of the insulating layer. A substrate having a first surface and a second surface, with a second active layer formed in the first surface, is provided such that the first active layer is coupled to the second surface of the substrate. | 05-21-2015 |
Patent application number | Description | Published |
20120316412 | Analyte Monitoring Device and Methods of Use - An analyte monitor includes a sensor, a sensor control unit, and a display unit. The sensor has, for example, a substrate, a recessed channel formed in the substrate, and conductive material disposed in the recessed channel to form a working electrode. The sensor control unit typically has a housing adapted for placement on skin and is adapted to receive a portion of an electrochemical sensor. The sensor control unit also includes two or more conductive contacts disposed on the housing and configured for coupling to two or more contact pads on the sensor. A transmitter is disposed in the housing and coupled to the plurality of conductive contacts for transmitting data obtained using the sensor. The display unit has a receiver for receiving data transmitted by the transmitter of the sensor control unit and a display coupled to the receiver for displaying an indication of a level of an analyte. The analyte monitor may also be part of a drug delivery system to alter the level of the analyte based on the data obtained using the sensor. | 12-13-2012 |
20130018254 | APPARATUS AND METHODS FOR IMAGING BLOOD VESSELS - Various portable systems, devices and methods for imaging or visualizing blood vessels or other body tissue to facilitate accurate placement of a needle or other elongate instrument in blood vessels or other body tissue are described herein. In certain variations an imaging system for aiding needle insertion in a patient may include a mountable unit having, an illumination source, an image sensor, and a display for displaying an image based on image information from the image sensor, The mountable unit may be configured for attachment to a hand of a user such that the user's hand on which the unit is mounted remains free to hold an object. The display may be positioned next to a needle insertion site during needle insertion by the user such that the needle insertion site and an image of the blood vessel and/or needle are simultaneously within the user's field of view. | 01-17-2013 |
20140276088 | Illumination Optics for a Visible or Infrared Based Apparatus and Methods for Viewing or Imaging Blood Vessels - The illumination apparatus and methods described herein increase the depth of the illumination's tissue penetration, help minimize surface reflections and back-scatter for a non-contact camera based imaging system thus providing increased tissue-structure contrast and more information about the structures beneath the surface. It does this by using one or more of the following techniques:
| 09-18-2014 |
20140365245 | METHOD FOR MANAGING TREATMENT OF A HEALTH CONDITION USING SUBJECTIVE SYMPTOM DATA - A method for managing treatment of a particular health condition afflicting a patient includes programming a processor with a health management application program that prompts a user for entry of health condition data, including a patient physiological data, subjective patient health condition data, and medication delivery data, compiles the health condition data into a data summary, and transmits the data summary through a communication unit. A drop-down list related to subjective symptoms is provided, which includes stress and depression. A display touch method is used to enter data, selections, and controls. The health management program also provides prompts for the entry of diet data, and further displays drop-down lists related to daily activities and alerts for medication delivery. | 12-11-2014 |
20150302164 | Method for Managing Treatment of a Health Condition Using Subjective Symptom Data - A method for managing treatment of a particular health condition afflicting a patient includes programming a processor with a health management application program that prompts a user for entry of health condition data, including a patient physiological data, subjective patient health condition data, and medication delivery data, compiles the health condition data into a data summary, and transmits the data summary through a communication unit. A drop-down list related to subjective symptoms is provided, which includes stress and depression. A display touch method is used to enter data, selections, and controls. The health management program also provides prompts for the entry of diet data, and further displays drop-down lists related to daily activities and alerts for medication delivery. | 10-22-2015 |