Patent application number | Description | Published |
20100002543 | Micromechanical Structure for Receiving and/or Generating Acoustic Signals, Method for Producing a Micromechnical Structure, and Use of a Micromechanical Structure - A micromechanical structure and a method for producing a micromechanical structure are provided, the micromechanical structure being configured for receiving and/or generating acoustic signals in a medium at least partially surrounding the structure. The structure includes a first counterelement that has first openings and essentially forms a first side of the structure, a second counterelement that has second openings and essentially forms a second side of the structure, and an essentially closed diaphragm disposed between the first counterelement and the second counterelement. | 01-07-2010 |
20100135123 | ACOUSTIC SENSOR ELEMENT - A micromechanical acoustic sensor element, which has at least one diaphragm and at least one fixed counter element, the diaphragm being situated in a cavity between a substrate and the counter element and acting as movable electrode of a capacitor system, the counter element acting as first fixed counter electrode of this capacitor system, and at least one through hole being formed in the substrate for the application of sound pressure to the diaphragm. For fixation and strengthening purposes, the counter element is connected to the substrate via at least one support element. The support element is situated in the region of the cavity, and an opening is formed in the diaphragm for the support element. | 06-03-2010 |
20100236906 | METHOD AND DEVICE FOR SWITCHING ELECTRICAL APPLIANCES - Exemplary methods and devices of an electrical operating device, an electrical appliance having an electrical operating device, and a method for switching an electrical appliance, are provided. For example, an electrical operating device embodiment may include an acceleration sensor, an electrical switching means, an electric line, and a signal line. The signal line may be associated with the acceleration sensor and the electrical switching means. The acceleration sensor may be designed so that at a predefinable acceleration, a signal is generated by which the electrical switching means is activated. The electric line is switchable using the electrical switching means. | 09-23-2010 |
20110108932 | Micromechanical Capacitive Sensor Element - A manufacturing method for producing a micromechanical sensor element which may be produced in a monolithically integrable design and has capacitive detection of a physical quantity is described. In addition to the manufacturing method, a micromechanical device containing such. a sensor element, e.g., a pressure sensor or an acceleration sensor, is described. | 05-12-2011 |
20110143816 | PORTABLE DEVICE INCLUDING WARNING SYSTEM AND METHOD - A portable device for displaying information, in particular a mobile telephone, having a display for outputting image or text information, a detection system, and an output unit. The detection system is designed to detect an approach of the portable device to an object. The output unit may output a warning signal in the event of a predefined approach to the object, in particular a defined distance. | 06-16-2011 |
20120133905 | Microprojector and manufacturing method for a microprojector - A microprojector is described, in which the microprojector includes a light source, at least one optical imaging arrangement for creating an image with the aid of the light source, at least one electrical arrangement for activating the light source, and a damping element for damping mechanical shocks of the microprojector. Also described is a method for manufacturing a microprojector as well as a corresponding utilization. | 05-31-2012 |
20120297879 | INERTIAL SENSOR - An inertial sensor, comprising a substrate and a rocker that is connected to the substrate via a spring apparatus, the spring apparatus having at least two springs for suspending the rocker on the substrate, the two springs being disposed with an offset from one another with reference to their longitudinal axis. | 11-29-2012 |
20130277774 | METHOD FOR MANUFACTURING A HYBRID INTEGRATED COMPONENT - A simple and cost-effective manufacturing method for hybrid integrated components including at least one MEMS element, a cap for the micromechanical structure of the MEMS element, and at least one ASIC substrate, using which a high degree of miniaturization may be achieved. The micromechanical structure of the MEMS element and the cap are manufactured in a layered structure, proceeding from a shared semiconductor substrate, by applying at least one cap layer to a first surface of the semiconductor substrate, and by processing and structuring the semiconductor substrate proceeding from its other second surface, to produce and expose the micromechanical MEMS structure. The semiconductor substrate is then mounted with the MEMS-structured second surface on the ASIC substrate. | 10-24-2013 |
20130285985 | METHOD AND DEVICE FOR ASCERTAINING A GESTURE PERFORMED IN THE LIGHT CONE OF A PROJECTED IMAGE - A method for ascertaining a gesture performed in the light cone of a projected image which has a plurality of pixels includes: detecting all pixels of the projected image and one or multiple parameter values of the individual pixels; comparing the one or the multiple detected parameter values of the individual pixels with a parameter comparison value; assigning a subset of the pixels to a pixel set as a function of the results of the comparison; and ascertaining a gesture performed in the light cone of the projected image based on the assigned pixel set. | 10-31-2013 |
20130299924 | HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF - A component system includes at least one MEMS element, a cap for a micromechanical structure of the MEMS element, and at least one ASIC substrate. The micromechanical structure of the MEMS element is implemented in the functional layer of an SOI wafer. The MEMS element is mounted face down, with the structured functional layer on the ASIC substrate, and the cap is implemented in the substrate of the SOI wafer. The ASIC substrate includes a starting substrate provided with a layered structure on both sides. At least one circuit level is implemented in each case both in the MEMS-side layered structure and in the rear-side layered structure of the ASIC substrate. In the ASIC substrate, at least one ASIC through contact is implemented which electrically contacts at least one circuit level of the rear-side layered structure and/or at least one circuit level of the MEMS-side layered structure. | 11-14-2013 |
20140092458 | MAGNETICALLY DRIVABLE MICROMIRROR - A magnetically drivable micromirror having an outer frame, a coil former, and torsion springs, situated in a first plane, the torsion springs having an axis of rotation, and the coil former being connected to the outer frame by the torsion springs so as to be capable of rotational motion about the axis of rotation, having a mirror element that is situated in a second plane parallel to the first plane, the mirror element being connected to the coil former by an intermediate layer. A 2D scanner having a first magnetically drivable micromirror and a second drivable mirror, and to a method for producing a micromirror are also described. | 04-03-2014 |
20140110800 | Method for manufacturing a cap for a mems component, and hybrid integrated component having such a cap - A manufacturing method for a cap, for a hybrid vertically integrated component having a MEMS component a relatively large cavern volume having a low cavern internal pressure, and a reliable overload protection for the micromechanical structure of the MEMS component. A cap structure is produced in a flat cap substrate in a multistep anisotropic etching, and includes at least one mounting frame having at least one mounting surface and a stop structure, on the cap inner side, having at least one stop surface, the surface of the cap substrate being masked for the multistep anisotropic etching with at least two masking layers made of different materials, and the layouts of the masking layers and the number and duration of the etching steps being selected so that the mounting surface, the stop surface, and the cap inner side are situated at different surface levels of the cap structure. | 04-24-2014 |
20140111421 | ELECTRICAL DEVICE, IN PARTICULAR A TELECOMMUNICATION DEVICE HAVING A PROJECTION UNIT AND METHOD FOR OPERATING AN ELECTRICAL DEVICE - A telecommunication device has: a projection unit for projecting image information on a projection surface situated outside the telecommunications device, the image information being projected onto the projection surface (i) with the aid of at least one optical element in a projection beam path for sequentially constructing an image, and (ii) for momentarily spatially limiting the projection relative to the total area of the image information on the projection surface; and a detection unit. During projection a movement of the projection surface, e.g., a displacement or a rotation, takes place relative to the projection unit. The detection unit detects the movement of the projection surface with the aid of a reflection signal passing along a detection beam path, the projection beam path and the detection beam path coinciding at least in the area of the at least one optical element. | 04-24-2014 |
20140117475 | HYBRID INTEGRATED COMPONENT - A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap. | 05-01-2014 |
20140232643 | LASER PROJECTION DEVICE AND METHOD - A laser projection device is described having a projection unit, which is designed to project an image and to generate an interrupt signal as a function of a distance of the projection unit from at least one object located in front of the projection unit in the projection direction, and having an application control unit, which is designed to control the projection unit as a function of the interrupt signal. A method is also described. | 08-21-2014 |
20140340585 | LASER PROJECTION DEVICE AND LASER PROJECTION METHOD FOR PROJECTING LASER BEAMS ONTO A PROJECTION PLANE - A laser projection device is described for projecting laser beams onto a projection plane, including a controllable multibeam laser diode unit; including a controllable optical deflection unit, which is designed in such a way that laser beams generated by the multibeam laser diode unit are deflected with the aid of the deflection unit; and including a control unit, which is designed in such a way that it controls the deflection unit to move laser beams deflected by the deflection unit onto a projection plane along a scanning line in such a way that different deflected laser beams run in the projection plane on the same scanning line. | 11-20-2014 |
20140340655 | PROJECTOR, AND METHOD FOR CONTROLLING A PROJECTOR ACCORDING TO THE INVENTION - A projector having at least one laser diode which is designed to emit light, having a laser control device which is designed to control the at least one laser diode, having a first controllable resonant mirror which is designed to reflect the light that is emitted by the laser diode, and having a control device which is designed to control the orientation of the first controllable resonant mirror. The control device is further designed to reduce the power supply to the laser diode and to the laser control device in a first configuration of a power-saving mode of the projector, and to further control the orientation of the first controllable resonant mirror at a resonant frequency of the first controllable resonant mirror. Moreover, a corresponding method is described. | 11-20-2014 |
20140375553 | Method and device for determining gestures in the beam region of a projector - A method for determining gestures in the beam region of a projector includes: projecting an image onto a surface with the aid of the projector, using light; measuring a first set of light intensities of light backscattered from the direction of the surface, under the influence of a gesture made in the beam region of the projector; assigning the measured light intensities to, in each instance, a position of the image projected by the projector; at a first time point, generating a first light intensity function over a second set of positions, which are assigned measured light intensities; at a second time point, generating at least one second light intensity function over the second set of positions; and determining the gesture made, based on the result of a comparison between the first and second light intensity functions. | 12-25-2014 |
20150022502 | METHOD FOR READING OUT A LIGHT SENSOR CONTROL UNIT AND A DEVICE FOR READING OUT A LIGHT SENSOR CONTROL UNIT - A method for reading out a light sensor control unit having the method steps: (a) reading out a light signal of the light sensor by the light sensor control unit and generating a data signal corresponding to the light signal, b) storing the generated data signal in a buffer memory unit of the light sensor control unit and, if a terminating condition is not fulfilled: continuing the method with method step a), if the terminating condition is fulfilled: continuing the method with c) reading out the data signals stored in the buffer memory unit of the light sensor control unit in a data block by a processor device. | 01-22-2015 |
20150062678 | MULTI-LASER PROJECTION DEVICE AND CORRESPONDING PRODUCTION METHOD - A multi-laser projection device includes: a plurality of first assemblies, each including a fixed assemblage of a respective laser diode and an associated first collimator lens; a second assembly that forms a fixed assemblage of a beam combiner and a respective second collimator lens that is fastened on an entry surface of the beam combiner and that appertains to a respective laser diode; and a deflection unit. The plurality of first assemblies, the second assembly, and the deflection unit are mounted in a common housing so as to be adjusted to one another. | 03-05-2015 |