Patent application number | Description | Published |
20100271740 | INTEGRATED CIRCUIT PROVIDED WITH A LARGE AREA PROTECTION AGAINST ELECTROSTATIC DISCHARGES - An integrated circuit protected against electrostatic discharges, including: first and second supply rails; first and second intermediary rails normally connected to the first and second supply rails; inverters formed of a P-channel MOS transistor series-connected to an N-channel MOS transistor, the sources of the P-channel and N-channel MOS transistors being respectively connected to the first and second supply rails and the bodies of the P-channel and N-channel transistors being respectively connected to the first and second intermediary rails; a positive overvoltage detector between the first and second supply rails; and a switch for connecting the first and second intermediary rails to the second and first supply rails when a positive overvoltage is detected. | 10-28-2010 |
20100271741 | STRUCTURE FOR PROTECTING AN INTEGRATED CIRCUIT AGAINST ELECTROSTATIC DISCHARGES - A structure for protecting an integrated circuit against electrostatic discharges, comprising an assembly of identical cells, each of which is connected to a terminal forming a pad of the circuit, a first supply rail, or a second supply rail, the cells forming between any two of said terminals an assembly of four alternated layers of different conductivity types. | 10-28-2010 |
20110042747 | STRUCTURE FOR PROTECTING AN INTEGRATED CIRCUIT AGAINST ELECTROSTATIC DISCHARGES - A structure for protecting an integrated circuit against electrostatic discharges, including a device for removing overvoltages between first and second power supply rails; and a protection cell connected to a pad of the circuit including a diode having an electrode, connected to a region of a first conductivity type, connected to the second power supply rail and having an electrode, connected to a region of a second conductivity type, connected to the pad and, in parallel with the diode, a thyristor having an electrode, connected to a region of the first conductivity type, connected to the pad and having a gate, connected to a region of the second conductivity type, connected to the first rail, the first and second conductivity types being such that, in normal operation, when the circuit is powered, the diode is non-conductive. | 02-24-2011 |
20120248542 | TRANSISTOR WITH ADJUSTABLE SUPPLY AND/OR THRESHOLD VOLTAGE - The first electrode of the transistor may include a first electrically conductive region provided within the semiconductor substrate. The second electrode may include a second electrically conductive region provided within the semiconductor substrate. The first and second regions may be separated by the substrate region, and the control electrode may include a third electrically conductive region provided within the substrate. The third electrically conductive region may be both separated from the substrate region by an insulating region and electrically coupled to the substrate region by a junction diode intended to be reverse-biased. | 10-04-2012 |
20120275075 | Electrostatic Discharge Protection Device - Semiconducting device for protecting at least one node of an integrated circuit against electrostatic discharges, comprising a doublet of floating gate thyristors connected in parallel and head-to-foot, the two thyristors having respectively two distinct gates and a common gate formed by a common semiconducting layer, the anode of a first thyristor of the doublet and the cathode of the second thyristor of the doublet forming a first terminal of the doublet designed to be connected to a cold point and the cathode of the first thyristor of the doublet and the anode of the second thyristor of the doublet forming a second terminal of the doublet designed to be connected to the said node to be protected. | 11-01-2012 |
20120286321 | High-Performance Device for Protection from Electrostatic Discharge - The semiconductor device for protection from electrostatic discharges comprises several modules (MDi) for protection from electrostatic discharges comprising triggerable elements (TRi) coupled with triggering means, the said modules being connected between two terminals by the intermediary of a resistive network (R). A common semiconductor layer contacts all of the modules, each triggerable element (TRi) having at least one gate (GHi), and the triggering means comprise a single triggering circuit (TC) common to all of the triggerable elements and whose output is connected to the gates of all of the triggerable elements. | 11-15-2012 |
20120319204 | Triggerable Bidirectional Semiconductor Device - A triggerable bidirectional semiconductor device has two terminals and at least one gate. The device comprises, within a layer of silicon on insulator, a central semiconductor zone incorporating the at least one gate and comprising a central region having a first conductivity type, two intermediate regions having a second conductivity type respectively arranged on either side of and in contact with the central region, two semiconductor end zones respectively arranged on either side of the central zone, each end zone comprising two end regions having opposite types of conductivity, in contact with the adjacent intermediate region, the two end regions of each end zone being mutually connected electrically in order to form the two terminals of the device. | 12-20-2012 |
20130120049 | Power Switch - A power switch includes first and second MOS transistors in series between first and second nodes. Both the first and second transistors have a gate coupled to its substrate. First and second resistive elements are coupled between the gate of the first transistor and the first node, and between the gate of the second transistor and the second node, respectively. A triac is coupled between the first and second nodes. The gate of the triac is coupled to a third node common to the first and second transistors. A third MOS transistor has a first conduction electrode coupled to the gate of the first transistor and a second conduction electrode coupled to the gate of the second transistor. | 05-16-2013 |
20130214326 | Bidirectional Semiconductor Device for Protection Against Electrostatic Discharges, Usable on Silicon on Insulator - A device includes, within a layer of silicon on insulator, a central semiconductor zone including a central region having a first type of conductivity, two intermediate regions having a second type of conductivity opposite to that of the first one, respectively disposed on either side of and in contact with the central region in order to form two PN junctions, two semiconductor end zones respectively disposed on either side of the central zone, each end zone comprising two end regions of opposite types of conductivity, in contact with the adjacent intermediate region, the two end regions of each end zone being mutually connected electrically in order to form the two terminals of the device. | 08-22-2013 |
20130264677 | METHOD FOR PRODUCING AN ELECTRONIC DEVICE BY ASSEMBLING SEMI-CONDUCTING BLOCKS AND CORRESPONDING DEVICE - At least three electrically conducting blocks are disposed within an isolating region; and at least two of them are mutually separated and capacitively coupled by a part of the isolating region. At least two of them, being semiconductor, have opposite types of conductivity or identical types of conductivity, but with different concentrations of dopants, and these are in mutual contact by one of their sides. The mutual arrangement of these blocks within the isolating region, their type of conductivity and their concentration of dopants form at least one electronic module. Some of the blocks define input and output blocks. | 10-10-2013 |
20140097464 | Electronic Device for Protection against Electrostatic Discharges, with a Concentric Structure - The component incorporates, in topological terms, a scalable number of triac structures in a concentric annular arrangement. The component can be used with an electronic device to protect against electrostatic discharges. For example, the components can be used to protect the input/output pad, the first power supply terminal, and the second power supply terminal of an integrated circuit against electrostatic discharges. | 04-10-2014 |
20140124866 | INTEGRATED CIRCUIT COMPRISING A MOS TRANSISTOR HAVING A SIGMOID RESPONSE AND CORRESPONDING METHOD OF FABRICATION - An integrated circuit may include at least one MOS transistor having a sigmoid response. The at least one MOS transistor may include a substrate, a source region, a drain region, a gate region, and insulating spacer regions on either side of the gate region. The substrate may include a first region situated under the gate region between the insulating spacer regions. At least one of the source and drain regions may be separated from the first region of the substrate by a second region of the substrate situated under an insulating spacer region, which may be of a same type of conductivity as the first region of the substrate. | 05-08-2014 |
20140197448 | Bidirectional Semiconductor Device for Protection against Electrostatic Discharges - An integrated circuit is produced on a bulk semiconductor substrate in a given CMOS technology and includes a semiconductor device for protection against electrostatic discharges. The semiconductor device has a doublet of floating-gate thyristors coupled in parallel and head-to-tail. Each thyristor has a pair of electrode regions. The two thyristors respectively have two separate gates and a common semiconductor gate region. The product of the current gains of the two transistors of each thyristor is greater than 1. Each electrode region of at least one of the thyristors has a dimension, measured perpendicularly to the spacing direction of the two electrodes of the corresponding pair, which is adjusted so as to impart to the thyristor an intrinsic triggering voltage less than the breakdown voltage of a transistor to be protected, and produced in the CMOS technology. | 07-17-2014 |
20150077888 | Electronic Device for ESD Protection - A device includes a transistor configured for operating in a hybrid mode, an element configured for generating and injecting a current into the substrate of the transistor in the presence of an ESD pulse, and a thyristor triggerable at least by the element. | 03-19-2015 |