Gamal
Gamal Abdel-Azim, Appleton, WI US
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20100228532 | METHOD TO CREATE AN INDEX ON MANAGEMENT OF THE TRANSITION PERIOD AND TO PREDICT FIRST LACTATION MILK PRODUCTION - A computer implemented method and system for creating an index on management of the transition period and for calculating predicted milk production for an animal such as a dairy cow during a current lactation period. The calculation is made based on individual characteristics of the animal without relying on factors related to a previous lactation, so an accurate prediction may be obtained for first lactation milk production. In a preferred embodiment, the milk production prediction is based on predicted transmitting ability (PTA) for milk for the individual animal in combination with one or more other factors related to the current state of the animal. | 09-09-2010 |
Gamal Rafai-Ahmed, Markham CA
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20120038061 | SEMICONDUCTOR CHIP WITH OFFSET PADS - A semiconductor chip device includes a first semiconductor chip adapted to be stacked with a second semiconductor chip wherein the second semiconductor chip includes a side and first and second conductor structures projecting from the side. The first semiconductor chip includes a first edge, a first conductor pad, a first conductor pillar positioned on but laterally offset from the first conductor pad toward the first edge and that has a first lateral dimension and is adapted to couple to one of the first and second conductor structures, a second conductor pad positioned nearer the first edge than the first conductor pad, and a second conductor pillar positioned on but laterally offset from the second conductor pad and that has a second lateral dimension larger than the first lateral dimension and is adapted to couple to the other of the first and second conductor structures. | 02-16-2012 |
Gamal Refai-Ahmed, Ontario CA
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20100157522 | Alternative Form Factor Computing Device with Cycling Air Flow - Various apparatus and methods of removing heat from devices in a computing device. In one aspect, a method of removing heat from a semiconductor chip in an enclosure of a computing device is provided. Heat from the semiconductor chip is transferred using a heat sink that is thermally coupled to the semiconductor chip. Air is moved using an air mover positioned in the enclosure. The air mover is operable to move the air past the heat sink and recycle at least a portion of the air to again pass the heat sink. | 06-24-2010 |
20110304051 | THERMAL INTERFACE MATERIAL WITH SUPPORT STRUCTURE - Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip and a heat spreader is provided. The method includes placing a thermal interface material layer containing a support structure on the first semiconductor chip. The heat spreader is positioned proximate the thermal interface material layer. The thermal interface material layer is reflowed to establish thermal contact with both the first semiconductor chip and the heat spreader. | 12-15-2011 |
Gamal Refai-Ahmed, Albany, NY US
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20140151871 | HEAT SPREADER WITH FLEXIBLE TOLERANCE MECHANISM - A semiconductor device packaging system includes a substrate, a heat spreader, a stiffener attached to the substrate, and at least one die electrically coupled to the substrate and thermally coupled to the heat spreader. The semiconductor device packaging system further includes at least one stud coupled to one of the stiffener and the heat spreader and at least one orifice formed through one of the stiffener and the heat spreader. In addition, the at least one orifice is aligned with the at least one stud. | 06-05-2014 |
20150337828 | VIBRATIONAL FLUID MOVER ACTIVE CONTROLLER - A vibrational fluid mover includes a housing having at least one actuator element positioned thereon that vibrates responsive to a wave shape voltage applied thereto, such that a volume of a chamber in the housing increases and decreases to entrain and eject fluid into/out from the chamber. A control system is operably connected to the actuator element to cause the voltage to be provided thereto so as to actively control the movement of the actuator element. The control system is programmed to set a baseline value for an operational parameter of the vibrational fluid mover generated responsive to a target voltage and frequency being provided, monitor operation of the vibrational fluid mover during operation at the target voltage and frequency, identify a deviation of the operational parameter from the baseline value, and modify the voltage and frequency provided to the actuator element based on any deviation of the operational parameter. | 11-26-2015 |
20150342023 | THERMAL CLAMP APPARATUS FOR ELECTRONIC SYSTEMS - An electronic device includes an outer case defining an internal volume, a circuit board positioned within the internal volume and having a first surface and a second surface, one or more active components mounted on the first surface of the circuit board, and a thermal management system to provide cooling for the active components. The thermal management system includes a first heat spreader in thermal contact with an active component, a second heat spreader in thermal contact with the second surface of the circuit board, thermal carriers coupled to the first and second heat spreaders to remove thermal energy therefrom, and a heat exchanger coupled to the thermal carriers to receive thermal energy therefrom and dissipate the thermal energy, wherein one thermal carrier is routed between the first heat spreader and the heat exchanger and the other thermal carrier is routed between the second heat spreader and the heat exchanger. | 11-26-2015 |
20150342088 | INTEGRATED COMPACT IMPINGEMENT ON EXTENDED HEAT SURFACE - A thermal management system that provides cooling to an electronic device is disclosed. The thermal management system includes a surface having a plurality of extended elements thermally coupled to the surface, a plurality of vibrator assemblies configured to generate a cooling flow across the surface, and a mounting structure disposed atop the plurality of extended elements of the surface to position the plurality of vibrator assemblies relative to the surface. The mounting structure is configured to orient each of the plurality of vibrator assemblies to the surface at an angel, such that the cooling flow generated by the plurality of vibrator assemblies impinges on the extended elements at an angle. | 11-26-2015 |
Gamal Refai-Ahmed, Niskayuna, NY US
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20150348952 | INTERCONNECT DEVICES FOR ELECTRONIC PACKAGING ASSEMBLIES - An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more support elements having a first surface and a second surface, and one or more spring elements having a first end and a second end, and wherein first ends of the one or more spring elements are coupled to the first surface or the second surface of a respective support element. | 12-03-2015 |