Gopalakrishnan
Gopalakrishnan Chandasekaran, Kancheepuram District IN
Patent application number | Description | Published |
---|---|---|
20110117387 | METHOD FOR PRODUCING METAL NANODOTS - A method for fabricating metal nanodots on a substrate is provided. The method includes: preparing a nanoporous polysulfone membrane; applying the nanoporous polysulfone membrane onto a substrate; depositing a metal into the pores of the polysulfone membrane thereby forming metal nanodots on the substrate; and removing the nanoporous polysulfone membrane. | 05-19-2011 |
Gopalakrishnan Kaliamurthi, Chennai IN
Patent application number | Description | Published |
---|---|---|
20150229701 | SENDING FILES WITH MULTIPLE JOB SESSIONS - A file transfer system and method for transferring large files to a destination quickly may include dividing up a large file into a plurality of components and transmitting the components simultaneously to the destination. A file can be separated into a plurality of segments and transmitted from a first module to a second module through a network simultaneously using multiple jobs corresponding to the segments. Once the second module receives the segments, the second module can implement a supply command to recreate the original saved file from the segments received from the first module. The simultaneous transmission of the segments may assist in transferring of the file at a faster rate. | 08-13-2015 |
Gopalakrishnan Rangarajulu, Bangalore IN
Patent application number | Description | Published |
---|---|---|
20150366084 | INTRINSIC SAFE IN-LINE ADAPTOR WITH INTEGRATED CAPACITIVE BARRIER FOR CONNECTING A WIRELESS MODULE WITH ANTENNA - An intrinsic safe in-line adaptor with an integrated capacitive barrier for connecting a wireless module with an antenna. The in-line adaptor (e.g., N-type to N-type) can be designed to include an intrinsic safe circuit and the integrated capacitive barrier. The intrinsic safe circuit further includes a multi-layer PCB and the PCB can be potted and sealed with a mechanical metal casing. The intrinsic safe capacitive barrier can be integrated with a coaxial connector and mounted as part of a flameproof enclosure to meet an explosion safety standard and an intrinsic safety requirement. The mechanical metal casing can be isolated by the enclosure (e.g., rubber) to meet isolation requirements. The wireless module can be directly connected with the antenna utilizing the in-line adaptor via the coaxial connector and without any specific cable assembly. | 12-17-2015 |
Gopalakrishnan Trichy Rengarajan, Villach AT
Patent application number | Description | Published |
---|---|---|
20140061935 | METHOD FOR MANUFACTURING A LAYER ARRANGEMENT, AND A LAYER ARRANGEMENT - A method for manufacturing a layer arrangement in accordance with various embodiments may include: providing a first layer having a side; forming one or more nanoholes in the first layer that are open towards the side of the first layer; depositing a second layer over the side of the first layer. | 03-06-2014 |
20140138813 | Method for Manufacturing an Electronic Component - A semiconductor wafer includes a first main face and a second main face opposite to the first main face and a number of semiconductor chip regions. The wafer is diced along dicing streets to separate the semiconductor chip regions from each other. At least one metal layer is formed on the first main face of each one of the semiconductor chip regions. | 05-22-2014 |
20140264764 | LAYER ARRANGEMENT - A layer arrangement in accordance with various embodiments may include: a first layer having a side; one or more nanoholes in the first layer that are open towards the side of the first layer; a second layer filling at least part of the nanoholes and covering at least part of the side of the first layer, the second layer including at least one of the following materials: a metal or metal alloy, a glass material, a polymer material, a ceramic material. | 09-18-2014 |