Patent application number | Description | Published |
20110084779 | BULK ACOUSTIC WAVE RESONATOR AND METHOD OF FABRICATING SAME - An acoustic resonator with improved quality factor and electro-mechanical coupling is disclosed. In one embodiment, the acoustic resonator includes an acoustic mirror formed on the top surface of a substrate or in the substrate, a first electrode having a end portion, formed on the acoustic mirror, a piezoelectric layer formed on the first electrode; and a second electrode formed on the piezoelectric layer, where at least one of the first electrode and the second electrode and the piezoelectric layer define an air gap in a region that overlaps the end portion of the first electrode. In one embodiment, a dielectric film is deposited on the surface of the end portion of the first electrode to form completely planarized surface before the piezoelectric layer deposition. In another embodiment, an air gap between the second electrode and the piezoelectric layer, so that the piezoelectric coupling in the end portion area of the first electrode is minimally contributed into the whole resonator. | 04-14-2011 |
20110148547 | PIEZOELECTRIC RESONATOR STRUCTURE - A piezoelectric resonator structure, comprising: (i) a substrate, (ii) an acoustic mirror, (iii) a first electrode, (iv) a piezoelectric layer, and (v) a second electrode, wherein each of the substrate, the acoustic mirror, the first electrode, the piezoelectric layer, and the second electrode has a top surface and a bottom surface, a first end portion and an opposite, second end portion, and a body portion defined therebetween, wherein the overlapped area of body portions of the substrate, the acoustic mirror, the first electrode, the piezoelectric layer and the second electrode is defined as an active area A. A plurality of air gaps and interference structures is formed at the first end portion of the piezoelectric layer and the second electrode, and the second end portion of the piezoelectric layer and the second electrode to enhance the performance of the piezoelectric resonator. | 06-23-2011 |
20110227671 | TEMPERATURE COMPENSATED THIN FILM ACOUSTIC WAVE RESONATOR - The present invention in one aspect relates to an acoustic wave resonator having an acoustic reflector, a piezoelectric layer, a composite structure having a first electrode, a temperature compensation layer formed on the first electrode, having one or more vias or trenches formed therein, and a second electrode formed on the temperature compensation layer and electrically connected to the first electrode at least through the one or more vias or trenches, and a third electrode, where the composite structure is disposed under the piezoelectric layer, on the piezoelectric layer, or inside the piezoelectric layer. | 09-22-2011 |
20110277286 | METHODS FOR WAFER LEVEL TRIMMING OF ACOUSTICALLY COUPLED RESONATOR FILTER - In one aspect of the present invention, a method of manufacturing an acoustically coupled device includes the steps of providing a substrate; forming a sacrificial layer in or on a selected portion of the substrate; forming a first resonator on the sacrificial layer such that the first resonator has an edge portion extending onto the substrate; trimming the first resonator to a targeted frequency value within a desired tolerance; forming an acoustic decoupler on the first resonator; forming a second resonator on the acoustic decoupler; removing the sacrificial layer to form an air cavity beneath the bottom surface of the first resonator; and trimming the second resonator to achieve a desired device performance. | 11-17-2011 |
20110304412 | Acoustic Wave Resonators and Methods of Manufacturing Same - In one aspect of the invention, the acoustic wave resonator includes a substrate defined an air cavity, a first passivation layer formed on the substrate and over the air cavity, a seed layer formed on the passivation layer, a bottom electrode formed on the seed layer, a piezoelectric layer formed on the bottom electrode, a top electrode formed on the piezoelectric layer, and a second passivation layer formed on the top electrode. | 12-15-2011 |
20120007696 | COUPLED ACOUSTIC DEVICES - In one aspect of the invention, an acoustic device has a first coupled resonator filter (CRF) and a second CRF electrically coupled to one another in series. Each CRF has an input port, an output port, a bottom film bulk acoustic resonator (FBAR), an acoustic decoupler formed on the bottom FBAR, and a top FBAR formed on the acoustic decoupler. Each FBAR has a bottom electrode, a piezoelectric layer formed on the bottom electrode, and a top electrode formed on the piezoelectric layer. The decoupling layer capacitance arising between the two electrodes enclosing the acoustic decoupler in a CRF is configured to achieve targeted filter response. A compensating capacitance is introduced to improve the amplitude and phase imbalance performance of an unbalanced to balanced CRF by eliminating the existence of asymmetric port-to-ground or feedback capacitance at the balanced output port produced by the decoupling layer capacitance. | 01-12-2012 |
20120056694 | COMPOSITE BULK ACOUSTIC WAVE RESONATOR - In one aspect of the invention, the acoustic wave resonator includes a resonator structure having a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer, and a composite layered structure associated with the resonator structure such that the immunity of the acoustic wave resonator to environmental change and aging effects is improved, the trimming sensitivity is substantially minimized, and/or dispersion characteristics of the acoustic wave resonator is optimized. | 03-08-2012 |
20120074811 | ACOUSTIC WAVE DEVICES - In one aspect of the invention, an acoustic wave device includes a substrate, and at least one acoustic wave resonator having a bottom electrode adjacent to the substrate, a top electrode, a piezoelectric layer sandwiched between the bottom and top electrodes, a passivation layer formed on the top electrode, and a mass load layer sandwiched between the substrate and the bottom electrode, or between the bottom electrode and the piezoelectric layer. | 03-29-2012 |
20120182090 | ACOUSTIC WAVE RESONATOR - In one aspect of the invention, an acoustic wave device includes a substrate, an acoustic isolator formed in or on the substrate, a bottom electrode formed on the acoustic isolator, a piezoelectric layer formed on the bottom electrode, a top electrode formed on the piezoelectric layer, and boundary means such as a gasket surrounding one of the first and second electrodes whose perimeter is aligned inside the perimeter of the acoustic isolator. The gasket has a lateral side having a wall profile, a curve profile, a multi-step profile, a gradually variable profile, or a combination of them. | 07-19-2012 |
20140132367 | COUPLED ACOUSTIC DEVICES - In one aspect of the invention, an acoustic device has a first coupled resonator filter (CRF) and a second CRF electrically coupled to one another in series. Each CRF has an input port, an output port, a bottom film bulk acoustic resonator (FBAR), an acoustic decoupler formed on the bottom FBAR, and a top FBAR formed on the acoustic decoupler. Each FBAR has a bottom electrode, a piezoelectric layer formed on the bottom electrode, and a top electrode formed on the piezoelectric layer. The decoupling layer capacitance arising between the two electrodes enclosing the acoustic decoupler in a CRF is configured to achieve targeted filter response. A compensating capacitance is introduced to improve the amplitude and phase imbalance performance of an unbalanced to balanced CRF by eliminating the existence of asymmetric port-to-ground or feedback capacitance at the balanced output port produced by the decoupling layer capacitance. | 05-15-2014 |
20140132987 | INFORMATION INPUT METHOD, APPARATUS AND SYSTEM FOR ASSOCIATED APPARATUS OF IMAGING DEVICE - An information input method, apparatus and system for an associated apparatus of an imaging device are provided. The system includes a chip and an information input apparatus; the chip is adapted to store universal information, and alternative information sent by the information input apparatus; the information input apparatus is adapted to store and send to the chip the alternative information. | 05-15-2014 |