Patent application number | Description | Published |
20110066792 | Segmentation Of Flash Memory For Partial Volatile Storage - This disclosure provides a method and system that segment flash memory to have differently managed regions. More particularly, flash memory is segmented into a “non-volatile” region, where program counts are restricted to preserve baseline retention assumptions, and a “volatile” region, where program counts are unrestricted. Contrary to conventional wisdom, wear leveling is not performed on all flash memory, as the volatile region is regarded as degraded, and as the non-volatile region has program counts restricted to promote long-term retention. More than two regions may also be created; each of these may be associated with intermediate program counts and volatility expectations, and wear leveling may be applied to each of these on an independent basis if desired. Refresh procedures may optionally be applied to the region of flash memory which is treated as volatile memory. | 03-17-2011 |
20110075466 | METHODS AND APPARATUS FOR USING A CONFIGURATION ARRAY SIMILAR TO AN ASSOCIATED DATA ARRAY - Methods, apparatus, and systems in accordance with this invention include memories that include a data array and a configuration array adapted to store configuration information for configuring the data array. The data array and the configuration array include a plurality of wordlines and a plurality of bitlines. The plurality of wordlines in the data array extend in the same direction as the plurality of wordlines in the configuration array. Likewise, the plurality of bitlines in the data array extend in the same direction as the plurality of bitlines in the configuration array. Numerous other aspects are disclosed. | 03-31-2011 |
20110228616 | Clock Generator Circuits with Non-Volatile Memory for Storing and/or Feedback-Controlling Phase and Frequency - A clock-signal generator (e.g. a PLL or a DLL) uses non-volatile memory to store an analog control voltage that determines an output phase and/or frequency of the clock-signal generator. Locked loops take time to lock on a given reference frequency. To keep this time to a minimum, NVM | 09-22-2011 |
20120030420 | PROTOCOL FOR REFRESH BETWEEN A MEMORY CONTROLLER AND A MEMORY DEVICE - The present embodiments provide a system that supports self-refreshing operations in a memory device. During operation, the system transitions the memory device from an auto-refresh state, wherein a memory controller controls refreshing operations for the memory device, to a self-refresh state, wherein the memory device controls the refreshing operations. While the memory device is in the self-refresh state, the system sends progress information for the refreshing operations from the memory device to the memory controller. Next, upon returning from the self-refresh state to the auto-refresh state, the system uses the progress information received from the memory device to control the sequencing of subsequent operations by the memory controller. | 02-02-2012 |
20120314484 | Multilevel DRAM - A multi-level dynamic random-access memory (MLDRAM) represents an original bit combination of more than one bit using a cell voltage stored in a single memory cell. The cell voltage is in one of a number of discrete analog voltage ranges each corresponding to a respective one of the possible values of the bit combination. In reading a selected memory cell, stored charge is conveyed via a local bitline to a preamplifier. The preamplifier amplifies the signal on the local bitline and drives a global bitline with an analog signal representative of the stored voltage. A digitizer converts the analog signal on the global bitline into a read bit combination. The read bit combination is then moved to a data cache over the global bitline. The data cache writes an analog voltage back to the memory cell to write a new value or restore data destroyed in reading the cell. | 12-13-2012 |
20130114353 | MEMORY METHODS AND SYSTEMS WITH ADIABATIC SWITCHING - A memory system includes wordlines and pairs of complementary bitlines that provide access to memory storage elements. Capacitive and resistive loads associated with wordlines and bitlines are driven relatively slowly between voltage levels to reduce peak current, and thus power dissipation. Power dissipation is further reduced by charging complementary bitlines at substantially different rates. | 05-09-2013 |
20130132685 | MEMORY CONTROLLER AND MEMORY DEVICE COMMAND PROTOCOL - Embodiments generally relate to a command protocol and/or related circuits and apparatus for communication between a memory device and a memory controller. In one embodiment, the memory controller includes an interface for transmitting commands to the memory device, wherein the memory device includes bitline multiplexers, and accessing of memory cells within the memory device is carried out by a command protocol sequence that includes a wordline selection, followed by bitline selections by the bitline multiplexers. In another embodiment, a memory device includes bitline multiplexers and further includes an interface for receiving a command protocol sequence that specifies a wordline selection followed by bitline selections by the bitline multiplexers. | 05-23-2013 |
20130215669 | RESISTANCE CHANGE MEMORY CELL CIRCUITS AND METHODS - The gate of the access transistor of a 1 transistor 1 resistor (1T1R) type RRAM cell is biased relative to the source of the access transistor using a current mirror. Under the influence of a voltage applied across the 1T1R cell (e.g., via the bit line), the RRAM memory element switches from a higher resistance to a lower resistance. As the RRAM memory element switches from the higher resistance to the lower resistance, the current through the RRAM cell switches from being substantially determined by the higher resistance of the RRAM device (while the access transistor is operating in the linear region) to being substantially determined by the saturation region operating point of the access transistor. | 08-22-2013 |
20140006691 | Memory Pre-Characterization | 01-02-2014 |
20140016423 | Reducing Memory Refresh Exit Time - Components of a memory system, such as a memory controller and a memory device, that reduce delay in exiting self-refresh mode by controlling the refresh timing of the memory device. The memory device includes a memory core. An interface circuit of the memory device receives an external refresh signal indicating an intermittent refresh event. A refresh circuit of the memory device generates an internal refresh signal indicating an internal refresh event of the memory device. A refresh control circuit of the memory device performs a refresh operation on a portion of the memory core responsive to the internal refresh event, at a time relative to the intermittent refresh event indicated by the external refresh signal. | 01-16-2014 |
20140164823 | Memory Disturbance Recovery Mechanism - Components of a memory system, such as a memory controller and memory device, which detect accumulated memory read disturbances and correct such disturbances before they reach a level that causes errors. The memory device includes a memory array and a disturbance control circuit. The memory array includes a plurality of memory rows. Each memory row is associated with a disturbance warning circuit having a state that corresponds to an accumulated disturbance in the memory row. The disturbance control circuit determines, responsive to an activation of a memory row of the plurality of memory rows specified by a row access command, whether the disturbance condition is present in the memory row based on the state of the disturbance warning circuit associated with the memory row. If a disturbance condition is present, the disturbance control circuit causes a recovery operation to be performed on the memory row to reduce the accumulated disturbances. | 06-12-2014 |
20140351673 | DRAM METHOD, COMPONENTS, AND SYSTEM CONFIGURATIONS FOR ERROR MANAGEMENT - A memory device is disclosed that includes a row of storage locations to store a data word, and a spare row element. The data word is encoded via an error code for generating error information for correcting X bit errors or detecting Y bit errors, where Y is greater than X. The spare row element has substitute storage locations. The logic is responsive to detected errors to (1) enable correction of a data word based on the error information where there are no more than X bit errors, and (2) substitute the spare row element for a portion of the row where there are at least Y bit errors in the data word. | 11-27-2014 |
20140376304 | RESISTANCE CHANGE MEMORY CELL CIRCUITS AND METHODS - The gate of the access transistor of a 1 transistor 1 resistor (1T1R) type RRAM cell is biased relative to the source of the access transistor using a current mirror. Under the influence of a voltage applied across the 1T1R cell (e.g., via the bit line), the RRAM memory element switches from a higher resistance to a lower resistance. As the RRAM memory element switches from the higher resistance to the lower resistance, the current through the RRAM cell switches from being substantially determined by the higher resistance of the RRAM device (while the access transistor is operating in the linear region) to being substantially determined by the saturation region operating point of the access transistor. | 12-25-2014 |
20150085595 | Protocol For Refresh Between A Memory Controller And A Memory Device - The present embodiments provide a system that supports self-refreshing operations in a memory device. During operation, the system transitions the memory device from an auto-refresh state, wherein a memory controller controls refreshing operations for the memory device, to a self-refresh state, wherein the memory device controls the refreshing operations. While the memory device is in the self-refresh state, the system sends progress information for the refreshing operations from the memory device to the memory controller. Next, upon returning from the self-refresh state to the auto-refresh state, the system uses the progress information received from the memory device to control the sequencing of subsequent operations by the memory controller. | 03-26-2015 |
Patent application number | Description | Published |
20100025811 | INTEGRATED CIRCUIT WITH BUILT-IN HEATING CIRCUITRY TO REVERSE OPERATIONAL DEGENERATION - An integrated circuit device ( | 02-04-2010 |
20110060868 | MULTI-BANK FLASH MEMORY ARCHITECTURE WITH ASSIGNABLE RESOURCES - This disclosure has described embodiments of a nonvolatile memory that includes at least two concurrently accessible memory banks ( | 03-10-2011 |
20110060875 | FRACTIONAL PROGRAM COMMANDS FOR MEMORY DEVICES - A memory system ( | 03-10-2011 |
20110299317 | INTEGRATED CIRCUIT HEATING TO EFFECT IN-SITU ANNEALING - In a system having a memory device, an event is detected during system operation. The memory device is heated to reverse use-incurred degradation of the memory device in response to detecting the event. In another system, the memory device is heated to reverse use-incurred degradation concurrently with execution of a data access operation within another memory device of the system. In another system having a memory controller coupled to first and second memory devices, data is evacuated from the first memory device to the second memory device in response to determining that a maintenance operation is needed within the first memory device. | 12-08-2011 |
20130138882 | VERIFY BEFORE PROGRAM RESUME FOR MEMORY DEVICES - A method of programming data into a memory device including an array of memory cells is disclosed. The method comprises receiving at least one program command that addresses a number of the memory cells for a programming operation to program data in the memory cells. The at least one program command is executed by iteratively carrying out at least one program/verify cycle to incrementally program the addressed memory cells with the program data. A secondary command may be selectively received after initiating but before completing the programming operation. The programming operation may be selectively resumed by first verifying the memory cells, then carrying out at least one program/verify cycle. | 05-30-2013 |
20130148437 | THERMAL ANNEAL USING WORD-LINE HEATING ELEMENT - In response to detecting an event during operation of an integrated-circuit memory device containing charge-storing memory cells, an electric current is enabled to flow through a word line coupled to the charge-storing memory cells for a brief interval to heat the charge-storing memory cells to an annealing temperature range. | 06-13-2013 |
20140254286 | THERMAL ANNEAL USING WORD-LINE HEATING ELEMENT - In response to detecting an event during operation of an integrated-circuit memory device containing charge-storing memory cells, an electric current is enabled to flow through a word line coupled to the charge-storing memory cells for a brief interval to heat the charge-storing memory cells to an annealing temperature range. | 09-11-2014 |
Patent application number | Description | Published |
20110208905 | Non-Volatile Memory Device For Concurrent And Pipelined Memory Operations - This disclosure provides a non-volatile memory device that concurrently processes multiple page reads, erases or writes involving the same memory space. The device relies upon a crossbar and a set of page buffers that may each be dynamically assigned to each read or write request. The device also separates memory array control from IO control, such that multiple cycle state change operations can be performed while the buffers are used to transfer data into and out of the buffers along an external data bus; using this structure, the memory device can accept multiple transactions where pages can be immediately loaded into buffers and then “pipelined” either for transfer to a write data register or to an external bus as appropriate. By significantly mitigating the substantial “busy time” associated with program and erase of non-volatile memory devices, especially flash devices, this disclosure greatly expands potential application of such devices. | 08-25-2011 |
20110286267 | Pattern-Sensitive Coding of Data for Storage in Multi-Level Memory Cells - A method of operating a memory device includes receiving first and second sets of bits to be stored in multi-level cells in the device. A multi-level encoding is selected from among a plurality of multi-level encodings for storing the first and second sets of bits in the multi-level cells. Each multi-level encoding includes at least four encoding levels for a respective multi-level cell. Respective multi-level encodings have respective costs associated with programming the first and second sets of bits into the multi-level cells in accordance with the respective multi-level encodings. The multi-level encoding is selected based on the respective costs of the respective encodings. The first and second sets of bits are encoded in accordance with the selected multi-level encoding to produce encoded data for storage in the device such that a respective multi-level cell stores respective bits from both the first and second sets of bits. | 11-24-2011 |
20110286280 | Pulse Control For NonVolatile Memory - This disclosure provides a nonvolatile memory device that uses pulsed control and rest periods to mitigate the formation of defect precursors. A first embodiment uses pulsed bitline control, where the coupling between a memory cell channel and a reference voltage (selected in response to the bitline) is pulsed when it is desired to change state in the associated memory cell. Each pulse may be chosen to be less than about (20) nanoseconds, while a “rest period” between pulses typically is chosen to be on the order of about a hundred nanoseconds or greater (e.g., one microsecond). Because bitline control is used, very short rise times can be enabled, enabling generation of pulse durations of (50) nanoseconds or less. In other embodiments, these methods may also be more generally applied to other conductors (e.g., wordline or substrate well, for program or erase operations); if desired, segmented wordlines or bitlines may also be used, to minimize RC loading and enable sufficiently short rise times to make pulses robust. | 11-24-2011 |
20120020161 | Multiple Plane, Non-Volatile Memory With Synchronized Control - This disclosure provides a multiple-plane flash memory device where high voltage programming (setting) or erasing (resetting) pulses are timed to occur simultaneously. By regulating when each memory plane (e.g., each logical or physical partition of memory having its own dedicated array control and page buffer) applies high voltage pulses, the overhead circuitry needed to control multiple concurrent operations may be reduced, thereby conserving valuable die space. Both the “program phase” and the “verify phase” of each state change operation cycle may be orchestrated across all planes at once, with shared timing and high voltage distribution. | 01-26-2012 |
20120314520 | Memory Architecture With Redundant Resources - A hierarchical memory architecture includes an array of memory sub-arrays, each of which includes an array of memory cells. Each sub-array is supported by local wordlines, local column-select lines, and bitlines. The local wordlines are controlled using main wordlines that extend past multiple sub-arrays in a direction parallel to a first axis, whereas the local column-select lines are controlled using main column-select lines that extend between sub-arrays in a direction perpendicular to the first axis. At the direction of signals presented on the local wordlines and column-select lines, subsets of the bitlines in each sub-array are connected to main data lines that extend over a plurality of the sub-arrays in parallel with the second axis. Some embodiments include redundant data resources that are selected based on a decoding of row addresses. | 12-13-2012 |
20130235649 | DIRECT RELATIVE MEASUREMENT OF MEMORY DURABILITY - Disclosed is a memory including a plurality of resistive change memory cells, including at least a first group and a second group of the memory cells and a comparison circuit configured to conduct a direct relative comparison of a remaining endurance of the first group of memory cells to a remaining endurance of the second group of memory cells. | 09-12-2013 |
20130242640 | Methods and Systems for Resistive Change Memory Cell Restoration - A resistive change memory device includes a first conductive line, a second conductive line, and a resistive change memory cell that includes a resistive memory element coupled between the first conductive line and the second conductive line. The resistive change memory device also includes control circuitry to apply, via the first conductive line and the second conductive line, a first biasing condition to the resistive change memory cell for a reset operation and a second biasing condition to the resistive change memory cell for a restore operation. The restore operation is performed to counteract a decrease in resistance of the resistive memory element for a reset state of the resistive change memory cell. At least one of a voltage, current, and duration of the second biasing condition is greater than a corresponding voltage, current, or duration of the first biasing condition. | 09-19-2013 |
20130250657 | System and Method for Writing Data to an RRAM Cell - A resistive RAM device includes a bit line, a word line, an RRAM cell coupled to the word line and to the bit line, a write driver and a disable circuit. The write driver is coupled to the bit line. The disable circuit stops a write operation performed by the write driver on a respective RRAM cell when a predefined condition on the bit line is achieved. The predefined condition depends on a mode of operation of the RRAM cell. | 09-26-2013 |
20140115296 | Remapping Memory Cells Based on Future Endurance Measurements - A method of operating a memory device that includes groups of memory cells is presented. The groups include a first group of memory cells. Each one of the groups has a respective physical address and is initially associated with a respective logical address. The device also includes an additional group of memory cells that has a physical address but is not initially associated with a logical address. In the method, a difference in the future endurance between the first group of memory cells and the additional group of memory cells is identified. When the difference in the future endurance between the first group and the additional group exceeds a predetermined threshold difference, the association between the first group and the logical address initially associated with the first group is ended and the additional group is associated with the logical address that was initially associated with the first group. | 04-24-2014 |
20140153310 | CONTENT ADDRESSABLE MEMORY - A content addressable memory can include an array of memory cells having multiple memory elements, such as RRAM elements, to store data based on a plurality resistive states. A common switching device, such as a transistor, can electrically couple a plurality of the multiple memory elements with a matchline during read, write, erase, and search operations. In search operations, the memory cells can receive a search word and selectively discharge a voltage level on the matchline based on the data stored by the memory elements and the search word provided to the memory elements. The voltage level of the matchline can indicate whether the search word matched the data stored in the memory cells. The content addressable memory can potentially have an effective memory cell sizing under 0.5F | 06-05-2014 |
20140185362 | SYSTEM AND METHOD FOR PERFORMING MEMORY OPERATIONS ON RRAM CELLS - A resistive RAM (RRAM) device has a bit line, a word line, a source line carrying a bias voltage that is a substantially static and non-negative voltage, an RRAM cell, and a bit line control coupled to the bit line circuit. The RRAM cell includes a gate node coupled to the word line, a bias node coupled to the source line, and a bit line node coupled to the bit line. The bit line control circuit is configured to generate non-negative command voltages to perform respective memory operations on the RRAM cell. | 07-03-2014 |
20140247656 | Pulse Control For NonVolatile Memory - A nonvolatile memory device that uses pulsed control and rest periods to mitigate the formation of defect precursors. A first embodiment uses pulsed bitline control, where the coupling between a memory cell channel and a reference voltage is pulsed when it is desired to change state in the associated memory cell. Each pulse may be chosen to be less than about 20 nanoseconds, while a “rest period” between pulses can be on the order of about a hundred nanoseconds or greater. Because bitline control is used, very short rise times can be enabled, enabling generation of pulse durations of 50 nanoseconds or less. In other embodiments, these methods may also be more generally applied to other conductors (e.g., wordline or substrate well, for program or erase operations); segmented wordlines or bitlines may also be used, to minimize RC loading and enable sufficiently short rise times to make pulses robust. | 09-04-2014 |