Patent application number | Description | Published |
20140238719 | HIGH VOLTAGE WIRE HARNESS FOR USE IN AUTOMOBILE - A high voltage wire harness for use in an automobile includes one or a plurality of high voltage conductive paths, a metallic tubular body and a high voltage recognition component. The high voltage conductive paths are routed in an automobile. The metallic tubular body is adapted to serve as an exterior cladding member for the high voltage conductive paths. The high voltage recognition component is capable of letting a worker recognize that the wire harness includes a high voltage is retrofitted to an exterior surface side of the metallic tubular body. | 08-28-2014 |
20140332266 | PROTECTOR AND WIRE HARNESS - A protector comprises a terminal engagement section to be engaged with a terminal of a tubular body into which one or a plurality of electrically conductive paths are to be inserted, wherein an electrically conductive path pullout hole is formed in the terminal engagement section as an area by which the one or the plurality of electrically conductive paths are pulled out; and the terminal engagement section further includes an electrically conductive path fixing portion that extends from an opening edge of the electrically conductive path pullout hole in a direction in which the one or the plurality of electrically conductive paths are pulled out, and a tubular body fixing portion that extends along an exterior surface of the tubular body. | 11-13-2014 |
20140338971 | WIRE HARNESS - A wire harness comprises one or a plurality of electrically conductive paths, a tubular body into which the one or plurality of electrically conductive paths are to be inserted, and a protector to be engaged with a terminal of the tubular body, wherein the protector has a terminal engagement section to be engaged with the terminal of the tubular body, and a roll prevention portion which serves as an area that is mounted on a predetermined mounting surface without rolling, is formed in the terminal engagement section. | 11-20-2014 |
20140346290 | SLIDING TYPE CLAMP AND CLAMP UNIT - A sliding type clamp includes a clamp fixing part adapted to be fixed to a stud bolt, and a clamp body adapted to clamp an objected member. The clamp fixing part and the clamp body are integrally formed. The clamp fixing part has a first sliding structure which slides along a direction perpendicular to an axis of the stud bolt. The clamp body has a second sliding structure which slides with respect to the objected member along a longitudinal direction of the objected member. | 11-27-2014 |
20150083462 | Structure for Mounting Retrofit Part to Cladding Member - To provide a structure for mounting a retrofit part to a cladding member that can prevent the retrofit part from causing a turn or positional displacement. A clamp includes a clamp base and a clamp cover continuous to the clamp base by a hinge. The clamp has spike-shaped portions. The spike-shaped portions are formed and placed on both a mount surface of the clamp base and a mount surface of the clamp cover. The spike-shaped portions are an area that prevents the clamp from causing a turn or positional displacement, and each protrusively formed substantially into a pyramid shape with a pointed end. The spike-shaped portions are formed as an area that bites into an exterior surface of a cladding member and that resists external force, such as vibrations, when the clamp is mounted. | 03-26-2015 |
Patent application number | Description | Published |
20150041210 | WIRE HARNESS - A wire harness includes one or more electrically-conducting paths, and a tubular exterior member configured to cover the electrically-conducting paths. The exterior member is a resin member including a flexible tubular part having flexibility and a less-flexible tubular part having less flexibility than that of the flexible tubular part. The exterior member is integrally formed to have a linear shape as a whole in a state where the flexible tubular part is not deflected. | 02-12-2015 |
20150107895 | WIRE HARNESS EXTERIOR MEMBER AND WIRE HARNESS - Tubes are connected to each other by a tube connecting part such that a distance between respective ends of the tubes is an optional distance or such that the ends of the tubes abut each other. | 04-23-2015 |
20150114680 | WIRE HARNESS EXTERIOR MEMBER AND WIRE HARNESS - A wire harness exterior member includes a flexible tube portion, an inflexible tube portion, and a post-attached part attached to a boundary between the flexible tube portion and the inflexible tube portion. The post-attached part is attached such that at least a portion of an attaching surface of a rigid attaching portion overlaps the flexible tube portion. | 04-30-2015 |
20150136481 | WIRE HARNESS EXTERIOR MEMBER AND WIRE HARNESS - An exterior member has a straight tube body to be arranged at a vehicle underfloor portion of a vehicle and at least one rigidity adding portion to add rigidity to the straight tube body. | 05-21-2015 |
20150136482 | WIRE-HARNESS PACKAGING MEMBER AND WIRE HARNESS - A wire-harness packaging member covering a conductive path includes a setting portion which is provided on an outer surface of the wire-harness packaging member so as to set an attachment position of a post-fitted part attached to the wire-harness packaging member. The wire-harness packaging member is a tube body which is made of resin and with which an attachment portion is formed integrally as the setting portion when the tube body is molded out of the resin. The wire-harness packaging member is formed into a substantially linear shape as a whole, including a bendable tube portion formed as a portion which can be bent and a non-bendable tube portion formed as a portion which is hardly bent, and the attachment portion is formed in the non-bendable tube portion. | 05-21-2015 |
20150136483 | WIRE HARNESS EXTERIOR MEMBER AND WIRE HARNESS - A wire harness exterior member has a plurality of specified sections set along a tubular body longitudinal direction of a body portion, and the body portion has, for each specified section, a resin characterized portion molded using a resin material having characteristics adapted to the corresponding specified section. | 05-21-2015 |
20150136484 | WIRE HARNESS COMBINATION STRUCTURE - Each of wire harnesses includes a conductive path, an exterior member which covers the conductive path, a base portion which is retrofitted to or integrally formed with the exterior member, and a combination structure portion which is integrally formed with the base portion. The combination structure portion includes a combining engagement portion and a combined engagement portion. The combining engagement portion of the combination structure portion in one of the wire harnesses is detachably engaged with the combined engagement portion of the combination structure portion in the other wire harness, or the combined engagement portion of the combination structure portion in the one of the wire harnesses is detachably engaged with the combining engagement portion of the combination structure portion in the other wire harness, so that the wire harnesses are combined with each other. | 05-21-2015 |
20150151693 | CLAMP STRUCTURE OF HARNESS PROTECTION TUBE - A harness pressing part ( | 06-04-2015 |
20150175095 | CONCENTRIC CORE WIRE INSULATING STRUCTURE AND INSULATING METHOD - A concentric core wire insulating structure includes a concentric core wire, and an insulative member that covers the concentric core wire. The concentric core wire has a central conductor which is exposed at one end of the concentric core wire, and a bundled outer conductor which is exposed at the end. The insulative member integrally covers the outer conductor, an outside insulative sheath of the central conductor, and an outside insulative sheath of the outer conductor. The outer conductor passes through a branch pipe part of the insulative member. | 06-25-2015 |
20150175097 | EXTERIOR MEMBER AND ELECTRIC WIRE WIRING STRUCTURE - An exterior member which covers the circumference of an electric wire, which is wired between electrical components, along the electric wire, and is supported by a supporting body while one side in a circumferential direction is exposed, includes an exterior member body that is formed into a long cylindrical shape and which has a predetermined background color, and an identifying mark that is provided on the outer surface of the exterior member body and which has another predetermined color different from the background color. The exterior member body is formed with at least one bent part which is bent at a middle position in a longitudinal direction, and the identifying mark is provided to face the one side while the exterior member is supported by the supporting body. | 06-25-2015 |
20150175098 | WIRE HARNESS - A wire harness has at least one electrically conducting path and an exterior member accommodating the electrically conducting path to protect the electrically conducting path. The exterior member has a heat reflecting portion provided at at least a portion of an outer surface of the exterior member to reflect external heat. | 06-25-2015 |
20150179300 | WIRE HARNESS - A wire harness includes at least one conducting path, and a tubular exterior member that covers the conducting path. The exterior member has a shape changed portion in at least one position. The shape changed portion includes at least one small tube portion which includes an accommodation space necessary for accommodating the conducting path, a tube continuous portion one end of which is continuous with an end of the small tube portion, and a large tube portion which is continuous with another end of the tube continuous portion and includes a tubular shape that is larger in outer shape than the small tube portion. | 06-25-2015 |
20150179308 | EXTERIOR MEMBER AND ELECTRIC WIRE ARRANGEMENT STRUCTURE - An exterior member has an exterior member body having a base color, and an identification mark having an identification color different from the base color. The identification mark includes at least one of a plurality of line marks provided parallel to each other, and a line mark provided continuously and spirally. | 06-25-2015 |
20150179312 | EXTERIOR MEMBER MANUFACTURING METHOD - A method of manufacturing an exterior member which covers the circumference of an electric wire, which is wired between electrical components, along the electric wire, and is supported by a supporting body while one side in a circumferential direction is exposed, the exterior member including an exterior member body that is formed into a long cylindrical shape and which has a predetermined background color and an identifying mark that is provided on the outer surface of the exterior member body and which has another predetermined color different from the background color, includes providing the identifying mark on the outer surface of the exterior member body having a straight shape and bending the exterior member body at a middle position in the longitudinal direction after the providing the identifying mark. | 06-25-2015 |
20150187469 | METHOD FOR PRODUCING WIRE HARNESS - Disclosed is a method for producing a wire harness including a core inserting step of forming a widely open braided mesh portion by widening a braided mesh of a braid before crimping is performed, and of inserting a core into an end from the outside of the braid via the widely open braided mesh portion. | 07-02-2015 |
Patent application number | Description | Published |
20110110016 | THIN-FILM CAPACITOR - A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part. | 05-12-2011 |
20130088811 | Thin-Film Capacitor - A thin-film capacitor and a method for making the thin-film capacitor having a structure that can prevent vertical stress acting on outer connecting terminals, such as bumps, from concentrating on electrode layers, and capable of easily increasing the equivalent series resistance to a desired value. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. The lead conductor includes a connecting part disposed in an opening in the protective layer and electrically connected to one of the electrode layers of the capacitor unit, and a wiring part extending over the protective layer. The bump is disposed above the wiring part. | 04-11-2013 |
Patent application number | Description | Published |
20090311631 | NEAR-FIELD EXPOSURE APPARATUS AND NEAR-FIELD EXPOSURE METHOD - A near-field exposure apparatus includes a near-field exposure mask, a mechanism to place a substrate to be exposed, opposed to the near-field exposure mask, a mechanism to perform relative alignment of the near-field exposure mask and the substrate to be exposed, a mechanism to closely contact the near-field exposure mask and the substrate to be exposed, with each other, a mechanism to project exposure light to the near-field exposure mask, and a soft X-ray irradiating device to remove static electricity charged in at least one of the near-field exposure mask and the substrate to be exposed. The soft X-ray irradiating device is disposed at a side of the near-field exposure mask remote from the substrate to be exposed. | 12-17-2009 |
20100029027 | SURFACE EMITTING LASER MANUFACTURING METHOD, SURFACE EMITTING LASER ARRAY MANUFACTURING METHOD, SURFACE EMITTING LASER, SURFACE EMITTING LASER ARRAY, AND OPTICAL APPARATUS INCLUDING SURFACE EMITTING LASER ARRAY - Provided is a surface emitting laser manufacturing method, etc., which reduces process damage occurring to a surface relief structure, enabling stable provision of a single transverse mode characteristic. Provided is a method including a surface relief structure for controlling a reflectance in a light emitting portion of an upper mirror, the surface relief structure including a stepped structure, includes: forming a resist pattern including a pattern for forming a mesa structure and a pattern for forming a stepped structure, on or above the upper mirror, and performing first-phase etching for etching the surface layer of the upper mirror to determine the horizontal position of the stepped structure; forming a current confining structure after the performing first-phase etching; and performing second-phase etching for further etching the area that the first-phase etching has been performed, to determine the depth position of the stepped structure, after the forming a current confining structure. | 02-04-2010 |
20100220377 | OPTICAL FILTER - An optical filter that transmits light of the visible light region includes a dielectric substrate; a dielectric layer that is formed on a surface of the dielectric substrate; and a first metal structure group in which a plurality of first metal structures are arranged two-dimensionally in an isolated state in the in-plane direction of the dielectric substrate, that is provided between the dielectric substrate and the dielectric layer, comprising: the first metal structures having first and second lengths in first and second directions orthogonal to each other, which lengths are equal to or less than a first wavelength in the visible light region; and a transmittance of the first wavelength being reduced or a reflectance being increased by surface plasmons induced on a surface of the first metal structures by resonance between light incident on the dielectric substrate or the dielectric layer and the first metal structures. | 09-02-2010 |
20110076058 | SURFACE EMITTING LASER MANUFACTURING METHOD, SURFACE EMITTING LASER ARRAY MANUFACTURING METHOD, SURFACE EMITTING LASER, SURFACE EMITTING LASER ARRAY, AND OPTICAL APPARATUS INCLUDING SURFACE EMITTING LASER ARRAY - Provided is a surface emitting laser manufacturing method, etc., which reduces process damage occurring to a surface relief structure, enabling stable provision of a single transverse mode characteristic. Provided is a method including a surface relief structure for controlling a reflectance in a light emitting portion of an upper mirror, the surface relief structure including a stepped structure, includes: forming a resist pattern including a pattern for forming a mesa structure and a pattern for forming a stepped structure, on or above the upper mirror, and performing first-phase etching for etching the surface layer of the upper mirror to determine the horizontal position of the stepped structure; forming a current confining structure after the performing first-phase etching; and performing second-phase etching for further etching the area that the first-phase etching has been performed, to determine the depth position of the stepped structure, after the forming a current confining structure. | 03-31-2011 |
20110293331 | SURFACE-EMITTING LASER AND IMAGE FORMING APPARATUS USING THE SAME - This invention provides a surface-emitting laser that can prevent delamination at the interface of a selective oxidation layer and a spacer layer, while suppressing any rise of voltage, to improve the reliability of operation. | 12-01-2011 |
20120075688 | OPTICAL FILTER - An optical filter that transmits light of the visible light region includes a dielectric substrate; a dielectric layer that is formed on a surface of the dielectric substrate; and a first metal structure group in which a plurality of first metal structures are arranged two-dimensionally in an isolated state in the in-plane direction of the dielectric substrate, that is provided between the dielectric substrate and the dielectric layer, comprising: the first metal structures having first and second lengths in first and second directions orthogonal to each other, which lengths are equal to or less than a first wavelength in the visible light region; and a transmittance of the first wavelength being reduced or a reflectance being increased by surface plasmons induced on a surface of the first metal structures by resonance between light incident on the dielectric substrate or the dielectric layer and the first metal structures. | 03-29-2012 |
20120114005 | SURFACE-EMITTING LASER AND SURFACE-EMITTING LASER ARRAY, METHOD OF MANUFACTURING A SURFACE-EMITTING LASER AND METHOD OF MANUFACTURING A SURFACE-EMITTING LASER ARRAY, AND OPTICAL APPARATUS INCLUDING A SURFACE-EMITTING LASER ARRAY - Provided is a method of manufacturing a surface-emitting laser capable of preventing characteristics fluctuations within the plane and among wafers and oscillating in a single fundamental transverse mode. The method includes after performing selective oxidation: exposing a bottom face of a surface relief structure by etching a second semiconductor layer with a first semiconductor layer where a pattern of the surface relief structure has been formed as an etching mask and a third semiconductor layer as an etching stop layer; and exposing a top face of the surface relief structure by etching the first semiconductor layer where the pattern of the surface relief structure has been formed, with the second semiconductor layer and the third semiconductor layer as etching stop layer. | 05-10-2012 |
20120327422 | SEMICONDUCTOR OPTICAL INTEGRATED DEVICE AND OPTICAL COHERENCE TOMOGRAPHIC IMAGING APPARATUS PROVIDED WITH THE SEMICONDUCTOR OPTICAL INTEGRATED DEVICE - Provided is a semiconductor optical integrated device, formed by arranging a light emitting element and a light detecting element in a plane of the same substrate, each formed by laminating layers which at least include a first clad layer of a first conductive type, an active layer and a second clad layer of a second conductive type on a substrate, wherein the active layer has a structure where a second active area of a conductive type and an undoped first active area are laminated, and the second active area has the same conductive type as that of the first or second clad layer laminated in the closest position to the second active area. This device suppresses heat generation due to increased operating current and unnecessary light generation at an operation of the light emitting element, and enhancing light absorption efficiency at the an operation of the light emitting element. | 12-27-2012 |
20130044780 | SURFACE-EMITTING LASER AND SURFACE-EMITTING LASER ARRAY, METHOD OF MANUFACTURING A SURFACE-EMITTING LASER AND METHOD OF MANUFACTURING A SURFACE-EMITTING LASER ARRAY, AND OPTICAL APPARATUS INCLUDING A SURFACE-EMITTING LASER ARRAY - Provided is a method of manufacturing a surface-emitting laser capable of preventing characteristics fluctuations within the plane and among wafers and oscillating in a single fundamental transverse mode. The method includes after performing selective oxidation: exposing a bottom face of a surface relief structure by etching a second semiconductor layer with a first semiconductor layer where a pattern of the surface relief structure has been formed as an etching mask and a third semiconductor layer as an etching stop layer; and exposing a top face of the surface relief structure by etching the first semiconductor layer where the pattern of the surface relief structure has been formed, with the second semiconductor layer and the third semiconductor layer as etching stop layer. | 02-21-2013 |
20130195135 | SURFACE EMITTING LASER - A surface emitting laser having a mesa structure includes an off-orientation substrate, a bottom reflection mirror, an active layer, a current confinement layer, a top reflection mirror, and a surface-relief structure. The central axis of a high-reflectivity region of the surface-relief structure and the central axis of the mesa structure do not coincide with each other. | 08-01-2013 |
20140055790 | VARIABLE WAVELENGTH SURFACE EMITTING LASER - A surface emitting laser includes a first laser, and a second laser, wherein each of the first laser and the second laser includes a light resonant cavity including a pair of reflecting mirrors, and a semiconductor layer configured to emit light and arranged inside the light resonant cavity, an oscillation wavelength of light varied by displacing a location of the reflecting mirror in a thickness direction of the semiconductor layer, the semiconductor layer is shared by the first laser and the second laser, the first laser has a resonant cavity length for oscillating with (n+1)th order (n is an integer of 1 or more) of a longitudinal mode, the second laser has a resonant cavity length for oscillating with nth order of a longitudinal mode, and respective wavelength bands of light oscillated by the first laser the second laser are different. | 02-27-2014 |
Patent application number | Description | Published |
20130017392 | ADHESIVE SHEETAANM Inao; YouichiAACI TokyoAACO JPAAGP Inao; Youichi Tokyo JPAANM Kashio; MikihiroAACI TokyoAACO JPAAGP Kashio; Mikihiro Tokyo JP - According to the present invention, there can be obtained a pressure sensitive adhesive sheet having an adhesive layer which even when the thickness is reduced to 5 μm or less, exhibits a desired adhesive strength. The pressure sensitive adhesive sheet includes a base material having an adhesive layer provided on at least one surface thereof, wherein a pressure sensitive adhesive constituting the adhesive layer contains (A) an acrylic copolymer having a crosslinkable functional group and (B) a urethane resin, the urethane resin is a product obtained by allowing an isocyanate-terminated urethane prepolymer obtained by a reaction between [b1] a diol and [b2] a polyvalent isocyanate compound to react with [b3] a chain extender, and the chain extender is composed of [b4] a compound having two hydroxyl groups and/or amino groups and [b5] a compound having three or more hydroxyl groups and/or amino groups, in a proportion of [b4] to [b5] of from 7/3 to 10/0 in terms of a mass ratio. | 01-17-2013 |
20140017467 | PRESSURE SENSITIVE ADHESIVE SHEET - The present invention relates to a pressure sensitive adhesive sheet including a pressure sensitive adhesive layer on at least one surface of a base material, wherein the pressure sensitive adhesive layer is made of a two-layer structure of a first pressure sensitive adhesive layer and a second pressure sensitive adhesive layer in this order from the side of the base material; a first pressure sensitive adhesive constituting the first pressure sensitive adhesive layer has a loss tangent (tan δ) value at 0° C. of 0.25 or more and a storage elastic modulus value at 0° C. of from 0.01 to 0.80 MPa; and a resin component contained in a second pressure sensitive adhesive constituting the second pressure sensitive adhesive layer contains from 10 to 100 t by mass of an acrylic copolymer having a crosslinkable functional group. The pressure sensitive adhesive sheet according to the present invention exhibits an excellent adhesive strength even when the pressure sensitive adhesive layer is reduced in thickness. | 01-16-2014 |
20140134414 | FLAME RETARDANT ADHESIVE SHEET - Provided is a flame retardant adhesive sheet having an adhesive agent layer on at least one surface of a base material, which even when the adhesive agent layer does not contain a flame retardant agent, has both excellent flame retardant properties and adhesive properties. The present invention is concerned with a flame retardant adhesive sheet including an adhesive agent layer on at least one surface of abase material, wherein the base material has flame retardant properties adapted to VTM-0 in a test according to the UL94 standard; a thickness per surface of the adhesive agent layer is 0.6 μm or more, and a total thickness of the adhesive agent layer is not more than 2.2 μm; the adhesive agent constituting the adhesive agent layer does not contain a flame retardant agent but contains (A) an acrylic copolymer and (B) a specified urethane resin. | 05-15-2014 |
Patent application number | Description | Published |
20130208598 | COMMUNICATION SYSTEM, CONTROL DEVICE, AND NODE DEVICE - A wireless communication system is provided. A control device includes: a receiver configured to be able to receive information from radio frequency channels; a processor that judges whether a first channel is congested, and generates switchover instruction information when the first channel is judged to be congested; and a transmitter that transmits the switchover instruction information. Each node device includes: a receiver that receives information through the first channel; a transmitter that transmits information through a transmission channel; and a processor that recognizes whether a hop count from the control device is one, selects a second channel and specifies it as the transmission channel in a first case in which the receiver receives the switchover instruction information from the control device and the hop count is recognized as one, and specifies the first channel as the transmission channel in a second case in which the first case does not hold. | 08-15-2013 |
20140016645 | COMMUNICATION METHOD AND COMMUNICATION APPARATUS - A communication apparatus includes a receiver, a memory, a processor, and a transmitter. The receiver receives a route information frame and a first frame that is not the route information frame. The memory holds a route information table. The route information table records route information included in the route information frame. When the route information table does not include the source address of the first frame, the processor associates the source address with the address of a transfer-source apparatus that has transferred the first frame to the receiver, and registers these addresses in a registration table. In order to transmit a second frame addressed to a destination apparatus that is not recorded in the route information table, the processor obtains the address of a transfer-source apparatus registered in association with the address of the destination apparatus. The transmitter transmits the second frame to the address obtained by the processor. | 01-16-2014 |
20140029603 | METHOD AND DEVICE FOR TIME-SYNCHRONIZATION IN AD HOC NETWORK - A method and a device perform time-synchronization with an ad hoc network configured by a plurality of nodes. The method includes: transmitting a time-synchronization request frame including an address of one of the plurality of nodes which belong to the ad hoc network to one of the plurality of nodes having a function of receiving the time-synchronization request frame and transmitting a time-synchronization reply frame including time-synchronization information; receiving the time-synchronization reply frame including the time-synchronization information from one of the plurality of nodes which receive the time-synchronization request frame; and performing time-synchronization with one of the plurality of nodes using the time-synchronization information included in the time-synchronization reply frame. | 01-30-2014 |
20140269344 | NODE DEVICE, COMMUNICATION METHOD, STORAGE MEDIUM, AND NETWORK SYSTEM - Anode device includes a transmitter and a processor. The transmitter transmits an inspection frame used in inspecting a status of a route from a source node device to a destination node device. The processor generates a first inspection frame and selects a first node device to which the transmitter transmits the first inspection frame from among candidates for a node device to which a frame addressed to the destination node device is to be forwarded. The processor judges whether a transmission of the first inspection frame has been successfully performed. When the transmission of the first inspection frame has failed, the processor generates a second inspection frame which records a failure in a communication with the first node device. The processor selects a second node device to which the transmitter transmits the second inspection frame from among the candidates. | 09-18-2014 |
20150131480 | APPARATUS AND METHOD FOR DETERMINING AN OPTIMUM GATEWAY NODE IN A COMMUNICATION NETWORK - A network includes node devices each storing a table that manages paths to plural gateway devices for connecting to another network. A node device generates a hello frame for specifying a main gateway device of the node device at a predetermined timing, and transmits the hello frame to adjacent node devices. The node device, upon receiving a hello frame from an adjacent node device operating as a first hop destination of a data frame destined for the main gateway device, determines whether quality of a path to the main gateway device is lowest among paths to the plural gateway devices, based on path quality information included in the hello frame. When the quality of a path to the main gateway device is lowest, the node device changes the main gateway device to a gateway device that is registered in the table and specified by information included in the hello frame. | 05-14-2015 |
20150215199 | NETWORK DEVICE AND COMPUTER-READABLE RECORDING MEDIUM - If destination information on a packet is not present in a routing table, a network device broadcasts, to adjacent nodes, a path request packet in which destination information on a packet is set. When the network device receives a path response packet associated with the path request packet from another node, the network device sends the packet after setting a send source node of the path response packet to the transfer destination. Furthermore, if the network device does not receive the path response packet, the network device sends, by using flooding, a packet in which the destination information on the packet is set. | 07-30-2015 |