Patent application number | Description | Published |
20080257397 | SYSTEM, METHOD, AND APPARATUS FOR EXTRACTING POWER FROM A PHOTOVOLTAIC SOURCE OF ELECTRICAL ENERGY - System, method, and apparatus are provided for harvesting electrical energy from a photovoltaic source of electrical energy. The photovoltaic source has power-generating characteristics defined by a family of voltage-current curves comprising points of maximum electrical power over a respective range of at least one of the following for the photovoltaic source: distinct illumination intensities and distinct temperatures. The apparatus is made up of a switching converter coupled to the photovoltaic source. The converter has an input voltage-current curve having a predefined functional relationship between the input voltage and the input current. The predefined functional relationship of the input voltage-current curve of the converter is configured to provide during operation of the converter an approximation with respect to at least some of the points of maximum electrical power for the photovoltaic source without having to perform current and voltage calculations corresponding to a maximum power from the photovoltaic source. | 10-23-2008 |
20080285205 | INTEGRATED INDUCTOR AND CAPACITOR COMPONENTS AND METHODS OF MANUFACTURE - An integrated inductor and capacitor component is provided and includes a number of tapered conductors. Neighboring ones of the tapered conductors are separated by a gap extending along a length of the component. A first one of the tapered conductors is characterized by a first width w | 11-20-2008 |
20090066391 | High voltage, high speed, high pulse repetition rate pulse generator - A high voltage, high speed, and high repetition rate pulse generator solves the high pulse repetition rate limitations associated with RF power amplifiers. The pulse generator employs resonant techniques to provide current limiting features that allow for continued high voltage, high speed, and high repetition pulse rate operation of the pulse generator without impairment of the pulse generator during both short circuit and open circuit load conditions. | 03-12-2009 |
20090159677 | CONTACTLESS POWER AND DATA TRANSFER SYSTEM AND METHOD - A contactless power and data transfer system is disclosed. The system includes an encapsulated optoelectronic semiconductor device at least partly disposed within a barrier encapsulation, and a contactless power transfer system configured to transfer at least one of power and data across the barrier encapsulation. A method for manufacturing a contactless power and data transfer system is also disclosed. | 06-25-2009 |
20090231890 | Boost converter input ripple current reduction circuit - A boost inductor value reduction circuit is integrated into a traditional boost power converter to greatly reduce undesirable high frequency harmonics from being fed back to the input side of the boost power converter. The boost inductor value reduction circuit is very small when compared with traditional filter techniques, is less costly than traditional filter techniques, and does not degrade the boost power converter control performance. It can also be used to reduce the size of the boost inductor without compromising the converter performance for use in energy efficient sensitive applications such as photovoltaic inverters. | 09-17-2009 |
20090296434 | High efficiency, multi-source photovoltaic inverter - A photovoltaic (PV) inverter system operates continuously in a buck converter mode to generate a sum of full wave rectified sine wave currents at a current node common to a plurality of buck converters in response to a plurality of full wave rectified sine wave currents generated via the plurality of buck converters. The PV inverter system increases the level of the voltage sourcing each buck converter when a corresponding DC power source voltage is lower than the instantaneous voltage of a utility grid connected to the PV inverter system. | 12-03-2009 |
20090323379 | High efficiency photovoltaic inverter - A photovoltaic (PV) inverter includes a single DC to AC converter configured to operate solely in a buck mode for PV array voltage levels greater than a connected power grid instantaneous voltage plus converter margin, and further configured to operate solely in a boost mode for PV array voltage levels plus margin less than the connected power grid instantaneous voltage, such that the PV inverter generates a rectified sine wave current in response to the available PV array power, and further such that the PV inverter generates a utility grid current in response to the rectified sine wave current. | 12-31-2009 |
20100071742 | Quasi-AC, photovoltaic module for unfolder photovoltaic inverter - A photovoltaic (PV) energy system includes a pulsed bus defined by a non-zero average value voltage that is proportional to a rectified utility grid AC supply voltage. The PV energy system also includes a plurality of PV modules, each PV module including a bucking circuit configured to convert a corresponding PV voltage into a pulsing current, wherein the pulsating bus is configured to sum the pulsing currents produced via the plurality of PV modules such that a resultant pulsing current is injected into the pulsating bus in phase with the non-zero average value voltage. A current unfolding circuit is configured to control the amount of AC current injected into the utility grid in response to the resultant pulsing current. | 03-25-2010 |
20100271081 | GATE DRIVE CIRCUITRY FOR NON-ISOLATED GATE SEMICONDUCTOR DEVICES - One embodiment is a gate drive circuitry for switching a semiconductor device having a non-isolated input, the gate drive circuitry having a first circuitry configured to turn-on the semiconductor device by imposing a current on a gate of the semiconductor device so as to forward bias an inherent parasitic diode of the semiconductor device. There is a second circuitry configured to turn-off the semiconductor device by imposing a current on the gate of the semiconductor device so as to reverse bias the parasitic diode of the semiconductor device wherein the first circuitry and the second circuitry are coupled to the semiconductor device respectively through a first switch and a second switch. | 10-28-2010 |
20100277868 | INSULATED METAL SUBSTRATES INCORPORATING ADVANCED COOLING - A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS. | 11-04-2010 |
20110051473 | SWITCHING INVERTERS AND CONVERTERS FOR POWER CONVERSION - A switching inverter having two single-ended EF | 03-03-2011 |
20110133874 | MAGNETIC COMPONENTS AND METHODS FOR MAKING THE SAME - A method for making a magnetic component is provided. The method comprises providing a core with one or more ridges protruding from one or more surfaces of the core, depositing one or more electrically conductive materials on the core, and removing at least a portion of the one or more ridges to form one or more continuous conductors wound around the core. Each of the one or more continuous conductors defines at least one insulating gap. Further, a magnetic component and methods for making the magnetic component are also presented. | 06-09-2011 |
20130264909 | SYSTEM FOR DRIVING A PIEZOELECTRIC LOAD AND METHOD OF MAKING SAME - A driver system comprises a direct current (DC) voltage source and a first bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and configured to convert a first voltage on the primary side to a second voltage on the secondary. The driver system also comprises a second bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side coupled to the secondary side of the first bi-directional DC-to-DC converter and configured to convert the first voltage on the primary side to a third voltage on the secondary. The first and second bi-directional DC-to-DC converters are capable of boosting the first voltage, and the second control signal is a complement of the first control signal. A voltage difference between the second and third voltages comprises an output voltage that comprises an amplification of the first control signal. | 10-10-2013 |
20130336035 | SYSTEM FOR DRIVING A PIEZOELECTRIC LOAD AND METHOD OF MAKING SAME - A system for driving a piezoelectric load includes a direct current (DC) voltage source and a bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and comprising a control input configured to receive a first control signal configured to control conversion of a first voltage on the primary side of the bi-directional DC-to-DC converter to a second voltage on the secondary side of the bi-directional DC-to-DC converter. The driver system also includes a capacitor coupled to the secondary side of the bi-directional DC-to-DC converter and configured to remove a DC offset of the second voltage and includes a reactive load having a first terminal coupled to the capacitor and a second terminal coupled to the secondary side of the bi-directional DC-to-DC converter. | 12-19-2013 |
20140124501 | INDUCTION COOKTOP APPLIANCE - An induction cooktop appliance is provided. The induction cooktop appliance includes an induction heating element and a metal top panel positioned above the induction heating element for supporting cooking utensils thereon. The metal top panel defines an opening above the induction heating element. The opening can limit or regulate eddy currents within the metal top panel. | 05-08-2014 |
20140133104 | LOW PROFILE SURFACE MOUNT PACKAGE WITH ISOLATED TAB - A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s). | 05-15-2014 |
20140167248 | POWER MODULE PACKAGE - An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir. | 06-19-2014 |
20150022056 | SYSTEM FOR DRIVING A PIEZOELECTRIC LOAD AND METHOD OF MAKING SAME - A driver system comprises a direct current (DC) voltage source and a first bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and configured to convert a first voltage on the primary side to a second voltage on the secondary. The driver system also comprises a second bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side coupled to the secondary side of the first bi-directional DC-to-DC converter and configured to convert the first voltage on the primary side to a third voltage on the secondary. The first and second bi-directional DC-to-DC converters are capable of boosting the first voltage, and the second control signal is a complement of the first control signal. A voltage difference between the second and third voltages comprises an output voltage that comprises an amplification of the first control signal. | 01-22-2015 |
20150024553 | POWER MODULE PACKAGE - An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir. | 01-22-2015 |