Patent application number | Description | Published |
20090029118 | METHOD OF MULTI-STAGE SUBSTRATE ETCHING AND TERAHERTZ OSCILLATOR MANUFACTURED USING THE SAME METHOD - A method of multi-stage substrate etching and a terahertz oscillator manufactured by using the method are provided. The method comprises the steps of forming a first mask pattern on any one surface of a first substrate, forming a hole by etching the first substrate using the first mask pattern as an etching mask, bonding, to the first substrate, a second substrate having the same thickness as a depth to be etched, forming a second mask pattern on the second substrate bonded, forming a hole by etching the second substrate using the second mask pattern as an etching mask, and removing an oxide layer having the etching selectivity between the first substrate and the second substrate, whereby the etched bottom is made uniformly even in a deep step, the edge curvature is minimized, and a T-shape is prevented from being formed on the etched wall face to thereby improve the etching quality. Further, the etching depth is previously controlled by lapping or polishing, the upper and lower substrates are precisely boned to each other using the alignment key, and a multi-layer processing is possibly performed thereto, so that the precision and the uniformity in structure of the oscillator or amplifier is obtained. | 01-29-2009 |
20090108966 | LINE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A line structure is provided which includes a ferroelectric film which is formed on at least one surface of both sides of a substrate and a permittivity of which changes according to a magnitude of an applied voltage, an inductor which is formed on a first side of the substrate, and a capacitor which has a capacitance corresponding to the permittivity of the ferroelectric film and the substrate. | 04-30-2009 |
20090120903 | Method of multi-stage substrate etching and terahertz oscillator manufactured using the same method - A method of multi-stage substrate etching is provided. The method comprises the steps of: forming a first mask pattern on one surface of a first substrate; forming a hole by etching the first substrate using the first mask pattern as an etching mask; forming a second mask pattern on one surface of a second substrate; forming a hole by etching the second substrate to a predetermined depth using the second mask pattern as an etching mask; bonding the first and second substrates together such that an etched surface of the first substrate faces an etched surface of the second substrate; forming a third mask pattern on the second substrate; and forming a hole passing through the second substrate by etching the second substrate using the third mask pattern as an etching mask, whereby it is prevented the occurrence of a radius of curvature in the bottom surface and the overhang structure occurring on a step surface, so that etching quality is improved, a precise bonding between the substrates is obtained using the alignment key positioned on each substrate, and a multi-layer process is carried out. | 05-14-2009 |
20090142014 | AD CONVERTER USING PHOTONIC CRYSTAL - An AD converter is provided. The AD converter includes a light source unit which provides an optical signal, at least one waveguide unit which consists of a photonic crystal and transmits the optical signal, a modulation unit which applies a RF signal to the at least one waveguide unit, thereby modulating an optical signal output from the at least one waveguide unit, and a digital conversion unit which converts the modulated optical signal to a digital signal. Accordingly, a compact-sized AD convert can be realized. | 06-04-2009 |
20090252938 | Substrate structure and method of forming the same - Provided are a substrate structure and method of forming the same. The method of forming the substrate structure may include etching a substrate to form an etched portion having a vertical surface, forming a diffusion material layer on the whole substrate or in part of the substrate; annealing the diffusion material layer to form a seed layer diffused downward toward the surface of the etched portion, and forming a metal layer on the seed layer. Accordingly, surface characteristics of the etched portion of the substrate may be enhanced by the seed layer, and therefore, a metal layer with improved adhesion and a uniform thickness may be formed on the vertical surface of the etched portion. | 10-08-2009 |
20100020136 | INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes: a substrate having an ink feed hole extending therethrough; a chamber layer including a plurality of ink chambers above the substrate; a nozzle layer including a plurality of nozzles above the chamber layer; and at least one support beam formed in the substrate to connect inner walls of the ink feed hole. | 01-28-2010 |
20100051580 | METHOD OF MANUFACTURING INKJET PRINTHEAD - A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole. | 03-04-2010 |
20100053272 | INK EJECTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are an ink ejecting device and a method of manufacturing the same. The disclosed ink ejecting device includes an inkjet head including a substrate, which includes an ink feed hole, a plurality of via holes, which are formed in the rear surface of the substrate, and which expose the ink feed holes therethtough, a chamber layer stacked on the substrate, and a nozzle layer stacked on the chamber layer, and includes a base header, which is attached to the inkjet head and includes a plurality of ink supply slots having a corresponding arrangement with respect to the via holes. | 03-04-2010 |
20100171793 | INK FEEDHOLE OF INKJET PRINTHEAD AND METHOD OF FORMING THE SAME - An ink feedhole of an inkjet printhead and a method of forming the same includes an ink feedhole that penetrates a substrate and has a width that narrows in an upper direction of the substrate, wherein at least one internal wall of the ink feedhole has a plurality of steps and inclines with respect to a surface of the substrate. | 07-08-2010 |
20110080708 | DISPLAY APPARATUS HAVING A COOLING DEVICE - A display apparatus having a front substrate that is a display panel, a rear substrate disposed at a predetermined distance apart from the front substrate and facing the front substrate, the rear substrate comprising a back light unit, and a cooling device to remove heat generated by the rear substrate. The cooling device includes an actuator disposed between the front substrate and the rear substrate, the actuator to generate an ion wind using a voltage, a transparent electrode installed to face the actuator and which is grounded, a plurality of supports to support ends of the actuator, and a high-voltage power source to apply a voltage to the actuator. | 04-07-2011 |
20110108400 | MEMS SWITCH - A Micro Electro Mechanical System (MEMS) switch includes a substrate, a fixed signal line formed on the substrate, a movable signal line spaced apart from one of an upper surface and a lower surface of the fixed signal line, and at least one piezoelectric actuator connected to a first end of the movable signal line so as to bring or separate the movable signal line in contact with or from the fixed signal line. The piezoelectric actuator includes a first electrode, a piezoelectric layer formed on the first electrode, a second electrode formed on the piezoelectric layer, and a connecting layer formed on the second electrode and connected with the movable signal line. | 05-12-2011 |
20120133450 | METHOD OF MULTI-STAGE SUBSTRATE ETCHING AND TERAHERTZ OSCILLATOR MANUFACTURED USING THE SAME METHOD - A method of multi-stage substrate etching and a terahertz oscillator manufactured by using the method are provided. The method comprises the steps of forming a first mask pattern on any one surface of a first substrate, forming a hole by etching the first substrate using the first mask pattern as an etching mask, bonding, to the first substrate, a second substrate having the same thickness as a depth to be etched, forming a second mask pattern on the second substrate bonded, forming a hole by etching the second substrate using the second mask pattern as an etching mask, and removing an oxide layer having the etching selectivity between the first substrate and the second substrate. | 05-31-2012 |
20130069731 | METHOD OF MULTI-STAGE SUBSTRATE ETCHING AND TERAHERTZ OSCILLATOR MANUFACTURED USING THE SAME METHOD - A method of multi-stage substrate etching, includes forming a first mask pattern on one surface of a first substrate; forming a hole by etching the first substrate using the first mask pattern as an etching mask; forming a second mask pattern on one surface of a second substrate; forming a hole by etching the second substrate to a predetermined depth using the second mask pattern as an etching mask; bonding the first and second substrates together such that an etched surface of the first substrate faces an etched surface of the second substrate; forming a third mask pattern on the second substrate; and forming a hole passing through the second substrate by etching the second substrate using the third mask pattern as an etching mask, whereby it is prevented the occurrence of a radius of curvature in the bottom surface and the overhang structure occurring on a step surface. | 03-21-2013 |
20130070445 | MICRO-OPTICAL SWITCHING DEVICE, IMAGE DISPLAY APPARATUS INCLUDING MICRO-OPTICAL SWITCHING DEVICE, AND METHOD OF MANUFACTURING MICRO-OPTICAL SWITCHING DEVICE - A micro-optical switching device, an image display apparatus including the micro-optical switching device, and a method of manufacturing the micro-optical switching device are provided. The micro-optical switching device includes a substrate; a first electrode disposed on the substrate and including a first opening array, wherein the first opening array includes a plurality of openings; and a second electrode disposed spaced apart from the first electrode and including a second opening array including a plurality of openings, wherein the plurality of openings of the second opening array do not overlap with the plurality of openings of the first opening array. | 03-21-2013 |
20130088856 | TRANSMISSIVE AND REFLECTIVE-MODE CONVERTIBLE DISPLAY - A transmissive and reflective mode convertible display is provided including a converting unit convertible between a reflective mirror layer state and a light transmitting layer state and a shutter unit. Based on the state of the converting unit, the display may be drive to utilize light from a backlight transmitted through the converting unit or external light reflected off the converting unit. | 04-11-2013 |
20130303909 | LASER-INDUCED ULTRASONIC WAVE APPARATUS AND METHOD - Laser-induced ultrasonic wave apparatuses and methods of generating images using the same. The laser-induced ultrasonic wave apparatus includes a laser source which irradiates a laser beam to a target object and a thermoelastic material; a thermoelastic material which converts the laser beam to a first ultrasonic wave and irradiates the first ultrasonic wave to the target object; and a receiving unit which receives an echo acoustic wave of the first ultrasonic wave and receives a second ultrasonic wave generated by the target object due to the laser beam. | 11-14-2013 |
20130345557 | LIGHT SCANNING PROBE AND MEDICAL IMAGING APPARATUS EMPLOYING THE SAME - A light scanning probe includes: a probe main body; a light scanner that includes a scanner module that is driven to rotate and a beam reflector that includes a plurality of reflection surfaces which alter a path of light being scanned by the scanner module, wherein the light scanner is disposed within the probe main body; and an optical fiber that guides light which is received from a light input unit toward the scanner module. A medical imaging apparatus includes the light scanning probe that irradiates light toward an object; a receiver that receives a signal which is generated in the object; and a signal processor that processes the signal received by the receiver. | 12-26-2013 |
20140033822 | ULTRASONIC TRANSDUCER, AND ULTRASONIC WAVE GENERATING APPARATUS AND ULTRASONIC SYSTEM INCLUDING THE SAME - An ultrasonic transducer, and an ultrasonic wave generating apparatus and an ultrasonic system including the same. The ultrasonic transducer includes a light-absorbing layer configured to absorb light incident on the light-absorbing layer and to generate heat based on the absorbed light; and a thermoelastic layer which is disposed on the light-absorbing layer and which is configured to thermally expand based on the heat to generate ultrasonic waves. | 02-06-2014 |