Junichi Abe
Junichi Abe, Iwate-Ken JP
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20090244728 | CAMERA MODULE AND METHOD FOR MANUFACTURING THE SAME - A camera module in which a shield having a lens holder therein can be fixed with high accuracy is provided. The camera module comprises: an insulating substrate | 10-01-2009 |
20110076007 | CAMERA MODULE - According to one embodiment, a camera module includes an insulating substrate | 03-31-2011 |
20120230669 | METHOD FOR MANUFACTURING CAMERA MODULE AND CAMERA MODULE - Certain embodiments provide methods for manufacturing camera module including arranging a camera module body in a first shield and forming a resin having a light shielding effect. The camera module body has: a sensor board which has a sensor unit; and an optical element which has a lens unit and a spacer. The process of arranging this camera module body in the first shield is a process of arranging the camera module body in the first shield such that a gap is formed between the camera module body and the first shield. The process of forming the resin having the light shielding effect is a process of forming the resin having the light shielding effect in the gap between the first shield and camera module body. | 09-13-2012 |
Junichi Abe, Hiroshima JP
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20100273019 | MULTILAYER STRUCTURE POLYMER AND RESIN COMPOSITION TOGETHER WITH ACRYLIC RESIN FILM MATERIAL, ACRYLIC RESIN LAMINATE FILM, PHOTOCURABLE ACRYLIC RESIN FILM OR SHEET, LAMINATE FILM OR SHEET AND LAMINATE MOLDING OBTAINED BY LAMINATING THEREOF - An acrylic resin film material comprising at least a multilayer structure polymer with a particular structure prevent a molded item from being whitened during insert- or in-mold molding and meet the requirement for surface hardness, heat resistance, and transparency or matting performance for vehicle applications. It is also possible to use an acrylic resin film material exhibiting a difference of 30% or less between haze values as determined in accordance with the testing method of JIS K7136 (haze measurement method) after and before a tensile test where a test piece with a width of 20 mm is pulled under the conditions of an initial inter-chuck distance of 25 mm, a rate of 50 mm/min and a temperature of 23° C. until an end-point inter-chuck distance becomes 33 mm as well as having a pencil hardness of 2B or higher as determined in accordance with JIS K5400. | 10-28-2010 |
Junichi Abe, Kitakami-City JP
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20080246868 | SOLID-STATE IMAGE SENSING DEVICE - In a solid-state image sensing device, a second substrate having transparency, including a via is placed on a solid-state image sensor having a pixel region and a logic region formed in a first substrate and in which a passive component electrically connected with the solid-state image sensor through the via is mounted on the second substrate. Thus, highly efficient location of passive components is attained for miniaturization. | 10-09-2008 |
Junichi Abe, Kanagawa-Ken JP
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20120002703 | WIRELESS TRANSMISSION METHOD, WIRELESS TRANSMISSION SYSTEM, AND TRANSMISSION APPARATUS AND RECEPTION APPARATUS OF WIRELESS TRANSMISSION SYSTEM - In a wireless transmission system that transmits and receives a modulated signal between a transmitter and a receiver that are coupled through a wireless transmission path, the transmitter includes a spectrum division filter bank dividing the modulated signal and generating a plurality of sub-spectrum signals each of which is arranged at a predetermined frequency position, and subjects the plurality of sub-spectrum signals arranged in spectra to a direct spectrum division transmission, and the receiver includes a spectrum combination filter bank extracting the plurality of sub-spectrum signals from the received signals arranged in spectra and subjected to the direct spectrum division transmission to combine the sub-spectrum signals into an original modulated signal. | 01-05-2012 |
Junichi Abe, Yokosuka-Shi JP
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20140211814 | COMMUNICATION SYSTEM, TRANSMITTER APPARATUS AND RECEIVER APPARATUS - A transmitter of a communication system includes a spectrum dividing section which divides a transmission signal into a plurality of sub-spectra at a first sampling speed F1 and combines one or more low-speed intermediate composite signals from the divided sub-spectra, and a multiplexing section which multiplexes the intermediate composite signals at a second sampling speed F2 faster than the first sampling speed F1 (F2>F1) and distributes to a broadband. A receiver includes a demultiplexing section which extracts one or more low-speed intermediate composite signals from a reception signal at the second sampling speed F2, and a spectrum combining section which combines the intermediate composite signals at the first sampling speed F1 and extracts the sub-spectra to re-combines the transmission signal. | 07-31-2014 |
Junichi Abe, Otake-Shi JP
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20150044439 | Acrylic Resin Composition for Film - The purpose of the present invention is to provide an acrylic resin composition for a film having reduced bleeding and sticking to a roll during formation of an acrylic resin film. The present invention is an acrylic resin composition for a film, the composition comprising: a high-molecular-weight hindered amine-based light stabilizer (A) having a triazine backbone; and an acrylic resin (B). When this acrylic resin composition for a film is used, there is reduced bleeding to a roll surface during film formation, and minimized sticking of the film to the roll. | 02-12-2015 |
20160107428 | Acrylic Resin Laminate Film, Manufacturing Method Therefor, and Melamine Decorative Board - Provided is an acrylic resin laminate film which has an excellent bonding property, resistance to water blushing, and an excellent external appearance. This acrylic resin laminate film is provided with: an acrylic resin layer (I) comprising an acrylic resin composition (A); and an acrylic resin layer (II) comprising a resin composition (B) that contains a reactive group-containing acrylic resin (B-1). (B) contains 10-100 mass % of (B-1), and 0-90 mass % of (B-2), which is an acrylic resin other than (B-1), with respect to 100 mass % of the total of (B-1), and (B-2), and further contains 0-50 parts by mass of (C), which is an additive other than (B-1), and (B-2), with respect to 100 parts by mass of the total of (B-1), and (B-2). (B-1) contains a monomer unit which has a substituent that reacts with an amino group, or a methylol group. The content of the monomer unit that has the reactive substituent is 3 mass % or more with respect to 100 mass % of (B). | 04-21-2016 |
Junichi Abe, Chiyoda-Ku JP
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20150270080 | VACUUM MONITORING APPARATUS - A vacuum monitoring device of a vacuum circuit breaker with a line of a vacuum valve led out to the external of a metal tank through a bushing having a shield working as a low-pass filter, includes: a first antenna; a second antenna; a first and a second detection portion measuring intensity of an electromagnetic wave detected by the antennas; and a determination portion determining a vacuum deterioration of the circuit breaker by comparing the intensity of the electromagnetic wave detected by the first and the second detection portions, wherein the first and second detection portion include frequency filters passing a frequency band, of electromagnetic waves resulting from discharges occurring when the vacuum valve deteriorates in vacuum, which is attenuated by the shield. | 09-24-2015 |
Junichi Abe, Otake-Shi, Hiroshima JP
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20150337127 | Thermoplastic Resin Powder and Method for Producing Same - The objective of the present invention is to provide a thermoplastic resin powder that suppresses a decrease in fluidity of a composition during melt molding and that has a suppressed alteration of the resin resulting from retention. The thermoplastic resin powder is obtained by coagulating a polymer from a latex produced by means of emulsion polymerization of a monomer, the content of metal-corroding free acids in the thermoplastic resin powder is no greater than 500 ppm, and the thermoplastic resin powder satisfies a predetermined formula (1). | 11-26-2015 |
Junichi Abe, Kitakami JP
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20160099285 | METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING CAMERA MODULE - Certain embodiments provide a method for manufacturing a solid-state imaging device including: forming a sensor chip fixed to a supporting substrate by a first adhesive; peeling off the sensor chip from the supporting substrate by softening the first adhesive; and fixing the peeled off sensor chip onto a curved surface of a mounting body to allow the sensor chip to be curved along the curved surface. | 04-07-2016 |