Patent application number | Description | Published |
20130285254 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBTRATE - A wiring substrate includes a core substrate. The core substrate includes a first surface, a second surface, and an opening extending through the core substrate between the first and second surfaces. A first conductive film is formed on the first surface and covers the opening. A second conductive film is formed on the second surface. The second conductive film covers the opening. An electronic component is arranged in the opening and connected to the first conductive film. An insulator fills the opening. A first wiring portion includes alternately stacked insulative layers and wiring layers and covers the first surface of the core substrate and the first conductive film. A second wiring portion includes alternately stacked insulative layers and wiring layers, and covers the second surface of the core substrate and the second conductive film. | 10-31-2013 |
20130319740 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole, a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member, and a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole. The whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively. | 12-05-2013 |
20140063763 | WIRING BOARD - A wiring board includes: a core layer having a through hole therethrough and comprising a first surface and a second surface opposite to the first surface; a first wiring layer formed on the first surface of the core layer and having a first opening which is communicated with the through hole, wherein an opening area of the first opening is larger than that of the through hole in a plan view; an electronic component disposed in the through hole and the first opening and having a first surface, and a second surface opposite to the first surface, the electronic component further having a pair of terminal on the first surface thereof; and a first resin layer filled in the through hole, the first opening and a gap between the pair of terminals so as to cover the second surface and the side surface of the electronic component. | 03-06-2014 |
20140291859 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in substrate, includes, a substrate having an opening portion, a first wiring layer formed in the substrate, an electronic component arranged in the opening portion, a first insulating layer formed on one face of the substrate and sealing the electronic component, a second insulating layer formed on other face of the substrate, a second wiring layer formed on the first insulating layer, and a third wiring layer formed on the second insulating layer. The first insulating layer is formed of an inner insulating layer covering the one face of the substrate and filling an inside of the opening portion, and an outer insulating layer formed on the inner insulating layer. | 10-02-2014 |
20140360760 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of the core. A first insulating layer covers a side surface of the electronic component and the first surface of the core and fills a portion of the cavity. A second insulating layer covers the first insulating layer. A third insulating layer covers the second surface of the core. The remainder of the cavity that is not filled with the first insulating layer is filled with the third insulating layer. | 12-11-2014 |
20140360765 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a core, first and second wiring layers formed on opposite sides of the core, an electronic component arranged in a cavity of the core, and a first insulating layer that fills the cavity and covers the one surface of the core. The electronic component is partially buried in the first insulating layer and partially projected from the cavity and exposed from the first insulating layer. A second insulating layer covers the first insulating layer. A third insulating layer covers the core and the projected and exposed portion of the electronic component. The thickness of the third insulating layer where the first wiring layer is located is equal to the total thickness of the first insulating layer and the second insulating layer where the second wiring layer is located. | 12-11-2014 |
20150041053 | Method of Manufacturing Wiring Substrate - A method of manufacturing a wiring substrate includes forming a pair of core substrates, each including a cavity; applying a film that covers the cavity to each core substrates; adhering an electronic component to the film in the cavity of each of the core substrates; arranging a support between the core substrates and a first insulator between the support and the core substrates; stacking the core substrates, the support, and the first insulators so that the first insulators form first insulation layers on the first surfaces of the core substrates, the cavities are filled with the first insulators, and the first insulators fix the corresponding electronic components to the corresponding core substrates; removing the film from the core substrates; and separating the core substrates from the support to separate the core substrates from each other. | 02-12-2015 |
20160081194 | Wiring Substrate and Semiconductor Device - A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, and a second wiring layer formed on a second surface of the core. The first wiring layer includes a first opening, and the second wiring layer includes a second opening. The core includes a plurality of electronic component accommodating bores that extend through the core at portions exposed from the first and second openings. An electronic component is arranged in each electronic component accommodating bore. The electronic component accommodating bores are filled with an insulating layer. The core includes a partition located between adjacent electronic component accommodating bores. The partition is formed by part of the core. | 03-17-2016 |