Patent application number | Description | Published |
20090025867 | MULTI-LAYER LAMINATE SUBSTRATES USEFUL IN ELECTRONIC TYPE APPLICATIONS - A laminate for electronic-type applications having a conductive layer and a dielectric multilayer. The dielectric multilayer comprises at least three layers: i. an adhesive layer; ii. a low coefficient of thermal expansion layer; and iii. a curl balancing layer. Optionally, the laminate can also comprise a second conductive layer bonded to the curl balancing layer. | 01-29-2009 |
20090142567 | THERMALLY CONDUCTIVE ARAMID-BASED DIELECTRIC SUBSTRATES FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGING - The present invention relates generally to fiber-based reinforced composite sheets comprising one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, impregnated with a polymeric matrix, said polymeric matrix comprising at least one polymer and a thermally conductive filler component suitable for conducting heat, the sheet being useful as a thermally conductive printed circuit board substrate or as a component in a thermally conductive integrated circuit chip package. | 06-04-2009 |
20090242823 | PROCESS FOR PREPARING POLYIMIDE BASED COMPOSITIONS USEFUL IN HIGH FREQUENCY CIRCUITRY APPLICATIONS - The invention is directed to polyimide based materials having improved electrical and mechanical performance, and also to a process of making such materials. The compositions of the invention comprise: i. a polyimide base polymer in an amount of at least 60 weight percent; ii. a discontinuous phase of inorganic material present in an amount of at least 4 weight percent; iii. a non-ionic halogenated dispersing agent in an amount of at least 0.1 weight percent; and iv. up to 30 weight percent of other optional ingredients, such as, fillers, processing aids, colorants, or the like. The compositions of the invention generally exhibit excellent high frequency performance and can be manufactured by incorporating the dispersing agent and inorganic material into a polyamic acid solution and then converting the polyamic acid solution into a polyimide by conventional or non-conventional means. | 10-01-2009 |
20090288699 | LAMINATE STRUCTURES FOR HIGH TEMPERATURE PHOTOVOLTAIC APPLICATIONS, AND METHODS RELATING THERETO - Laminate structures are disclosed, comprising a metal foil supporting a polyimide dielectric layer. The polyimide dielectric layer comprises a polyimide derived from at least one aromatic rigid rod diamine and at least one aromatic rigid rod dianhydride to provide a thermally and dimensionally stable polyimide. A bottom electrode is formed directly on the polyimide dielectric layer surface, and a CIGS absorber layer is formed directly on the bottom electrode. The CIGS laminates of the present disclosure can be incorporated into CIGS type solar cells, and the laminates further allow such CIGS solar cells to be monolithically integrated into a photovoltaic module on a single substrate. | 11-26-2009 |
20090297858 | MULTILAYER INSULATION FOR WIRE, CABLE OR OTHER CONDUCTIVE MATERIALS - The present disclosure relates to a multilayer insulation structure having superior abrasion resistance. The multilayer insulation structure has a first polyimide outer layer, a polyimide core layer and an optional second polyimide outer layer. The first and second polyimide outer layers contain a fluoropolymer micropowder. The first and second polyimide outer layers have a combined weight of from 10 to 80 weight % of the total weight of the multilayer insulation structure. The abrasion resistance of the multilayer insulation structure is from 1500 to 18300 scrape cycles. The multilayer insulation structure is useful as wire or cable insulation wrap. | 12-03-2009 |
20100291371 | MULTI-LAYER ARTICLE FOR FLEXIBLE PRINTED CIRCUITS - Provided is a multi-layer article comprising an electrically conductive metal layer adheringly contacting the surface of a polymeric composite film less than 500 μm in thickness, having a surface, the polymeric composite film comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. A process of film casting onto a conductive metal layer is provided. | 11-18-2010 |
20140093714 | COLORED POLYIMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a colored polyimide film having 48 to 94 weight percent of a polyimide, 5 to 25 weight percent pigment and 0.05 to 2 weight percent carbon black. The polyimide is derived is derived from at least one aromatic diamine and at least one aromatic dianhydride. The colored polyimide film has an optical density of at least 1.4 | 04-03-2014 |
20140103265 | COLORED POLYIMIDE FILMS AND METHODS RELATING THERETO - The present disclosure is directed to a method of increasing optical density by incorporating carbon black in to a colored polyimide composition to obtain a colored polyimide film. The colored polyimide film has 48 to 94 weight percent of a polyimide, 5 to 25 weight percent pigment and 0.05 to 2 weight percent carbon black. | 04-17-2014 |