Kaneshima
Keiichiro Kaneshima, Suwa-Shi JP
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20130102834 | SLIDE DEVICE, MECHANICAL SEAL, ROTARY DEVICE, PUMP AND AUXILIARY ARTIFICIAL HEART SYSTEM - Provided is a slide device which can reduce a frictional force more than a conventional slide device when used in an aqueous liquid containing a blood component. In a slide device which includes: a fixed-side slide member having a slide surface; and a rotary-side slide member having a slide surface, the slide device being used in an aqueous liquid containing a blood component in a state where the slide surface of the fixed-side slide member and the slide surface of the rotary-side slide member face each other in an opposed manner, at least one of the fixed-side slide member and the rotary-side slide member is formed of a member which is made of a material which contains silicon and has hydrate of silicon oxide on the slide surface thereof. | 04-25-2013 |
Shoji Kaneshima, Hyogo JP
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20090272264 | COMPRESSED AIR PRODUCING METHOD AND PRODUCING PLANT - A compressed air producing method, in which two or more adsorption columns, in all or part of which a zeolite-series adsorbent is charged, are switched over to purify feed air and the adsorbent charged in at least one adsorption column of said adsorption columns is regenerated in turn with regeneration gas, is characterized by comprising a step of performing, when an adsorption column (R) in a regeneration step transfers to a purification step, the purge of said adsorbent with purified air, and characterized in that the internal pressure of an adsorption column (R) in the purge step is controlled such that a differential pressure thereof from the internal pressure of an adsorption column (P) in the purification step falls within a specified value. | 11-05-2009 |
Syuji Kaneshima, Fukuoka-Shi JP
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20140256820 | THERAPEUTIC AGENT FOR BLOOD-BRAIN BARRIER DISRUPTION SYNDROME - A medicinal agent or a pharmaceutical composition, each of which comprises a biguanides agent or a pharmaceutically acceptable salt thereof as an active ingredient, and which can potentiate blood-brain barrier functions including tight junction capability and transcellular transport capability of a brain capillary endothelial cell and therefore can treat blood-brain barrier dysfunction syndrome. | 09-11-2014 |
Takuma Kaneshima, Kurashiki-Shi JP
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20140350169 | VINYL ALCOHOL POLYMER, METHOD FOR PRODUCING SAME, AND COMPOSITION AND COATING AGENT CONTAINING VINYL ALCOHOL POLYMER - The present invention provides a vinyl alcohol polymer having a mercapto group and having excellent reactivity. The present invention is a side-chain mercapto group-containing vinyl alcohol polymer including vinyl alcohol units and structural units represented by the following formula (I) (the characters in the formula are as defined in the description): | 11-27-2014 |
Yasuji Kaneshima, Mie-Ken JP
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20120097338 | WORK BONDING AND SUPPORTING METHOD AND WORK BONDING AND SUPPORTING APPARATUS USING THE SAME - Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work. | 04-26-2012 |
Yasuji Kaneshima, Kameyama-Shi JP
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20090095418 | ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME - The ultraviolet ray is applied on the surface of the protective tape from an ultraviolet ray generator. In addition, the ultraviolet ray having intensity higher than that from the ultraviolet ray generator is applied on spot on the wafer edge by an irradiation gun. In this case, the ultraviolet ray intensity and the rotation speed of the holding table are controlled by a controller so that the ultraviolet irradiation amount per unit area of the wafer edge portion becomes equal to that to the joining surface of the protective tape. | 04-16-2009 |
20090133551 | METHOD FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER AND PROTECTIVE TAPE CUTTING DEVICE - A cutter blade is cut-in by being moved towards a deep part of a notch from one open end of the notch while being moved in a forward direction with respect to an outer periphery of a wafer. Immediately before a blade edge reaches the deep part of the notch, cutting movement of the cutter blade is once stopped, reversely moved to a initial piercing position, and thereafter, the cutter blade is moved towards the deep part of the notch from the other open end of the notch while being moved in a reverse direction with respect to the outer periphery of the wafer. | 05-28-2009 |
20090272496 | PROTECTIVE TAPE JOINING APPARATUS - A chuck table is configured with a table main body having a wafer placement part holding a wafer placed thereon, and an annular tape support frame provided outside the wafer placement part with a cutter blade traveling groove being interposed therebetween. The tape support frame has, at a top face thereof, a plurality of linear grooves arranged in parallel in a tape joining direction, a large number of linear tape support parts each located between the linear grooves, and an annular tape support part supporting the protective tape at an outer side of the cutter blade traveling groove. | 11-05-2009 |
20140113413 | SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTING APPARATUS - A resin sealing sheet is cut into an adhesive sheet piece having an outer shape smaller than that of a wafer. The adhesive sheet piece is joined to a supporting adhesive tape together with a ring frame. The adhesive tape between the ring frame and the adhesive sheet piece is sandwiched by upper and lower housings to form a chamber. The wafer with a support board placed on a wafer holding table within the chamber faces to the adhesive sheet piece closely. The chamber is divided into two spaces by the adhesive tape. Differential pressure generated within the two spaces causes the adhesive tape and the adhesive sheet piece to cave and bend toward the wafer, whereby the adhesive sheet piece is joined to the wafer. | 04-24-2014 |
20140238207 | ADHESIVE TAPE CUTTING METHOD AND ADHESIVE TAPE CUTTING APPARATUS - A strip adhesive tape except for a portion on a notch of a wafer W is cut by contacting a cutter of a first cutting mechanism along an outer periphery of the wafer. The adhesive tape cut out into a wafer shape is reeled and collected while being separated. Thereafter, the wafer with the adhesive tape is transported to a second cutting mechanism. The second cutting mechanism cuts out the portion of the adhesive tape on the notch with a cutter having the same shape as that of the notch. | 08-28-2014 |
Yasuji Kaneshima, Mieken JP
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20080230183 | RELEASING METHOD AND RELEASING APPARATUS OF WORK HAVING ADHESIVE TAPE - In a method for releasing a work having an adhesive tape from a holding member which sucks and holds the work having the adhesive tape, the work having the adhesive tape is released from the holding member while supplying a gas which reduces a holding force of the holding member between the holding member and the work having the adhesive tape. | 09-25-2008 |