Patent application number | Description | Published |
20080238384 | Current source circuit and method of outputting current - A current source circuit includes a voltage output section which outputs a voltage signal; a current source section and a conversion section. The current source section has at least one current source block comprising a plurality of current sources, each of which outputs an output current. The conversion section is provided between the voltage output section and the current source section and outputs a reference current to the plurality of current sources of the at least one current source block based on the voltage signal such that the output current from each of the plurality of current sources is set based on the reference current. | 10-02-2008 |
20090002973 | Mount Board and Electronic Device - An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board | 01-01-2009 |
20090107703 | WIRING BOARD, PACKAGING BOARD AND ELECTRONIC DEVICE - To restrain the stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion even when the electronic component is mounted on the curved board. A flexible wiring board in which a plurality of insulation layers ( | 04-30-2009 |
20110001222 | ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING SAME - An electronic device comprises an electronic element package and a mounting substrate on which the electronic element package is mounted. The electronic element package has an LGA electrode. The mounting substrate has a through-hole having a conductor which covers an inner wall. The LGA electrode has an area larger than an opening area of the through-hole on a side facing the LGA electrode. The electronic element package is mounted on the mounting substrate so that at least a part of the opening of the through-hole overlaps with the LGA electrode. The LGA electrode and the conductor of the through-hole are electrically connected to a conductive material provided inside the through-hole. In the LGA electrode, at least a part of the region that does not overlap with the opening of the through-hole is joined to the mounting substrate by an adhesive. | 01-06-2011 |
20110242780 | MOUNT BOARD AND ELECTRONIC DEVICE - An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board | 10-06-2011 |
20120212471 | DRIVING CIRCUIT AND VOLTAGE GENERATING CIRCUIT AND DISPLAY UNIT USING THE SAME - To provide a liquid crystal display capable of implementing a symmetrical frame and a narrower frame without lowering drive capability of a common drive circuit. | 08-23-2012 |
20140003015 | MOUNT BOARD AND ELECTRONIC DEVICE | 01-02-2014 |
20150160071 | VIBRATION DETECTING APPARATUS AND VIBRATION DETECTING METHOD - Provided are a vibration detector and a vibration detecting method, which are power saving, can detect vibration even if the vibration is very weak, and can perform both start-up of the apparatus and collection of data of vibration information by the use of only one sensor. The apparatus includes a vibration detector, a semiconductor switch, a controller and a power supply. The semiconductor switch and the controller are connected to the power supply. The vibration detector detects vibration and consequently generates a vibration voltage. The semiconductor switch includes a voltage divider for generating a bias voltage inside. The semiconductor switch detects a voltage produced by superposing the bias voltage onto the vibration voltage outputted from the vibration detector, and conducts current when the detected voltage is equal to or larger than a certain value. The controller wakes up with the current conducted by the semiconductor switch as a trigger signal. | 06-11-2015 |