Patent application number | Description | Published |
20090026550 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes: a silicon substrate; and a field effect transistor including a gate insulating film over the silicon substrate, a gate electrode on the gate insulating film, and source and drain regions. The gate electrode includes, in part in contact with the gate insulating film, a crystallized Ni silicide region containing an impurity element of a conductivity type opposite to a conductivity type of a channel region in the field effect transistor. | 01-29-2009 |
20090114993 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A semiconductor device includes a silicon substrate; a P channel type field effect transistor including a first gate insulating film on the substrate, a first gate electrode on the first gate insulating film and a first source/drain region; and an N channel type field effect transistor including a second gate insulating film on the substrate, a second gate electrode on the second gate insulating film and a second source/drain region. The entire first gate electrode is made of a metal silicide, and at least in an upper portion including the upper surface of the second gate electrode, a silicide region of the same kind as the metal (M) is provided. The metal concentration in the silicide region is lower than that in the silicide of the first gate electrode. In an upper portion including the upper surface of the second gate electrode, there is a barrier layer region containing a metal diffusion suppressing element at a concentration higher than that in the lower portion. | 05-07-2009 |
20090170252 | Formation method of metallic compound layer, manufacturing method of semiconductor device, and formation apparatus for metallic compound layer - A formation method of a metallic compound layer includes preparing, in a chamber, a substrate having a surface on which a semiconductor material of silicon, germanium, or silicon germanium is exposed, and forming a metallic compound layer, includes: supplying a raw material gas containing a metal for forming a metallic compound with the semiconductor material to the chamber; heating the substrate to a temperature at which the raw material gas is pyrolyzed; and forming a metallic compound layer by reaction of the metal with the semiconductor material so that no layer of the metal is deposited on the substrate. A manufacturing method of a semiconductor device employs this formation method of a metallic compound layer. | 07-02-2009 |
20090321839 | Semiconductor device and method for manufacturing the same - A semiconductor device includes a silicon substrate; an N-channel field-effect transistor including a first gate insulating film on the silicon substrate, a first gate electrode on the first gate insulating film and a first source/drain region; and a P-channel field-effect transistor including a second gate insulating film on the silicon substrate, a second gate electrode on the second gate insulating film and a second source/drain region. Each of the first and second gate electrodes includes a crystallized nickel silicide region containing an impurity element, the crystallized nickel silicide region being contact with the first or second gate insulating film, and a barrier layer region in an upper portion including an upper surface of the gate electrode, the barrier layer region containing an Ni diffusion-preventing element higher in concentration than that of a lower portion below the upper portion. | 12-31-2009 |
20100084713 | Semiconductor device manufacturing method and semiconductor device - A second mask is provided so as to cover a second gate pattern and a first gate pattern is heated to a temperature at which a material gas containing a first metal thermally decomposes, polysilicon constituting the first gate pattern is reacted with the first metal for silicidation under the conditions that the layer of the first metal does not deposit, and thus the first gate pattern is turned into a first gate electrode constituted by a silicide of the first metal. After the second mask is removed, a first mask is provided so as to cover the first electrode and the second gate pattern is heated to a temperature at which the material gas thermally decomposes, polysilicon constituting the second gate pattern is reacted with the first metal for silicidation under the conditions that the layer of the first metal does not deposit, and thus the second gate pattern is turned into a second gate electrode constituted by the silicide of the first metal. Then, the first mask is removed. With such a manufacturing method, a silicide layer is formed without adding an annealing process. | 04-08-2010 |
20100219478 | MOSFET, METHOD OF FABRICATING THE SAME, CMOSFET, AND METHOD OF FABRICATING THE SAME - The present invention provides an NMOSFET including a semiconductor substrate, a gate insulating film formed on the semiconductor substrate, and a first gate electrode formed on the gate insulating film. The first gate electrode is composed of silicide of a metal M, and at least one element selected as an impurity from a group consisting of sulfur (S), fluorine (F) and chlorine (Cl). The impurity exists as an impurity layer at a surface of the first gate electrode at which the first gate electrode makes contact with the gate insulating film. | 09-02-2010 |
20110037106 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME - A semiconductor device improves a Schottky-barrier field-effect transistor. In a semiconductor device including a gate electrode formed with interposition of a gate insulating film on a channel formed on a semiconductor substrate, and a Schottky source/drain formed within a top surface of the substrate to be positioned on both sides of the gate insulating film so that end portions of the Schottky source and the Schottky drain do not cover a lower end portion of the gate insulating film and so as to form Schottky junctions with the semiconductor substrate, a Schottky barrier height at an interface between the end portion of the Schottky source and the semiconductor substrate and a Schottky barrier height at an interface between the end portion of the Schottky drain and the semiconductor substrate are different from Schottky barrier heights at interfaces between portions except the end portions of the Schottky source/drain and the substrate. | 02-17-2011 |
20160141030 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device has at least one memory cell using a resistance variable element, and a control circuit which controls writing to and reading from the memory cell. Operations by the control circuit include a first writing operation, a second writing operation, and a rewriting operation. The first writing operation is a writing operation for applying a first voltage of a first polarity to the memory cell. The second writing operation is a writing operation for applying a second voltage of a second polarity opposite to the first polarity to the memory cell. The rewriting operation is a writing operation for, when the first writing operation fails, further executing a second A writing operation for applying the second voltage of the second polarity to the memory cell and a first A writing operation for applying the first voltage of the first polarity to the memory cell. | 05-19-2016 |