Kodani, JP
Kazufumi Kodani, Tokyo JP
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20140127608 | REINFORCING MATERIAL FOR SOLID POLYMER FUEL CELL, AND COHESIVE/ADHESIVE COMPOSITION FOR USE IN SAME - There is provided a reinforcing material equipped with a cohesive/adhesive layer, having a proper initial adhesion force to an adherend, such as an electrolyte membrane, a catalyst layer and a gas diffusion layer, and which can be temporarily fixed readily. A reinforcing material produced by forming a cohesive/adhesive layer on a substrate. The cohesive/adhesive layer includes an aliphatic polyamide, an epoxy resin and a polythiol. When the reinforcing material is used, it becomes possible to correct the position of an adherend after the adhesion of the reinforcing material to the adherend. In addition, it can prevent the formation of wrinkles on the adherend or the like upon the adhesion of the reinforcing material. Therefore, a catalyst layer laminated membrane or the like which has a reinforcing material attached thereto can be produced readily without requiring the employment of any highly skilled technique. | 05-08-2014 |
20140170532 | SOLID-OXIDE FUEL CELL - A configuration for preventing deformation of a solid oxide fuel cell is provided. A solid oxide fuel cell | 06-19-2014 |
Kazuya Kodani, Kawasaki Kanagawa JP
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20150262959 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a substrate joined to a base by a first junction material and a semiconductor element joined to the substrate by a second junction material. At least one of the first and second junction materials comprises tin, antimony, and cobalt. In some embodiments, the junction materials comprise cobalt having a weight percentage between 0.05 wt % and 0.2 wt %, antimony with a weight percentage between 1 wt % and 10 wt %, and the balance being substantially tin. | 09-17-2015 |
Kazuya Kodani, Kanagawa-Ken JP
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20150076516 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE - According to one embodiment, a semiconductor device includes a semiconductor element and a metal film. The semiconductor element has a first surface and a second surface opposite to the first surface. The metal film is provided above the second surface of the semiconductor element. The metal film includes Cr. | 03-19-2015 |
20150076699 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, a semiconductor device includes a semiconductor element, an interconnection layer, and a bonding layer. The interconnection layer includes Cu. The bonding layer includes a first alloy that is an alloy of Cu and a first metal other than Cu between the semiconductor element and the interconnection layer. A melting point of the first alloy is higher than a melting point of the first metal. | 03-19-2015 |
20150078414 | METHOD OF TESTING SEMICONDUCTOR DEVICE AND APPARATUS OF TESTING SEMICONDUCTOR DEVICE - According to one embodiment, in a method of testing a semiconductor device, the semiconductor device has a semiconductor element and a substrate which are bonded by bonding material including metal fine particles. Image data of a heat distribution in the semiconductor device are temporally acquired while heating the semiconductor device. A time change of a fractal dimension based on the image data is calculated. An inclination of the time change of the fractal dimension is calculated. The inclination and a reference inclination set in advance are compared. Whether or not the semiconductor device is good is determined. | 03-19-2015 |
Kazuya Kodani, Tokyo JP
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20130043594 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - According to one embodiment, between the mounting substrate and the semiconductor chip, there is a joint support layer including a metal or its alloy selected from the group of Cu, Al, Ag, Ni, Cr, Zr and Ti and a melt layer laminated across the joint support layer, and formed of a metal selected from the group of Sn, Zn and In or of an alloy of at least two metals selected from the same metals. The process of joining the mounting substrate and the semiconductor chip includes intervening a joining layer which is formed, at least for its outermost layer, by the melt layer, maintaining the temperature to be higher than the melting point of the melt layer, then forming an alloy layer which has a higher melting point than the melt layer by liquid phase diffusion. | 02-21-2013 |
Kazuya Kodani, Kawasaki-Shi JP
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20120217630 | HEATSINK, HEATSINK ASSEMBLY, SEMICONDUCTOR MODULE, AND SEMICONDUCTOR DEVICE WITH COOLING DEVICE - According to one embodiment, a heatsink includes a base and heat radiation fins placed on one of surfaces of the base and arranged in parallel to each other with a submillimeter narrow pitch. Each of the multiple heat radiation fins has a submillimeter thickness, a length in a width direction of 60 mm or smaller, and a height of 40 mm or smaller. The heatsink assembly may be constituted by allaying a plurality of the heatsinks and thermally connecting each of the heatsinks to each other using a heat transport device. | 08-30-2012 |
Kazuya Kodani, Kanagawa JP
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20140077377 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - According to one embodiment, the semiconductor device in the embodiment has an assembly substrate, a semiconductor chip, and a jointing layer. The semiconductor chip is joined to the assembly substrate via the jointing layer. An intervening diffusion barrier layer may be interposed between the chip and jointing layer. The jointing layer is an alloy layer mainly made of any metal selected from Sn, Zn and In or an alloy of Sn, Zn and In, and any metal selected from Cu, Ni, Ag, Cr, Zr, Ti and V or an alloy of any metal selected from Cu, Ni, Ag, Cr, Zr, Ti and V and any metal selected from Sn, Zn and In, where the alloy has a higher melting temperature than that of Sn, Zn and In or an alloy of Sn, Zn and/or In. | 03-20-2014 |
20140284797 | POWER SEMICONDUCTOR DEVICE FABRICATION METHOD, POWER SEMICONDUCTOR DEVICE - A method for fabricating a power semiconductor device that comprises a base substrate with a conductive layer on a surface of the base substrate and semiconductor components mounted on the base substrate includes forming a hardened layer on the surface of the conductive layer before mounting a semiconductor component on the base substrate. The forming of the hardened layer may optionally be performed using a peening process, for example, a shot peening process, a laser peening process, or an ultrasonic peening process. The conductive layer may comprise a metal such as, for example, aluminum or copper. | 09-25-2014 |
Masafumi Kodani, Tohaku-Gun JP
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20100018847 | TRIGGER SWITCH - A trigger switch has a trigger arranged projected and biased to a front side in a housing, and a lock member projecting from a side of the trigger towards the housing, and being engaged with a lock button projecting to the side from the housing to fix the trigger in a pulled-in state. The lock member is swingably attached to the trigger. | 01-28-2010 |
Masayuki Kodani, Ueda-Shi JP
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20150378152 | OPTICAL SCANNER - The optical scanner comprises: a motor having an rotor shaft; a rotor being attached to the rotor shaft; a tilt mirror having an inclined reflective surface and being attached to the rotor shaft together with the rotor; and a bearing section being provided to a stator housing and capable of rotatably holding the rotor shaft. The rotor and the tilt mirror are prohibited from detaching from and rotating with respect to the rotor shaft. A recessed part, through which the rotor shaft is penetrated, is formed in the tilt mirror. An elastic member, which always biases the tilt mirror toward the rotor, is provided between a retainer section and an inner bottom part of the recessed part. | 12-31-2015 |
20150378153 | ROTARY BODY DRIVING APPARATUS - The rotary body driving apparatus for rotating a rotary body comprises: a rotor shaft, to which the rotary body and a rotor are attached, being rotatably held by a bearing section; a rotor magnet being attached to the rotor and partially exposed as a position detecting magnet; a first positioning section being formed in the rotor, the first positioning section corresponding to the position detecting magnet; and a second positioning section corresponding to a reference surface of the rotary body. The rotary body is attached to the rotor in a state where the first positioning section and the second positioning section are aligned so as to make circumferential positions of the reference surface and the position detecting magnet correspond to each other. | 12-31-2015 |
Masayuki Kodani, Nagano JP
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20130069469 | ROTOR OF MOTOR, METHOD OF PRODUCING THE ROTOR, INNER ROTOR-TYPE BRUSHLESS MOTOR AND METHOD OF PRODUCING THE MOTOR - The rotor of the present invention is capable of improving magnetic characteristics, general versatility and ease of assembly. The rotor comprises: a rotor shaft; a ring-shaped rotor magnet being disposed coaxially with the rotor shaft; and a non-magnetic cover covering an outer circumference of the rotor magnet. The rotor magnet and the cover are integral-molded with molding resin in a state where an outer circumference of the cover is exposed and both end parts and an inner circumference of the rotor magnet are covered with the molding resin. | 03-21-2013 |
20140145544 | STATOR AND ELECTRIC MOTOR HAVING THE SAME - The stator of the electric motor comprises: a stator core; tooth sections being radially extended from the stator core; an even number of slots, each of which is formed between the tooth sections; an insulator covering the tooth sections; and motor coils being wound in the slots. The insulator has guide projections, each of which corresponds to each of the tooth sections so as to guide a magnet wire. The guide projections have guide sections, each of which includes a base end part and a front end part. In each of the guide sections, a radial thickness of at least one part located in the base end part is thin, a radial thickness of the front end part is thicker than that of the base end part. The guide sections are formed in same side faces of the guide projections arranged in the circumferential direction. | 05-29-2014 |
20140241915 | ELECTRIC FLUID PUMP - An electric fluid pump includes: a case including a recess portion into which a fluid flows; a rotor arranged in the recess portion; an axial member supporting the rotor; and a flange member insert-molded with the case and the axial member, secured to an end portion of the axial member, and buried in a bottom wall portion of the recess portion, wherein the flange member includes: a first flange portion; a reduced portion closer to an inner surface of the bottom wall portion than the first flange portion, and smaller than the first flange portion in a radial direction; and a second flange portion closer to the inner surface than the reduced portion, larger than the first flange portion in the radial direction, and partially exposed from the inner surface, and the inner surface is flat. | 08-28-2014 |
Tadashi Kodani, Tottori-Shi JP
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20130033408 | THREE-AXIS ANTENNA AND CORE ASSEMBLY USED THEREIN - A core assembly comprising first and second core members each having a rectangular body around which an X-axis coil and a Y-axis coil are wound, and flanges integrally and diagonally extending from the body; and a bobbin having an annular portion and projections diagonally extending therefrom; the projections of the bobbin being provided with terminal members connected to coil ends of the X-axis coil, the Y-axis coil and the Z-axis; the annular portion of the bobbin acting as a space for disposing the first core member from one side, and providing a space receiving at least partially the body of the second core member from the other side, such that the body of the first core member is at least partially adjacent to the body of the second core member; and a space for winding the Z-axis coil being provided between the projections of the bobbin and the flanges of the second core member. | 02-07-2013 |
Taichi Kodani, Kobe JP
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20110100857 | Packaged Product for Protecting Light-Sensitive Liquid Composition - A packaged product. The package has a plastic container and a light-sensitive liquid composition contained in the plastic container. The container has a plastic container for protecting a light-sensitive liquid composition from light. The container has: i) a top; ii) a bottom opposing to the top; iii) a first layer extending from the top to the bottom, wherein the first layer is non-opaque; and iv) a second layer superposed with a part of the first layer, wherein the second layer has a blocking agent. The container has a non-superposed area covering the bottom. In the non-superposed area the first layer is not superposed with the second layer. The non-superposed area has a height h from about 2 mm to about 50 mm. | 05-05-2011 |
Tetsuhiro Kodani, Osaka JP
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20090072143 | PYROELECTRIC INFRARED SENSOR - There is provided a pyroelectric infrared sensor being capable of changing its shape and having high sensitivity. The sensor comprises the substrate | 03-19-2009 |
20100093962 | METHOD OF FORMING THIN FILM - There is provided a method of forming a thin film of vinylidene fluoride homopolymer having crystal form I which is applicable to various substrates in relatively easy way (coating conditions, application method, etc.), a process for preparing a vinylidene fluoride homopolymer having crystal form I efficiently at high purity, and novel vinylidene fluoride homopolymers which can give a thin film being excellent in ferroelectricity. The method of forming a thin film of vinylidene fluoride homopolymer comprises (i) a step for preparing a green powder product of vinylidene fluoride homopolymer comprising crystal form I alone or as main component by subjecting vinylidene fluoride to radical polymerization in the presence of a bromine compound or iodine compound having 1 to 20 carbon atoms which contains at least one moiety represented by —CRf | 04-15-2010 |
20130237677 | METHOD OF FORMING THIN FILM - A vinylidene fluoride homopolymer represented by the formula (4): | 09-12-2013 |
20150349500 | POLARIZED RESIN FILM AND PROCESS FOR PRODUCING SAME - An object of the present invention is to provide a polarized vinylidene fluoride/tetrafluoroethylene copolymer resin film that can significantly reduce, when used as an optical film, the deterioration of the quality of video or still images formed by display elements. | 12-03-2015 |
Tetsuhiro Kodani, Settsu-Shi JP
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20100249324 | PROCESS FOR PREPARING VINYLIDENE FLUORIDE HOMOPOLYMER HAVING I-FORM CRYSTAL STRUCTURE - The present invention provides a process for easily preparing a vinylidene fluoride homopolymer comprising an I-form crystal structure at high purity by selecting a solvent, and the process for preparing the vinylidene fluoride homopolymer comprises not less than 70% by mass of I-form crystal structure, which is obtained by dissolving a vinylidene fluoride homopolymer having a number average degree of polymerization of 3 to 20 in a solvent consisting of an organic solvent having a dipole moment of not less than 2.8 alone or comprising the organic solvent in a part, thereafter, evaporating the solvent. | 09-30-2010 |
20130027339 | TRANSPARENT PIEZOELECTRIC SHEET-WITH-A-FRAME, TOUCH PANEL, AND ELECTRONIC DEVICE EACH HAVING THE TRANSPARENT PIEZOELECTRIC SHEET - A transparent piezoelectric sheet-with-a-frame includes a transparent piezoelectric sheet and a frame covering a peripheral edge portion of the transparent piezoelectric sheet. The transparent piezoelectric sheet includes one transparent piezoelectric film including an organic polymer, one first transparent plate electrode placed on a first main surface of the transparent piezoelectric film and having a first transparent plate electrode portion, and one second transparent plate electrode placed on a second main surface of the transparent piezoelectric film and having a second transparent plate electrode portion. An outline of the second transparent plate electrode portion is positioned inside an outline of the first transparent plate electrode portion as seen in a plan view. The outline of the first transparent plate electrode portion completely coincides with the frame, and the outline of the second transparent plate electrode portion does not at all coincide with the frame as seen in the plan view. | 01-31-2013 |
20130027340 | TRANSPARENT PIEZOELECTRIC SHEET, AND TRANSPARENT PIEZOELECTRIC SHEET-WITH-A-FRAME, TOUCH PANEL, AND ELECTRONIC DEVICE EACH HAVING THE TRANSPARENT PIEZOELECTRIC SHEET - A transparent piezoelectric sheet includes a quadrilateral-shaped transparent piezoelectric film and a first transparent plate electrode. The quadrilateral-shaped transparent piezoelectric film includes an organic polymer. The quadrilateral-shaped transparent piezoelectric film has entire main surfaces that are piezoelectric. The first transparent plate electrode is layered on part of a first main surface of the main surfaces of the transparent piezoelectric film. One to three sides of the four sides of the quadrilateral shape of the transparent piezoelectric film and area(s) of the first main surface adjacent thereto are not covered by the first transparent plate electrode. | 01-31-2013 |
20140016176 | HYDROPHOBIC DIELECTRIC FILM FOR ELECTROWETTING - A hydrophobic dielectric film for electrowetting, which can drive a conductive liquid by using a low voltage and containing a vinylidene fluoride based polymer. | 01-16-2014 |
Tetsuhiro Kodani, Settsu-Shi, Osaka JP
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20150368413 | HIGH DIELECTRIC FILM - The present invention aims to provide a film having a high dielectric constant and a low dissipation factor. The high dielectric film of the present invention includes a vinylidene fluoride/tetrafluoroethylene copolymer (A) with a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 95/5 to 80/20. The film includes an β-crystal structure and a β-crystal structure. The ratio of the β-crystal structure is 50% or more. | 12-24-2015 |
Yoshiaki Kodani, Osaka JP
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20130164880 | METHOD FOR PRODUCING PHOTOVOLTAIC DEVICE AND PHOTOVOLTAIC DEVICE - A method for producing a photovoltaic device that includes spherical photovoltaic elements and a support with a large number of recesses for receiving the elements one by one and to the photovoltaic device. Each of the spherical photovoltaic elements includes a spherical first semiconductor and a second semiconductor layer covering the first semiconductor. A conductive adhesive is applied to the bottoms of the recesses of the support serving as a second conductor layer. The elements are disposed in the bottoms of the recesses with the conductive adhesive applied thereto, to fix the elements to the support and electrically connect their second semiconductor layers to the support. An electrical insulator layer, which has through-holes serving as conductive paths, is bonded to the backside of the support, and a first conductor layer, which interconnects the electrodes of the first semiconductors of the respective elements, is formed thereon. | 06-27-2013 |
Yoshinobu Kodani, Hofu-Shi JP
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20100004356 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor - Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material. | 01-07-2010 |
20100074831 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor - Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material. | 03-25-2010 |
20100075228 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor - Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material. | 03-25-2010 |
20120135238 | NON-THERMOFUSIBLE PHENOL RESIN POWDER, METHOD FOR PRODUCING THE SAME, THERMOSETTING RESIN COMPOSITION, SEALING MATERIAL FOR SEMICONDUCTOR, AND ADHESIVE FOR SEMICONDUCTOR - Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material. | 05-31-2012 |
20120237830 | NON-THERMOFUSIBLE PHENOL RESIN POWDER, METHOD FOR PRODUCING THE SAME, THERMOSETTING RESIN COMPOSITION, SEALING MATERIAL FOR SEMICONDUCTOR, AND ADHESIVE FOR SEMICONDUCTOR - Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 μm and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material. | 09-20-2012 |